Abstract: Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound having an ester group; and a semiconductor device including a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. (A) An epoxy curing agent that is derived by adduction between amide-type reactants from polyamine compounds comprising from 25-75 mol % of a polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof and glycidyl ether compound; (B) An epoxy curing agent of the mixture of (B1) amide-type reactants prepared through polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof, and (B2) a reactant is derived by adduction between other aliphatic polyamines or a mixture thereof and glycidyl ether compound. Coating composition comprising the epoxy curing agent of the above described A or B.

Abstract: A coating composition of oil and organofunctional silane is provided for the treatment of metal substrates. The coating composition features at least 80% by weight of oil and 0.5% to 10% by weight of organofunctional silane. The organofunctional silane includes a polysulfide silane, and the preferred metal substrate is a tire cord. When a tire cord is coated with the coating composition, it allows a tire to be formulated with lower sulfur levels and without cobalt.

Abstract: The process for preparing a self-healing composite material comprising a matrix of epoxy polymer, in which a catalyst of ring opening metathesis reaction and microcapsules containing a cyclic olefin having 7 to 40 carbon atoms are dispersed, comprises the steps of: preparing a mixture of a precursor of the epoxy polymer, having at least one oxirane ring, a curing agent chosen from the group consisting of tertiary amines, a Hoveyda-Grubbs II metathesis catalyst reaction, having the formula (I), wherein Ar=aryl having at least one halogen or alkyl substituent and “R=alkyl with 1 to 20 carbon atoms, and microcapsules containing a cyclic olefin having 7 to 40 carbon atoms; and heating the mixture at a temperature comprised between 25 and 130° C. for at least 1 hour, so as to obtain such matrix of epoxy polymer due to a reaction between precursor and curing agent, which reaction does not substantially involve either said catalyst or said microcapsules.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: Curable compositions for making fibre-reinforcement structural composites such as GRP comprise an unsaturated polyester resin base, a co-polymerizable monomer and preferably, one or more performance-enhancing additives. Thixotropy is endowed by 5% by weight or less of an organic amide.

Abstract: This invention relates to a stable, low level styrene emission vinyl ester or unsaturated polyester resin composition containing a nonionic surfactant or a copolymer of maleic acid half ester of a polyethylene glycol and a monoalkenyl aromatic monomer as stabilizing agents.

Abstract: The present invention relates to a coating solution for preventing adhesion of polymer scale and a method for preventing scale adhesion during preparation of polymers which can provide polymers having high quality without coloring thereof while preventing adhesion of polymer scale to a polymerizer when a monomer having an ethylenically unsaturated double bond is polymerized. A coating solution for preventing adhesion of polymer scale which comprises anaphthoquinone natural dyestuffs, anthraquinone natural dyestuffs, tannin natural dyestuffs, xanthone natural dyestuffs, flavonoid natural dyestuffs, or/and benzoquinone natural dyestuffs and a polyvinyl alcohol having a degree of saponification of not less than 70 mole % was applied on at least a part of a polymerizer which comes in contact with a monomer having an ethylenically unsaturated double bond and was dried to give a coating film during polymerization thereof.

Abstract: The problem of the potential for creation of a reactive noncompressible crust in a fluid adhesive mixture comprising a deposit of an uncured curable fluid curable resin composition and a deposit of a fluid curing agent wherein the deposits are separated by a thin flexible barrier film formed from the interaction of the cured resin as reacted by the curing agent, is overcome by including with the fluid curing agent a thickener in an amount sufficient to render the fluid curing agent non-free-flowing at room temperature and preventing the formation of any substantial amount of noncompressible crust in the mixture.

Abstract: Blends of high molecular weight polyphenylene ethers with various epoxy materials, particularly polyglycidyl ethers of bisphenolic compounds, are homogeneous at high temperatures and may be cured in the presence of a catalyst such as aluminum tris(acetylacetonate) or zinc bis(acetylacetonate), especially in the additional presence of an accelerator such as a basic nitrogen compound. The cured compositions have advantageous physical and electrical properties and are useful, for example, for the preparation of printed circuit boards.

Abstract: A solvent-based thermosetting coating composition comprising a hydroxy functional epoxy-polyester graft copolymer and blocked polyisocyanate crosslinking agent. The coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer suitable for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, the composition may be formulated as a high solids composition sprayable with conventional spraying equipment. The hydroxy functional epoxy-polyester graft copolymer is the product of polymerization of lactone monomers in the presence of hydroxy functional epoxy ester resin precursor. The precursor resin is the reaction product of diepoxide chain extended with diphenol and chain terminated with acid component comprising primary hydroxy functional acid. The polymerization of the lactone monomers is carried out at a temperature between about 50.degree. C. and about 300.degree. C.

Abstract: A solvent-based thermosetting coating composition comprising a hydroxy functional epoxy ester resin, and polycaprolactone diol, and blocked polyisocyanate crosslinking agent. The coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, the composition may be formulated as a high solids composition sprayable with conventional spraying equipment. The resin is formed by reaction of diepoxide chain extended substantially simultaneously with diphenol and dicarboxylic acid and chain terminated with acid component comprising primary hydroxy functional acid.

Abstract: A hydroxy functional epoxy-polyester graft copolymer and solvent-based thermosetting coating composition comprising said copolymer and blocked polyisocyanate crosslinking agent. The coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer suitable for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, the composition may be formulated as a high solids composition sprayable with conventional spraying equipment. The hydroxy functional epoxy-polyester graft copolymer is the product of polymerization of lactone members in the presence of hydroxy functional epoxy ester resin precursor. The precursor resin is the reaction product of diepoxide chain extended with diphenol and chain terminated with acid component comprising primary hydroxy functional acid. The polymerization of the lactone monomers is carried out at a temperature between about 50.degree. C. and about 300.degree.

Abstract: A high solids coating composition which comprises 10-96 percent by weight resin solids of a low molecular weight epoxy oligomer, 2-35 percent by weight crosslinking glycoluril-formaldehyde resin and a primary sulfonic acid catalyst. The oligomer is condensed upon heating into a high molecular weight polymer film with simultaneous crosslinking with the crosslinking agent to provide the desired film properties.

Abstract: A liquid or pasty thermosetting adhesive which can be pre-gelled, which is suitable for the bonding of moulded parts or for the sealing of folded seams, and which contains (a) a liquid epoxide resin having on average more than one epoxide group in the molecule, and (b) a latent epoxide curing agent insoluble in the epoxide resin, the adhesive being characterized in that it also contains (c) in an amount of 5 to 50 percent by weight relative to the epoxide resin, at least one halogen-free thermoplast in powder form, which is insoluble in the epoxide resin at room temperature, and which has a softening point of between 60.degree. and 160.degree. C., such as a polyethylene, a polypropylene or an ethylene/acrylic acid/acrylate terpolymer.