Elemental Metal Dnrm Patents (Class 524/439)
-
Patent number: 6727310Abstract: The present invention relates to a water-based metallic coating composition comprising a resin composition for a water-based coating composition, a metallic pigment, metal silicate and a polyamide resin and capable of forming a coating film which is excellent in a flip-flop property and which is free of metallic mottling.Type: GrantFiled: May 11, 2001Date of Patent: April 27, 2004Assignee: Kansai Paint Co., Ltd.Inventors: Yutaka Mizutani, Eiji Hamaoka, Mikio Shimakawa
-
Patent number: 6727308Abstract: The present invention relates to laser-markable plastics of which a feature is that they comprise as dopant at least one metal powder and/or semimetal powder selected from the group consisting of aluminum, boron, titanium, magnesium, copper, tin, silicon and zinc and one or more effect pigments based on phyllosilicates.Type: GrantFiled: April 13, 2001Date of Patent: April 27, 2004Assignee: Merck Patent Gesellschaft mit beschränkter HaftungInventors: Helge Kniess, Dieter Heinz, Reiner Delp, Gerhard Pfaff, Matthias Kuntz
-
Publication number: 20040072938Abstract: A vibration damping treatment for damping vibration of a structure includes a viscoelastic material and a plurality of flakes or platelets distributed in the viscoelastic material. The vibration damping material provides damping along more than one axis. An adhesive located on one surface of the viscoelastic material attaches the vibration damping treatment to the structure. Alternately, the vibration damping treatment is applied to the structure as a coating. The width and height dimensions of the flakes or platelets, preferably has a rectangular, square, or irregular cross-section. The viscoelastic material is selected from the group of acrylics, silicones, polymers and elastomers. The flakes or platelets are selected from the group of graphite, hard plastic, ceramic, steel, aluminum, clay, mica, and magnesium. A volume fraction of the flakes is between 5% and 50%. A constraining layer is not required.Type: ApplicationFiled: October 11, 2002Publication date: April 15, 2004Inventor: Stepan S. Simonian
-
Patent number: 6720377Abstract: A color pigment master batch having a high recycling property and a process for producing a blow-molded article having a grain-tone appearance using this color pigment master batch. The color pigment master batch for blow molding includes a pigment and a carrier resin. The carrier resin is a thermoplastic elastomer which is a crystalline or amorphous thermoplastic elastomer having a Vicat softening point higher than a melting temperature of a molding base resin and a crystal melting point or a flow-starting temperature higher by 20° C. or more than a melting temperature of the molding base resin and in which an MFR ratio thereof to the molding base resin is 5 or more.Type: GrantFiled: March 28, 2002Date of Patent: April 13, 2004Assignees: Idemitsu Petrochemical Co., Ltd., Tokyo Printing Ink Mfg. Co., Ltd.Inventors: Masami Takimoto, Toshihisa Miyaoka, Takeshi Watanabe
-
Publication number: 20040068036Abstract: Emissive coatings for flexible substrates, preferably elastomers or elastomers bonded to metal are disclosed The coating composition is formed by combining parts (a) and (b) where part (a) comprises an organic solution or aqueous dispersion of a functional group containing polymer or copolymer and thermal conductive filler; and part (b) comprises a liquid curing component, for example a poly isocyanate, a carbodiimide, or an amino resin. The coating compounds can be applied to an substrate either before or after the substrate has been vulcanized. The coatings can be cured at ambient temperatures and provide heat dissipation over long term service at elevated temperatures.Type: ApplicationFiled: October 7, 2002Publication date: April 8, 2004Inventors: James R. Halladay, Frank J. Krakowski, Kenneth C. Caster, Ernest Barritt Troughton
-
Patent number: 6716904Abstract: A heat-radiating electromagnetic wave absorber molded in a predetermined form from a mixed composition comprising Fe—Si alloy powder as soft magnetic powder and a thermally conductive filler in an organic matrix. This heat-radiating electromagnetic wave absorber has better thermal conductivity, as well as excellent electromagnetic wave absorbing property in high frequency band.Type: GrantFiled: June 13, 2002Date of Patent: April 6, 2004Assignee: Polymatech Co., Ltd.Inventor: Kouya Takahashi
-
Publication number: 20040063839Abstract: The present invention provides a method of producing an electron emitting device using a carbon fiber using a catalyst, capable of preferably growing carbon fibers at a low temperature without the need of a high temperature process for growing the carbon fibers or a high temperature alloy process on a substrate, and growing the carbon fibers by a density capable of applying an electric field necessary for the electron emission further effectively. Using alloy particles containing Pd and at least one element selected from the group consisting of Fe, Co, Ni, Y, Rh, Pt, La, Ce, Pr, Nd, Gd, Tb, Dy, Ho, Er, and Lu as the catalyst, a dispersion of the alloy particles is applied on a carbon fiber producing subject surface for providing the alloy particles so as to grow the carbon fibers.Type: ApplicationFiled: September 15, 2003Publication date: April 1, 2004Applicant: CANON KABUSHIKI KAISHAInventors: Shinichi Kawate, Takeo Tsukamoto
-
Patent number: 6712989Abstract: A composite magnetic body is obtained without the use of halogen-based or halogen-containing materials, such as, halogen-based binding agent of halogen-based resins or elastomers, and bromine-based fire retardents. The composite magnetic body (1) comprises a soft magnetic powder (2) and a silicone rubber (3). The silicone rubber (3) should preferably be a solid silicone rubber. An electromagnet interference suppressing body is obtained using this composite magnetic body.Type: GrantFiled: June 13, 2001Date of Patent: March 30, 2004Assignee: Tokin CorporationInventors: Yoshio Awakura, Shigeyoshi Yoshida, Mikio Nishimura
-
Patent number: 6713534Abstract: A fine-particle, free-flowing rubber powder containing silicatic fillers, one or more organosilanes having trialkoxysilyl groups, and a rubber prepared by solution polymerization is prepared by a process that starts from a two-phase system: 1) filler in water, and 2) rubber in organic solvent. A rubber/silicatic filler/silane composite is formed during transfer, under gentle conditions, of the various reactants into a single phase. The process features a high degree of freedom in selecting forms of filler and in selecting the organosilane and gives a finished rubber powder in which a silicatic filler and an organosilane have undergone complete chemical reaction.Type: GrantFiled: April 10, 2002Date of Patent: March 30, 2004Assignee: PKU Pulverkautschuk Union GmbHInventors: Udo Goerl, Matthias Schmitt, Reinhard Stober, Andreas Gouw
-
Publication number: 20040059032Abstract: An acrylate-functionalized alkyd coating composition is disclosed having improved dry time. The compositon includes an acrylate-functionalized alkyd resin, a solvent, and a drier package that provides the composition with a cobalt content of at least 0.01 wt %, based on binder solids content, and a calcium content of from 0.15 wt % to 5 wt %, based on the binder solids content. The drier mixture disclosed results in the coating composition having improved dry time when compared with similar coating compositions using conventional drier packages.Type: ApplicationFiled: January 31, 2003Publication date: March 25, 2004Inventor: Mingbo He
-
Patent number: 6710103Abstract: A powder-based coating composition for coating a substrate, having a first color effect, with a film layer is disclosed. Application of the film layer to the substrate produces a second color effect different from the first color effect. The composition includes a powder-based binder and a color effect-providing pigment. The powder-based binder is the reaction product of a resin, having a functional group, and a cross-linking agent reactive with the functional group. The color effect-providing pigment includes a pigment substrate and an inorganic coating. The pigment substrate has first and second substantially parallel and planar surfaces, and the inorganic coating is disposed on the first and second surfaces. The inorganic coating has an index of refraction of 1.8 or less. To produce the second color effect, the inorganic coating and the pigment substrate of the color effect-providing pigment interact with the first color effect of the substrate upon application of the film layer to the substrate.Type: GrantFiled: September 27, 2001Date of Patent: March 23, 2004Assignee: BASF CorporationInventors: William C. Norris, Josef Rademacher
-
Patent number: 6710109Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.Type: GrantFiled: July 11, 2001Date of Patent: March 23, 2004Assignee: Cool Options, Inc. a New Hampshire Corp.Inventors: Kevin A. McCullough, James D. Miller, E. Mikhail Sagal
-
Patent number: 6706219Abstract: An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature.Type: GrantFiled: May 7, 2001Date of Patent: March 16, 2004Assignee: Honeywell International Inc.Inventor: My Nguyen
-
Publication number: 20040048079Abstract: Polyimide/metal laminates having a polyimide film and a metal layer laminated thereon, wherein the polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesion under the ordinary conditions and, moreover, can sustain the adhesive strength at a high ratio after exposure to high temperature or high temperature and high humidity. Owing to these characteristics, these polyimide/metal laminates are appropriately usable in flexible print wiring boards, multi-layered print wiring boards, rigid flex wiring boards, tapes for TAP, semiconductor packages such as CFOs and multi chip modules (MCMs), magnetic recording films, coating films for aerospace materials and filmy resistance elements.Type: ApplicationFiled: May 16, 2003Publication date: March 11, 2004Applicant: Kaneka CorporationInventors: Masaru Nishinaka, Kiyokazu Akahori
-
Patent number: 6703128Abstract: An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.Type: GrantFiled: February 15, 2002Date of Patent: March 9, 2004Assignee: Delphi Technologies, Inc.Inventors: Bruce A. Myers, Arun K. Chaudhuri, Jeffrey H. Burns
-
Patent number: 6699929Abstract: Compounds with both vinyl ether and carbamate, thiocarbamate or urea functionality are suitable for use in microelectronics applications and show enhanced adhesive strength compared to compounds that do not contain carbamate, thiocarbamate or urea functionality.Type: GrantFiled: August 10, 2001Date of Patent: March 2, 2004Assignee: National Starch and Chemical Investment Holding CorporationInventors: Osama M. Musa, Donald E. Herr
-
Publication number: 20040039097Abstract: This invention provides a water-based metallic paint which comprises a resin composition for water-based paint and metallic pigment, said water-based metallic paint containing 5-15 parts by weight of polyamide resin per 100 parts by weight of the resin composition for water-based paint, and the storage modulus of elasticity of the paint liquid immediately after spray coating of said water-based metallic paint being at least 100 Pa/20° C. under the conditions of 0.5 Pa stress and 0.1 Hz frequency, said water-based metallic paint forms coating excelling in flip-flop property and being free of metallic unevenness.Type: ApplicationFiled: August 26, 2003Publication date: February 26, 2004Inventors: Hiroyuki Nagano, Yasushi Nakao, Takayuki Ono
-
Publication number: 20040030003Abstract: An aqueous effect coating material comprising at least one water soluble or dispersible binder,Type: ApplicationFiled: June 5, 2003Publication date: February 12, 2004Inventors: Egon Wegner, Frank Jansing
-
Publication number: 20040030010Abstract: The present invention relates to pigment preparations comprising polyamide particles with an average particle size of below 50 &mgr;m and a pigment of an average particle size below 0.2 &mgr;m. The inventive pigment preparations are useful for coloring high molecular weight material, like coatings, inks and in particular plastics like polyvinyl chloride, polyamide, polyester, polycarbonate and, especially polyamide fibers.Type: ApplicationFiled: April 29, 2003Publication date: February 12, 2004Inventor: Fridolin Babler
-
Publication number: 20040030029Abstract: Disclosed is a polyester composition comprising:Type: ApplicationFiled: July 3, 2001Publication date: February 12, 2004Inventors: Stephen Weinhold, Lavonna Suzanne Buehrig, Robert Noah Estep, David Paul Fischer
-
Publication number: 20040010065Abstract: An object of the present invention is to provide a discoloration inhibitor for metals, for protecting metal artifacts, such as those made of silver, copper, and nickel, or their alloys, from discoloration due to sulfur-containing gases such as sulfur oxide (SOx), mercaptans, and hydrogen sulfide, for example, during display or storage of the metal artifacts. A discoloration inhibitor for metals comprising: a fiber having a crosslinking structure and containing carboxyl groups therein, at least part of said carboxyl groups being present as a salt of an alkali metal, an alkali earth metal or ammonia; and fine particles of a metal and/or a metal compound substantially insoluble in water and reactive with a sulfur-containing compound dispersed in said fiber is disclosed.Type: ApplicationFiled: July 11, 2003Publication date: January 15, 2004Inventors: Noriyuki Kohara, Hideyuki Tsurumi
-
Patent number: 6673463Abstract: A structure material of the present invention consisting essentially of 20 parts by weight or more of a polymer mixture consisting essentially of of a thermoplastic aromatic polyester and a thermoplastic aliphatic polyester on the basis of 100 parts by weight of the structure material. The polymer mixture comprises 3 to 40 parts by weight of the aliphatic polyester on the basis of 100 parts by weight of the polymer mixture.Type: GrantFiled: March 31, 1997Date of Patent: January 6, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Onishi, Takahiko Terada, Yoshikazu Yamagata
-
Patent number: 6660792Abstract: A thermoplastic composition, such as PET, contains an inert iron compound such as FeP, FeSi, or combinations thereof, having no chemical activity in the PET, with or without certain quantities of elemental metals, such as antimony, and a reducing agent or other stabilizer such as phosphite or phosphoric acid. A method for forming this composition is also disclosed. The composition may also optionally contain a color stabilizer, a DEG inhibitor and stress crack inhibiting agents.Type: GrantFiled: December 14, 2000Date of Patent: December 9, 2003Assignee: M & G USA CorporationInventors: Freddie Lee Massey, George Aaron Deisz, Kevin Rollick, William C. Tung
-
Publication number: 20030220432Abstract: A thermoplastic, thermally-conductive composition is provided. The composition comprises a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The composition can be used to make shaped, thermally-conductive articles. The articles can be used as thermal interfaces for dissipating heat from heat-generating devices such as electronic parts. The articles can have good electrical conductivity.Type: ApplicationFiled: April 8, 2003Publication date: November 27, 2003Inventors: James Miller, Kevin A. McCullough, E. Mikhail Sagal, Jeffrey Panek
-
Patent number: 6652968Abstract: A pressure activated electrically conductive polymeric matrix material that is doped with particulate filler material. Electrical conductivity is pressure activated with a change in electrical resistance; specifically, with no pressure applied, the material is at a high resistance and with pressure the resistance is materially lower. Conductive fillers may be spherical or powder substrate, such as glass, graphite, etc., having plated thereon a metal coating which is electrically conductive and which is more thermally conductive than the substrate. The polymeric matrix materials may include polyurethane, silicone, and many other synthetic or natural rubbers.Type: GrantFiled: March 22, 2001Date of Patent: November 25, 2003Inventors: Dorothy H. J. Miller, Brian L. Miller
-
Patent number: 6653365Abstract: A dental composite material that comprises a polymerizable resin composition; a filler system comprising polyhedral oligomeric silsesquioxane fillers; and a curing system. The dental composite material is useful for a variety of dental materials, treatments, and restorative functions including crown and bridge materials, fillings, adhesives, sealants, luting agents or cements, denture base materials, orthodontic materials and sealants, and other dental restorative materials.Type: GrantFiled: April 30, 2002Date of Patent: November 25, 2003Assignee: Pentron Clinical Technologies, LLCInventor: Weitao Jia
-
Patent number: 6652777Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.Type: GrantFiled: February 28, 2001Date of Patent: November 25, 2003Assignee: Amesbury Group, Inc.Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
-
Patent number: 6649683Abstract: A method of forming a solid matrix for use with surface-enhanced Raman spectroscopy is described. The method comprises the steps of: admixing a colloidal metal solution with a polymeric support medium to form a suspension; optionally depositing said suspension on a surface; and then drying the suspension to form the matrix. The polymeric support medium provides a plymer/sol suspension in which the sol particles are resistant to aggregation and precipitation. Upon drying the suspension shrinks to provide a mechanically-hard film subsequently usable to provide a sample for spectroscopic analysis.Type: GrantFiled: January 11, 2002Date of Patent: November 18, 2003Assignee: Avalon Instruments LimitedInventor: Steven Ernest John Bell
-
Patent number: 6645613Abstract: The present invention is directed to a coating composition comprising a pigment, a water-dispersible urethane resin, and a solvent effective amount of a water-soluble solvent. The water-dispersible urethane resin exists as a colloidal dispersion in water but when mixed with a water-soluble solvent swells to provide a dispersion having a viscosity sufficiently high in the solvent so as to maintain the pigment in suspension in the solvent for a time sufficient to apply the coating composition. The present invention is also directed to a method for coating a substrate with the novel coating composition and to a coated substrate prepared by the novel method.Type: GrantFiled: March 24, 2000Date of Patent: November 11, 2003Assignee: Spraylat CorporationInventor: Anthony R. Ricca
-
Patent number: 6639008Abstract: A silicone composition that includes at least one functionalized polydiorganosiloxane, at least one cure catalyst, at least one reactive diluant, and at least one thermally conductive filler is provided in the present invention. Further embodiments of the present invention include a method for substantially increasing the thermal conductivity of a silicone composition and a thermal interface material containing the aforementioned silicone composition.Type: GrantFiled: November 27, 2001Date of Patent: October 28, 2003Assignee: General Electric CompanyInventors: Larry Neil Lewis, Steven Kennth Gifford, Slawomir Rubinsztajn
-
Publication number: 20030199608Abstract: A functional material comprising fine coloring particles having an average primary particle diameter of 1 to 50 nm in a dried state, and having a BET specific surface area value of 30 to 500 m2/g and a light transmittance of not less than 80%. The functional material composed of fine coloring particles, exhibits not only an excellent transparency but also a high tinting strength and a clear hue.Type: ApplicationFiled: December 16, 2002Publication date: October 23, 2003Inventors: Mamoru Kamigaki, Hiroko Morii, Kazuyuki Hayashi, Toru Iwaki
-
Patent number: 6635698Abstract: A transparent/translucent flame redardant composition comprises a uniform blend of a miscible resin blend of a polycarbonate resin and a cycloaliphatic polyester resin wherein the composition has at least a 80% pass rate in 10 test specimen in the Norme Francaise NF-P-92-505 flammability test of L'Association Francaise de Normalisation using test specimens with weight between about 1.0 to about 6.0 kilograms per square meter.Type: GrantFiled: December 22, 2000Date of Patent: October 21, 2003Assignee: General Electric CompanyInventors: Johannes Martinus D. Goossens, Walter C. M. van der Heijden, Gabrie Hoogland, Johannes Jacobus M. de Moor, Hendrik Verhoogt
-
Patent number: 6630534Abstract: Disclosed is a composition useful as a sealing or undercoating material for automobiles. The composition comprises fine particles (A) comprising polyurethane resin, a plasticizer (B) and fillers (C), wherein not less than 50% of (A) is spherical particles having a ratio of major axis/minor axis in the range of 1.0 to 1.5.Type: GrantFiled: March 31, 2000Date of Patent: October 7, 2003Assignees: Sanyo Chemical Industries, Ltd., Toyota Jidosha Kabushiki KaishaInventors: Keiji Tanaka, Toshihiko Kinsho, Takashi Yabuta, Keiichi Yokouchi, Takao Nomura
-
Patent number: 6630527Abstract: Disclosed herein is a UV stabilized composition, comprising a polyester resin and a polycarbonate resin; an impact modifier; and an additive composition comprising a hindered amine light stabilizer and another UV absorber. Such compositions find utility in the manufacture of automobile components, for example.Type: GrantFiled: October 19, 2001Date of Patent: October 7, 2003Assignee: General Electric CompanyInventors: Jean R. Pierre, Peter H. Th. Vollenberg
-
Patent number: 6624225Abstract: This invention relates to a composition for repairing metallic articles which in its initial state is in the form of an adhesive, self-supporting putty, capable of being molded including 5-15% by weight of a sacrificial binder containing at least one acrylic resin and volatile solvent. The invention also relates to a kit for the composition and methods for repair.Type: GrantFiled: June 3, 1996Date of Patent: September 23, 2003Assignee: Liburdi Engineering LimitedInventors: Keith Ellison, Joseph Liburdi
-
Patent number: 6624227Abstract: The invention provides an aqueous coating composition comprising nonionically and/or anionically stabilized film-forming polymers and metallic pigments and a compound which is the reaction product of a phosphonic acid derivative, a hydroxy-functional addition polymers and, optionally a compound having a hydroxy group, in which the phosphonic acid derivative is selected from one or both of wherein R and R′ are selected from the group consisting of an aliphatic and an aromatic substituent having 1 to 25 carbon atoms optionally including heteroatoms of at least one of oxygen, phosphorus and silicon.Type: GrantFiled: July 12, 2000Date of Patent: September 23, 2003Assignee: E. I. du Pont de Nemours and CompanyInventors: Paul Peter Bruylants, Josef Huybrechts, Kenneth S. Kirshenbaum, Charles T. Berge
-
Patent number: 6624224Abstract: A thermally conductive mechanically compliant pad of high stability including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin consisting of a blend of silicone oil and octyl-ethoxysilane to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin blend.Type: GrantFiled: October 17, 2000Date of Patent: September 23, 2003Assignee: The Bergquist CompanyInventor: Sanjay Misra
-
Publication number: 20030171452Abstract: Antibacterial powder paint composition consisting mainly of polyamide, characterized in that zinc and/or silver/zinc composite compound is incorporated in polyamide as antibacterial agent. This powder coating composition can produce a film with improved antibacterial activity, discoloration and endurance.Type: ApplicationFiled: April 30, 2003Publication date: September 11, 2003Inventors: Takatoshi Kuratsuji, Hiroshi Shimizu
-
Patent number: 6617377Abstract: A resistive composition for screen printing onto a substrate. The resistive composition, based on total composition has a) 5-30 wt. % of polymer resin, b) greater than 0 up to and including 10 wt. % of thermosetting resin, c) 10-30 wt. % conductive particles selected from the group consisting of carbon black, graphite and mixtures thereof and d) 0.025-20 wt. % carbon nanoparticles, wherein all of (a), (b), (c) and (d) are dispersed in a 60-80 wt. % organic solvent.Type: GrantFiled: October 25, 2001Date of Patent: September 9, 2003Assignee: CTS CorporationInventor: Antony P. Chacko
-
Patent number: 6613829Abstract: Conductive hardening resin for a semiconductor device of the present invention contains metal powder for providing electric conduction between electrodes positioned on the front of a semiconductor chip and a wiring material including lead terminals via a conductive plate. The resin has a modulus of elasticity of 2.0×109 Pa or below when hardened. The resin prevents the contact resistance of the metal plate, lead terminals and semiconductor chip from increasing in the event of temperature cycling tests and a pressure cooker tests. Further, the resin frees the metal plate and chip from peel-off and corrosion, respectively.Type: GrantFiled: January 23, 2002Date of Patent: September 2, 2003Assignees: NEC Electronics Corporation, Sumitomo Bakelite Co., Ltd.Inventors: Akira Fukuizumi, Kazuto Oonami
-
Publication number: 20030158294Abstract: An electrically-insulating polymer-based material with improved thermal conductivity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.Type: ApplicationFiled: February 15, 2002Publication date: August 21, 2003Inventors: Arun K. Chaudhuri, Bruce A. Myers
-
Patent number: 6608129Abstract: Composites which include a polymer matrix having natural free volume therein and an inorganic or organic material disposed in the natural free volume of the polymer matrix are disclosed. In addition, methods for making a composite are described. A polymer matrix having free volume therein is provided. The free volume is evacuated, and inorganic or organic molecules are infused into the evacuated free volume of the polymer matrix. The inorganic or organic molecules can then be polymerized under conditions effective to cause the polymerized inorganic or organic molecules to assemble into macromolecular networks. Alternatively, where the polymer matrix contains a functionality, the inorganic or organic molecules can be treated under conditions effective to cause the inorganic or organic molecules to interact with the polymer matrix's functionality.Type: GrantFiled: March 22, 2000Date of Patent: August 19, 2003Assignee: Integument Technologies, Inc.Inventors: Timothy S. Koloski, Terrence G. Vargo
-
Publication number: 20030153666Abstract: In one aspect, the invention provides ink receptor compositions capable of receiving and fixing a water resistant image on a substrate without bleeding, feathering, or smudging. The ink receptor compositions comprise colloidal alumina; multivalent metal ion; hydrophilic binder; hydrophobic latex; surfactant; and optionally an image transfer aid. In other aspects, the invention provides methods of imaging substrates, ink receptor media, and ink receptor kits.Type: ApplicationFiled: January 21, 2003Publication date: August 14, 2003Applicant: 3M Innovative Properties CompanyInventor: Omar Farooq
-
Publication number: 20030153640Abstract: The present invention relates to powdered thermosetting compositions including a binder which comprises a carboxyl group containing amorphous isophthalic acid containing polyester, a carboxyl group containing semi-crystalline polyester, at least 10 parts by weight, based on the total weight of the binder, of a specific glycidyl group containing acrylic copolymer and a curing agent having functional groups reactive with the polyesters' carboxyl groups. The powdered thermosetting compositions are useful for the preparation of powdered paints and varnishes which give low gloss coatings having an outstanding flow, a remarkable weatherability and excellent mechanical properties.Type: ApplicationFiled: November 18, 2002Publication date: August 14, 2003Inventors: Luc Moens, Nele Knoops, Daniel Maetens
-
Patent number: 6605661Abstract: A structural element having a plurality of recycled, convoluted scrap metal turnings or shavings disposed randomly within a transparent plastic moldment. The turnings or shavings are interlocked with each other and with the plastic and substantially fill the moldment. A method of forming the structural element is disclosed.Type: GrantFiled: December 13, 2000Date of Patent: August 12, 2003Inventor: Demir Hamami
-
Patent number: 6599965Abstract: The invention provides a coating composition for use with metallic substrates that provides a unique balance of required properties. In particular, the coating composition of the invention simultaneously provides desirable levels of adhesion to metal, sandability without the production of harmful dust, corrosion resistance, and recoatability. The coating composition of the invention comprises a polyurethane or epoxy/amine film-forming component, and a corrosion protection component consisting of aluminum selected from the group consisting of nonleafing aluminum pigments, the corrosion protection component being present in the composition in an amount effective to prevent corrosion of the substrate. A cured film of the coating applied to a steel substrate has a pass rating after 480 hours in salt spray per ASTM B117.Type: GrantFiled: December 22, 2000Date of Patent: July 29, 2003Assignee: BASF CorporationInventors: Matthew T. Lane, David L. Newton
-
Patent number: 6596792Abstract: This thermoplastic composition and process for making articles of the same includes a thermoplastic matrix that includes a resin and filler materials wherein the filler materials includes a combination of fibers, at least one lubricant, and thermally conductive material, for improving tribological performance of thermoplastic materials. In the alternative, a thermally conductive lubricant may be substituted for the combination of the lubricant and the thermally conductive material.Type: GrantFiled: May 1, 2001Date of Patent: July 22, 2003Assignee: Caterpillar IncInventor: Kristy J. Johnson
-
Patent number: 6593410Abstract: In this method for making a sintered reactive material, fuel particles are blended with a polymer matrix comprising at least one fluoropolymer in an inert organic media to disperse the fuel particles in the polymer matrix and form a reactive material. The reactive material is dried and pressed to obtain a shaped pre-form, which is sintered in an inert atmosphere to form the sintered reactive material. By sintering in an inert atmosphere, the sintered reactive material may include reactive metals and/or metalloids in a non-oxidized state. The resulting sintered reactive material preferably has a tensile strength in excess of 1800 psi and an elongation at break in excess of 30%.Type: GrantFiled: February 21, 2001Date of Patent: July 15, 2003Assignee: Alliant Techsystems Inc.Inventors: Daniel B. Nielson, Richard L. Tanner, Gary K. Lund
-
Patent number: 6579931Abstract: Positive temperature coefficient (“PTC”) materials for use in electronic components for the protection of electrical circuits. Through the use of an organo-metallic coupling agent, the room temperature resistivity of polymeric PTC materials may be reduced. The PTC materials of the present invention include a polyolefin, a conductive filler and an organo-metallic coupling agent, and have an electrical resistivity at 25° C. of less than 1 ohm cm.Type: GrantFiled: February 25, 2000Date of Patent: June 17, 2003Assignee: Littelfuse, Inc.Inventor: Tom J. Hall
-
Publication number: 20030105206Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 &OHgr;·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.Type: ApplicationFiled: September 24, 2002Publication date: June 5, 2003Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue