Abstract: A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

Abstract: This invention relates to shape memory block copolymers comprising: at least one switching segment having a Ttrans from 10 to 70° C.; and at least one soft segment, wherein at least one of the switching segments in linked to at least one of the soft segments by at least one linkage, and wherein the copolymer transforms from a first shape to a second shape by application of a first stimulus and the copolymer transforms back to the first shape from the second shape by application of a second stimulus. The shape memory block copolymers may be biocompatible and biodegradable.

Abstract: A phenol resin molding material of the present invention includes a modified olefin-based polymer particle (I) and a phenol resin (II). Furthermore, it is preferable that the above-described modified olefin-based polymer particle (I) satisfy at least one of the following requirements (A), (B), and (C). (A) Inclusion of at least one element selected from a group consisting of a group 15 element, a group 16 element, and a group 17 element of the periodic table. (B) When the whole of the above-described olefin-based polymer particle (I) is set as 100 wt %, the content of the above-described elements is greater than or equal to 0.05 wt % and less than or equal to 50 wt %. (C) MFR which is measured under the conditions of 190° C. and 2.16 kgf based on JIS K 7210 is greater than or equal to 0.001 g/10 minutes and less than 3 g/10 minutes.

Abstract: A coating liquid for coating glass fiber cords, containing: a chlorophenol-formaldehyde condensate (A) obtained by condensing a chlorophenol (D) and formaldehyde (E) in water; an emulsion of a vinylpyridine-styrene-butadiene copolymer (B); and an emulsion of a chlorosulfonated polyethylene (C).

Abstract: A phenolic resin molding compound, which is thermally stable in a heating cylinder, is provided. By using the phenolic resin molding compound, moldings with an excellent dimensional precision can be obtained. The phenolic resin molding compound comprises: (A) a novolac phenolic resin with an o/p ratio (ortho/para ratio) of 0.7 to 0.9; (B) a novolac phenolic resin with an o/p ratio of 1.1 to 1.3; (C) talc; and (D) a polyethylene or polyethylene/polypropylene copolymer. The amount of (D) the polyethylene or polyethylene/polypropylene copolymer relative to a total weight of the phenolic resin molding compound is 0.5 to 1.5 weight %. It is preferable that the total amount of (A) and (B) is 20 to 40 weight %, and the amount of (C) is 5 to 15 weight %.

Abstract: The invention relates a mixture of a urethane-aldehyde resin UA prepared by condensation of an aldehyde A1 and an alkyl urethane U, and of a novolak PA, to a process for the preparation of the said mixture, and a method of use thereof as adhesion promoter in rubber goods.

Abstract: Binder compositions for making fiberglass products and methods for making and using same are provided. The binder composition can include a phenol-aldehyde resin or a mixture of Maillard reactants and one or more modifiers selected from the group consisting of a copolymer comprising one or more vinyl aromatic derived units and at least one of maleic anhydride and maleic acid; an adduct of styrene, at least one of maleic anhydride and maleic acid, and at least one of an acrylic acid and an acrylate; and one or more latexes.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4?-dihydroxy-2,2?-diphenylpropane (C) a quinonediazide group-containing compound.

Abstract: There is disclosed a method for producing a thermoplastic elastomer composition, the method involving subjecting an ethylene-?-olefin-based copolymer rubber (A) and a polyolefin-based resin (B) in the presence of an alkylphenol resin (C) and a metal halide (D) to dynamic thermal treatment within a melt-kneading apparatus, wherein the metal halide (D) is a powder, and a mixture of a powder of the metal halide (D) and a particle having a volume-average particle diameter of 0.1 ?m to 3 mm is continuously fed to the melt-kneading apparatus.

Abstract: Compositions comprising a novolac polymer, an olefin-based polymer with an epoxy group, a filler and optionally a thermoplastic polymer are provided. The compositions may be halogen-free. The present compositions exhibit excellent compatibility between the novolac polymer and the olefin-based polymer with an epoxy group resulting in compositions with superior mechanical properties.

Abstract: A wax extender may be employed in the manufacture of particle board, and oriented strand board to reduce the content of the wax in favor of a copolymer prepared by copolymerizing vinyl acetate with a hydrophobic reactive comonomer. The hydrophobic reactive comonomer may have the general formula: wherein R1 is a hydrophobic group having from about 4 to about 25 carbons; and R2, R3 and R4 are independently hydrogen or a methyl group subject to the limitation that at least one of these is hydrogen.

Abstract: Binder compositions for making fiberglass products and methods for making and using same are provided. The binder composition can include a phenol-aldehyde resin or a mixture of Maillard reactants and one or more modifiers selected from the group consisting of a copolymer comprising one or more vinyl aromatic derived units and at least one of maleic anhydride and maleic acid; an adduct of styrene, at least one of maleic anhydride and maleic acid, and at least one of an acrylic acid and an acrylate; and one or more latexes.

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.

Abstract: Fiberglass mats, binder compositions, and methods for making the same are provided. The fiberglass mat can include a plurality of glass fibers and an at least partially cured binder composition. The binder composition, prior to at least partial curing, can include a first copolymer modified by reaction with one or more base compounds. The first copolymer can include one or more unsaturated carboxylic acids, one or more unsaturated carboxylic anhydrides, or a combination thereof, and one or more vinyl aromatic derived units. The first copolymer can have a weight average molecular weight (Mw) of about 500 to about 200,000. The first copolymer can be present in an amount ranging from about 60 wt % to about 95 wt %, based on a combined weight of the first copolymer and the one or more base compounds.

Abstract: The present invention provides a resin composition suitable for printed circuit boards, the composition includes one epoxy resin or the mixture thereof, curing agent, promoting agents and additives, wherein the ratio of curing agent to epoxy resin is 1.55˜2.5, in which epoxy resin consists of at least one of phenol-formaldehyde multi-functional epoxy resin; curing agent comprises at least one of styrene-maleic anhydride copolymer. After hardening, this resin composition has excellent electrical properties, high glass transition temperature and excellent heat-resistant properties, applicable to the lead-free printed circuit board manufacturing process, and in the field of the high-frequency and packaging-board containing printed circuit boards.

Abstract: Provided are a functional molded article having sufficient flexibility and moldability and also sufficiently having the function of a functional particle, and a method for producing the same. The functional molded article is formed by molding a mixture containing a functional particle, a binder, and a fibrous substance.

Abstract: Compositions comprising a novolac polymer, an olefin-based polymer with an epoxy group, a filler and optionally a thermoplastic polymer are provided. The compositions may be halogen-free. The present compositions exhibit excellent compatibility between the novolac polymer and the olefin-based polymer with an epoxy group resulting in compositions with superior mechanical properties.

Abstract: A cross-linked thermoplastic polyurea is formed by heating a mixture containing a thermoplastic urethane base material, a monomeric and/or polymeric di-isocyanate comprising between 1 to 10% of the total weight of the mixture, and a diamine comprising between 1 to 10% of the total weight of the mixture. A thermoplastic polyurethane may be formed by substituting hydroquinone for the diamine. The mixture is heated to a temperature within the range of 250° F. to 550° F. The heated mixture, which is flowable, is then injected into at least one injection molding device. The mixture is then cured at a temperature between 150° F. to 250° F. for a period of time between 2 and 36 hours. The cross-linked thermoplastic polyurethane/polyurea retains the excellent flowability characteristics of a thermoplastic urethane while the same time exhibits good abrasion, tensile strength, rebound, and compression set characteristics which are similar to those found in thermoset urethanes.

Abstract: Disclosed herein is a scratch resistant flame retardant thermoplastic resin composition comprising: 100 parts by weight of a base resin comprising (A) about 1 to about 99% by weight of a polycarbonate resin and (B) about 99 to about 1% by weight of a modified methacrylate resin; and (C) about 1 to about 50 parts by weight of a flame retardant.

Abstract: A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate.

Abstract: Binder compositions for making fiberglass products and methods for making and using same are provided. The binder composition can include a phenol-aldehyde resin or a mixture of Maillard reactants and one or more modifiers selected from the group consisting of a copolymer comprising one or more vinyl aromatic derived units and at least one of maleic anhydride and maleic acid; an adduct of styrene, at least one of maleic anhydride and maleic acid, and at least one of an acrylic acid and an acrylate; and one or more latexes.

Abstract: The present invention provides compositions such as a polymer grout, a molded plastic part, a void-filling plastic material, a concrete-anchoring material and a polymeric casting made from a thermosetting polymer chosen from vulcanized rubbers, polyoxybenzylmethylen-glycolanhydride (“Bakelite”), novolac resins, resole phenolic resins, duroplast, bismaleimide resins, polyimide resins, melamine, acrylic resins, polyester resins, cyanate ester resins, phenolic triazine resins, paracyclophane resins and epoxy resins and at least one phase change material (“PCM”). The compositions of the present invention have a lowered exotherm compared to compositions made from the same thermosetting polymer without the addition of a phase change material. Also provided are improved processes for producing the inventive compositions.

Abstract: Polyamide materials having high fluid, e.g., gas, and liquid barrier properties are useful as articles for containing or conveying fluids, in particular tubes, ducts or tanks.

Abstract: An aqueous ink composition comprising at least water, a pigment dispersed by polymer, a sulfonyl group-containing (co)polymer, and an ultra-penetrating agent. Also disclosed are a recording process using the ink composition, an ink cartridge containing the ink composition, and a recorded article having an image recorded by the recorded method.

Abstract: A coating composition is disclosed, comprising a binder component having hydroxyl-functional groups; a curing agent having functional groups, wherein the functional groups of the curing agent are reactive with the hydroxyl-functional groups of the binder component; and pulverized rubber, the pulverized rubber having particles with a size suitable for spraying the coating.

Abstract: The present invention relates to a styrenic thermoplastic resin composition, and more particularly to a styrenic thermoplastic resin composition comprising a non-halogen flame-retardant having superior flame-retarding properties and impact strength. The present invention provides a flame-retarding styrenic thermoplastic resin composition comprising a) 100 weight parts of a base resin comprising i) 10 to 50 weight parts of a rubber-modified styrene-containing graft copolymer, ii) 5 to 20 weight parts of phenol novolac resin, and iii) 20 to 70 weight parts of a styrene-containing copolymer; and b) 5 to 20 weight parts of an aromatic phosphate. In addition, the a) base resin may further comprise iv) 10 to 40 weight parts of a thermoplastic polyurethane resin.

Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.

Abstract: The present invention relates to a halogen-free phosphorous epoxy resin composition, primarily used as an adhesive for the printed circuit board. The composition comprises a halogen-free phosphorous contained epoxy resin which reduces the addition amount of additional flame retardant; in order to offer flame retardancy while maintaining high flexibility of flexible printed circuit board.

Abstract: To provide an aqueous ink composition which, without impairing ejection stability, is excellent in light-fastness and water-fastness, does not cause cohesion differential, gloss differential, bronzing phenomenon, color-bleeding, and the like, and has improved fixing ability and coloring property. An aqueous ink composition comprising at least water, a pigment dispersed by polymer, a sulfonyl group-containing (co)polymer, and an ultra-penetrating agent.

Abstract: The present invention relates to a styrenic thermoplastic resin composition, and more particularly to a styrenic thermoplastic resin composition comprising a non-halogen flame-retardant having superior flame-retarding properties and impact strength. The present invention provides a flame-retarding styrenic thermoplastic resin composition comprising a) 100 weight parts of a base resin comprising i) 10 to 50 weight parts of a rubber-modified styrenic-containing graft copolymer, ii) 5 to 20 weight parts of phenol novolac resin, and iii) 20 to 70 weight parts of a styrene-containing copolymer; and b) 5 to 20 weight parts of an aromatic phosphate. In addition, the a) base resin may further comprise iv) 10 to 40 weight parts of a thermoplastic polyurethane resin.

Abstract: Self-coating or self-layering lacquer systems from at least two different resins, oligomers, or polymers, which are emulsifiable or dispersible in water, have different surface tensions, and form self-layering phases. After the application, the phases separate into the components of the formulation.

Abstract: A method for bonding two substrates that includes applying an autodepositable adhesive to one of the substrates and then bonding the substrates together. This method is especially useful for bonding elastomers to metals. According to a first embodiment, the autodepositable adhesive is a one coat adhesive having a low pH (approximately 1-3) and including (A) a flexibilizer or film-former, (B) optionally, an aqueous dispersion of a phenolic resin that includes water and a reaction product of a phenolic resin precursor, a modifying agent and, optionally, a multi-hydroxy phenolic compound wherein the modifying agent includes at least one functional moiety that enables the modifying agent to react with the phenolic resin precursor and at least one ionic moiety, and (C) an acid.

Abstract: An initial solids mixture for a later organic coating, such as pigmented coatings, films, priming coats, etc., e.g., for a coil coating method in which an initial solids mixture is applied to a substrate, e.g., broad strip, and this is thereby pre-coated, wherein the initial solids mixture includes, as additive particles, boron carbide and/or silicon carbide and/or compounds of transition elements or lanthanides, the electrical conductivity of which is selected to be in the metallic range (?>102 1/?cm and ?<107 1/?cm), during the later coating, the additive particles have a continuous physical connection in at least one spatial direction.

Abstract: A water-based coating composition suitable for preparing hydrophilic surfaces on various articles is provided which includes a supporting polymer having functional moieties capable of undergoing crosslinking reactions, said supporting polymer soluble in or emulsified in an aqueous based medium; and a hydrophilic polymer, said hydrophilic polymer associated with the supporting polymer. The composition is characterized in that, when crosslinked at the functional moieties, the supporting polymer forms a three-dimensional network which substantially minimizes disassociation of the hydrophilic polymer.

Abstract: A process for forming a planarization film on a substrate that does not smoke or fume on heating includes applying a polymeric solution including a novolac resin having a weight average molecular weight between about 1000 and 3000 amu, which has been fractionated to remove molecules with molecular weight below about 350 amu, a surfactant selected from a group consisting of a non-fluorinated hydrocarbon, a fluorinated hydrocarbon and combinations thereof, and an optional organic solvent to a substrate, followed by heating the substrate.

Abstract: An aqueous composition that includes (A) a butadiene polymer latex that is prepared by an emulsion polymerization in the presence of a styrene sulfonate stabilizer and (B) a phenolic resin. A preferred aqueous butadiene polymer latex is one that is prepared by emulsion polymerization of at least 60 weight percent dichlorobutadiene monomer (based on the amount of total monomers used to form the butadiene polymer), in the presence of a styrene sulfonate stabilizer.

Abstract: A phenolic molding composition containing 40 to 100 parts by weight of inorganic fiber, 30 to 90 parts by weight of natural silica powder with a mean particle size of from 20 to 150 &mgr;m, and 1 to 15 parts by weight of a rubber component, as main components, in 100 parts by weight of resol-based phenolic resin. Preferably, the inorganic fiber contains 50% or more by weight of glass fiber. Further preferably, the natural silica powder is shaped like pulverized powder. A pulley is molded of a phenolic molding composition defined above.

Abstract: The disclosure relates to a process for improving the processability, storage stability and/or cure rate of an uncured silica reinforced rubber composition where silica comprises the major filler in the reinforced rubber composition, which comprises combining a mixture comprising, rubber, silica and at least one organic compound having a low molecular weight and a functional group wherein said functional group is at least an epoxy group, such as an epoxy/ether, epoxy/hydroxyl, epoxy/ester, epoxy/amine, ether/amine, episulfide, episulfide/ether, episulfide/ hydroxyl, episulfide/ester functional group located in a terminal or sterically unhindered position in ii the molecule of said organic compound where the molecular weight of said organic compound having a low molecular weight is less than 7,000, or the organic compound comprises an abietyl, styrenated resorcinol formaldehyde, or ester hydroxyl organic compound having a hydroxyl, ester, and optionally, an ether group, such as an ester diol.

Abstract: An aqueous adhesive composition, as for bonding nitrile rubbers to a metal substrate, has very good pre-bake resistance. The adhesive composition comprises a phenolic novolac or resole resin, chlorinated natural rubber, a reactive fillers, and precipitated silica. Utilization of the adhesive composition results in essentially failure of the nitrile rubber.

Abstract: A process for producing fiberboard panels includes I. gluing cellulosic fibers with an aqueous glue solution and adjusting the moisture content of the cellulosic fibers and/or the water content of the glue such that the moisture content of the glued cellulosic fibers is not more than 150%; and II. compressing the glued cellulosic fibers produced in step (I) at elevated temperature to fiberboard panels.

Abstract: Polyetherimide compositions having low warp and conductive properties are provided. The compositions are prepared by combining a polyetherimide resin or polyetherimide-copolymer resin and a filler wherein the filler comprises a plate-like filler and a conductive filler.

Abstract: A process for forming a planarization film on a substrate that does not smoke or fume on heating includes applying a polymeric solution including a novolac resin having a weight average molecular weight between about 1000 and 3000 amu, which has been fractionated to remove molecules with molecular weight below about 350 amu, a surfactant selected from a group consisting of a non-fluorinated hydrocarbon, a fluorinated hydrocarbon and combinations thereof, and an optional organic solvent to a substrate, followed by heating the substrate.

Abstract: 2-Hydroxybenzophenone derivatives substituted in the 4′-position by a thioether moiety exhibit enhanced absorption in the UV at longer wavelength. Compositions comprising organic material subject to actinic degradation are beneficially stabilized with such derivatives.

Abstract: A non-erasable liquid ink for a marking instrument including a colorant and a solvent and having a water content of about 0-15% by weight and a viscosity of about 15 to 4,500 cps. Also disclosed is a marking instrument filled with an ink of such a viscosity or lower in its reservoir.

Abstract: What is disclosed is an adhesive composition that exhibits substantial durability in bonding peroxide cured elastomers to many substrates. The invention is directed to adhesives consisting essentially of a diluent, a maleimide compound, acid scavenger, a polymeric film former and precipitated silica, optionally a phenolic resole, polyyisocyanate, or isocyanatosilane. The present invention is further directed to a method of bonding peroxide-curable elastomers to metallic surfaces whereby the substrate ius coated with the adhesive composition, drying the adhesive composition coating, applying a peroxide-cured elastomer to the adhesive composition coating, and curing the assembly with heat and/or pressure.

Abstract: A process for forming a planarization film on a substrate that does not smoke or fume on heating includes applying a polymeric solution including a novolac resin having a weight average molecular weight between about 1000 and 3000 amu, which has been fractionated to remove molecules with molecular weight below about 350 amu, a surfactant selected from a group consisting of a non-fluorinated hydrocarbon, a fluorinated hydrocarbon and combinations thereof, and an optional organic solvent to a substrate, followed by heating the substrate.

Abstract: A pressure-sensitive adhesive material comprises a pressure-sensitive adhesive layer comprising 100 parts by weight of natural rubber and 10 to 120 parts by weight of styrene-isoprene-styrene block copolymer (SIS) having a radiate configuration with a styrene content of 10 to 45% by weight. Preferably, the pressure-sensitive adhesive layer is free of metals or metal compounds. The pressure-sensitive adhesive layer may contain 5 to 150 parts by weight of a tackifier having an acid value of 1.5 or more. The pressure-sensitive adhesive material includes (A) a backing-less tape having a release liner having on one surface thereof the pressure-sensitive adhesive layer and (B) a double-coated tape having a backing having respective pressure-sensitive adhesive layers on surfaces thereof, at least one of which is constituted by the pressure-sensitive adhesive layer of the above-described type.

Abstract: Water-borne base coats, the resin solid of which contain 40 to 90 wt-% of a water-dilutable polyester binder, 0 to 50 wt-% of one or more additional binders, 0 to 20 wt-% of one or more paste resins and 10 to 40 wt-% of one or more cross-linking agents, wherein the water-dilutable polyester binder has a weight average molecular mass of 5000 to 50000, an acid value of 10 to 50 mg KOH/g, a hydroxyl value of 30 to 100 mg KOH/g and an average hydroxyl-functionality of 2 to 3 and consists of 5 to 25 wt-% of structural units —O—R—O— derived from one or more macrodiols having a hydroxyl value of 25 to 120 mg KOH/g, wherein R represents residues located between the terminal hydroxyl groups of the one or more macrodiols, are suitable for preparing water-borne base coat/clear coat-two-layer coatings, in particular water-borne base coat/powder clear coat two-layer coatings.

Abstract: Solvent-free applicable curable coating material containing as binder inorganic polymers and/or organic polymers, cross-linkers and sliding aids.

Abstract: A low-solvent aqueous binder includes: a water-insoluble synthetic resin component A; and an emulsifier resin B in a mass ratio of A to B of from 70:30 to 30:70. The emulsifier resin B is a reaction product of a water-insoluble synthetic resin B1 that includes hydroxyl groups as functional groups, a synthetic resin B2 that includes carboxyl groups as functional groups, and a neutralizing agent for the carboxyl groups of B. The amount of the neutralizing agent is such that the neutralizing agent is able to neutralize from 5 to 200% of the carboxyl groups of B. A process for preparing a low-solvent aqueous binder includes: mixing the water-insoluble synthetic resin component B1 comprising hydroxyl functional groups and the synthetic resin B2 in bulk or dissolved in an organic solvent to form a mixture; removing the solvent by applying subatmospheric pressure and heating until the content of the mixture is at least 85% by mass; maintaining the mixture at a temperature from 90° to 150° C.