Abstract: The present invention provides a polyamide resin composition containing (A) a crystalline polyamide resin containing a polycapramide resin as a main component, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the polyamide resin composition contains, as the (C), (C-1) a glass fiber, (C-2) a wollastonite having a needle shape, and (C-3) an inorganic reinforcing material of a plate-like crystal; a mass ratio of the (B) to (A) satisfies 0.35?(B)/(A)?0.80; when a total content of the (A), (B), and (C) is 100 parts by mass, a content (parts) of each component satisfies 30?(A)+(B)?55; 10?(B)?23; 20?(C-1)?40; 8?(C-2)?25; 8?(C-3)?25; 45?(C-1)+(C-2)+(C-3)?70; and an amount of a carboxyl group in the polyamide resin composition is less than 120 meq/kg.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and external electrodes respectively on two end surfaces of the multilayer body and connected to the internal electrode layers, an interposer at a board mounting surface of the capacitor main body, and an insulating resin film in a gap between the board mounting surface and a capacitor-facing surface of the interposer which is opposed to the board mounting surface.

Abstract: The invention relates to a composition comprising at least one first polyamide, conforming to the formula MXD·10 or MXD·10/Z and having a melting temperature Tf1, and at least one second polyamide. Said at least second polyamide has a melting temperature Tf2 such that Tf1?40° C.?Tf2<Tf1+20° C. The invention likewise relates to an article obtained from such a composition, to a method of shaping such an article, and to the use of such a composition and of such an article.

Abstract: A base die is configured to: receive a first data and a first encoded data in a writing phase and perform a first error checking and correction processing, where the first encoded data is obtained by performing a first error correction code (ECC) encoding processing on the first data; perform a second ECC encoding processing on the first data on which the first error checking and correction processing has been performed, to generate a second encoded data; and choose to transmit a to-be-written data to a memory die based on a selection signal in the writing phase, where the to-be-written data is either an initial data or a second data; and choose to transmit the initial data or third data in a reading phase based on a selection signal.

Abstract: A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa·s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

Abstract: There is provided a low-viscosity resin composition having high mechanical strength when formed into a molded article and having excellent fluidity, and a molded article formed from the resin composition.

Abstract: A resin composition resulting in a cured article which is excellent in balance among mechanical strength, surface smoothness, and light transmittance, a method for producing a cured article, a cured article, and a flexible substrate or flexible display including the cured article. The resin composition includes a polyamic acid having a structural unit represented by the following formula (1), a cellulose compound having a weight average molecular weight of 60,000 or less, and an organic solvent. In the formula (1), A is a tetravalent organic group and B is a divalent organic group.

Abstract: The present invention relates to an extrudable polymer composition comprising: 99.5 to 99.95% of at least one hard-soft block copolymer comprising: at least 25% by weight of soft block polyethylene glycol (PEG) with functionality equal to 2, with respect to the total weight in copolymer; from 0.05 to 0.5% by weight of at least one polyol comprising at least three hydroxyl groups, with respect to the total weight of the composition; characterised in that: the weight-average molecular mass of said copolymer is at least equal to 100,000 g/mol; and the weight-average molecular mass of the polyol is at least equal to 1000 g/mol; and said at least one polyol binding hard copolymer blocks by ester bonds. This invention relates in particular to the use of said composition in extrusion processes for manufacturing vapour-permeable objects.

Abstract: A powder coating composition can include: a polyester polymer comprising carboxylic acid functional groups; a crosslinker reactive with the carboxylic acid functional groups of the polyester polymer; and a thermoplastic fluoropolymer unreactive with the polyester polymer and crosslinker. The powder coating composition is substantially free of an isocyanate functional crosslinker.

Abstract: An impregnated fibrous material comprising a fibrous material made of continuous fiber and at least one thermoplastic polymer matrix, wherein the at least one thermoplastic polymer is an non-reactive amorphous polymer, the glass transition temperature of which is such that Tg?80° C., or a non-reactive semi-crystalline polymer, the melting temperature of which is Tf?150° C., the fiber volume ratio is constant in at least 70% of the volume of the tape or ribbon, the fiber ratio in the pre-impregnated fibrous material ranging from 45 to 65% by volume, the porosity rate in the pre-impregnated fibrous material being less than 10%.

Abstract: A high-frequency and high-transmission speed FPC with FRCC. The FPC includes FRCC and a double-sided board laminated again each other. The FRCC includes a third copper foil layer, a second ultra-low dielectric adhesive layer and a second insulating layer located between the third copper foil layer and the second ultra-low dielectric adhesive layer. One surface of the third copper foil layer is an inner surface. The double-sided board includes a first copper foil layer, a second copper foil layer and a first insulating layer located between the first copper foil layer and the second copper foil layer. An inner surface of the first copper foil layer has an Rz value of 0.05-0.5 ?m. An inner surface of the second copper foil layer has an Rz value of 0.1-1.10 ?m. The FPC has a good electrical property, a simple structure, a cost advantage, a brief preparation process, and a low thermal expansion coefficient.

Abstract: A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): wherein Y1 and Y2 are independently —H, —CH3, or —CH2CH3; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.

Abstract: The present invention refers to a polyamide moulding composition consisting of the following components: a) 45 to 75% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 18 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines and cycloaliphatic diamines, b) 5 to 20% by weight of at least one fibrous reinforcing agent, c) 10 to 40% by weight of at least one non-sized filler which is different from the fibrous reinforcing agent in b), d) 0 to 10% by weight of a at least one additive, with the proviso that the component b) and c) add up to 25 to 45% by weight and the entirety of components a) to d) add up to 100% by weight. Moreover, the present invention refers to a moulded article producible from this moulding composition.

Abstract: A thermoplastic composition includes 35-95 weight percent of a poly(etherimide-siloxane) copolymer having a siloxane content of more than 0 to less than 50 weight percent based on the total weight of the poly (etherimide-siloxane) copolymer, 5-65 weight percent of a polyester, and 0-20 weight percent of one or more additives, wherein the weight percent of each component is based on the combined weight of the polymer components. An electrical wire including a wire conductor and a coating including the thermoplastic composition and an article including the electrical wire are also described.

Abstract: A thermoplastic composition is described herein including a first polyetherimide sulfone having a glass transition temperature of 250 to 290° C., and a second polyetherimide sulfone having a glass transition temperature of 230 to 249° C. The composition has an advantageous combination of optical properties including improved yellowness index, transmission, and haze. A method of manufacturing the thermoplastic composition and articles including the thermoplastic composition are also described. A method for improving the optical properties of a thermoplastic composition is also disclosed, where the method includes melt mixing the first and second polyetherimide sulfones, each having a glass transition temperature as defined herein. The method provides a composition having at least one of improved yellowness, haze, and transmission.

Abstract: The present invention relates to a polyamide resin composition, which not only demonstrates superior mechanical properties but also has favorable moldability and superior thermal conductivity, wherein the polyamide resin composition comprises (A) a polyamide resin, (B) glass fibers, (C) a thermally conductive filler, and (D) a polyamide elastomer, and the amount of the component (B) based on 100 parts by mass of the total amount of the components (A), (B), (C) and (D) is 9 parts by mass to 35 parts by mass; and, a molded article comprising the same.

Abstract: The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.

Abstract: A multilayer injection molded article containing a layer (X) formed of a resin composition containing a polyamide compound (A) and a resin (B), and a layer (Y) containing a resin (C) as a major component, wherein the polyamide compound (A) contains from 25 to 50% by mol of a diamine unit, which contains a particular diamine unit in an amount of 50% by mol or more; from 25 to 50% by mol of a dicarboxylic acid unit, which contains a particular dicarboxylic acid unit in an amount of 50% by mol or more; and from 0.1 to 50% by mol of a particular constitutional unit.

Abstract: A multilayer injection molded article containing a layer (A) containing a polyamide resin (A), and a layer (B) containing a resin (B) as a major component, wherein the polyamide resin (A) contains from 25 to 50% by mol of a diamine unit, which contains a particular diamine unit in an amount of 50% by mol or more; from 25 to 50% by mol of a dicarboxylic acid unit, which contains a particular dicarboxylic acid unit in an amount of 50% by mol or more; and from 0.1 to 50% by mol of a particular constitutional unit.

Abstract: An injection molded article containing a resin composition containing a polyamide compound (A) and a resin (B), wherein the polyamide compound (A) contains from 25 to 50% by mol of a diamine unit, which contains a particular diamine unit, in an amount of 50% by mol or more; from 25 to 50% by mol of a dicarboxylic acid unit, which contains a particular dicarboxylic acid unit, in an amount of 50% by mol or more; and from 0.1 to 50% by mol of a particular constitutional unit.

Abstract: A resist underlayer film-forming composition containing a copolymer having a structural unit of Formula (1) and a structural unit of Formula (2), a cross-linkable compound, a cross-linking catalyst, and a solvent. wherein A is a divalent organic group containing a triazine ring, X1 is an —S— group or an —O— group, Q is a linear, branched, or cyclic hydrocarbon group having a carbon atom number of 1 to 15, the hydrocarbon group may have at least one sulfur atom or oxygen atom in a main chain and at least one hydroxy group as a substituent, n is 0 or 1, R1 and R2 are each independently a C1-3 alkylene group or a single bond, Z is a divalent group having at least one sulfur atom or oxygen atom, and when X1 is an —O— group, Z is a divalent group having at least one sulfur atom.

Abstract: A wire harness includes a metal pipe; a high-voltage conductive path; and another conductive path. Another conductive path is configured as an unshielded electric wire. The high-voltage conductive path includes a high-voltage circuit; a shielding member; and an insulating member.

Abstract: Provided is a polyamide resin having excellent color tone and elastic modulus, excellent gas barrier properties and low water absorption. The polyamide resin comprises a diamine structural unit and a dicarboxylic acid structural unit, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A-1) and/or bis(aminomethyl)cyclohexane (A-2) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), characterized in that it has a sulfur atom concentration of 1 to 200 ppm by mass.

Abstract: The invention relates to compositions based on polyamide blends and additives, to the use of these compositions in moulding compositions for production of products having short-term heat distortion resistance, and to a process for producing polyamide-based products having short-term heat distortion resistance, especially for electrics or electronics applications.

Abstract: A fuser member including a substrate and a release layer disposed on the substrate is provided. The fuser member includes a substrate and a release layer disposed on the substrate. The release layer includes non-woven polymer fibers having graphene particles dispersed along the fibers. A method of manufacturing the release layer is provided.

Abstract: A resin composition comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit represented by formula (III), wherein the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol %.

Abstract: Provided is a heat-resistant resin composite excellent in heat resistance and bending properties. This heat-resistant resin composite is constituted of a matrix resin and reinforcing fibers dispersed in the matrix resin. The matrix resin is constituted of a heat-resistant thermoplastic polymer having a glass transition temperature of 100° C. or higher, and a polyester-based polymer comprising a terephthalic acid unit (A) and an isophthalic acid unit (B) at a copolymerization proportion (molar ratio) of (A)/(B)=100/0 to 40/60. The proportion of the heat-resistant thermoplastic polymer in the composite is 30 to 80 wt %.

Abstract: Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend of insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.

Abstract: Polyamide molding materials for transparent molding parts. The materials comprise transparent copolyamides that contain: (A) 40 to 100 wt % of at least one transparent copolyamide with a glass transition temperature (Tg) of at least 80° C. and not more than 150° C., composed of at least two diamines that are different from each other, wherein the at least two diamines are a mixture of (a) 50 to 90 mol % bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-3-ethylcyclohexyl)methane (EACM) and/or bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and b) 10 to 50 mol % aliphatic diamine having 9 to 14 carbon atoms, in particular decandiamine, particularly preferably at least 20 mol % decandiamine, each relative to the total amount of diamines, and of one or more aliphatic dicarboxylic acids, having 6 to 36 carbon atoms, (B) 0 to 60 wt % of at least one further polymer, (C) 0 to 10 wt % of additives, the sum of the components (A), (B) and (C) totaling 100% by weight.

Abstract: There is provided a reinforcing carbon fiber bundle of the present invention is a reinforcing carbon fiber bundle with a sizing agent adhered to surfaces of carbon fibers, and characterized in that the sizing agent is constituted by at least two components, a first component does not melt at 150° C., and a second component in flowable at 150° C., and the reinforcing carbon fiber bundle is improved in impregnation property and openability and is excellent in workability and optimum for a composite.

Abstract: The present invention generally relates to polyamide compositions having improved anti-delamination. More specifically, the present invention relates to novel polyamide compositions demonstrating improved anti-delamination, in which the compositions have at least one reinforcement agent.

Abstract: An object of the present invention is to provide a photo-aligning liquid crystal aligning agent for forming a liquid crystal alignment layer capable of materializing a liquid crystal display device which has a high transmittance while maintaining a liquid crystal aligning property, a voltage holding ratio and the like and in which flickering is inhibited from being caused after operated for a long time.

Abstract: A polyamide molding composition is described comprising the following components (A)-(C) in the following composition, where the entirety of components (A), (B) and (C) gives 100% by weight: (A) from 25 to 75% by weight of at least one transparent copolyamide composed of (a) from 50 to 90 mol % of a cycloaliphatic diamine selected from the group consisting of: bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4-amino-3-ethylcyclohexyl)methane (EACM), bis(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and mixtures thereof and (b) from 10 to 50 mol % of an unbranched, aliphatic diamine, based in each case on the total amount of diamines, and also (c) of one or more aliphatic and cycloaliphatic dicarboxylic acid(s), (B) from 25 to 75% by weight of at least one further polyamide of PAXY type, where X and Y can assume, independently of one another, the values from 9 to 14, (C) from 0 to 10% by weight of additives.

Abstract: The invention relates to a copolyamide comprising at least two different units corresponding to the following general formulation: A/X.T A is chosen from a unit obtained from an amino acid, a unit obtained from a lactam and a unit corresponding to the formula (Ca diamine).(Cb diacid), with a representing the number of carbon atoms of the diamine and b representing the number of carbon atoms of the diacid, a and b each being between 4 and 36, advantageously between 9 and 18, X.

Abstract: A composition, containing at least 50% by weight of a polyamide fraction which comprises: a) from 50 to 95 parts by weight of a polyamide having as copolymerized units bis(4-aminocyclohexyl)methane (PACM) and a linear dicarboxylic acid having from 8 to 18 C atoms; and b) from 50 to 5 parts by weight of a linear aliphatic polyamide having an average of from 8 to 12 C atoms in the monomer units, where the sum of the parts by weight of a) and b) is 100 is provided. The composition can be processed to give a moulded article having high transparency, high toughness and high resistance to chemicals, to solvents and to stress cracking.

Abstract: Thermoplastic polymer mixture (M) comprising at least one poly(aryl ether ketone) (P1), at least one poly(arylene sulfide) (P2), and between 0 and 25 wt. % of the total weight of the thermoplastic mixture (M), of a thermoplastic polymer material (P3) consisting of (i) at least one poly(biphenyl ether sulfone) (P3a), and/or (ii) at least one poly(ether imide) (P3b), and/or at least one poly(ether imide sulfone) (P3c), wherein: the combined weight amount of the poly(aryl ether ketone) (P1) and the poly(arylene sulfide) (P2), based on the total weight of the polymer mixture (M), is of at least 30%, and the weight amount of the poly(aryl ether ketone) (P1), based on the combined weight of the poly(aryl ether ketone) (P1) and the poly(arylene sulfide) (P2), is of at most 90%.

Abstract: The invention relates to a polyesteramide resin containing ester groups and at least one amide group in the back-bone characterized in that it has at least one hydroxyalkylamide endgroup, and a Tg<0° C.

Abstract: Disclosed herein are methods and fiber reinforced thermoplastic composition comprising: a polyaryletherketone (PAEK) component; a polyimide component, wherein the polyimide component comprises a blend of at least a first polyimide (PI) having glass transition temperature of at least 300° C. and a second polyimide (PI) having glass transition temperature less than the glass transition temperature of the first polyimide; and a reinforcement fiber component. The resulting fiber reinforced thermoplastic compositions exhibit improved mechanical performance.

Abstract: The present invention relates to a thermoplastic molding composition comprising the following components: A) 20 to 98.99% by weight of at least one polyamide, B) 0.01 to 40% by weight of at least one branched polyimide selected from condensates of either b1) at least one polyisocyanate having an average of more than two isocyanate groups per molecule or b2) at least one polyamine having an average of more than two amino groups per molecule and b3) at least one polycarboxylic acid having at least three COOH groups per molecule or its anhydride C) 1 to 59% by weight of at least one flame retardant selected from the group of c1) phosphorus-containing flame retardants c2) nitrogen-containing flame retardants and mixtures of these, D) 0 to 50% by weight of further additives, where the total of the proportions by weight is 100% by weight based on the molding composition.

Abstract: A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.

Abstract: Polymeric particles having a size of about 0.1 to about 100 microns comprising at least two different phase separated polymers, at least one pigment, and at least one additive, where the pigment and additive are distributed within the phase separated polymers. Also disclosed are methods for preparing polymeric particles comprising phase separated polymers that comprise additives and pigments, wherein the methods involve molding.

Abstract: A phenolic compound for manufacturing a modified polyamide that has an increased degree of crystallinity is described. A polyamide composition comprising at least one such phenolic compound and optionally reinforcing fillers or extenders is also described. The composition is preferably a composition to be molded, for example in the form of granules or powder, that is used for the manufacture of articles by an injection-molding process.

Abstract: A porous polyimide film having a three-layer structure that comprises two surface layers (a) and (b) and a macrovoid layer sandwiched between the surfaces layers (a) and (b). The macrovoid layer has a partition wall bonding to the surface layers (a) and (b), and multiple macrovoids each surrounded by the partition wall and the surface layers (a) and (b) and having a mean pore size in the film plane direction of from 10 to 500 ?m. The partition wall of the macrovoid layer has a thickness of from 0.1 to 50 ?m and has multiple pores having a mean pore size of from 0.01 to 50 ?m. The surface layers (a) and (b) each have a thickness of from 0.1 to 50 ?m, at least one of the surface layers has multiple pores having a mean pore size of from more than 5 ?m to 200 ?m, and the other surface layer has multiple pores having a mean pore size of from 0.01 to 200 ?m.

Abstract: A colored polyimide film includes a polyimide polymer obtained by reacting diamine monomers with dianhydride monomers, wherein the diamine monomers are oxydianiline (ODA) and phenylene diamine (PDA) monomers, and the dianhydride monomers are pyromellitic dianhydride (PMDA); a matting agent comprised of polyimide particles; and one or more color pigment. The polyimide films described herein have low gloss, low transparency, and low coefficient of thermal expansion.

Abstract: A tube connector made from a polyamide composition, the polyamide composition including at least one first polyamide A having an average number of carbon atoms per nitrogen atom CA and at least one second polyamide B having an average number of carbon atoms per nitrogen atom CB, wherein CA?8.5 and CB?7.5, and wherein CA<CB. The composition may include a third polyamide C having an average number of carbon atoms per nitrogen atom CC, wherein CB?CC.

Abstract: A thermostabilized thermoplastic molding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The molding composition exhibits reduced deterioration when exposed to an elevated temperature of 230° C.

Abstract: Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin.

Abstract: Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed.

Abstract: The present invention relates to the use of a specific compound as a fluidizing agent or as a fluidizing agent precursor in the molten state for a composition including a thermoplastic polymer, in particular a polyamide. The invention further relates to a method for preparing a polyamide article in which the viscosity, in the molten state, of a composition including the polyamide is decreased. The fluidizing agent can further enable the production of an article which has an unreduced density and/or in which the mean molar mass of the polymers of the composition is increased.

Abstract: A method for producing a multicoat color and/or effect paint system comprising a pigmented aqueous basecoat material comprising at least one polyurethane resin (A) as binder, at least one color and/or effect pigment, and 0.05% to 10% by weight, based on the total amount of the pigmented aqueous basecoat material, of an associative thickener (B) different from the polyurethane resin (A), the associative thickener (B) being composed of at least one compound of the following formula (I): with n=0 to 50, where R= with m=0 to 10, where R1?H or R2, where R2= with o=0 to 50, with the proviso that for not more than 50% by weight of the compounds of the formula (I), m=0 and R1?H.