Abstract: A monolithic refractory castable material comprises from about 25 to about 80 weight percent of graphite, from about 1 to about 15 weight percent of a water dispersible, curable phenolic novolac resin, and from about 70 to about 15 weight percent of one or more refractory aggregates, based on the weight of the monolithic refractory castable material. The monolithic refractory castable material is water dispersible and may be delivered to a structure surface by casting, pumping, shotcreting or gunning processes. In one embodiment, the monolithic refractory castable material may be employed to install or replace a blast furnace lining.

Abstract: The invention relates to a hydroxy-aromatic resin, prepared by bringing together and reacting a hydroxy-aromatic compound and glyoxylic acid. The invention further relates to use of the resin in adhesives, laminates, and coatings.

Abstract: A rosin-modified phenolic resin, comprising a product obtained by reaction of (a) a rosin material containing 0.4 to 10% of dihydroagathic acid, (b) a condensate of a phenolic compound and formaldehyde, and (c) a polyol. The rosin-modified phenol resin is suitable for printing ink applications, and the amount of printing ink mist can reduced without the luster of the printed materials being diminished while maintaining various ink capabilities (dryng properties, emulsifying properties, etc.).

Abstract: A varnish composition includes (1) a benzoxazine resin having highly symmetric molecular structure; (2) at least one of naphthol type novolac resins, aniline type novolac resins and phenolic type novolac resins; (3) fillers. The benzoxazine resin having highly symmetric molecular structure, and the at least one of naphthol type novolac resins, aniline type novolac resins and phenolic type novolac resins contribute to increase the temperature of glass transition of the varnish composition, while decrease the coefficient of thermal expansion and moisture absorbability due to their small and highly symmetric molecular structures. A copper substrate can meet the requirement of high temperature of glass transition (TMA?200° C.) and low coefficient of thermal expansion (?1/??30/1350(?m/(m° C.). Therefore, the composition of the invention can be widely used as high-performance electronic material.

Abstract: An abrasive product includes a plurality of abrasive particles and a resin cured with a polythiol group. A method of preparing the abrasive product includes contacting the plurality of abrasive particles with a curable composition that includes a resin and a polythiol group, and curing the curable composition to produce the abrasive product. A method of abrading a work surface includes applying an abrasive product to a work surface in an abrading motion to remove a portion of the work surface. A curable composition includes a formaldehyde resin and a polythiol group. A formaldehyde resin is crosslinked by a polythiol group. A method of crosslinking the formaldehyde resin includes reacting the polythiol group with the formaldehyde resin.

Abstract: Embodiments of the invention may include one or more high-density textile fibers with a density from about 1 to about 11 g/mL. Some embodiments may include fabrics and/or garments made from such fibers. Embodiments comprising garments can include, for instance, exercise aids for providing extra mass to the wearer. Other embodiments can comprise, without limitation, building materials, safety equipment, armor, body armor, protective apparel, marine repair materials, marine protective devices, boat hulls, vehicle chassis, or blast-resistant materials.

Abstract: Disclosed are an ink composition and a method for fabricating a liquid crystal display (LCD) device using the same, wherein in forming patterns of the LCD device using an imprint lithography and a roll printing, an ink composition with high thermal resistance, consisting of polymer resin and additive both endurable even at a high temperature is used to form fine patterns with constantly maintaining pattern linewidths and line intervals, the ink composition consisting of 5-45% by weight of polymer resin, 5-45% by weight of additive added to retain thermal stability, and 50-90% by weight of organic solvent, wherein the ink composition is endurable even at a high temperature of 90-250° C.

Abstract: This invention relates to novel and useful toluene and styrene derived telomer distributions, such distributions being desirable substrates for the preparation of brominated flame retardants.

Abstract: There is disclosed a resist underlayer film composition of a multilayer resist film used in lithography including (A) a fullerene derivative having a carboxyl group protected by a thermally labile group and (B) an organic solvent. There can be a resist underlayer film composition of a multilayer resist film used in lithography for forming a resist underlayer in which generation of wiggling in substrate etching can be highly suppressed and the poisoning problem in forming an upper layer pattern using a chemically amplified resist can be avoided, a process for forming the resist underlayer film, a patterning process and a fullerene derivative.

Abstract: Composite Maillard-resole binders to produce or promote cohesion in non-assembled or loosely assembled matter.

Abstract: The present invention is a method for decomposing a polymer material by chemically decomposing a polymer material containing a first monomer and a second monomer in a mixture of the polymer material with the first monomer or a derivative of the first monomer to produce a chemical raw material. A relationship between a proportion of number of molecules of the second monomer to number of molecules of the first monomer in a reaction system for decomposing the polymer material and the molecular weight of the chemical raw material produced in the reaction system is acquired in advance (S101). Subsequently, an addition mount of the derivative of the first monomer to be added to the polymer material is determined based on the above relationship (S102). The first monomer in the addition amount determined is then mixed with the polymer material (S103).

Abstract: There is disclosed a resist underlayer film-forming composition comprising, at least: a resin (A) obtained by condensing a compound represented by the following general formula (1) with a compound represented by the following general formula (2) by the aid of an acid catalyst; a compound (B) represented by the general formula (1); a fullerene compound (C); and an organic solvent. There can be a resist underlayer film composition in a multi-layer resist film to be used in lithography, which underlayer film is excellent in property for filling up a height difference of a substrate, possesses a solvent resistance, and is not only capable of preventing occurrence of twisting during etching of a substrate, but also capable of providing an excellently decreased pattern roughness; a process for forming a resist underlayer film by using the composition; and a patterning process.

Abstract: The present invention relates to a production process for a phenols novolac resin obtained by reacting phenols with formaldehydes, wherein they are reacted in the presence of a metal compound used as a catalyst for the reaction described above, and a chelating agent is further added in order to deactivate a catalytic action of the metal compound and a resin-coated sand prepared by using the above phenols novolac resin. It is possible to provide a process for producing a phenols novolac resin having an ortho rate of 30 to 60%, suitably 40 to 55% at a good yield (70% or more) and a resin-coated sand having a high curing property prepared by using the above phenols novolac resin.

Abstract: Hydroxy-functional polyester-polyurethane dispersions comprising a reaction product of: (a) at least one, at least difunctional polyol component; (b) at least one ionizable compound having at least one acid group and at least one functional group capable of reacting with isocyanate groups, the at least one functional group selected from the group consisting of mono-, di-, and trihydroxycarboxylic acids, hydroxysulfonic acids, aminosulfonic acids, and aminocarboxylic acids; (c) at least one acid anhydride; and (d) at least one, at least difunctional polyisocyanate component; methods for preparing such dispersions; compositions containing such dispersions; and uses thereof.

Abstract: Carbon with mesopores (about two to fifteen nanometers in average pore size) is made using sucrose as a source of carbon, and silica and phosphoric acid as templates for the mesopore structure in the carbon. A silica sol is prepared in a water/ethanol medium and sucrose is dispersed in the sol. Phosphoric acid may be added to the sol to control pore size in the mesopore size range. The sol is dried, carbonized, and the silica and phosphate materials removed by leaching. The residue is a mesoporous carbon mass having utility as a catalyst support, gas absorbent, and the like.

Abstract: A phenol-formaldehyde resin, which can be obtained by alkalinically catalyzed condensation of phenol and formaldehyde in the presence of at least one salt of inorganic acids and by neutralization by means of an inorganic or organic acid following the condensation, wherein the production takes place with the addition of at least one compound of the formula R1—(CH2)n—R2, in which R1 and R2, independently of one another, stand for —C(O)R, —COOR, —CN, or —NO2, and R represents H or CH3, and n has the value of 1 or 2. Also disclosed are the production of such resins and their use as binders for mineral-fiber-based insulating products.

Abstract: Disclosed are binders including urea-extended phenol-formaldehyde alkaline resole resins to which melamine-containing resin has been added, and non-woven fiber compositions made therewith. The disclosed binders may be cured to low formaldehyde-emission and low trimethylamine-emission, water-resistant thermoset binders.

Abstract: Compositions containing at least one binder and at least one surface-active additive in processes for the production of composite mouldings, and the use thereof.

Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.

Abstract: Adhesive and sealant systems on the basis of unsaturated polyester resins, epoxy resins, polyurethane, silane-terminated polymers, vinyl ester resins, acrylates, polyvinyl acetate, polyvinyl alcohol, polyvinyl ethers, ethylene-vinyl acetate, ethylene-acrylic acid copolymers, polyvinyl acetates, polystyrene, polyvinyl chloride, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, polysulphide, polyethylene, polypropylene, fluorinated hydrocarbons, polyamides, saturated polyesters and copolyesters, phenol-formaldehyde resins, cresol-/resorcinol-formaldehyde resins, urea-formaldehyde resins, melamine-formaldehyde resins, polyimides, polybenzimidazoles or polysulphones and containing 1% to 15% by weight of a hydrophilic fumed silica structurally modified by grinding.

Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.

Abstract: Disclosed are an ink composition and a method for fabricating a liquid crystal display (LCD) device using the same, wherein in forming patterns of the LCD device using an imprint lithography and a roll printing, an ink composition with high thermal resistance, consisting of polymer resin and additive both endurable even at a high temperature is used to form fine patterns with constantly maintaining pattern linewidths and line intervals, the ink composition consisting of 5-45% by weight of polymer resin, 5-45% by weight of additive added to retain thermal stability, and 50-90% by weight of organic solvent, wherein the ink composition is endurable even at a high temperature of 90-250° C.

Abstract: A method of making an electrochemical cell electrode substrate includes creating an aqueous or dry mixture of chopped carbon fibers, chopped cross-linkable resin fibers that are still fuseable after being formed into a felt, such as novolac, a temporary binder, such as polyvinyl alcohol fiber or powder, forming a non-woven felt from either an aqueous suspension of the aqueous mixture or an air suspension of the dry mixture, by a non-woven, wet-lay or dry-lay, respectively, felt forming process, a resin curing agent, such as hexamethylene tetramine may be included in the aqueous or dry mixture, or it may be coated onto the formed felt; pressing one or more layers of the formed felt for 1-5 minutes to a controlled thickness and a controlled porosity at a temperature at which the resin melts, cross-links and then cures, such as 150° C.-200° C.; and heat treating the pressed felt in a substantially inert atmosphere, first to 750° C.-1000° C. and then to 1000° C.-3000° C.

Abstract: The invention provides an electrode, electrolyte and/or a separator plate comprising a conductive material-doped ester-cured alkaline phenolic resole resin containing conducting alkaline salts.

Abstract: It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts. The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25° C. by using an E type viscometer, and a viscosity at 0.5 rpm being 1.

Abstract: An object of the present invention is to provide a cationic curable composition which has low viscosity, can be rapidly photo-cured even in the air, has good adhesion to a substrate such as glass or resin, and is excellent in glass cleaner resistance and water resistance; an ink jet ink, a gravure ink and a hard coating material which comprise the composition; and cured products thereof. A cationic curable composition comprising: (A) 1 to 100 parts by weight of a phenol derivative having 3 or more aromatic rings per molecule, wherein the aromatic ring has a structure in which some or all of hydrogen atoms of phenolic hydroxyl groups of the aromatic ring are substituted by polymerizable functional groups; (B) 1 to 500 parts by weight of a cationic polymerizable compound; and (C) 0.05 to 20 parts by weight of a photo- and/or thermo-cationic initiator is provided.

Abstract: It is a main object of the present invention to provide an alkylphenol resin for rubber compounding to obtain a rubber composition having high tackiness, and a rubber composition using the same. The present invention solves the above object by providing a resin for rubber compounding synthesized from a phenol having a para-substituted alkyl group having 1 to 18 carbon atoms and an aldehyde other than formaldehyde.

Abstract: A resin composition comprising: (i) one or more polymerisable liquid thermoset resin components; (ii) optionally one or more curing agents for said one or more polymerisable liquid resin components; and (iii) at least one gelator, wherein said gelator interacts within said composition to form a gel at ambient temperatures, said gel being thermally reversible such that the gelled composition can undergo a transition from the gelled state to a state of lower viscosity when the composition is treated to facilitate the cure of said polymerisable resin component.

Abstract: A polyphenylene ether resin composition comprising a polyphenylene ether, wherein the polyphenylene ether has a polymer chain comprising recurring units each represented by the following formula (1): and has the following characteristics (a), (b) and (c): (a) when the polyphenylene ether is analyzed by 1H-NMR, the polyphenylene ether exhibits a triplet signal (S1) at 3.55 ppm, wherein the triplet signal (S1) has a relative intensity of 0.05 to 0.25 in terms of the percentage of the integrated intensity of the triplet signal (S1), based on the integrated intensity of a signal (S2) observed at 6.47 ppm; (b) the polyphenylene ether exhibits an absorbance of from 0.01 to 0.40 at a wavelength of 480 nm; and (c) the polyphenylene ether has a weight average molecular weight of from 30,000 to 100,000.

Abstract: A resin solution usable for forming a protection layer, including an organic solvent and a resol resin. The resin solution may further include any combination of a cross-linking agene or agent(s), a photo active compound (PAC) or compounds(s), and/or development accelerator or accelerator(s) a method forming a cured resin layer, including applying a resin solution, including a resol resin, directly or indirectly on a substrate and hard baking the resin solution to form the cured resin layer. The resin solution may include a resol resin and/or a novolac resin.

Abstract: Improved resin-bonded powdered metal components are protected against corrosion and reduction of crush strength during contact with corrosive fluids such as alcohols, ethanol-containing fuels, glycols and peroxide-containing fuels by a resin system coating that, when cured, provides a relatively high crosslink density and relatively few hydrolysable radicals. Magnetic properties of resin-bonded powdered metal magnets are protected from heat degradation by the cured resin coating. The coating can be a heat-cured resin system comprising a phenol novolac resin and a compatible hardener. In one embodiment magnetizable powdered materials have an uncured resin system coating to provide a B-stage material that can be cured after compression shaping.

Abstract: [PROBLEMS] To provide a liquid crystal sealant that exhibits high bonding strength at high temperatures even at a cell gap as narrow as =3 m, being able to provide a liquid crystal display cell of high reliability, and that with respect to the production process, is applicable to both of the conventional thermosetting sheet-fed process and jig press process. [MEANS FOR SOLVING PROBLEMS] There is provided a liquid crystal sealant comprising as essential components (a) epoxy resin, (b) curing agent containing at least one type of each of novolak resin and polyfunctional hydrazide compound, and (c) inorganic filler.

Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

Abstract: A curing accelerator for a curing resin of the invention is represented by the following general formula (I). R1 to R3 in the formula (I) represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 18 carbon atoms, and each may be the same or different. Two or more of R1 to R3 may be bonded to have a ring structure. R4 to R7 represent a hydrogen atom or a substituted or unsubstituted monovalent organic group having 1 to 18 carbon atoms, and each may be the same or different. Y? represents a group in which one proton is discharged from a monovalent group having 0 to 18 carbon atoms and having at least one proton capable of being discharged. Two or more of R4 to R7 and Y? may be bonded to have a ring structure. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

Abstract: A composition for the treatment of metal surfaces and for the deposition of metals or metal alloys on plastics surfaces contains a) at least one polymer as component A, composed of the structural element (1) and at least three structural elements selected from the group consisting of b) water or another solvent which is suitable for dissolving, dispersing, suspending or emulsifying the polymer, as component B; c) if required, surface-active compounds, dispersants, suspending media and/or emulsifiers as component C. In a process for the treatment of a metal surface and a process for the deposition of metals or metal alloys on a plastics surface, the metal or plastics surface is brought into contact with a polymer (component A). Furthermore, polymers (component A) are used for the treatment of metal surfaces and for the deposition of metals or metal alloys on a plastics surface, and polymers composed of special components A?a, A?b and A?c.

Abstract: The present invention provides compositions such as a polymer grout, a molded plastic part, a void-filling plastic material, a concrete-anchoring material and a polymeric casting made from a thermosetting polymer chosen from vulcanized rubbers, polyoxybenzylmethylen-glycolanhydride (“Bakelite”), novolac resins, resole phenolic resins, duroplast, bismaleimide resins, polyimide resins, melamine, acrylic resins, polyester resins, cyanate ester resins, phenolic triazine resins, paracyclophane resins and epoxy resins and at least one phase change material (“PCM”). The compositions of the present invention have a lowered exotherm compared to compositions made from the same thermosetting polymer without the addition of a phase change material. Also provided are improved processes for producing the inventive compositions.

Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.

Abstract: In the present invention, a novolac-type phenolic resin which does not require cold storage is used as a base resin for a resin pulley. To improve dimensional stability, strength, thermal shock resistance and abrasion resistance of the resin pulley, the pulley is formed with a resin composition containing the novolac-type phenolic resin, silica which is difficult to be abraded itself to be an abrasive powder and serves to grind and abrade dust with contact, and 5 to 20% by weight of alumina, harder than silica, having an average particle diameter of 5 ?m or larger.

Abstract: A carbon-phenol resin molding compound is provided, which is preferably used to obtain molded articles having high electrical and thermal conductivities as well as good mechanical strength. The resin molding compound is prepared by reacting a phenol with an aldehyde in the presence of a catalyst, while mixing them with a carbon powder such that a content of the carbon powder in the molding compound is 75 wt % or more. The catalyst is at least one selected from tertiary amines, carbonates, hydroxides and oxides of alkali metals or alkali earth metals.

Abstract: A polymeric material with antistatic properties, characterised by comprising a dispersion of ions within a polymeric matrix containing heteroatoms.

Abstract: This invention relates to a resin composition useful as a vibration-damping agent and the like. The resin composition is formulated by adding 1 wt % or more of styrenated phenol obtained by the reaction of a phenol with styrene to a polycyclic aromatic oligomer obtained by condensing a polycyclic aromatic compound containing 2 to 3 rings and formaldehyde. The polycyclic aromatic oligomer is obtained by the reaction of a polycyclic aromatic compound with formaldehyde and, if necessary, further with a phenol in the presence of an acid catalyst and has a number average molecular weight of 300–1000. The styrenated phenol is obtained by the reaction of 1 mole of a phenol with 1–2.5 moles of styrene in the presence of an acid catalyst.

Abstract: The adhesive system for use in binding lignocellulosic materials into a composite product, the adhesive system consisting essentially of a first part and one of (a) a second part; (b) a third part, and (c) both the second part and the third part; the first part being selected from the group consisting of powdered tannins, powdered modified tannins, and mixtures thereof; the second part being a powdered component reactive with the first part and selected from the group consisting of aldehyde polymers, phenolic resoles, modified phenolic resoles, and mixtures thereof; the third part being a liquid polymeric isocyanate, wherein: when the system consists essentially of the first part and (a) the second part, the weight ratio of the first part to the second part is from about 1:99 to about 65:35; when the system consists essentially of the first part and (b) the third part, the weight ratio of the first part to the third part is from about 1:99 to about 65:35; and when the system consists essentially of the fir

Abstract: The present invention provides a resol-type phenol resin composition which can be cured even in a low temperature range, using a curing accelerator which has no adverse effect on other materials or substances with which the resulting cured article is in contact, or a curing accelerator which requires a small amount of an additive. The composition comprises a resol-type phenol resin (A), an alkali earth metal oxide and/or an alkali earth metal hydroxide (B) (e.g. magnesium oxide, calcium hydroxide, barium hydroxide, etc.), and a salt (C) of a sulfur atom-containing oxo acid and a nitrogen atom-containing base (e.g. ammonium thiosulfate, etc.). This composition is cured at 10 to 110° C.

Abstract: A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.

Abstract: An initial solids mixture for a later organic coating, such as pigmented coatings, films, priming coats, etc., e.g., for a coil coating method in which an initial solids mixture is applied to a substrate, e.g., broad strip, and this is thereby pre-coated, wherein the initial solids mixture includes, as additive particles, boron carbide and/or silicon carbide and/or compounds of transition elements or lanthanides, the electrical conductivity of which is selected to be in the metallic range (?>102 1/?cm and ?<107 1/?cm), during the later coating, the additive particles have a continuous physical connection in at least one spatial direction.

Abstract: A binder for inorganic fiber, which comprises an aldehyde condensable thermosetting resin precursor and a fluorocarbon compound having a polyfluoroalkyl group.

Abstract: A substantially infinitely water-dilutable resole (P:F) resin solution useful for preparing an aqueous binder composition and the related method of its use for making glass fiber products, especially fiberglass insulation.

Abstract: A two-part metal protection composition includes: an aqueous metal treatment conversion coating component that includes an admixture of an acid and a coating forming component; and an aqueous protective coating component that is applied over metal treated with the aqueous metal treatment conversion coating component and includes an admixture of a blister suppressing agent and an organic film forming protective component. The aqueous metal treatment conversion coating component may contain an accelerator, such as hydroxylamine. In a preferred embodiment, the blister suppressing agent is an organic oxidizing agent that includes one or more of nitroguanidine; aromatic nitrosulfonates, Naphthol Yellow S; and picric acid (trinitrophenol).

Abstract: A crosslinking agent that is an ungelled reaction product of (a) at least one aminoplast resin and (b) at least one tall oil rosin wherein the crosslinking agent is essentially free of active hydrogen functional groups and has a glass transition temperature of at least 10° C. is disclosed. Methods for preparing crosslinking agents are also disclosed. Further provided is a curable powder coating composition including a polymer having a glass transition temperature of at least 30° C. containing reactive functional groups and the present crosslinking agent; a multilayer composite coating composition and substrates coated therewith are also disclosed.

Abstract: This invention relates to an UV stabilizing additive composition comprising an ortho-hydroxy triazine compound, a hindered hydroxybenzoate compound and optionally a hindered amine compound. This additive composition may be used to stabilize materials from UV radiation. This invention also contemplates a method of stabilizing a material by contacting the material with the UV stabilizing additive composition.