Containing Reactant Having Atom Other Than C, H, Or O Patents (Class 524/595)
  • Patent number: 9949369
    Abstract: The present invention is a cyanate ester compound represented by the following formula (1): wherein Ar represents an aromatic ring; R1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: April 17, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masayuki Katagiri, Keita Tokuzumi, Makoto Tsubuku, Tomoo Tsujimoto, Kenji Arii, Takashi Kobayashi, Masanobu Sogame, Yoshinori Mabuchi, Sotaro Hiramatsu
  • Patent number: 9574079
    Abstract: The present invention provides substantially formaldehyde free aqueous thermosetting binder resins from resorcinol and cycloaliphatic dialdehydes, glutaraldehyde or their mixtures and urea which may be excluded or included up to amounts which deter hot wet tensile strength in the cured binder. The compositions provide binders that on a performance cost basis are equivalent to phenol formaldehyde resins but without the formaldehyde.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 21, 2017
    Assignees: Rohm and Haas Company, Dow Global Technologies LLC
    Inventors: William C. Finch, Sudhir M. Mulik, Manesh Nadupparambil Sekharan
  • Publication number: 20150011092
    Abstract: A resist underlayer film-forming composition for forming a resist underlayer film having both dry etching resistance and heat resistance. A resist underlayer film-forming composition comprising a polymer containing a unit structure of Formula (1): In Formula (1), R3 is a hydrogen atom, and both n1 and n2 are 0. A method for producing a semiconductor device comprising the steps of: forming an underlayer film on a semiconductor substrate using the resist underlayer film-forming composition; forming a hard mask on the underlayer film; further forming a resist film on the hard mask; forming a resist pattern by irradiation with light or electron beams and development; etching the hard mask using the resist pattern; etching the underlayer film using the hard mask patterned; and fabricating the semiconductor substrate using the patterned underlayer film.
    Type: Application
    Filed: January 25, 2013
    Publication date: January 8, 2015
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Yasunobu Someya, Keisuke Hashimoto, Tetsuya Shinjo, Hirokazu Nishimaki, Ryo Karasawa, Rikimaru Sakamoto
  • Publication number: 20140227887
    Abstract: A phenolic self-crosslinking polymer whose self-crosslinking reaction at a heating step is performed without additives for hardening the polymer, and a composition of resist-underlayer-film containing the same, are disclosed.
    Type: Application
    Filed: September 5, 2012
    Publication date: August 14, 2014
    Inventors: Jeong-Sik Kim, Jae-Hyun Kim, Jae-Woo Lee
  • Patent number: 8759471
    Abstract: The invention relates a mixture of a urethane-aldehyde resin UA prepared by condensation of an aldehyde A1 and an alkyl urethane U, and of a novolak PA, to a process for the preparation of the said mixture, and a method of use thereof as adhesion promoter in rubber goods.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: June 24, 2014
    Assignee: Allnex Germany GmbH
    Inventors: Ralph Schäfer, Peter Ziegler
  • Patent number: 8729181
    Abstract: Aromatic polycyanate compounds which comprise cycloaliphatic moieties, a process for the production thereof and resins and thermoset products which are based on these compounds.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: May 20, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Michael J. Mullins, Robert E. Hefner, Jr., Ulrich Herold, Mark B. Wilson
  • Publication number: 20140051796
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Application
    Filed: October 30, 2013
    Publication date: February 20, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventor: Joseph Gan
  • Publication number: 20130324662
    Abstract: The present invention provides a polybenzoxazole resin containing a repeating unit represented by the following general formula (1): wherein R1 is a tetravalent aromatic group; N atoms and O atoms which are bonded to R1 are present in the form of pairs each consisting of an N atom and an O atom such that the N atom and the O atom in each pair are respectively bonded to adjacent two carbon atoms constituting the same aromatic ring in R1; R2 is an alkanediyl group having 1 to 6 carbon atoms; and n is an integer of 2 to 10000, which is excellent in electrical insulating properties, heat resistance, mechanical properties, physical properties, dimensional stability and the like, as well as a polybenzoxazole precursor capable of producing the polybenzoxazole resin which is excellent in solubility in solvents and storage stability.
    Type: Application
    Filed: April 4, 2012
    Publication date: December 5, 2013
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Eiichi Honda
  • Publication number: 20130310514
    Abstract: A resist underlayer film-forming composition includes a polymer including a repeating unit shown by a formula (1), and having a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and a solvent. Each of R3 to R8 individually represent a group shown by the following formula (2) or the like. R1 represents a single bond or the like. R2 represents a hydrogen atom or the like.
    Type: Application
    Filed: July 22, 2013
    Publication date: November 21, 2013
    Applicant: JSR Corporation
    Inventors: Shin-ya MINEGISHI, Yushi MATSUMURA, Shinya NAKAFUJI, Kazuhiko KOMURA, Takanori NAKANO, Satoru MURAKAMI, Kyoyu YASUDA, Makoto SUGIURA
  • Patent number: 8541516
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: September 24, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8536283
    Abstract: A varnish composition includes (1) a benzoxazine resin having highly symmetric molecular structure; (2) at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins; (3) fillers. The benzoxazine resin having highly symmetric molecular structure, and the at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins contribute to increase the glass transition temperature of the varnish composition, while decrease the coefficient of thermal expansion and moisture absorbability due to their small and highly symmetric molecular structures. A copper substrate can meet the requirement of high glass transition temperature (TMA?200° C.) and low coefficient of thermal expansion (?1/??30/135 (?m/m° C.). Therefore, the composition of the invention can be widely used as high-performance electronic material.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: September 17, 2013
    Assignee: Nan Ya Plastics Corporation
    Inventors: Ming-Jen Tzou, Chi-Cheng Chen, Mei-Ling Chen
  • Publication number: 20130209348
    Abstract: The present application is directed to methods for preparation of polymer particles in gel form and carbon materials made therefrom. The carbon materials can have enhanced electrochemical properties and find utility in any number of electrical devices, for example, as electrode material in ultracapacitors or batteries.
    Type: Application
    Filed: February 8, 2013
    Publication date: August 15, 2013
    Applicants: EnerG2 Technologies, Inc., Georgia-Pacific Chemicals LLC
    Inventors: Georgia-Pacific Chemicals LLC, EnerG2 Technologies, Inc.
  • Publication number: 20130190445
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Application
    Filed: March 8, 2013
    Publication date: July 25, 2013
    Applicant: Dow Global Technologies LLC
    Inventor: Dow Global Technologies LLC
  • Publication number: 20120252957
    Abstract: Polymers useful as in non-enzymatic saccharification processes are provided. Provided are also methods for hydrolyzing cellulosic materials into monosaccharides and/or oligosaccharides using these polymeric acid catalysts.
    Type: Application
    Filed: February 27, 2012
    Publication date: October 4, 2012
    Applicant: Midori Renewables, Inc.
    Inventors: John M. Geremia, Brian M. Baynes
  • Publication number: 20120202155
    Abstract: The invention relates to an underlayer coating composition comprising a polymer, where the polymer comprises at least one hydroxyaromatic unit in the backbone of the polymer phenol which has a pendant group comprising a fluoro or iodo moiety, and at least one unit comprising an aminoplast. The invention further relates to a process for forming an image using the composition, especially for EUV.
    Type: Application
    Filed: February 8, 2011
    Publication date: August 9, 2012
    Inventors: Huirong Yao, Zachary Bogusz, Guanyang Lin, Mark Neisser
  • Publication number: 20120153424
    Abstract: A hard mask composition, a method of forming a pattern, and a semiconductor integrated circuit device, the hard mask composition including a solvent; and a compound, the compound including a structural unit represented by the following Chemical Formula 1:
    Type: Application
    Filed: September 23, 2011
    Publication date: June 21, 2012
    Inventors: Seung-Bae OH, Hwan-Sung Cheon, Sung-Wook Cho, Min-Soo Kim, Jee-Yun Song, Yoo-Jeong Choi
  • Patent number: 8168743
    Abstract: The invention relates to a curable benzoxazine macromonomer containing at least 3 benzoxazine rings and at least one aliphatic, heteroaliphatic, araliphatic, hetereoaraliphatic, aromatic or heteroaromatic fragment, the fragment comprising a shortest atom chain containing at least 40 consecutive atoms between two benzoxazine nitrogen atoms or between two benzoxazine oxygen atoms, and said atom chain must not include any oxazine ring atoms (“soft fragment”). The invention further relates to cured products made thereof and a method or producing the same.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: May 1, 2012
    Assignees: Henkel AG & Co. KGaA, Henkel Corporation
    Inventors: Andreas Taden, Ursula Tenhaef, Stefan Kreiling, Rainer Schoenfeld, Stanley Leroy Lehmann
  • Publication number: 20120076994
    Abstract: A liquid resin, which is the Michael addition product of an amine-terminated aminoamide thermoplastic polymer with one or more polyol ester compounds having at least one (meth)acrylate group, wherein the amine-terminated aminoamide thermoplastic polymer contains a bisphenol or novolac segment to provide increased hardness and improved flow of radiation-curable compositions incorporating such resins, methods of printing using such compositions and articles printed with such compositions.
    Type: Application
    Filed: May 12, 2010
    Publication date: March 29, 2012
    Applicant: Sun Chemical B.V.
    Inventors: Shaun Lawrence Herlihy, Sean Phillip Francis Mayers
  • Patent number: 8133933
    Abstract: Phenolic resin binder systems for sand molds, used in metal casting, which improve the quality of thermally reclaimed sand, are described. The substantial or complete elimination of calcium compounds (e.g., calcium stearate and calcium hydroxide, conventionally employed as a mold lubricant and a resin curing catalyst, respectively) allows the thermally reclaimed sand to be reused over multiple thermal reclamation cycles without the adverse effects previously encountered.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: March 13, 2012
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: Richard Rediger, Edward Lucas
  • Publication number: 20110281975
    Abstract: The invention relates to a process for the preparation of a phosphated polycondensate, at least one sulphonic acid being used as catalyst, and to the use of the phosphated polycondensate obtained as an admixture for aqueous suspensions of hydraulic and/or latently hydraulic binders.
    Type: Application
    Filed: September 7, 2009
    Publication date: November 17, 2011
    Inventors: Alexander Kraus, Frank Dierschke, Fabian Becker, Thomas Schuhbeck, Harald Grassl, Karin Groess
  • Publication number: 20110275758
    Abstract: The present invention relates to modified phenolic resins which contain silicic acid ester units. The modified phenolic resins may, for example, be used as components of a foundry binder system. The invention also relates to a method for producing such modified phenolic resins and to two-component binder systems which contain these modified phenolic resins. The invention furthermore relates to methods for producing foundry molds and foundry cores which contain the modified phenolic resins, and to the foundry molds and foundry cores themselves.
    Type: Application
    Filed: June 21, 2011
    Publication date: November 10, 2011
    Applicant: Huttenes-Albertus Chemische Werke GmbH
    Inventors: David Strunk, Gerard Ladegourdie, Frank Lenzen
  • Publication number: 20110269902
    Abstract: The present invention relates to modified phenolic resins which contain silicic acid ester units. The modified phenolic resins may, for example, be used as components of a foundry binder system. The invention also relates to a method for producing such modified phenolic resins and to two-component binder systems which contain these modified phenolic resins. The invention furthermore relates to methods for producing foundry molds and foundry cores which contain the modified phenolic resins, and to the foundry molds and foundry cores themselves.
    Type: Application
    Filed: August 19, 2009
    Publication date: November 3, 2011
    Applicant: Huttenes-Albertus Chemische Werke GmbH
    Inventors: David Strunk, Gerald Ladegourdie, Frank Lenzen
  • Publication number: 20110224345
    Abstract: This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic.
    Type: Application
    Filed: March 15, 2010
    Publication date: September 15, 2011
    Inventors: Ming Jen TZOU, June Che Lu, Yi Cheng Lin
  • Publication number: 20110117501
    Abstract: A resist underlayer polymer, a resist underlayer composition including the same, and a method of patterning using the same, the resist underlayer polymer including a repeating unit represented by at least one of Chemical Formula 1 and Chemical Formula 2:
    Type: Application
    Filed: September 21, 2010
    Publication date: May 19, 2011
    Inventors: Jee Yun SONG, Hwan-Sung Cheon, Sung-Wook Cho, Kyong-Ho Yoon, Min-Soo Kim, Seung-Bae Oh
  • Publication number: 20110009562
    Abstract: Aromatic polycyanate compounds which comprise cycloaliphatic moieties, a process for the production thereof and resins and thermoset products which are based on these compounds.
    Type: Application
    Filed: March 9, 2009
    Publication date: January 13, 2011
    Applicant: Dow Global Technologies Inc.
    Inventors: Michael J. Mullins, Robert E. Hefner, JR., Ulrich Herold, Mark B. Wilson
  • Publication number: 20100331484
    Abstract: Cationic polymers and methods for using the same are provided. The method can include contacting an aqueous medium with a cationic polymer. The cationic polymer can include a polymer formed by reacting an aldehyde, and optionally an aldehyde-reactive compound, in the presence of a sufficient amount of guanidine to provide the polymer with a net cationic charge.
    Type: Application
    Filed: June 24, 2010
    Publication date: December 30, 2010
    Applicant: GEORGIA-PACIFIC CHEMICALS LLC
    Inventors: Brian L. Swift, Pablo G. Dopico, Roger S. Johnson
  • Patent number: 7807748
    Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: October 5, 2010
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
  • Publication number: 20100210787
    Abstract: The invention relates to a curable benzoxazine macromonomer containing at least 3 benzoxazine rings and at least one aliphatic, heteroaliphatic, araliphatic, hetereoaraliphatic, aromatic or heteroaromatic fragment, the fragment comprising a shortest atom chain containing at least 40 consecutive atoms between two benzoxazine nitrogen atoms or between two benzoxazine oxygen atoms, and said atom chain must not include any oxazine ring atoms (“soft fragment”). The invention further relates to cured products made thereof and a method or producing the same.
    Type: Application
    Filed: April 23, 2010
    Publication date: August 19, 2010
    Applicants: Henkel AG & Co. KGaA, Henkel Corporation
    Inventors: Andreas Taden, Ursula Tenhaef, Stefan Kreiling, Rainer Schoenfeld, Stanley L. Lehmann
  • Patent number: 7741406
    Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: June 22, 2010
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
  • Publication number: 20100048789
    Abstract: A resin composition includes brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0-20 wt %, high thermal conductivity powder of 5-85 wt % and a processing aid of 0-10 wt %. The resin composition possesses high glass transition temperature, high thermal conductivity, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.
    Type: Application
    Filed: January 6, 2009
    Publication date: February 25, 2010
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Sung-Yueh Shieh, Dein-Run Fung, Te-Chao Liao, Hao-Sheng Chen
  • Patent number: 7635728
    Abstract: Flame retardant compositions are disclosed which comprise (a) at least one particulate material which expands on the application of heat and (b) at least one particulate nano-filler, together with at least one polymer and/or at least one curable monomer or oligomer. The compositions may also contain certain silicon-based materials. Flame-retardant compositions comprising polyorganosiloxanes containing one or more functional groups selected form amino, hydroxyl, methacrylic, acrylic and epoxy groups, are also disclosed.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: December 22, 2009
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Constantinos D. Diakoumakos, Dimiter Lubomirov Kotzev
  • Publication number: 20090181260
    Abstract: An alkanolamine-modified phenolic resin formulation is formed by reacting a basic catalyst, formaldehyde, water and a benzene-ol to form an intermediate composition to which and an alkanolamine is subsequently added to reduce the presence of free formaldehyde. The alkanolamine-modified phenolic resin formulation can be employed to coat abrasive products having a relatively low free formaldehyde content.
    Type: Application
    Filed: December 3, 2008
    Publication date: July 16, 2009
    Applicants: Saint-Gobain Abrasive, Inc., Saint-Gobain Abrasifs
    Inventors: Jagmohan Verma, Adiseshaiah K. Seshu, Abdul Habid Pullichola, Olivier Pons Y. Moll, Philippe Espiard
  • Publication number: 20090054558
    Abstract: Pulverulent polycondensation products are described, consisting of a) 5 to 95% by weight of a polycondensation product based on an aromatic or heteroaromatic compound (A) having 5 to 10 C atoms or heteroatoms having at least one oxyethylene or oxypropylene radical and one aldehyde (C) selected from the group consisting of formaldehyde, glyoxylic acid and benzaldehyde or mixtures thereof, and b) 5 to 95% by weight of a finely divided mineral carrier material having a specific surface area of 0.5 to 500 m2/g (according to BET as specified in DIN 66 131). The pulverulent polycondensation products according to the invention are outstandingly suitable in construction material mixtures in an amount of from 0.1 to 5% by weight, based on the weight of the construction material. The pulverulent polycondensation products have a number of advantages here, such as, for example, excellent storage stability, good liquefying action at low dosage and industrially simple production.
    Type: Application
    Filed: December 18, 2006
    Publication date: February 26, 2009
    Applicant: CONSTRUCTION RESEARCH & TECHNOLOGY GMBH
    Inventors: Philipp Wieland, Alexander Kraus, Gerhard Albrecht, Harald Grassl, Kerstin Becher
  • Patent number: 7495043
    Abstract: The present invention discloses a method for producing a clay/AMO complex by modifying layered inorganic silicate clay with the intercalating agent AMO (amine-terminated Mannich oligomer). The AMO is prepared by polymerizing polyoxyalkylene amine having molecular weight over 1000, p-cresol and formaldehyde. The present invention also discloses a method for producing nanosilicate plates by extracting the AMO from the above complex with a hydroxide or a chloride of alkali metal or alkaline-earth metal. The extracted AMO can be recycled for reusing.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: February 24, 2009
    Assignee: National Chung-Hsing University
    Inventors: Jiang-Jen Lin, Chung-Ming Tsai
  • Patent number: 7390847
    Abstract: A composition for the treatment of metal surfaces and for the deposition of metals or metal alloys on plastics surfaces contains a) at least one polymer as component A, composed of the structural element (1) and at least three structural elements selected from the group consisting of b) water or another solvent which is suitable for dissolving, dispersing, suspending or emulsifying the polymer, as component B; c) if required, surface-active compounds, dispersants, suspending media and/or emulsifiers as component C. In a process for the treatment of a metal surface and a process for the deposition of metals or metal alloys on a plastics surface, the metal or plastics surface is brought into contact with a polymer (component A). Furthermore, polymers (component A) are used for the treatment of metal surfaces and for the deposition of metals or metal alloys on a plastics surface, and polymers composed of special components A?a, A?b and A?c.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: June 24, 2008
    Assignee: BASF SE
    Inventors: Monica Fernandez Gonzalez, Hans-Ulrich Jäger, Peter Neumann, Helmut Witteler
  • Patent number: 6955848
    Abstract: This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: October 18, 2005
    Assignee: Zeon Corporation
    Inventors: Yasuhiro Wakizaka, Kanji Yuyama
  • Patent number: 6906130
    Abstract: A substantially infinitely water-dilutable resole (P:F) resin solution useful for preparing an aqueous binder composition and the related method of its use for making glass fiber products, especially fiberglass insulation.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: June 14, 2005
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Kim Tutin, Kurt Gabrielson, Jesse Petrella, Michael Bryant, Carl White, Hayes Ingram, Edward Lucas, Jr.
  • Patent number: 6902766
    Abstract: A two-part metal protection composition includes: an aqueous metal treatment conversion coating component that includes an admixture of an acid and a coating forming component; and an aqueous protective coating component that is applied over metal treated with the aqueous metal treatment conversion coating component and includes an admixture of a blister suppressing agent and an organic film forming protective component. The aqueous metal treatment conversion coating component may contain an accelerator, such as hydroxylamine. In a preferred embodiment, the blister suppressing agent is an organic oxidizing agent that includes one or more of nitroguanidine; aromatic nitrosulfonates, Naphthol Yellow S; and picric acid (trinitrophenol).
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: June 7, 2005
    Assignee: Lord Corporation
    Inventor: Helmut W. Kucera
  • Patent number: 6780900
    Abstract: Disclosed is an ink composition comprising (a) an aldehyde copolymer ink vehicle, (b) a nonpolymeric aldehyde viscosity modifier, (c) a colorant, (d) an optional conductivity enhancing agent, (e) an optional antioxidant, and (f) an optional UV absorber.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: August 24, 2004
    Assignee: Xerox Corporation
    Inventor: Shadi L. Malhotra
  • Publication number: 20040152829
    Abstract: A thermally conductive polymer molded article formed by molding a thermally conductive composition which comprises a liquid crystalline polymer and thermally conductive filler having magnetic anisotropy, wherein the liquid crystalline polymer and the thermally conductive filler are oriented in a predetermined direction by a magnetic field. The thermally conductive composition contains 100 parts by weight of the liquid crystalline polymer and 5 to 800 parts by weight of the thermally conductive filler having magnetic anisotropy. The thermally conductive filler has a thermal conductivity in at least one direction higher than the thermal conductivity of the liquid crystalline polymer.
    Type: Application
    Filed: July 21, 2003
    Publication date: August 5, 2004
    Inventors: Masayuki Tobita, Naoyuki Shimoyama, Tsukasa Ishigaki, Toru Kimura
  • Patent number: 6765047
    Abstract: A method for microencapsulating red phosphorus in polymerized urea resorcinol formaldehyde resin is disclosed. The method entails (i) preparing an aqueous mixture containing urea, resorcinol and formaldehyde, (ii) adding hexamethylene tetramine and optionally water to the mixture to yield a stabilized mixture (iii) dispersing red phosphorus in the to the stabilized mixture (iv) adding acid to the reaction mixture, and (v) collecting the resulting encapsulated red phosphorus. The product is suitable as flame retarding agent in molding compositions.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: July 20, 2004
    Assignee: Bayer Aktiengesellschaft
    Inventors: Henricus Peerlings, Michael Wagner, Wolfgang Podszun
  • Patent number: 6706809
    Abstract: Infinitely water soluble, storage stable, low molecular weight, amine-modified resins/binders (e.g., phenol-formaldehyde resole resins and binders made therefrom) are used to produce low odor fiberglass products, such as fiberglass insulation for automobile headliners and room dividers. The cured, bonded fiberglass products have low TMA (trimethylamine) emission because the free formaldehyde in the resin has been scavenged with melamine, which resists thermal decomposition, and because the binder contains a relatively low urea content, which is a TMA contributor. The resole resin production process includes adding two different formaldehyde scavengers (e.g., melamine and urea) to produce a modified phenol-formaldehyde resole resin. This resole resin is produced into a binder by mixing with water, optionally in the presence of a latent acid catalyst (e.g., an ammonium salt of a strong acid).
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: March 16, 2004
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Kim Tutin, W. Hayes Ingram, Mary L. Epling, Kurt D. Gabrielson, James T. Wright, Carl R. White
  • Patent number: 6706808
    Abstract: The presently disclosed invention relates to a phenolic binder comprising a premix of a urea modified phenol-formaldehyde resole resin, a curing agent, and an additive selected from the group consisting of ammonium lignosulfonate, melamine and a melamine derivative. A method for reducing gaseous emissions in the manufacture of fibrous insulation materials is also disclosed.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: March 16, 2004
    Assignee: Owens Corning Fiberglas Technology, Inc.
    Inventors: Yadollah Delaviz, Susan Muench, Kathleen Bullock
  • Patent number: 6586498
    Abstract: An ink jet ink composition comprising from about 0.5% to about 30% by weight of a pigment, a carrier and a dispersant, the dispersant comprising an anionic derivative of an ethoxylated alkylphenol-formaldehyde resin, the ratio of dispersant:pigment being from about 0.1:1 to about 5:1.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: July 1, 2003
    Assignee: Eastman Kodak Company
    Inventors: David Erdtmann, Alan R. Pitt, Ian M. Newington
  • Patent number: 6538048
    Abstract: An ink jet printing method, comprising the steps of: A) providing an ink jet printer that is responsive to digital data signals; B) loading the printer with ink jet recording elements; C) loading the printer with an ink jet ink composition comprising from about 0.5% to about 30% by weight of a pigment, a carrier and a dispersant, the dispersant comprising an anionic derivative of an ethoxylated alkylphenol-formaldehyde resin, the ratio of dispersant:pigment being from about 0.1:1 to about 5:1; and D) printing on the ink jet recording element using the ink jet ink in response to the digital data signals.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: March 25, 2003
    Assignee: Eastman Kodak Company
    Inventors: David Erdtmann, Ian M. Newington, Alan R. Pitt
  • Patent number: 6488893
    Abstract: A combination of a semi-soluble methacrylic polymer and a sulfonated naphthalene condensation product, optionally with a semi-soluble or insoluble ethyl methacrylate polymer of high molecular weight, provides improved resistance to staining by acid colorants of fibrous polyamide substrate.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: December 3, 2002
    Assignee: Trichromatic Carpet Inc.
    Inventors: Yassin M. Elgarhy, Karim Elgarhy
  • Patent number: 6476119
    Abstract: A primer or coating composition that includes (A) an aqueous dispersion of a phenolic resin that includes water and a reaction product of a phenolic resin precursor, a modifying agent and, optionally, a multi-hydroxy phenolic compound wherein the modifying agent includes at least one functional moiety that enables the modifying agent to react with the phenolic resin precursor and at least one ionic moiety, and (B) a flexibilizer. According to one embodiment the modifying agent is an aromatic compound. According to another embodiment the ionic moiety of the modifying agent is sulfate, sulfonate, sulfinate, sulfenate or oxysulfonate and the dispersed phenolic resin reaction product has a carbon/sulfur atom ratio of 20:1 to 200:1.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: November 5, 2002
    Assignee: Lord Corporation
    Inventors: Helmut W. Kucera, Rebecca S. Cowles
  • Patent number: 6458443
    Abstract: The invention concerns a stain resist composition comprising: (a) a component selected from the group consisting of (1) an anionically modified phenol formaldehyde polymer comprising a phenol moiety and a formaldehyde moiety, (2) a naphthalene condensate, (3) a lignin sulfonate, (4) a phenol sulfonate derivative, a mixture thereof and (5) a (meth)acrylic polymer comprising residues of acrylic or methacrylic acid; and (b) a polyester.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: October 1, 2002
    Assignee: Arrow Engineering, Inc.
    Inventors: Robert B. Collier, J. Todd Mull
  • Patent number: 6344499
    Abstract: A puncture sealing agent for sealing an inner surface of a tire comprises a deproteinized rubber latex that is formed by removing protein from a natural rubber latex. The puncture sealing agent includes nitrogen content at 0.1 wt. % or less of rubber solid content of the deproteinized rubber latex, and ammonia content at 0.5 wt. % or less of the rubber solid content.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: February 5, 2002
    Assignee: Sumitomo Rubber Industries, Ltd.
    Inventors: Kazuhiko Kawamura, Tamisuke Kimura, Akihiko Hamada, Yoshiaki Miyamoto, Maiko Okada
  • Publication number: 20010007887
    Abstract: The invention relates to a pigment preparation comprising an organic pigment and 0.2 to 20% by weight, based on the total weight of the pigment preparation, of an ammonium polyphosphate or of an organophosphorus compound.
    Type: Application
    Filed: December 8, 2000
    Publication date: July 12, 2001
    Applicant: Clariant GmbH
    Inventors: Rudiger Jung, Klaus Saitmacher, Arpad Acs