Nitrogen-containing Reactant Patents (Class 524/606)
  • Patent number: 7384682
    Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: June 10, 2008
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Publication number: 20080132625
    Abstract: A hot melt adhesive that contains fragrances is provided. The hot melt adhesive can be used to adhere packaging materials to one another and, upon exposure of the adhesive surface, releases a fragrance, in particular at low temperatures. A method for manufacturing such a hot melt adhesive is also provided, wherein the thermal stress from manufacture is kept low.
    Type: Application
    Filed: December 27, 2007
    Publication date: June 5, 2008
    Inventors: Erik Niehaus, Petra Padurschel, Marcel Roth, Gunter Hoffmann, Rolf Tenhaef, Georg Meine, Andreas Bauer
  • Publication number: 20080132633
    Abstract: Portable electronic device housings comprising polyamide compositions comprising fibrous reinforcing agents having non-circular cross sections.
    Type: Application
    Filed: November 15, 2007
    Publication date: June 5, 2008
    Inventor: Georgios Topoulos
  • Publication number: 20080121141
    Abstract: Exothermically-enhanced articles, such as those made of fabric, are provided. The enhancement allows for faster drying times. Enhancement may be provided by using activated particles exhibiting exothermic properties. The activated particles may be removably encapsulated with a protective substance that may be used to activate or deactivate the particles.
    Type: Application
    Filed: November 16, 2007
    Publication date: May 29, 2008
    Inventors: Gregory W. Haggquist, Philip C. Haugaard
  • Publication number: 20080125522
    Abstract: The present invention provides compositions such as a polymer grout, a molded plastic part, a void-filling plastic material, a concrete-anchoring material and a polymeric casting made from a thermosetting polymer chosen from vulcanized rubbers, polyoxybenzylmethylen-glycolanhydride (“Bakelite”), novolac resins, resole phenolic resins, duroplast, bismaleimide resins, polyimide resins, melamine, acrylic resins, polyester resins, cyanate ester resins, phenolic triazine resins, paracyclophane resins and epoxy resins and at least one phase change material (“PCM”). The compositions of the present invention have a lowered exotherm compared to compositions made from the same thermosetting polymer without the addition of a phase change material. Also provided are improved processes for producing the inventive compositions.
    Type: Application
    Filed: November 27, 2006
    Publication date: May 29, 2008
    Inventors: James A. Thompson-Colon, Brian Iske
  • Publication number: 20080119589
    Abstract: Color concentrates for thermoplastic biofiber composites are disclosed. The concentrates employ three factors to achieve concentrated delivery of color to the processing machine and excellent and substantially uniform dispersion of color in the processing machine: melt flow of the concentrate exceeding at least 4 g/10 min. using ASTM D-1238; pellet size of the concentrate such that at least 50 pellets weigh less than one gram; and weight percent of the colorant ingredients in the concentrate exceeding at least 30 weight percent.
    Type: Application
    Filed: November 2, 2007
    Publication date: May 22, 2008
    Applicant: POLYONE CORPORATION
    Inventors: Thomas M. MAJEWSKI, Peter PRUSAK
  • Patent number: 7361291
    Abstract: Polymer compositions comprising a) a polymer substrate selected from the group consisting of the polyolefins, polyesters, polyamides and polylactic acids and b) a combination of i) at least one permanent antistatic additive selected from the group consisting of the polyetheresteramides and ii) at least one migratory antistatic additive selected from the group consisting of the alkylsulfonic acid salts, the alkyl diethanolamines and the alkyl diethanolamides, are effectively antistatic.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: April 22, 2008
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Hui Chin, Christopher J. Fagouri
  • Publication number: 20080044682
    Abstract: An article comprises a solvent cast film comprising a polyetherimide comprising structural units derived from a dianhydride component selected from the group consisting of 3,4?-oxydiphthalic anhydride, 3,3?-oxydiphthalic anhydride, 4,4?-oxydiphthalic anhydride, and combinations thereof, and a diamine component. The polyetherimide has a glass transition temperature that is at least 190° C. The film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight. The film has less than 15 molar % of a member selected from the group consisting of biphenyltetracarboxylic acid, dianhydrides of biphenyltetracarboxylic acid, esters of biphenyltetracarboxylic acid, and combinations thereof.
    Type: Application
    Filed: June 6, 2007
    Publication date: February 21, 2008
    Inventors: Kwok Pong Chan, Erik Hagberg, Tara J. Mullen, Roy Ray Odle
  • Patent number: 7321005
    Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: January 22, 2008
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7276555
    Abstract: A method of dispersing pigment using an amide-modified resin or an amide-modified hydrocarbyl moiety, and the resulting pigment concentrate or coating or ink composition.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: October 2, 2007
    Assignee: Hexion Specialty Chemicals, Inc.
    Inventors: Christopher J. Holmes, Richard K. Winblad, Rudolf Anthonius Maria Venderbosch, Richard Hendrikus Gerrit Brinkhuis
  • Patent number: 7273897
    Abstract: An ink jet ink composition of water, a humectant, and a hyperbranched polymeric dye of a hyperbranched polymer having a dye chromophore pendant on the polymer chain or incorporated into the polymer backbone.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: September 25, 2007
    Assignee: Eastman Kodak Company
    Inventors: Jin-Shan Wang, Huijuan Chen, Steven Evans
  • Patent number: 7211615
    Abstract: A composition containing from 88 to 99.99% by weight of a polyamide, a compound of a polyamide and mixtures of these, and from 0.01 to 0.25% by weight of a flow aid where the drying loss from the flow aid after 5 days of conditioning at a relative humidity of 95% is less than or equal to 1%, determined by ISO 787/2.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: May 1, 2007
    Assignee: Degussa AG
    Inventors: Franz-Erich Baumann, Sylvia Monsheimer, Maik Grebe, Wolfgang Christoph, Dirk Heinrich, Holger Renners, Heinz Scholten, Thomas Schiffer, Joachim Muegge, Johannes Chiovaro
  • Patent number: 7192997
    Abstract: A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexibilizing agent and a filler material.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: March 20, 2007
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7179855
    Abstract: The invention concerns polyamide molding compositions with good surface quality and good flow behavior containing prepolymeric polyamides with a solution viscosity of ?rel 1.01–1.30 in quantities from 0.1 to 20 wt. %.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: February 20, 2007
    Assignee: EMS - Chemie AG
    Inventors: Renato Nay, Manfred Hewel
  • Patent number: 7166669
    Abstract: Dark-colored thermoplastic molding compositions are disclosed. The compositions are suitable for making molded parts which in the wavelength region from 700 to 1200 nm are laser-transmitting, at least in spectral partial regions, and may be welded to laser-absorbing molded parts by means of laser transmissions welding.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: January 23, 2007
    Assignee: Bayer Aktiengesellschaft
    Inventors: Detlev Joachimi, Andreas Elschner, Manfred Botzen, Frank Krause, Herbert Magerstedt
  • Patent number: 7151127
    Abstract: The present invention relates to the use of thermoplastic polyamide moulding compositions with reduced or strongly reduced formation of solid deposits and/or coverings during a thermoplastic conversion into commodity goods in discontinuous processes in particular injection moulding, and continuous processes such as the extrusion of films, fibers, tubes and jacketings containing at least 20% by weight polyamide and/or at least one copolymer with at least 20% by weight polyamide components.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: December 19, 2006
    Assignee: Ems-Chemie AG
    Inventors: Georg Stoeppelmann, Ornulf Rexin, Eduard Schmid, Ralph Kettl, Manfred Hewel
  • Patent number: 7151134
    Abstract: A thermoplastically processable cured rubber composition comprises a crosslinked or cured urethane polymer dispersed in a matrix made of a thermoplastic polymeric material. In one aspect, the matrix forms a continuous phase and the crosslinked urethane polymer is in the form of particles forming a non-continuous phase. The processable rubber compositions can be made by a process of dynamic vulcanization of a urethane prepolymer material in the presence of the thermoplastic matrix material. The process involves combining a urethane prepolymer, a curing agent capable of reacting with the urethane prepolymer, and a thermoplastic material to form a mixture, and heating the mixture at a temperature and for a time sufficient to effect reaction between the curing agent and the prepolymer. Mechanical energy is supplied to the mixture during the heating step so that the crosslinking or curing of the urethane prepolymer occurs while the prepolymer and thermoplastic are undergoing a mixing.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: December 19, 2006
    Assignee: Freudenberg-NOK General Partnership
    Inventors: Edward Hosung Park, Francis Joseph Walker
  • Patent number: 7135516
    Abstract: The present invention relates to a carbon fiber sizing agent comprised of water-soluble thermoplastic resin and amphoteric surfactant within a weight ratio range of 6/1 to 1/3, a carbon fiber sizing method comprising treating carbon fibers using a sizing liquid containing the aforementioned sizing agent, sized carbon fibers comprising adhering the aforementioned sizing agent to their surfaces, and a fabric that uses said carbon fibers. The carbon fiber sizing agent of the present invention has satisfactory solubility in water over a wide pH range, and is able to impart to carbon fibers adequate convergence for forming stable chopped carbon fibers, superior workability and satisfactory uniform tow dispersibility in water over a wide pH range. Since a fabric of the present invention demonstrates affinity to water over a wide pH range, it is suitable for applications such as immersing said fabric in an aqueous matrix in order to impregnate the fabric with that matrix.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: November 14, 2006
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Naoki Sugiura, Norihito Maki
  • Patent number: 7129318
    Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: October 31, 2006
    Assignee: I.S.T. (MA) Corporation
    Inventors: Gary L. Deets, Jianming Xiong
  • Patent number: 7083851
    Abstract: A composition for forming a layer on a substrate includes a polyelectrolyte that is soluble in a polar solvent. The polyelectrolyte includes a plurality of aromatic groups and nitrogen atoms in a main polymer chain and has a refractive index of at least about 1.64 at a wavelength of about 680 nm. The composition also includes a solvent and, optionally, a plurality of colloidal particles.
    Type: Grant
    Filed: July 26, 2004
    Date of Patent: August 1, 2006
    Assignee: Vampire Optical Coatings, Inc.
    Inventor: Tom Faris
  • Patent number: 7067577
    Abstract: The present invention relates to a resin composition comprising a resin and apatite, wherein referring to the particulate form of said apatite present in the resin composition thus obtained, the apatite is present in a particulate form having an average diameter or average thickness (d) of not greater than 100 nm and an average aspect ratio (L/D) of not smaller than 5 as defined by the ratio of the average length (L) to said average diameter or average thickness (d).
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: June 27, 2006
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Masaaki Aramaki, Kenya Sonobe
  • Patent number: 7053172
    Abstract: The fuel-barrier polyamide resin of the present invention is a product of the polycondensation of a diamine component comprising 70 mol % or higher of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or higher of a mixed dicarboxylic acid which comprises a C4 to C20 ?,?-linear aliphatic dicarboxylic acid and at least one dicarboxylic acid selected from the group consisting of isophthalic acid and naphthalenedicarboxylic acid in a molar ratio of 30:70 to 95:5. The polyamide resin is excellent in not only fuel-barrier property and heat resistance, but also moldability and recyclability, and therefore suitably used as a barrier material of fuel containers.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: May 30, 2006
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Kazunobu Sato, Kazunobu Maruo, Jun Mitadera, Masashi Kurokawa
  • Patent number: 7053169
    Abstract: The invention relates to new thermoplastically processible transparent polyamide molding materials based on copolyamides containing diamines and dicarboxylic acids with aromatic cores which exhibit a high index of refraction nD20 over 1.59 and a low density under 1.3 g/cm3. At the same time, a low birefringence, high hardness, and scratchresistance are achieved. The polyamide molding materials are fabricated by means of conventional pressure reactors (autoclaves) according to a modified technique. The granulate that is produced from the inventive molding materials is reshaped by thermoplastic processes like injection molding, particularly in multichamber cavity tools. The invention also relates to the utilization of the inventive molding materials for producing optical lenses.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: May 30, 2006
    Assignee: Ems-Chemie AG
    Inventor: Friedrich Severin Bühler
  • Patent number: 7034065
    Abstract: An ink jet ink composition comprising water, a pigment, a humectant and a hyperbranched polymer having end groups consisting essentially of hydrophilic moieties, said hyperbranched polymer having the following formula: HB—Xg wherein: HB is a hyperbranched polymer core; X is a hydrophilic end group; and g is an integer of at least 2.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: April 25, 2006
    Assignee: Eastman Kodak Company
    Inventors: Jin-Shan Wang, Huijuan Chen
  • Patent number: 7026435
    Abstract: Polymer derivatives based upon polyalkyleneimine backbones having from about 20% to about 60% of their reactive amino functionalities substituted by C14-20 carboxylic acids, are disclosed. Fiber lubricants and/or sizing compositions comprising such polymer derivatives are also disclosed. The disclosed fiber lubricants exhibit excellent affinity for fiberglass fibers and have excellent hydrophobicity, while also providing excellent lubrication. Methods for preparing said derivatives are also disclosed. Also disclosed are methods for treating fibers using the polymer derivatives.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: April 11, 2006
    Assignee: Cognis Corporation
    Inventors: Douglas F. Fry, Frank Norman Tuller
  • Patent number: 7009029
    Abstract: Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 ?m. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: March 7, 2006
    Assignee: Kuraray Co., Ltd.
    Inventors: Hideaki Oka, Hideharu Matsuoka, Toru Kuki
  • Patent number: 7008995
    Abstract: Carboxy resins of low equivalent weight per carboxyl group are synthesized by reacting a compound having two or more isocyanate groups with a compound having one hydroxyl group and two or more carboxyl groups. In a preferred embodiment, the compound having isocyanate groups is an isocyanurate derivative of a diisocyanate. The compound having isocyanate groups and the compound having one hydroxyl group and two or more carboxyl groups are reacted under conditions where reaction of carboxyl groups with isocyanate is substantially avoided. In another aspect of the invention, coating compositions are provided that contain in addition to the carboxy resin, a second component having a number of functional groups that are reactive with the carboxyl groups on the carboxy resin.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: March 7, 2006
    Assignee: BASF Corporation
    Inventor: Sunitha Grandhee
  • Patent number: 6955848
    Abstract: This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: October 18, 2005
    Assignee: Zeon Corporation
    Inventors: Yasuhiro Wakizaka, Kanji Yuyama
  • Patent number: 6943231
    Abstract: Transparent polyamide molding materials are provided which are characterized in that they have a melting enthalpy between 0 and 12 J/g and the polyamides are constituted of 100 mole-% of a diamine mixture having 10-70 mole-% of PACM [bis-(4-amino-cyclohexyl)-methane] with less than 50 wt.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: September 13, 2005
    Assignee: EMS-Chemie AG
    Inventor: Friedrich Severin Bühler
  • Patent number: 6936644
    Abstract: An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: August 30, 2005
    Assignee: Cookson Electronics, Inc.
    Inventor: Kenneth B. Gilleo
  • Patent number: 6936682
    Abstract: A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 to 97/3 and (b) an aliphatic diamine component is disclosed. The alicyclic polyamide having 1,4-cyclohexanedicarboxylic acid in a backbone thereof as a dicarboxylic acid unit, which is suitable as materials for various uses such as automotive parts, electric/electronics parts, industrial materials, engineering materials and daily household goods, and superior in heat resistance, low water absorption, light resistance, moldability and light weight, as well as superior in toughness, chemical resistance and appearance, and molded articles thereof.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: August 30, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Masaaki Aramaki, Tomofumi Maekawa
  • Patent number: 6930165
    Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: August 16, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6930155
    Abstract: A polyurethane composition comprising: A) from 3 to 35% by weight of a polymeric composition comprising 1) at least one polymer and 2) at least one thermoset in amounts of from 0.5 to 50% by weight, based on the sum of A1) and A2), prepared by reaction in the polymer matrix A1) of a) at least one starting component containing NH2 groups and b) at least one starting component containing NCO groups, a) and b) having simultaneously or independently a functionality of ?2 and at least one starting component having a functionality of >2 being present in amounts of from 0.5 to 100% by weight, based on the weight of A2); B) from 15 to 45% by weight in the polymeric composition A), based thereon, of at least one amorphous and/or crystalline polyester having an OH number of from 10 to 250 mg KOH/g; C) from 7 to 25% by weight in the polymeric composition A), based thereon, of at least one curing agent based on blocked polyisocyanates, isocyanurates and/or uretdiones having a functionality of at least 1.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: August 16, 2005
    Assignee: Degussa AG
    Inventors: Jörn Volker Weiss, Werner Grenda
  • Patent number: 6919422
    Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: July 19, 2005
    Assignee: General Electric Company
    Inventors: Robert R Gallucci, Roy Ray Odle, William A. Kernick, III, Mark Alan Sanner
  • Patent number: 6916866
    Abstract: The present invention relates to natural-colored and pigmented thermoplastic molding compositions and molded parts fabricated therefrom that are laser-absorbing at least in partial spectral regions of the wavelength range from 700 to 1200 nm and that can be welded by laser beam welding and to molded parts that are transparent or translucent to laser light.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: July 12, 2005
    Assignee: Bayer Aktiengesellschaft
    Inventors: Detlev Joachimi, Thomas Braig, Martin Döbler, Frank Krause, Frederik Thoma
  • Patent number: 6916877
    Abstract: The present invention is directed to a curable, water-based coating composition utilized in waterborne coating systems such as a waterborne primer system. The coating composition is the reaction product of a water-dispersible cross-linking agent and a water-based copolymer prepared by free-radical polymerization. The copolymer is the reaction product of a first block and a second block. The first block is the reaction product of a plurality of ethylenically unsaturated monomers. One of the ethylenically unsaturated monomers includes a functional group suitable for reaction with the cross-linking agent. The functional group in the first block is preferably a carbonate, carbamate, or hydroxyl functional group. Other monomers in the plurality include acrylic acid and methyl methacrylate. The first block is also the reaction product of a vinylaromatic hydrocarbon monomer such as diphenylethylene. The second block is the reaction product of a non-functional, ethylenically unsaturated monomer.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: July 12, 2005
    Assignee: BASF Corporation
    Inventors: Swaminathan Ramesh, Paul J. Lessek, Wolfgang Bremser, Paul J. Harris
  • Patent number: 6908983
    Abstract: The present invention contemplates a process for forming polyaminoamide polymers formed by the reaction of a dibasic acid/ester with excess amounts of an amine; the intermediate polymer resulting therefrom; a process for synthesizing effective, high solids resins resulting from the reaction of intermediate polymers with an epihalohydrin; and the resultant high, solids resin. These resins may be used as wet strength resins in the papermaking industry.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: June 21, 2005
    Assignee: Hercules Corporation
    Inventor: William W. Maslanka
  • Patent number: 6906165
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: June 14, 2005
    Assignee: Rhodia Engineering Palstics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6884865
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: April 26, 2005
    Assignee: Rhodia Engineering Plastics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6881791
    Abstract: A curable, water-based coating composition comprising a reaction product of: a copolymer comprising a free-radical polymerization product of: a first block comprising a reaction product of: a plurality of ethylenically unsaturated monomers, and a vinyl aromatic hydrocarbon monomer, wherein at least one monomer of the plurality of ethylenically unsaturated monomers includes a functional group that can react with a water-dispersible cross-linking agent, and at least one monomer of the plurality of ethylenically unsaturated monomers is present in an amount such that it can render the copolymer water dispersible, and a second block comprising a reaction product of at least one ethylenically unsaturated monomer, wherein at least a portion of which are non-functional, and a water-dispersible cross-linking agent, wherein the water-based copolymer is free of salt structures.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: April 19, 2005
    Assignee: BASF Corporation
    Inventors: Swaminathan Ramesh, Paul Harris, Wolfgang Bremser, Walter H. Ohrbom
  • Patent number: 6878800
    Abstract: Process for providing a binder for mineral fibers, comprising the steps of: mixing together under reactive conditions an amine and an anhydride whereby water is added thereto, once substantially all the anhydride is dissolved and/or reacted in the amine.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: April 12, 2005
    Assignee: Rockwool International A/S
    Inventors: Thor Husemoen, Erling Lennart Hansen, Povl Nissen
  • Patent number: 6867256
    Abstract: The invention concerns a thermoplastic copolyamide and composition comprising as matrix said thermoplastic copolyamide, and a method of making such thermoplastic copolyamide. More particularly it concerns a copolyamide of the statistical tree type resulting from the reaction between a plurifunctional monomer comprising at least three reactive functions to form an amide function, said functions being two different types, and bifunctional monomer conventionally used in making linear polyamides. The resulting copolyamide has a very low softness index in molten state compared to the linear polyamide and improved shock-resistant properties. The invention also concerns with methods for making these copolyamides and composition for molding, extruding or injecting parts. Said compositions comprise fillers and additives and said copolyamide as a matrix.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: March 15, 2005
    Assignee: Nyltech Italia
    Inventors: Giuseppe Di Silvestro, Cesare Guaita, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6864349
    Abstract: Polymerized fatty acid-based polyamides may be combined with low polarity and high polarity co-solvents to produce homogeneous water-in-oil emulsions. These emulsions have the appearance of white or translucent creams, with stiffnessranging from soft and greasy, to hard and able to support weight. These emulsions are stable in the presence or absence of surfactant, and are formed easily by mixing components with heat and then cooling. These emulsions are useful in applications favoring an oil base, such as skin creams and cosmetics with emulsions of low stiffness, and car polish with emulsions of greater stiffness.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: March 8, 2005
    Assignee: Arizona Chemical Company
    Inventors: Mark S. Pavlin, Richard A. O'Brien
  • Patent number: 6864354
    Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: March 8, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6861468
    Abstract: A polyester resin composition containing a thermoplastic polyester resin; a polyester copolymer containing a monomer having at least one of an amino group, an imino group, an amido group, and a sulfonic acid group; a layered silicate; and an antioxidant. The monomer having at least one of an amino group, an imino group, an amido group, and a sulfonic acid group is contained in the polyester copolymer in an amount of 5 to 15 mol %. The monomer having at least one of an amino group, an imino group, an amido group, and a sulfonic acid group is contained in the polyester resin composition in an amount of 1 to 5 mol % based on a total polyester content of the polyester resin composition. The antioxidant is contained in the polyester resin composition in an amount of 0.01% to 1.0% by mass.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: March 1, 2005
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Tetsuya Yoshida, Yukio Shirokura, Tadahiro Kegasawa, Masami Okamoto
  • Patent number: 6852828
    Abstract: A poly amic acid precursor containing a combination of tetrahydrofuran and N-methylpyrrolidinone as cosolvents is described. Utilizing the combination of tetrahydrofuran and N-methylpyrrolidinone allows for the removal of significant portions of the solvent during the formation of the polyimide. The removal of tetrahydrofuran and N-methylpyrrolidinone can be done without the use of preheating zones so as to allow for the large scale production of polyimide articles.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: February 8, 2005
    Assignee: Medtronic, Inc.
    Inventor: Lisa Scott
  • Patent number: 6852791
    Abstract: An anti-reflection coating-forming composition is provided. This composition includes a polymer and a solvent. The polymer has a structural unit represented by the formula (1): wherein R1 is a monovalent atom other than a hydrogen atom or a monovalent group, and n is an integer of 0-4, provided that when n is an integer of 2-4, a plural number of R1's are the same or different; R2 and R3 are each a monovalent atom or group; and X is a bivalent group. The anti-reflection coating formed from this composition has a high antireflective effect, does not generate intermixing with a resist film, and enables a good resist pattern profile excellent in resolution and precision in cooperation with a positive or negative resist.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: February 8, 2005
    Assignee: JSR Corporation
    Inventors: Kazuo Kawaguchi, Masato Tanaka, Tsutomu Shimokawa
  • Patent number: 6849706
    Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: February 1, 2005
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Havva Yagci Acar, Farid Fouad Khouri, William David Richards
  • Patent number: 6843939
    Abstract: This invention relates to an UV stabilizing additive composition comprising an ortho-hydroxy triazine compound, a hindered hydroxybenzoate compound and optionally a hindered amine compound. This additive composition may be used to stabilize materials from UV radiation. This invention also contemplates a method of stabilizing a material by contacting the material with the UV stabilizing additive composition.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: January 18, 2005
    Assignee: Cytec Technology Corp.
    Inventors: Joseph A. Stretanski, Brent M. Sanders
  • Patent number: RE39207
    Abstract: The invention concerns anti-static, peroxide-stable molding compounds on the basis of polyamides and/or polyesters, whereby the molding compounds are modified with very pure conductive carbon black with a low specific surface area. These anti-static molding compounds can be used for the production of injection-molded or extruded parts and the production of sheets or multi-layer hoses and tubes.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: July 25, 2006
    Assignee: EMS-Inventa AG
    Inventors: Georg Stöppelmann, Manfred Hewel