Abstract: The polyamide resin of the present invention is produced by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of a C4-C20 ?, ?-straight-chain aliphatic dicarboxylic acid in the presence of at least one phosphorus compound selected from the group consisting of phosphinic acid compounds and phosphonous acid compounds and in the presence of an alkali metal compound of a weak acid. The weak acid has a dissociation constant lower than a first dissociation constant of a dicarboxylic acid mainly constituting the polyamide resin. The polyamide resin satisfies the following requirements (A), (B) and (C): 14000?a?40000??(A) b?1.000??(B) 0.9930?b?1.1a2×10?11+3.2a×10?7?0.9980??(C) wherein a and b are as defined in the disclosure.

Abstract: A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 s−1 is greater than 1000 Pas and a shear velocity of 1000 s−1 is less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.

Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least (a) 10-90 wt. % primary aminocarbonamide; (b) 10-90 wt. % aminocarboxylic acid and/or lactam; (c) 0-4 wt. % water; the amounts being relative to the sum of the compounds (a+b+c). Preferably the sum of the compounds (a+b+c) is at least 75 wt. % of the total composition, more preferably 85 wt. %, most preferably 90 wt. %. The polyamide obtained with the process has a &eegr;rel of more than 2.2. The process is eminently suitable for the preparation of polyamide-6 (polycapronamide) from a composition comprising 6-aminocapronamide, 6-aminocaproic acid and/or &egr;-caprolactam. This composition is preferably obtained via the reductive amination of a 5-formylyalerate ester, preferably 5-formylmethylvalerate in water.

Abstract: A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270° C. to 340° C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.

Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage. In a representative composition, 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 &mgr;m to approximately 180 &mgr;m and a number average diameter of approximately 0.1 &mgr;m to 15.00 &mgr;m and the average aspect ratio of which is greater than 3:1 is compounded with 100 parts by weight of semi-aromatic polyamide in which the quantity of aromatic monomer in the monomer component that forms the polyamide is greater than 20 mol % and the melting point of which is greater than 280° C.

Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.

Abstract: A separating agent that serves as an optical resolution agent is composed of a novel, useful optically active polymer. The separating agent is obtained through anionic polymerization of a novel maleimide and serves to separate optically active compounds.

Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.

Abstract: The aqueous dispersion of polyamide resin of the present invention comprises dispersed polyamide resin particles, basic material and water. The dispersed polyamide resin particles have a weight-average diameter of 0.1-10 &mgr;m. The ratio of end carboxyl groups to end amino groups in the polyamide resin is between 60/40 and 100/0. The amount of said basic material added is 0.2-3.0 mol per mol of end carboxyl groups. Such an aqueous dispersion of polyamide resin can be manufactured by adding the polyamide resin to an aqueous dispersion medium containing 0.2-3.0 mol of basic material per mol of end carboxyl groups in the polyamide resin.

Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.

Abstract: An adhesive having polyamide and an electrically conductive filler dispersed or contained therein, for use in bonding components of electrostatographic, contact electrostatic, digital and other like printing machines.

Abstract: A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

Abstract: A black thermoplastic molding composition which containing a dye combination made from nonabsorbing, non-black polymer-soluble dyes which produce a black thermoplastic molding composition which is translucent or transparent to laser light.

Abstract: The invention provides a primary carbamate functional material of the formula: 1

Abstract: The present invention relates to a water-based metallic coating composition comprising a resin composition for a water-based coating composition, a metallic pigment, metal silicate and a polyamide resin and capable of forming a coating film which is excellent in a flip-flop property and which is free of metallic mottling.

Abstract: A tire comprising a tread, where the tread includes a vulcanized rubber, from about 5 to about 80 parts by weight of a nylon-containing block copolymer per 100 parts by weight of the vulcanized rubber, and from about 1 to about 100 parts by weight filler per 100 parts by weight of the vulcanized rubber.

Abstract: An ink jet ink composition of water, a dye, a humectant and a hyperbranched polymer.

Abstract: The present invention relates to a polyamide-based composition used for the manufacture of moulded components exhibiting high resistance to attack by light and/or weathering. The invention more particularly relates to compositions comprising a thermoplastic matrix based on semi-crystalline polyamide, a black pigment and optionally reinforcing fillers. This composition is characterized by the presence of thermally stabilizing additives, in combination with a black pigment comprising at least one black pigment of inorganic origin and with at least additives which decrease the effect of radiation on the degradation of the polymeric matrix. The compositions of the invention exhibit improved stability in their properties under the effect of light and/or weathering, for example similar to that of polyester.

Abstract: A conductive polymer gel composition including a copolymer with alkenyl monomer units and maleimide monomer units, a crosslinking agent, and an electrolyte solution. The conductive polymer has a current resistance less than or equal to 10−4 ohms and can be used to provide electrolyte cells.

Abstract: The present invention relates to a photosensitive resin composition having excellent heat resistance, processability, and adhesion, and a solder resist comprising the composition, a cover lay film, and a printed circuit board obtained from or with these. The cover lay film is excellent in processability and adhesion at relatively low temperatures and has a low elastic coefficient after curing while keeping sufficient mechanical strength, so that the cover lay film is preferably used for a printed circuit board or a hard disk. The cover lay film is soluble and can be laminated at temperatures of not higher than 150° C., and a solder resist having excellent properties, such as heat resistance which can be laminated directly onto FPC without any adhesives and a cover lay film having few warps when laminated onto the FPC can be provided according to the present invention.

Abstract: A heat resistant resin bonded grindstone is prepared by heating under pressure a molded composition comprising 20 to 50 vol. % of a polyimide resin powder, 50 to 70 vol. % of a metal powder, and 10 to 30 vol. % of a diamond powder, so that the diamond powder can be dispersed in and supported by a binder phase comprising the polyimide resin powder and the metal powder, in which the polyimide resin powder has been produced from a diamine compound comprising p-phenylenediamine and a mixture of 85 to 97 mol. % of 3,3′,4,4′-biphenyltetracarboxylic acid or its dianhydride and 15 to 3 mol. % of 2,3,3′,4′-biphenyltetracarboxylic acid or its dianhydride.

Abstract: The present invention relates to a method of producing a functional polymer particle having at least one kind of functional group selected from the following structure group (A), which comprises the step of reacting a non-crosslinked polymer particle having a succinimidoxycarbonyl group with a compound having at least one kind of functional group selected from the following structure group (A) and at least one functional group selected from the group consisting of a primary amino group and a secondary amino group: 1

Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.

Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.

Abstract: A molding composition of at least 50% by weight of a polyamine-polyamide copolymer obtained from 0.05 to 2.5% by weight of a polyamine having at least 4 nitrogen atoms and having a viscosity of at least 5 000 Pa•s at 250° C. and at a shear rate of 0.1 l/s, and having a viscosity ratio of at least 7 at 250° C., when the melt viscosities at shear rates of 0.1 l/s and 100 l/s are compared with one another, has high melt stiffness and is easy to cut, and performs well in blow molding.

Abstract: A polyamide, the enzymatic reaction product of at least one polyamine and diester, and processes for preparing and using the same. In addition, processes for preparing and using the enzymatic reaction product as creping adhesives and wet strength resins to make cellulose products.

Abstract: A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

Abstract: The present invention contemplates poly(aminoamide) pre-polymers, polyamide polymers, a multi-step process for the synthesis of these pre-polymers and polymers using acrylates and at least one monomer containing at least two primary amines, and the resins resulting from the reaction of the polymers with an epihalohydrin. These resins may be used as wet strength resins and creping aids in the papermaking industry as well as surface additives for wool.

Abstract: Novel compounds derived from traditional semi- drying and non-drying oils featuring internally plasticizing and crosslinkable properties are disclosed and claimed. Preferred embodiments include acrylate or methacrylate esters of hydroxy long-chain olefinic compounds derived from castor oil or lesquerella oil. A process for the preparation of the novel compounds is also disclosed, which involves esterification reaction of ethylenically unsaturated carboxylic acids or its derivatives with substituted hydroxy long-chain olefinic compounds. These compounds are suitable for forming latices, which form films at low minimum film forming temperatures (MFT) ranging from −5 to 10 ° C. and cure to above ambient glass transition (Tg polymers without the use of traditional organic cosolvents which contribute to environmental pollution via volatile organic compounds (VOCs) emissions. These latices are therefore useful in waterborne coatings, contact and pressure sensitive adhesives, and inks.

Abstract: A latex emulsion that includes crosslinked polymeric microparticles dispersed in an aqueous continuous phase. The microparticles are prepared from a monomer mix of a crosslinking monomer, a monomer having hydrophilic functional groups, and one or more other monomers. Also disclosed is a thermosetting composition that includes a first reactant that has reactive functional groups; a curing agent that has at least two functional groups reactive with the functional groups of the first reactant; and the latex emulsion of crosslinked polymeric microparticles dispersed in an aqueous continuous phase. The thermosetting composition may be used to coat a substrate. The coating may be a multi-layer composite coating that includes a base coat layer deposited from a pigmented film-forming base coat composition containing the thermosetting composition; and a substantially pigment free top coat layer deposited over a portion of the base coat layer from a substantially pigment free top coat composition.

Abstract: Disclosed is a polyamide resin composition, a method for producing the composition, and articles from the composition. The polyamide resin composition polyamide resin composition is formed by melt-kneading (A) 100 parts by weight of nylon resin, and (B) 5-150 parts by weight of at least one of a non-fibrous inorganic filler having an average particle diameter of 0.05-10 &mgr;m and a fibrous inorganic filler, excluding glass fiber, having a fiber diameter of 0.05-10 &mgr;m. In the polyamide resin composition, an amount of a polyamide resin component deposit remaining on the inorganic filler when the inorganic filler is recovered by dissolving the polyamide resin composition into hexafluoroisopropanol is at least 4 g/m2 per unit surface area of the inorganic filler measured by a BET method. The nylon resin composition is excellent in rigidity and toughness and particularly excellent in high-speed surface impact fracture characteristic.

Abstract: Novel latex or emulsion compositions containing internally plasticizing and crosslinkable monomers derived from traditional semi-drying or non-drying oils are disclosed and claimed. The monomers are ethylenically unsaturated derivatives of long-chain olefinic compounds. Preferred embodiments include latex formed from acrylate or methacrylate esters of fatty alcohols. A process for the synthesis of the latex composition is also disclosed, which involves (a) polymerization of the ethylenically unsaturated derivatives of a long-chain olefinic compound in an aqueous phase with at least one other copolymerizable monomer; and (b) blending of so formed polymer with at least one drier and a surfactant to form the novel latex or emulsion compositions. These compositions form films at low minimum film forming temperatures (MFT) ranging from −5 to 10° C.

Abstract: This thermoplastic composition and process for making articles of the same includes a thermoplastic matrix that includes a resin and filler materials wherein the filler materials includes a combination of fibers, at least one lubricant, and thermally conductive material, for improving tribological performance of thermoplastic materials. In the alternative, a thermally conductive lubricant may be substituted for the combination of the lubricant and the thermally conductive material.

Abstract: The present invention relates to new polyamide oligomers. These oligomers can be conjugated to lipids, nucleic acids, peptides, proteins, etc. The oligomer-lipid conjugates can be used to form liposomes, virusomes, micelles, etc., optionally containing drugs or biological agents. The polyamide oligomers are heterobifunctional allowing the attachment of other suitable ligand compounds (e.g., a targeting moiety). In addition, methods of use for the liposomes, virusomes, micelles, etc., are provided.

Abstract: The invention is directed to a polymer-clay nanocomposite material comprising a melt-processible matrix polymer and a layered clay material having decreased levels of extractable material, such as extractable salts of organic cations. This invention is also directed to processes for preparing polymer-clay nanocomposites, and articles or products produced from nanocomposite materials.

Abstract: A composition for protecting a target surface and a method of applying the composition is provided. The composition includes a PVP compound (i.e., polyvinylpyrrolidone and moieties thereof) or an anionic polymer dispersed in a solvent such as water or a C1-C4 alcohol. The compositions can further include optional ingredients such as surfactants, fragrances, waterproofing agents, and coloring agents. The compositions are applied to the target surface in a thin layer and allowed to dry. Preferably, at least one additional coat is subsequently applied to the first layer. The dried coating layers are essentially invisible to observers and have an ASTM D2240-97 hardness of at least about 70, making them useful for protecting the target surface from potentially damaging foreign elements (e.g., such as protecting the front end of an automobile from paint chips caused by flying rocks). The layers remain substantially in place upon exposure to rain. Additional layers can be applied periodically as desired.

Abstract: A wear-resistant aqueous coating composition and a method for producing a wear-resistant coating are disclosed. In particular, the present invention relates to aqueous coating compositions which include a polycarbodiimide, an emulsion polymer having multiple functional groups reactive with carbodiimide moieties, and an alkoxysilane which is either reactive with the aqueous emulsion polymer, reactive with the polycarbodiimide, or attached to the polycarbodiimide.

Abstract: A process for the production of polyamides is disclosed. In a first reaction step, suitable monomers such as caprolactam or an aliphatic aminocarboxylic acid are reacted with polyfunctional amines, which contain at least one secondary amino group, and/or with salts containing such amines and dicarboxylic acids. The reaction product is in a further process step undergoes solid phase post-condensation.

Abstract: An aqueous polymer dispersion comprising a polymer substantially free of cationic polymerizable groups and a cationic photoinitiator, wherein the polymer is capable of being precipitated by an acid or base generating photoinitiator upon exposure to radiation and is optionally an energy curable polymer.

Abstract: The invention relates to a removable coating and a method for preparing that removable coating. The method comprises applying to a surface of a substrate a removable coating composition including an aqueous dispersion of film forming polymer and amphoteric surfactant having isoelectric point at pH=3 to pH=8.

Abstract: This invention relates to non-aqueous coating and ink formulations for use on flexible film or paper packages for food, which require aseptic packaging conditions. The printed and coated packaging materials, and methods of aseptic packaging, as well as the aseptic packages are also disclosed. The coating formulation comprises the following components: 1) a mixing varnish comprising a phenolic-modified co-solvent-type polyamide resin, 2) a nitrocellulose compound varnish, 3) a non-aqueous solvent mixture, and 4) specialty additives, and wherein all components present in the formulation are stable in the presence of an oxidizing agent.

Abstract: A polyimide film of 20 to 125 &mgr;m thick composed of aromatic polyimide prepared from an aromatic tetracarboxylic acid component (composed mainly of 3,4,3′,4′-biphenyltetracarboxylic acid or its derivative) and an aromatic diamine component (composed mainly of p-phenyl-enediamine) and containing a micro-granular filler of metal atom-containing inorganic material, can be so denatured on its surfaces that an amount of the metal atom and a ratio of oxygen/carbon would increase by 0.03 to 1.0 atomic % and 0.01 to 0.20, respectively, on the processed surfaces, upon running in a gaseous mixture of argon and hydrogen between a plurality of activated plasma discharge electrodes arranged in a double line under such condition that the running polyimide film is free from contact with the electrodes.

Abstract: The invention describes the use in a formulation for floor adhesives of an aqueous dispersion containing from 5 to 70% by weight of at least one polymer having a glass transition temperature below 0° C. and carrying a ureido functional group.

Abstract: Novel nylon multi-polymer solutions are disclosed having improved shelf-life and resistance to gelation. These solutions include a range of alcohols and nylon multi-polymers in combination with effective amounts of halide salts selected from Group IIA, Li, Zn, or Al. The solutions may be applied to a variety of substrates.

Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C. under a load of 2,160 g, wherein said relative viscosity and said melt flow rate have a relationship of the following formula (I): 2.87×103 exp(−3.48 &eegr;r)≦MFR≦3.25×104 exp(−3.48 &eegr;r)  (I) wherein &eegr;r is relative viscosity and MFR is melt flow rate. The nylon 12 has excellent extrusion moldability and creep characteristics, fatigue characteristics and the like mechanical properties and is suited for tubular molds. A nylon 12 composition comprising the nylon 12 having the above-described specific relationship between &eegr;r and MFR and a plasticizer is also disclosed.

Abstract: The present invention is to provide a polyamide resin composition for fuse elements, assuring sufficient arc resistance upon boosting of vehicles voltage (e.g., 42 V system), being excellent in rigidity, heat resistance and transparency.

Abstract: The invention concerns a polyamide comprising macromolecular chains having a star-shaped configuration, a method for making said polyamide and compositions comprising same. More particularly, the invention concerns a method for making a polyamide comprising linear macromolecular chains and star-shaped macromolecular chains with control of the star-shaped chain concentration in the polymer. Said control is obtained by using besides the polyfunctional polymers and amino acids or lactams a polyfunctional comonomer comprising either acid functions or amine functions. The resulting polyamide has optimal mechanical and rheological properties for improving the speed and quality of mould filling and producing mouldable compositions comprising high filler factors.

Abstract: A packaging film is made from a master-batch on a polyamide base. The preferred polyamide base is copolyamide 6/12. The packaging films made from this master-batch exhibit improved slip properties and anti-blocking properties. The packaging films are particularly suitable for use in automatic packaging machines in order to increase the cycle frequencies in the are of foodstuff packaging.