Al Patents (Class 524/786)
  • Patent number: 5238969
    Abstract: Process for the preparation of filled heat-curable compounds of the polyurethane type by reaction of condensation of the constituents of the desired compound in the presence of a pulverulent filler, which is characterized in that the said filler is predispersed in the presence of a stabilizing agent in a liquid organic phase compatible with the desired heat-curable compound in the course of its formation reaction, the said filler being then in the form of a homogeneous and stable suspension, and the suspension thus prepared is then introduced into the reaction mixture before, during or after the introduction of at least one of the constituents of the desired heat-curable compound.The process according to the invention makes it possible to produce compounds of the polyurethane type whose mechanical and physical characteristics are at least equivalent or even improved in relation to those of the unfilled identical compounds by virtue of the excellent distribution of the inorganic filler.
    Type: Grant
    Filed: March 31, 1992
    Date of Patent: August 24, 1993
    Inventors: Marie-Josee Guarneri, Christian Leriche, Jean Preneau, Patrick Trouve, Pierre Verrier
  • Patent number: 5225458
    Abstract: A process for (co)polymerizing alpha-olefins in the gas phase in a fluidized bed or mechanically stirred bed reactor using a Ziegler-Natta type catalyst or a heat activated chromium oxide/refractory oxide catalyst wherein the (co)polymerization is carried out in the presence of 0.005 to 0.2 weight %, based on the weight of the (co)polymer bed, of an inert pulverulent inorganic substance (e.g. silica) having a mean particle diameter between 0.5 and 20 microns. The process is capable of being operated at temperatures closer to the softening point of the produced polyolefin than in the absence of the pulverulent solid.
    Type: Grant
    Filed: July 19, 1991
    Date of Patent: July 6, 1993
    Assignee: BP Chemicals Limited
    Inventors: Jean-Claude A. Bailly, Joelle Collomb
  • Patent number: 5219921
    Abstract: An electrically insulating paint composition which is curable at low temperatures from about 60.degree. C. to about 100.degree. C., which comprises (A) an alkenyl group-containing, silanol group-free organopolysiloxane which is a copolymer of three kinds of siloxane units represented by the same general formula (R.sup.1).sub.a SiO.sub.(4-a)/2, wherein R.sup.1 represents an unsubstituted or substituted monovalent hydrocarbon residue, and a's in three different units represent 0, 1 and 3 respectively, said copolymer containing at least two alkenyl groups in a molecule; (B) an organopolyhydrogensiloxane which is a homo- or copolymer containing at least one siloxane unit represented by the general formula (R.sup.2).sub.b SiO.sub.(4-b)/2, wherein R.sup.2 represents hydrogen or an unsubstituted or substituted monovalent hydrocarbon residue, and b satisfies a relation 0.ltoreq.b.ltoreq.
    Type: Grant
    Filed: May 27, 1992
    Date of Patent: June 15, 1993
    Assignee: Shin-Etsu Chemical Company, Ltd.
    Inventor: Shiro Gomyo
  • Patent number: 5216104
    Abstract: An addition-type silicone rubber composition comprising (a) an organopolysiloxane containing at least two alkenyl groups bonded to the silicon atoms in one molecule, (b) an organopolysiloxane containing one alkenyl group bonded to the silicon atom in one molecule on an average, (c) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to the silicon atoms, (d) a platinum catalyst; and a product of curing the composition. This silicone rubber composition can give a low-modulus silicone rubber by curing which neither contaminates the material in contact therewith nor deforms owing to shrinkage, without hindering the adhesion of the composition during its curing stage.
    Type: Grant
    Filed: July 17, 1990
    Date of Patent: June 1, 1993
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takehide Okami, Hironao Fujiki
  • Patent number: 5212232
    Abstract: A process for producing a styrene-based polymer, particularly a styrene-based polymer having mainly a syndiotactic structure by polymerizing a styrene-based monomer in the presence of a filler by using a catalyst containing (A) a titanium compound and (B) aluminoxane as main components. The filler acts as a catalyst carrier, increasing catalyst activity, and thus de-ashing treatment is not needed. When the filler is used in a large amount, there is obtained a composition in which the filler is uniformly dispersed in the styrene-based polymer. The styrene-based polymer or styrene-based polymer-containing composition is excellent in heat resistance and chemical resistance.
    Type: Grant
    Filed: October 3, 1991
    Date of Patent: May 18, 1993
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Masahiko Kuramoto, Hiroshi Maezawa, Hiroshi Hayashi
  • Patent number: 5196456
    Abstract: Superabsorbents made by the process of electron beam initiated polymerization of partially neutralized acrylic acid having improved absorbencies when a trivalent cationic salt, for example, Aluminum Acetate or a tetravalent cationic salt, for example, Platinum Tetrachloride, are added to the partially neutralized acrylic acid solution before polymerization is initiated.
    Type: Grant
    Filed: May 13, 1988
    Date of Patent: March 23, 1993
    Assignee: Chicopee
    Inventors: Hien V. Nguyen, Franklin Boardman
  • Patent number: 5179142
    Abstract: A polylactone-modified organopolysiloxane compound, wherein a polylactone-containing group represented by the formula (I) is bound to a silicon atom located at at least either of the terminal positions and/or intermediate positions to impart excellent properties as a synthetic resin modifier (when Y in (I) is an acetyl group or a hydrogen atom) or as a film former (when Y in (I) is a hydrogen atom): ##STR1## wherein Z represents a trivalent hydrocarbon residue which may contain oxygen, sulfur or/and nitrogen atom(s); X represents a lactone group of the formula, ##STR2## (wherein R represents a hydrogen atom or an alkyl group containing from 1 to 12 carbon atoms; a represents an integer from 4 to 6), k and L each represents an integer of 1 or more; and Y represents a hydrogen atom or an acetyl group.
    Type: Grant
    Filed: June 4, 1990
    Date of Patent: January 12, 1993
    Assignee: Shin-Etsu Chemical Company, Limited
    Inventors: Ichiro Ono, Hiroshi Yoshioka
  • Patent number: 5177140
    Abstract: A material for a mold which comprises, as main components, a refractory aggregate and a hardenable binder comprising a polyfunctional acrylamide having at least two ethylenically unsaturated groups in the molecule, has an excellent low-temperature rapid hardenability, disintegrability, and pot life and is especially suitable as a material for a mold for casting a low-melting-point metal such as an aluminum alloy.
    Type: Grant
    Filed: April 12, 1990
    Date of Patent: January 5, 1993
    Assignee: Asahi Yukizai Kogyo Co. Ltd.
    Inventors: Fumiyuki Ogawa, Kyouji Tominaga, Yoshiomi Ota, Isao Kai, Kazuo Tamemoto, Mitsuhiro Osada
  • Patent number: 5159012
    Abstract: An improved process for the manufacture of polyurethane elastomers from a reaction mixture which comprises a polyol, an isocyanate, water, a bismuth catalyst and an optional filler. In the improved process of this invention, the rate of reaction is decreased by the addition of water to the reaction mixture and increased by the removal of water from the reaction mixture.
    Type: Grant
    Filed: November 29, 1991
    Date of Patent: October 27, 1992
    Assignee: Textile Rubber & Chemical Co., Inc.
    Inventors: Van I. Doesburg, Mark N. Cline, Byoung-In Cho, L. Jay Taylor
  • Patent number: 5145931
    Abstract: An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain .ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure .gtoreq.10 mmHg at 200.degree. C.
    Type: Grant
    Filed: October 26, 1990
    Date of Patent: September 8, 1992
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Kazumi Nakayoshi, Katsutoshi Mine
  • Patent number: 5140061
    Abstract: Aqueous silicone dispersions crosslinkable into elastomeric state upon removal of water therefrom, well adapted for the production of paints and silicone elastomer seals, e.g., for the construction industry, include:(A) 100 parts by weight of an oil-in-water emulsion of an .alpha.,.omega.-(dihydroxy)polydiorganosiloxane, stabilized with an anionic and/or nonionic surfactant;(B) 0.1 to 20 parts by weight of an aminosilane and/or amidosilane;(C) 0 to 3 parts by weight of a metal curing catalyst; and(D) 0 to 250 parts by weight of a non-siliceous inorganic filler, such emulsion having a pH of from 7 to 13 and a dry solids content of at least 40%.
    Type: Grant
    Filed: February 5, 1990
    Date of Patent: August 18, 1992
    Assignee: Rhone-Poulenc Chimie
    Inventor: Michel Feder
  • Patent number: 5134191
    Abstract: A hard coating composition comprising an epoxy group-containing organic silicon compound and inorganic submicron particles such as silica sol is curable with a minimal amount of an antimony compound as the curing catalyst. The composition is thus stable during shelf storage and can be cured to a plastic optical article as a mar resistant hard coating film.
    Type: Grant
    Filed: February 12, 1990
    Date of Patent: July 28, 1992
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Mitsuhiro Takarada, Kazuharu Sato, Kenji Yamamoto, Shigeru Mori
  • Patent number: 5104919
    Abstract: A curable silicon composition comprising:(A) an organopolysiloxane containing at least two silicon-bonded unsaturated aliphatic hydrocarbon groups and having a viscosity of from 100 to 200,000 cSt at 25.degree. C.,(B) a vinyl group-containing organocyclopolysiloxane having the general formula (I): ##STR1## wherein R represents a hydrocarbon group having from 1 to 6 carbon atoms excluding unsaturated aliphatic hydrocarbon groups, and n represents an integer of from 3 to 8,(C) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms in the molecule,(D) a platinum family metal catalyst, and(E) a triazole compound.This curable silicone composition has good curing properties and can produce cured products having a markedly small permanent compression set.
    Type: Grant
    Filed: March 15, 1990
    Date of Patent: April 14, 1992
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takehide Okami, Masanobu Miyakoshi, Hajime Kiriki
  • Patent number: 5091445
    Abstract: A silicone sealant prepared by curing and cross-linking methylhydrosiloxanes by contacting and forming a mixture of an allyl amide or an allyl ester with at least one methylhydrosiloxane in the presence of a Group VIII metal catalyst, and heating the mixture of the allyl amide, the methylhydrosiloxane, a filler, and the Group VIII metal catalyst, in the presence of ambient moisture until the methylhydrosiloxane becomes cured and cross-linked.
    Type: Grant
    Filed: May 4, 1990
    Date of Patent: February 25, 1992
    Assignee: Dow Corning Corporation
    Inventor: Anthony Revis
  • Patent number: 5082891
    Abstract: The curable resin composition of the present invention consists of a curable resin having uniformly dispersed therein particles of a cured silicone rubber obtained from an organosiloxane composition curable by a platinum-catalyzed hydrosilation reaction, wherein said organosiloxane composition contains reaction products of an ethylenically unsaturated epoxy compound and an ethylenically unsaturated aromatic compound with the organohydrogenpolysiloxane present in said organosiloxane composition. Either or both of the epoxy compound and the aromatic compound can be prereacted with a portion of the silicon-bonded hydrogen atoms of the organohydrogenpolysiloxane.
    Type: Grant
    Filed: December 13, 1989
    Date of Patent: January 21, 1992
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Yoshitsugu Morita, Noriyasu Yokoyama, Keiji Yoshida
  • Patent number: 5082735
    Abstract: A process of curing and cross-linking methylhydrosiloxanes by contacting and forming a mixture of an allyl amide with at least one methylhydrosiloxane in the presence of a Group VIII metal catalyst, and heating the mixture of the allyl amide, the methylhydrosiloxane, and the Group VIII metal catalyst, in the presence of ambient moisture until the methylhydrosiloxane becomes cured and cross-linked.
    Type: Grant
    Filed: May 4, 1990
    Date of Patent: January 21, 1992
    Assignee: Dow Corning Corporation
    Inventors: Anthony Revis, William H. Campbell
  • Patent number: 5079292
    Abstract: A curable composition, suitable for use as a nonburnable adhesive is provided comprising a mixture of polysiloxane polymers comprising a straight chain component and a branched chain component, a platinum catalyst, a liquid organohydrogen polysiloxane cross-linking agent, a low viscosity dimethylvinyl chain-stopped dimethyl polysiloxane and alumina trihydrate.
    Type: Grant
    Filed: August 31, 1988
    Date of Patent: January 7, 1992
    Assignee: Liquid System Technologies, Inc.
    Inventors: Kenneth A. Hoffman, Jeffrey E. Julis, Thomas J. Rissmann
  • Patent number: 5061739
    Abstract: A room temperature curing composition comprising:(A) a silanol-terminated polydiorganosiloxane;(B) a hydrolyzable silyl-terminated polymer obtained by reacting:(a) an epoxy-terminated polyether;(b)(i) an heterocyclic compound containing imino groups, and/or;(ii) an aromatic compound or a heterocyclic compound containing mercapto groups; and,(c) an organosilicon compound containing an epoxy group and a hydrolyzable group;(C) an inorganic filler; and,(D) a curing catalyst.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: October 29, 1991
    Assignee: Toshiba Silicone Co., Ltd.
    Inventor: Chiyuki Shimizu
  • Patent number: 5036135
    Abstract: Reaction resin mixtures which can be economically processed provide inflammable molded materials with excellent mechanical properties and high dimensional stability under heat when they contain the following constituents: (A) a phosphorus-free polyfunctional epoxide; (B) an epoxy-group-containing phosphorus compound; (C) a polyfunctional isocyanate; (D) a curing catalyst; and, if required, (E) filler material.
    Type: Grant
    Filed: July 19, 1990
    Date of Patent: July 30, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang von Gentzkow, Jurgen Huber, Wolfgang Rogler, Dieter Wilhelm
  • Patent number: 5036131
    Abstract: A silicone dispersion, having improved toughness and thixotropic characteristics, cures to an elastomer upon exposure to the air. The dispersion is particularly useful for spraying onto exposed electrical conductors to prevent their shorting out from contact with animals and birds. The dispersion contains a hydroxyl endblocked polydimethylsiloxane, aluminum trihydrate, moisture activated crosslinking agent and catalyst. In order to obtain thixotropy, it also contains a phenyl or 3,3,3 trifluoropropyl-containing hydroxyl endblocked polydiorganosiloxane and untreated fumed silica. The method of making the dispersion is also specified.
    Type: Grant
    Filed: May 16, 1990
    Date of Patent: July 30, 1991
    Assignee: Dow Corning Corporation
    Inventor: Alan L. Himstedt
  • Patent number: 5023291
    Abstract: Disclosed herein is a polyester composition which comprises a polyester with a terminal carboxyl group content of 40 to 80 equivalents/10.sup.6 and 0.0 to 5 wt %, based on the total amount of the polyester composition, aluminum oxide particles of 0.005 to 5 .mu.m in average particle diameter and which has a melt resistivity of 6 x 10.sup.6 to 5 x 10.sup.8 .OMEGA..cm.By using the polyester composition, it is possible to successively produce a film having excellent wear resistance and flatness over a long production run.
    Type: Grant
    Filed: July 13, 1989
    Date of Patent: June 11, 1991
    Assignee: Diafoil Company, Limited
    Inventors: Seiji Sakamoto, Nobuyasu Shudo
  • Patent number: 5021494
    Abstract: A thermally conductive silicone composition comprising:(A) 100 parts by weight of a polyorganosiloxane containing at least two silicon-bonded alkenyl groups per molecule and having a viscosity as measured at 25.degree. C. of 10 to 100,000 cP;(B) a polyorganohydrogensiloxane containing at least three silicon-bonded hydrogen atoms per molecule in an amount such that the number of silicon-bonded hydrogen atoms contained therein is 0.5 to 4.0 per alkenyl group contained in component (A);(C) a catalyst selected from the group consisting of platinum and platinum compounds, in an amount of 0.1 to 100 ppm by weight, in terms of the amount of platinum atoms, based on the amount of component (A);(D) 100 to 800 parts by weight of a heat transfer filler having an average particle diameter of 5 to 20 .mu.m and having a particle size distribution such that particles having a particle diameter of 5 .mu.m or less are 20% or more of the whole particles and particles having a particle diameter of 10 .mu.
    Type: Grant
    Filed: October 3, 1989
    Date of Patent: June 4, 1991
    Assignee: Toshiba Silicone Co., Ltd
    Inventor: Masanori Toya
  • Patent number: 5021091
    Abstract: A hard coating composition comprising an organic silicon compound and inorganic submicron particles such as silica sol and antimony oxide sol is improved in curing properties and shelf stability by blending aluminum perchlorate as the curing catalyst.
    Type: Grant
    Filed: January 16, 1990
    Date of Patent: June 4, 1991
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Mitsuhiko Takarada, Kazuharu Sato, Kenji Yamamoto, Shigeru Mori
  • Patent number: 5013781
    Abstract: A gasket and packing material which exhibits excellent adhesiveness to substrates and resistances to degradation of properties when exposed to hot hydrocarbon oils and coolants such as used in an automobile radiator are made by curing a composition which contains polydimethylsiloxane, an organopolysiloxane having R'.sub.3 SiO.sub.0.5 and SiO.sub.2 units or R'.sub.3 SiO.sub.0.5, R'.sub.2 SiO, and SiO.sub.2 units, an inorganic filler, an alkoxysilane adhesion promoter, and a ketoxime silicon compound crosslinker.
    Type: Grant
    Filed: August 13, 1987
    Date of Patent: May 7, 1991
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Taro Koshii, Tetsuo Amemiya
  • Patent number: 5011647
    Abstract: Active hydrogen-containing compositions having internal mold release components are used in a process in preparing molded polymeric products. In the process, the active hydrogen-containing composition contains (a) a primary or secondary amine, (b) a carboxylic acid or amido carboxylic acid salt of a group II metal or of aluminum, lithium, copper, iron, cobalt or nickel, and optionally (c) a carboxylic acid or amido carboxylic acid.
    Type: Grant
    Filed: June 21, 1989
    Date of Patent: April 30, 1991
    Assignee: The Dow Chemical Company
    Inventors: Louis W. Meyer, Robert Carswell, J. Alan Vanderhider
  • Patent number: 5011870
    Abstract: The combination of known thermally conductive fillers having an average particle size of from about 10 to about 100 microns with aluminum nitride having an average particle size of less than one micron improves the thermal conductivity of organosiloxane compositions. The thermal conductivity values achieved using this combination of fillers is higher than can be achieved using the maximum loading of either filler alone that can be present without adversely affecting the ability of the organosiloxane composition to cure or to serve as useful coatings and encapsulates for electronic solid state devices and other substrates.
    Type: Grant
    Filed: February 8, 1989
    Date of Patent: April 30, 1991
    Assignee: Dow Corning Corporation
    Inventor: Adam L. Peterson
  • Patent number: 5008033
    Abstract: Active hydrogen-containing compositions having internal mold release components for use in preparing molded polymeric products are disclosed which contain (a) a primary or secondary amine, (b) a carboxylic acid or amido carboxylic acid salt of a group II metal or of aluminum, lithium, copper, iron, cobalt or nickel, and optionally (c) a carboxylic acid or amido carboxylic acid.
    Type: Grant
    Filed: June 12, 1989
    Date of Patent: April 16, 1991
    Assignee: The Dow Chemical Company
    Inventors: Louis W. Meyer, J. Alan Vanderhider, Robert Carswell
  • Patent number: 5008307
    Abstract: A liquid silicone rubber composition capable of yielding a thermally conductive elastomer which comprises an organopolysiloxane capable of reaction with an organohydrogenpolysiloxane having at least two .tbd.SiH bonds, two types of alumina powders having, respectively, defined average sizes, and a catalytic amount of platinum or a platinum compound used as a catalyst for the reaction between the organopolysiloxane and the organohydrogenpolysiloxane.
    Type: Grant
    Filed: December 11, 1989
    Date of Patent: April 16, 1991
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Hiroshi Inomata
  • Patent number: 4996112
    Abstract: Organopolysiloxane compositions that are storage-stable under anhydrous conditions, but curable into elastomeric state in the presence of moisture and, thus, are well suited as sealants and coatings and which particularly strongly adhere to substrates used in the construction industry, contain at least one .alpha., .omega.-dihydroxydiorganopolysiloxane polymer; at least one ketiminoxysilane crosslinking agent therefor; a bonding agent including admixture, or reaction product of, (i) an aminoorganosilicon compound containing a primary amine group, with (ii) an organosilicon compound containing an epoxy functional group; and, advantageously, a filler material and a curing catalyst.
    Type: Grant
    Filed: April 7, 1989
    Date of Patent: February 26, 1991
    Assignee: Rhone-Poulenc Chimie
    Inventors: Patrice Perrin, Andre Pierron
  • Patent number: 4978704
    Abstract: Organopolysiloxane compositions that are storage-stable under anhydrous conditions, but curable into elastomeric state in the presence of moisture and, thus, are well suited as sealants and coatings and which particularly strongly adhere to substrate used in the construction industry, contain at least one .alpha., .omega.-dihydroxydiorganopolysiloxane polymer; at least one acyloxysilane crosslinking agent therefor; a bonding agent including admixture, or reaction product of, (i) an aminoorganosilicon compound containing a primary amine group, with (ii) an organosilicon compound containing an epoxy functional group; and, advantageously, a filler material and a curing catalyst.
    Type: Grant
    Filed: April 7, 1989
    Date of Patent: December 18, 1990
    Assignee: Rhone-Poulenc Chimie
    Inventor: Patrice Perrin
  • Patent number: 4978706
    Abstract: A silicone composition which is stable in the absence of moisture, but cures to an elastomer upon exposure to moisture consists essentially of a hydroxyl endblocked polydiorganosiloxane; a difunctionalsilane having acetamido, urea, or urethane functional groups; and a tetrafunctionalsilane having oximino functional groups. A composition containing 100 parts by weight of the polydiorganosiloxane, from 0.1 to 7 parts by weight of difunctionalsilane, from 0.1 to 7 parts by weight of tetrafunctionalsilane, and a ratio of difunctionalsilane to tetrafunctionalsilane of from 0.1 to 3, and optional filler is useful as a sealant or adhesive, having an improved skin over time.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: December 18, 1990
    Assignee: Dow Corning Corporation
    Inventors: John E. Dietlein, Russell P. Kamis, Jerome M. Klosowski
  • Patent number: 4966920
    Abstract: The present invention provides a composition comprising a combustible material containing urethane linkages; and as a smoke and toxic gas suppressant, a polyester which has an acid value below 30 mg KOH/g, preferably below 10 mg KOH/g, and which is derived from:Ia.[A] a component which contains 4 carboxyl groups or anhydride thereof, and which is preferably an aromatic component, orIb. a mixture of [A] and [B]:[B] one or more components which contain 2 to 12, preferably 2 to 4, carboxyl groups or 1 to 6, preferably 1 or 2, carboxylic anhydride groups, selected from:[B.sub.1 ] an aliphatic carboxylic acid compnent containing 2-16 carbon atoms; [[B.sub.2 ] a cyclic non-aromatic carboxylic acid containing 7-17 carbon atoms; and[B.sub.3 ] an aromatic carboxylic acid containing 8-16 carbon atoms; andII.
    Type: Grant
    Filed: January 19, 1989
    Date of Patent: October 30, 1990
    Assignee: Ciba-Geigy Corporation
    Inventors: James Gainer, Robert L. Bentley
  • Patent number: 4962151
    Abstract: The pumpability and extrudability of a mixture of linear polymer and filler can be controlled by using a mixture of filler particle sizes. For 100 parts by weight of polymer there is mixed in from 50 to 150 parts by weight of filler mixture, the filler mixture comprising from 0.5 to 50 percent by weight of a large particle size filler having an average particle diameter of from 0.5 to 10 micrometers and from 50 to 99.5 percent by weight of a small particle size filler having an average particle diameter of less than 0.1 micrometers, the large particle size filler having an average particle diameter of at least 10 times the average particle diameter of the small particle size filler. By adjusting the ratio of large particle size filler to small particle size filler, the change in viscosity of the mixture with change in temperature can be controlled.
    Type: Grant
    Filed: June 22, 1989
    Date of Patent: October 9, 1990
    Assignee: Dow Corning Corporation
    Inventor: Frank A. Mellon
  • Patent number: 4954562
    Abstract: Improved water-absorbing, crosslinked acrylate resins are prepared by aqueous polymerization of (A) acrylic acid neutralized 70 to 100 mole percent for example with ammonia and/or caustic alkali and/or an amine; with (B) acrylamide in a mole ratio of 70 to 100 mole percent (A) to 30:0 mole percent (B); (C) styrene, in an amount of 0% to 25% based on the weight of acrylic acid or acrylate; and (D) a water miscible or a water soluble polyvinyl monomer in the presence of (E) a metal oxide, such as titanium dioxide, in an amount of 0.001% to 5% based on the total weight of (A), (B), (C), (D) and (E), such that the amount of (D) is 0.001 to 0.6 weight percent based on the total weight of (A), (B), (C), (D) and (E). In addition, surface treating the water-absorbing crosslinked acrylate resins with a polyquaternary amine substantially further increases both the rate of water absorption and the quantity of water absorbed and retained by the metal oxide-containing resin.
    Type: Grant
    Filed: January 30, 1989
    Date of Patent: September 4, 1990
    Assignee: American Colloid Company
    Inventor: Mark Anderson
  • Patent number: 4950710
    Abstract: A composite comprising the reaction product of a filler having a reactive hydroxylated surface, a monomer or polymer containing carboxyl groups, and an organoaluminum compound, the organoaluminum compound being reacted with said hydroxylated surface and with said monomer or polymer. A preferred composite is made by reacting aluminum sec-butoxide with fiberglass and acrylic acid and methyl methacrylate under polymerization conditions.
    Type: Grant
    Filed: February 8, 1988
    Date of Patent: August 21, 1990
    Assignee: Aluminum Company of America
    Inventor: Max E. Roha
  • Patent number: 4935086
    Abstract: A thermally conductive adhesive, and processes for formulating the same, are provided for bonding an electrical device package, such as an integrated circuit (IC) package, to a surface of a substrate, such as a printed circuit board. The thermally conductive adhesive comprises a polyurethane-based resin material and a predetermined amount of thermally conducting, electrically insulating material, such as alumina, mixed therewith. With such arrangement, a thermally conductive adhesive is provided having a low modulus of elasticity. Thus, such adhesive is soft and pliable rather than rigid, and thus deforms in response to the different amounts of thermal expansion, or contraction, of the IC package and PCB against, or away from, the thermally-conductive adhesive, thereby preventing damage to either the IC package or PCB, or separation of solder joints therebetween, due to such thermal expansion or contraction.
    Type: Grant
    Filed: October 8, 1986
    Date of Patent: June 19, 1990
    Assignee: Raytheon Company
    Inventors: Thomas E. Baker, Nicki S. Girouard
  • Patent number: 4906722
    Abstract: Thermosetting reactive systems, comprising(a) at least one epoxide resin,(b) at least one isocyanate resin,(c) a reaction accelerator of the formula I ##STR1## in which R.sup.1 is --(CR.sup.4 R.sup.5).sub.n - with n=2-24, phenylene or naphthylene which is unsubstituted or mono- or poly-substituted by halogen, nitro, C.sub.1 -C.sub.4 -alkyl, C.sub.1-C.sub.4 alkoxy or C.sub.3 -C.sub.8 dialkylaminoalkyl, or a radical of the formulae ##STR2## R.sup.2 and R.sup.3 independently of one another are C.sub.1-C.sub.12 alkyl, phenyl or naphthyl which are unsubstituted or mono- or poly-substituted by halogen, nitro, C.sub.1 -C.sub.4 alkyl or C.sub.1 -C.sub.1 -C.sub.4 alkoxy, or also C.sub.7 -C.sub.13 aralkyl, or in which R.sup.2 and R.sup.3, together with the N atom to which they are linked, form a 5-membered, 6-membered or 7-membered heterocyclic ring, and R.sup.4 and R.sup.5 independently of one another are hydrogen or C.sub.1 -C.sub.
    Type: Grant
    Filed: November 21, 1988
    Date of Patent: March 6, 1990
    Assignee: Ciba-Geigy Corporation
    Inventors: Sameer H. Eldin, Alfred Renner
  • Patent number: 4880869
    Abstract: This invention relates to .beta.-amino-.beta.-propiolactam derivativatives, moisture curable polyurethane compositions and their applications.The products of this invention have excellent characteristics such as good storage stability, rapid curing with atmospheric moisture and freedom from foaming.More particularly, condensed compounds are obtained by reacting specific secondary diamines such as piperazine and 1,3-(4,4'-dipiperidyl)propane with monoaldehyde having at least 3 carbon atoms, for example, isobutylaldehyde and .beta.-phenylpropylaldehyde. The .beta.-amino-.beta.-propiolactam derivatives are prepared by reacting the condensed compounds with monoisocyanate such as phenyl isocyanate and equimolar reaction products of diisocyanate with lower monohydric alcohol.In addition, the moisture curable polyurethane compositions contain said derivatives and polyisocyanate and/or polyurethane prepolymer having terminal isocyanato radicals.
    Type: Grant
    Filed: September 14, 1988
    Date of Patent: November 14, 1989
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masaaki Aoki, Mayumi Tani, Masayuki Kamiyama, Kiyotsugu Asai
  • Patent number: 4876019
    Abstract: Internal mold release compositions for use in preparing molded polymeric products are disclosed which contain (a) a primary or secondary amine (b) a carboxylic acid or amido carboxylic acid salt of a group II metal or of aluminum, lithium, copper, iron, cobalt or nickel, and optionally (c) a carboxylic acid or amido carboxylic acid.
    Type: Grant
    Filed: January 12, 1984
    Date of Patent: October 24, 1989
    Assignee: The Dow Chemical Company
    Inventors: Louis W. Meyer, James A. Vanderhider, Robert Carswell
  • Patent number: 4876308
    Abstract: A two component type polyurethane adhesive is provided for fiberglass reinforced plastics which requires no cleaning, preparation or treatment of the surface, and the like. The curative component is a nitrogen-free liquid polyether or polyester in an amount such that in association with a urethane prepolymer component containing free NCO groups, the ratio of the free NCO groups in the prepolymer component to the OH groups in said curative component is at least 1.2 and desirably at least 1.35. Such high NCO/OH ratios have unexpectedly been found to provide good adhesion and especially good humidity adhesion and peel strength adhesion to fiberglass reinforced plastics or metal surfaces which are free from any surface treatment.
    Type: Grant
    Filed: February 18, 1988
    Date of Patent: October 24, 1989
    Assignee: GenCorp Inc.
    Inventors: Earl G. Melby, H. William Cocain
  • Patent number: 4873272
    Abstract: A polyether having molecular weight from 1,000 to 50,000, end-blocked with hydrolyzable silyl groups and represented by the general formula (P): ##STR1## where R.sup.1, R.sup.2, R.sup.6 and R.sup.7 individually represent a divalent hydrocarbon group, R.sup.4 represents a monovalent hydrocarbon group, R.sup.8 represents an alkyl group with 1 to 6 carbon atoms, a represents a number from 1 to 3, m represents a number from 10 to 500, n represents a number of 1 or greater and --N.dbd.X.dbd.N-- represents a residue group of a diimino heterocyclic compound, from which nitrogen-bonded hydrogen atoms are eliminated, said diimino heterocyclic compound having no ##STR2## bond in a molecule is produced and utilized in room temperature curing compositions containing inorganic filler and curing catalyst. There is also disclosed a method for producing the above polyether by reacting polyoxyalkylene end-blocked with epoxy groups, diimino heterocyclic compound and organo silicon compound.
    Type: Grant
    Filed: November 9, 1987
    Date of Patent: October 10, 1989
    Assignee: Toshiba Silicone Co., Ltd.
    Inventors: Chiyuki Shimizu, Tamio Yoshida
  • Patent number: 4871790
    Abstract: A polymeric composition of matter comprises a polymer having dispersed therein at least one of colloidal metal and metal oxide particles in the submicrometer size range, said composition being aqueous-free and free of aliphatic hydrocarbon polymers and their halogenated derivatives. Methods for preparing the dispersions of the invention are also disclosed.
    Type: Grant
    Filed: November 25, 1987
    Date of Patent: October 3, 1989
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: William M. Lamanna, Fred B. McCormick, Robin E. Wright
  • Patent number: 4857574
    Abstract: Stable dispersion of addition (co)polymers in an inert relatively non-polar organic hydrocarbon liquid, the dispersed particles embracing both a (co)polymer and a polymer containing an ethylenically unsaturated monomer. The (co)polymers are substantially composed of:(a) 5 to 100 mole % of styrene and/or methyl styrene;(b) 0 to 95 mole % of alkyl methacrylate having 1 or 2 carbon atoms in the alkyl group and/or alkoxyalkylene methacrylate having 1 or 2 carbon atoms in the alkoxy group and the alkylene group;(c) 0 to 40 mole % of alkyl methacrylate having 3 to 12 carbon atoms in the alkyl group;(d) 0 to 40 mole % of hydroxalkyl methacrylate having 2 to 12 carbon atoms in the alkyl group and/or glycidyl methacrylate; and(e) 0 to 20 mole % of m methacrylic acid.The (co)polymers are grafted to a polymer of a number average molecular weight of 2000 to 10.
    Type: Grant
    Filed: February 11, 1988
    Date of Patent: August 15, 1989
    Assignee: Akzo nv
    Inventor: Roelof Buter
  • Patent number: 4824903
    Abstract: A heat-resistant silicone rubber is obtained from a composition of a vinyl-containing polyorganosiloxane, a hydrogenpolyorganosiloxane, a platinum-containing catalyst, carbon black, and an acetylacetone salt of a metal wherein the metal can be copper, zinc, aluminum, iron, cerium, zirconium, or titanium. The silicone rubber can maintain its rubber properties at temperatures of 350.degree. C. for prolonged periods of time.
    Type: Grant
    Filed: December 2, 1986
    Date of Patent: April 25, 1989
    Assignee: Dow Corning Kabushiki Kaisha
    Inventors: Koichi Aizawa, Shingo Sewa, Kiyoshi Mizushima, Minoru Emoto
  • Patent number: 4822830
    Abstract: Organopolysiloxanes having improved electrical properties, which comprises mixing an organopolysiloxane having reactive groups with an amine-containing organosilicon compound, which is capable of crosslinking with the organopolysiloxane and a treated alumina trihydrate and thereafter exposing the resultant composition to atmospheric moisture. The resultant composition may be dispersed in an organic solvent and applied to electrical insulators.
    Type: Grant
    Filed: November 9, 1987
    Date of Patent: April 18, 1989
    Assignee: Wacker Silicones Corporation
    Inventor: James R. Adkins
  • Patent number: 4808659
    Abstract: An adhesive composition comprising (1) a polymetallocarbosilane or a polycarbosilane and (2) a silicone resin. The adhesive composition further comprises an inorganic filler.
    Type: Grant
    Filed: December 8, 1986
    Date of Patent: February 28, 1989
    Assignee: UBE Industries, Ltd.
    Inventors: Yoshio Nishihara, Noriyuki Isobe, Satoshi Kotera
  • Patent number: 4795801
    Abstract: The invention relates to the use of chemical grafting to produce a stable liquid composition that is capable of hardening following an optional polymerization process. Under the invention, in order to produce a composition that is liquid, at least initially and prior to any polymerization, a polymerizable organic acid comprising at least two double bonds in resonance is combined in a solvent with an inorganic filler having at least one hydroxylated group with the help of a catalyst acting as a radical upon said organic acid. By adjusting the concentration of catalyst and using a polymerizable monomer solvent, the liquid composition may be hardened by polymerization after the initial grafting reaction. By ensuring that a portion of the organic acid retains free bonds that have not combined with filler, it is also possible to induce the composition to become chemically attached to a resin or to reinforcing fibers. The invention may be applied to the production of molded objects.
    Type: Grant
    Filed: February 9, 1987
    Date of Patent: January 3, 1989
    Inventors: Herve M. J. Farge, Jean M. L. Farge
  • Patent number: 4782107
    Abstract: Heat-vulcanizable organopolysiloxane compositions, adopted for curing into silicone elastomers having improved reversion and oil resistance and useful, e.g., as seals in contact with hot oils, comprise at least one diorganopolysiloxane resin (A) having a viscosity of greater than 1,000,000 mPa.s at 25.degree. C., a reinforcing and/or semireinforcing filler material (B), an organic peroxide (C), an organosilicon compound (D) containing at least one acryloyloxyalkyl or methacryloyloxyalkyl group bonded to a silicon atom, and (E) at least one oxide or hydroxide of an alkaline earth metal.
    Type: Grant
    Filed: January 8, 1987
    Date of Patent: November 1, 1988
    Assignee: Rhone-Poulenc Specialites Chimiques
    Inventor: Robert Lagarde
  • Patent number: 4778845
    Abstract: A one-component adhesive and/or sealing mass which is stable and pumpable at temperatures up to 30.degree. C. containsat least one prepolymer on the basis of a polyurethane, which contains from 0.1 to 15 percent by weight, referred to the prepolymer, of free, reactive isocyanate groups, andat least one with heat activatable hardener.Thereby the stoichiometric ratio between said prepolymer and said hardener is chosen in such a way that only a partial cross-linkage is possible during heating said mass to temperatures from 60.degree. C. to 180.degree. C., and that a product is obtained having from high viscous to plastic characteristics.The inventive masses may be used for bonding and/or sealing of one or more materials of the same or different origin to a composite.
    Type: Grant
    Filed: June 4, 1987
    Date of Patent: October 18, 1988
    Assignee: Sika AG, vorm. Kaspar Winkler & Co.
    Inventors: Hans-Peter Tschan, Lutz-Dieter Zabel, Ueli Pfenninger
  • Patent number: 4778860
    Abstract: The water permeability of cured thermosetting organic resin compositions is reduced and the dimensional stability of these compositions during molding is improved by the addition to the curable resin composition of a finely divided, cured organosiloxane material prepared from a curable organopolysiloxane, a curing agent for the organopolysiloxane, an optional silica filler and an aromatic hydrocarbon compound containing a substituted benzene ring where the substituent is a monovalent ethylenically unsaturated hydrocarbon radical or an alkenyloxy radical.
    Type: Grant
    Filed: August 31, 1987
    Date of Patent: October 18, 1988
    Assignee: Toray Silicone Company, Ltd.
    Inventors: Yoshitsugu Morita, Shoichi Shida