Abstract: Included is a method of preparing a compound for bonded magnets, the method including: coating a magnetic material having an average particle size of 10 ?m or less with a thermosetting resin and a curing agent at a ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin of 2 or higher and 10 or lower to obtain a coated material; granulating the coated material by compression to obtain a granulated product; milling the granulated product to obtain a milled product; and surface treating the milled product with a silane coupling agent to obtain a compound for bonded magnets, the method either including, between the granulation and the milling, heat curing the granulated product to obtain a cured product, or including, between the milling and the surface treatment, heat curing the milled product to obtain a cured product.

Abstract: A mar and scratch resistant additive that possesses multifunctional and other characteristics is described. The additive comprises a binder system platform that is easily introduced into a wide range of chemical coating platforms. The additive may also be introduced to these coatings by way of a silica carrier to simplify its use.

Abstract: A thermoplastic blended potting resin, a blended resin potted membrane, a membrane separation module, a fluid separation device, a method of making and a method of using the membrane separation module and the fluid separation device are described herein. The blended thermoplastic potting resin comprises at least one polar membrane having two end regions and a middle region; and a blended resin comprising a non-polar thermoplastic polymer and a polar thermoplastic polymer; wherein at least one of the two ends regions is coated with the blended potting resin to form a fluid-tight seal between the end regions and the open middle region, and wherein the polar thermoplastic polymer is 1% or greater by weight of blended resin.

Abstract: This invention relates to a coating composition comprising a carboxy-containing compound (A), a polyepoxide (B), and a specific polyol (C) having a number average molecular weight of 300 to 1,500, and a method for forming a multilayer coating film using the coating composition as a clear coating composition, the method comprising sequentially applying an aqueous first colored coating composition, an aqueous second colored coating composition, and the clear coating composition to a substrate, and heat-curing the resulting coating films all at once to form the multilayer coating film.

Abstract: An orientation control layer (OCL) for self-assembly of block copolymers comprises a random copolymer comprising a first repeat unit having an ethylenic backbone functional group and a side chain aromatic ring, a second repeat unit comprising an ethylenic backbone functional group and a side chain polycarbonate, and a third repeat unit comprising an ethylenic backbone functional group and a side chain ester or amide bearing an active group capable of forming a covalent bond with a substrate surface (e.g., a silicon wafer). The OCLs are neutral wetting to block copolymers having a high Flory-Huggins interaction parameter chi (?) (“high-chi” block copolymers) such as a block copolymer comprising a polystyrene block and a polycarbonate block. The neutral OCL wetting properties allow for formation of lamellar domain patterns of the self-assembled high-chi block copolymers to be oriented perpendicular to the OCL surface.

Abstract: A base material film used for a dicing sheet, the dicing sheet including the base material film and a pressure-sensitive adhesive layer laminated on one surface of the base material film. The base material film includes a single layer of resin film or multiple layers of resin films, at least the resin film in contact with the pressure-sensitive adhesive layer being formed from a resin composition containing ethylene-(meth)acrylic acid copolymer as a main constituent, the resin composition further containing 0.3 to 17.0 parts by mass of an epoxy compound based on 100 parts by mass of the ethylene-(meth)acrylic acid copolymer. The dicing sheet that uses the base material film does not require application of physical energy such as an electron beam or a ?-ray, and can be reduced in dicing dust that is generated during the dicing of a cut object.

Abstract: This disclosure describes a composition and a process for forming silica particles as either a neat film or in polymers during curing at atmospheric pressure and room temperature or thermal or radiation curing. The process includes formation of a nanoparticle precursor solution comprising a small amount of a particulate matting agent such as a silica powder matting agent in combination with a low viscosity liquid silica precursor materials such as a liquid alkoxide, alkoxysilane, tetraethylorthosilicate, sol gel silica or combinations thereof. The precursor solution can be applied to surfaces either neat to form a film upon heating or mixed into a curing polymer resin. The precursor has low viscosity so that it can be easily mixed into the resin, but during curing of the resin, the precursor rapidly forms particles, usually less than 10 microns in size depending on the concentration of the precursor used and the polymer composition.

Abstract: A method for manufacturing a planar electronic device includes applying a non-conductive fluid polymer to a lower side of a planar substrate. The substrate includes a hole extending through the substrate. The method also includes curing the fluid polymer to form a solid centering layer on the lower side of the substrate, with the centering layer extending across the hole along the lower side of the substrate. The method further includes loading a ferrite material body into the hole of the substrate through the upper side of the substrate, embedding the ferrite material body in an encapsulating material in the hole, and forming one or more conductive loops around the ferrite material body. The ferrite material body is held within the substrate between the lower side and the upper side of the substrate by the encapsulating material.

Abstract: The invention relates to a polyethylene composition comprising a mixture of flame retardants which are bromine-containing polymers. The polyethylene composition is useful in the manufacture of pallets. A process for making the polyethylene composition through a masterbatch route is also disclosed.

Abstract: A bimodal toughening agent comprising a) a first preformed coreshell toughening agent and b) a second preformed coreshell toughening agent wherein the second preformed coreshell toughening agent has a particle size of at least two times larger than that of the first preformed coreshell toughening agent, and the use of the bimodal toughening agent in a thermosettable epoxy resin composition, is disclosed.

Abstract: Methods for fabricating a random graft PS-r-PEO copolymer and its use as a neutral wetting layer in the fabrication of sublithographic, nanoscale arrays of elements including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. In some embodiments, the films can be used as a template or mask to etch openings in an underlying material layer.

Abstract: A coating composition, an anticorrosion film formed by the composition, as well as an anticorrosive article, are disclosed. The coating composition comprises 1-35% by weight of one or more fluoropolymer; 1-70% by weight of one or more epoxy resin; 5-70% by weight of one or more polyamideimide; 0-40% by weight an auxiliary binder consisting of one or more of polyethersulfone, polyphenylene sulfide, polyamide, polyimide, polyether ether ketone, polyetherimide, polyurethane, alkyd resin, polyester, or acrylic polymers; and, based on 100 parts by weight of the above components, 100-400 parts by weight of solvent.

Abstract: The invention relates to a crosslinkable polymer powder composition redispersible in water, obtainable by means of free radical polymerization, in an aqueous medium, of one or more monomers from the group consisting of vinyl esters of straight-chain or branched alkylcarboxylic acids having 1 to 15 C atoms, methacrylates and acrylates of alcohols having 1 to 15 C atoms, vinylaromatics, olefins, dienes and vinyl halides, no epoxide-functional comonomers being copolymerized, and subsequent drying of the polymer dispersion obtained thereby, wherein, before and/or during the polymerization and/or before the drying of the polymer dispersion obtained thereby, an epoxy resin is added and, if appropriate after the drying, a curing agent crosslinking with the epoxy resin is added.

Abstract: This invention relates to substance mixtures for thermoplastic molding compositions, comprising A) polyamide and/or copolyamide, B) copolymers of at least one olefin and of at least one acrylate of an aliphatic alcohol, C) additives with chain-extending effect and D) impact modifiers and optionally also E) other additives and/or F) fillers and reinforcing materials. The invention further relates to processes for producing molding compositions of the invention and molded products or semifinished products which are produced from the substance mixtures of the invention, preferably by means of extrusion or blow molding of the molding compositions to be produced from the substance mixtures.

Abstract: Methods for fabricating a random graft PS-r-PEO copolymer and its use as a neutral wetting layer in the fabrication of sublithographic, nanoscale arrays of elements including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. In some embodiments, the films can be used as a template or mask to etch openings in an underlying material layer.

Abstract: Disclosed is an epoxy resin composition, which includes (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent; and (C) polystyrene.

Abstract: Methods for fabricating a random graft PS-r-PEO copolymer and its use as a neutral wetting layer in the fabrication of sublithographic, nanoscale arrays of elements including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. In some embodiments, the films can be used as a template or mask to etch openings in an underlying material layer.

Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.

Abstract: A vibration-damping reinforcement composition contains 30 to 300 parts by weight of butyl rubber, 30 to 300 parts by weight of acrylonitrile-butadiene rubber, 100 parts by weight of epoxy resin, and 0.5 to 30 parts by weight of an epoxy resin curing agent.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1?m2?3.

Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.

Abstract: A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.

Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.

Abstract: Provided is a adhesive and an adhesive sheet which exhibit excellent chip-holding properties during dicing and from which chips can be easily stripped during pick up, even when considering changes over time. It is a adhesive composition which contains both (A) a (meth)acrylic acid ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of less than 350,000 and (B) a (meth)acrylic ester copolymer component that has functional-group containing monomer units and a weight average molecular weight of 350,000 to 2,000,000 at a weight ratio of 10:90 to 90:10, and further contains 0.5 to 20 parts by mass of a crosslinking agent per 100 parts by mass of components (A) and (B) in total, the crosslinking agent being a crosslinking agent that reacts with both the functional groups of the component (A) and the functional groups of the component (B).

Abstract: Methods for fabricating a random graft PS-r-PEO copolymer and its use as a neutral wetting layer in the fabrication of sublithographic, nanoscale arrays of elements including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. In some embodiments, the films can be used as a template or mask to etch openings in an underlying material layer.

Abstract: The invention provides a fire resistant material and a formulation thereof. The formulation comprises a liquid suspension of a modified inorganic particle and an organic component. The modified inorganic particle comprises an inorganic particle with hydroxyl groups and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The organic component comprises a monomer, oligomer, prepolymer, polymer, or combinations thereof, capable of reacting with the ethylenically unsaturated end group.

Abstract: There are provided an organic fiber-reinforced composite resin composition which is good in fiber dispersion, excellent in appearance, excellent in mechanical properties such as tensile elongation at break or impact strength and easy in thermal recycle; and a molded article obtained therefrom. An organic fiber-reinforced composite resin composition comprising (a) 60 to 95% by weight of a polyolefin resin (provided that an acid-modified polyolefin resin is excluded) and (b) 40 to 5% by weight (provided that (a)+(b)=100% by weight) of organic fiber to which a polar resin (provided that an acid-modified polyolefin resin is excluded) is attached, or an organic fiber-reinforced composite resin composition comprising organic fiber in an amount of 10 to 200 parts by weight based on 100 parts by weight of a polyolefin resin and having an Izod impact strength at ?40° C. of 10 kJ/m2 or more, and further, an organic fiber-reinforced composite resin molded article obtained therefrom.

Abstract: An article includes a reaction product of a filler having binding sites, a coupling agent composition including an aromatic amine and a first cycloolefin substituted with at least one epoxy group, a polymer precursor including a second cycloolefin, and a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted to the first cycloolefin or the second cycloolefin. The coupling agent composition is capable of bonding to the filler and the coupling agent composition is compatible with a metathesis catalyst. An associated method is also provided.

Abstract: In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.

Abstract: Embodiments of the invention are directed to modified resin systems for use in liquid resin infusion (LRI) processes, variations of LRI processes and other suitable processes. In one embodiment, the modified resin system includes a novel combination of at least one base resin, an amount of particles within a predetermined range and an amount of thermoplastic material within a predetermined range wherein, when combined, the modified resin system has an average viscosity below a threshold average viscosity at a specific temperature and a high level of toughness. The modified resin system may additionally include a curing agent and other suitable components.

Abstract: Toughened curable compositions are described. The curable compositions include a curable resin, surface-modified nanoparticles, and rubber nano-domains. Both core-shell rubber nano-domains, and nano-rubber domains arising from self-assembled block co-polymers are disclosed. Toughened, cured resin compositions, and articles comprising such cured compositions are also discussed.

Abstract: Heat-activable adhesive sheet of an adhesive comprising a blend of at least three synthetic nitrile rubber compositions S1, S2 and S3, each of which comprises at least one synthetic nitrile rubber, and at least one reactive resin which is capable of crosslinking with itself, with other reactive resins and/or with the nitrile rubbers of synthetic rubber compositions S1, S2 and S3, in which a) the blend of the heat-activable sheet being microphase-separated, characterized by at least three different glass transition temperatures in a DSC, b) at least one of said glass transition temperatures being greater than 10° C. and at least one of said glass transition temperature lower than ?20° C., c) the nitrile rubber or rubbers S1 having an acrylonitrile fraction of greater than/equal to 35%, d) the nitrile rubber or rubbers S2 having an acrylonitrile fraction of greater than 25% and less than 35%, e) the nitrile rubber S3 having an acrylonitrile fraction of less than/equal to 25%.

Abstract: A composition includes a coupling agent composition and a polymer precursor. The coupling agent composition includes an aromatic amine and a first cycloolefin substituted with at least one epoxy group. The polymer precursor includes a second cycloolefin and an epoxy compound. The coupling agent composition is capable of bonding to a filler having a corresponding binding site and the coupling agent composition is compatible with a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted to the first cycloolefin or the second cycloolefin. An associated method is also provided.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: An antireflective coating that contains at least two polymer components and comprises chromophore moieties and transparent moieties is provided. The antireflective coating is useful for providing a single-layer composite graded antireflective coating formed beneath a photoresist layer.

Abstract: A vibration-damping reinforcement composition contains 30 to 300 parts by weight of butyl rubber, 30 to 300 parts by weight of acrylonitrile-butadiene rubber, 100 parts by weight of epoxy resin, and 0.5 to 30 parts by weight of an epoxy resin curing agent.

Abstract: An epoxy adhesive composition of an epoxy resin, an epoxy terminated liquid rubber, filler, and an amine curing package for said epoxy resin is disclosed. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and strength build. Advantageously, a mixture of amines will be used in the curative including multifunctional aliphatic amines that improve adhesion and strength build; tertiary amines which are used to enhance adhesion and strength build, polyamides which can be used to provide flexibility; and amine-terminated rubbers (ATBN) which can improve toughness and impact resistance to the cured system. The preferred short chain diol is glycerin. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating.

Abstract: An adhesive composition that includes acrylic based monomer and/or methacrylic ester based monomer, an impact modifier; and an elastomer that includes urethane elastomer. The impact modifier includes methacrylate-butadiene-styrene copolymer.

Abstract: A composition contains a polyester; an aromatic epoxy compound, in an amount sufficient to provide 5 to 300 milliequivalents of epoxy per kilogram of polyester; and 0.5 to 6 weight percent, based on the weight of the polyester, and an ethylene-glycidyl methacrylate containing copolymer; and/or a copolyester copolymer, wherein the copolyester comprises, based on the weight of the copolyester, 15 to 95 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a C2-C6 aliphatic diol, and 5 to 85 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a poly(alkylene oxide) glycol having a molecular weight of 400-6,000 and a carbon to oxygen ratio of 2.0-4.3. The compositions have excellent hydrolytic resistance, and are suitable for making automotive and electronic parts.

Abstract: A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: The invention relates to a one-step fluoropolymer, especially polyvinylidene fluoride (PVDF), coating for use on metals, especially use on metal fuel line and brake tubes, etc, to provide a protective barrier with superior chemical resistance, impact resistance and heat resistance as well as good flexibility. The coating composition contains, on a resin solids basis, 75-94 percent polyvinylidene fluoride resin, 5-20 percent acrylic resin, and 1-15 percent polyepoxide resin. The coating has excellent adhesion on metal substrates, particularly on non-pretreated galvanized steel, without the need for a primer coating.

Abstract: A rubber component containing at least one of diene rubber and ethylene-propylene-diene rubber is dynamically crosslinked. Thereby the rubber component is dispersed in a mixture of a thermoplastic elastomer and a thermoplastic resin. An ethylene oxide-propylene oxide-allyl glycidyl ether and an anion-containing salt having fluoro groups and sulfonyl groups are added to the elastomer composition to obtain a conductive dynamically crosslinked thermoplastic elastomer composition. A mixture of the obtained conductive dynamically crosslinked thermoplastic elastomer composition and a micro-capsule composed of a polymer, having acrylic groups, which forms an outer shell thereof is molded to obtain a conductive roller having Shore A hardness specified in JIS K6253 not more than 40 measured at 23° C.

Abstract: A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), and monofunctional or polyfunctional epoxide compounds as curatives. The monofunctional or polyfunctional epoxide compound is stirred, preferably in the liquid state, into the aqueous polymer dispersion. Besides the epoxide compound, the heat-curable binder may further comprise a polyol or an alkanolamine as hardener.

Abstract: Condensation products of dihydroxyaromatics A, alone or in mixture with mono- or polyhydroxyaromatics C, with diepoxides or polyepoxides B which have been alkylolated by reaction with aldehydes D and whose alkylol groups may have been etherified with alcohols, a process for preparing them, and a method of use thereof in particular as compositions for coating the inside of foodstuff and beverage packaging forms made from metals.

Abstract: Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.

Abstract: Reactive, non-isocyanate coating compositions prepared by mixing epoxy, tertiary amine, anhydride, hydroxy- and, optionally, acid functional compounds, a system of making the coating composition, a method of coating the composition on a substrate and a substrate coated with the composition.

Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Abstract: A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two oxirane functional groups per molecule.

Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.