With Saturated 1,2-epoxy Reactant Containing More Than One 1,2-epoxy Group Per Mole Or Polymer Derived Therefrom; Or With Solid Copolymer Derived From At Least One Saturated Reactant And At Least One Unsaturated 1,2-epoxy Reactant Wherein The Epoxy Reactant Contains More Than One 1,2-epoxy Group Per Mole Patents (Class 525/107)
  • Patent number: 10781309
    Abstract: A thermoplastic polyester resin composition is obtained by blending, per 100 parts by weight of (A) a thermoplastic polyester resin, 0.1 to 5 parts by weight of (B) a novolac type epoxy resin having a specific structure, and 0.05 to 10 parts by weight of (C) an epoxy compound having two epoxy functional groups per molecule. Thus, a molded article that exhibits superior melt stability with respect to a wide range of processing temperatures, has excellent mechanical properties and heat resistance, and exhibits superior long-term hydrolysis resistance, chemical resistance, and oxidative deterioration resistance can be obtained.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: September 22, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Yusuke Tojo, Makito Yokoe, Hideyuki Umetsu
  • Patent number: 10747112
    Abstract: The present invention provides a compound represented by following formula (1), wherein R1 represents a 2n-valent group having 1 to 30 carbon atoms, each of R2 to R5 independently represents a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, a thiol group or a hydroxyl group, provided that at least one selected from R1 to R5 represents a group including an iodine atom and at least one R4 and/or at least one R5 represent/represents one or more selected from the group consisting of a hydroxyl group and a thiol group, each of m2 and m3 independently represents an integer of 0 to 8, each of m4 and m5 independently represents an integer of 0 to 9, provided that m4 and m5 do not represent 0 at the same time, n represents an integer of 1 to 4, and each of p2 to p5 independently represents an integer of 0 to 2.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: August 18, 2020
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takumi Toida, Masatoshi Echigo, Takashi Makinoshima
  • Patent number: 10738147
    Abstract: The present invention relates to an amine-based curing agent comprising at least 1% by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine tertiary amine and, more preferably, N-hydroxyethyl piperidine (NHEP). The present invention also relates to an epoxy resin composition formed using this amine-based curing agent and a method of making the epoxy resin composition. These tertiary amines enhance desirable properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with tertiary amine-based curing agents.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: August 11, 2020
    Assignee: Evonik Operations GmbH
    Inventors: Pritesh G. Patel, Gauri Sankar Lal, Douglas M. La Comare
  • Patent number: 10696798
    Abstract: A polymer composition comprising star macromolecules is provided. Each star macromolecule has a core and five or more arms, wherein the number of arms within a star macromolecule varies across the composition of star molecules. The arms on a star are covalently attached to the core of the star; each arm comprises one or more (co)polymer segments; and at least one arm and/or at least one segment exhibits a different solubility from at least one other arm or one other segment, respectively, in a reference liquid of interest.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: June 30, 2020
    Assignee: Pilot Polymer Technologies, Inc.
    Inventors: Wojciech Jakubowski, Patrick McCarthy, Nicolay Tsarevsky, James Spanswick
  • Patent number: 10662275
    Abstract: Guanylurea alcohol phosphate salts are disclosed. Flame retardant thermoplastic and thermoset polymers can be made by incorporating said guanylurea alcohol phosphate salts into polymers and these polymers have improved properties over similar thermoplastic or thermoset polymers where guanylurea phosphate salts are added as flame retardant dispersions to said polymer. Flame retardant polyurethane foams where the guanylurea alcohol phosphate salts have been incorporated into the polyurethane are a particularly preferred embodiment.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: May 26, 2020
    Assignee: LUBRIZOL ADVANCED MATERIALS, INC.
    Inventors: John Ta-Yuan Lai, Janean Nagorski
  • Patent number: 10662304
    Abstract: Embodiments of the present disclosure are directed to a composition and composite for protecting a transmission/reception device. The composite can include a reinforcing material and a cured epoxy composition impregnating the reinforcing material. The cured epoxy composition can contain reaction constituents including less than 50% stoichiometric amount of an anhydride curing agent to an epoxy resin. The composite can exhibit synergistic improvements in mechanical strength, weatherability, and signal transmission properties.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: May 26, 2020
    Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
    Inventors: Choung Lai, Ajay Padwal, Marie J. Demers, David W. Stresing, John E. Langlois
  • Patent number: 10513054
    Abstract: A continuous device (1) is provided for impregnating, in a single step, strands or ribbons of natural fibers (100) with a specific aqueous polymer dispersion to consolidate the fibers at the core of the fiber bundle and to improve their mechanical strength without any need for twisting. The device includes a stretching component (10) for elongating by the strand or the ribbon of natural fibers by stretching to give them a required yarn count, an impregnating component (20) for impregnating the fibers with the aqueous dispersion, a shaper for shaping/calibrating the wrung fibers, a dryer (40) for drying the shaped/calibrated fibers, and a conditioner (50) for conditioning the dried fibers to transform them into yarn or ribbon.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: December 24, 2019
    Assignee: DEHONDT TECHNOLOGIES
    Inventors: Guy Dehondt, Edouard Philippe
  • Patent number: 10381282
    Abstract: The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: August 13, 2019
    Assignee: MITSUBISHI CHEMICAL CORPORTION
    Inventor: Kazumasa Oota
  • Patent number: 10058638
    Abstract: The present invention relates to a medical tube article comprising a polymer mixture of a thermoplastic or thermo-curing polymer base material and an amphiphilic block copolymer.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: August 28, 2018
    Assignee: UNOMEDICAL A/S
    Inventors: Per Otto Børresen Gravesen, Torsten Winther, Karsten Aakerlund
  • Patent number: 10047264
    Abstract: The present invention relates generally to thermally conductive adhesives for thermal interfaces in electronic packaging, and more particularly, to a polymer-based composite thermal interface material (“TIM”) with an inter-penetrating network (IPN) polymer matrix consisting of polyurethane and an epoxy that is fully crosslinked. The IPN polymer matrix is designed to improve overall thermal conductivity by the altering the dispersion/distribution of thermally conductive fillers, the filler/polymer interfaces, and/or phonon scattering behaviors in the composite.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: August 14, 2018
    Assignee: International Business Machines Corporation
    Inventor: Wei Lin
  • Patent number: 10040033
    Abstract: An object of the present invention is to provide a multilayer separation membrane having excellent performance on both removal of suspended solids in water and adsorptive removal of metal ions in water. A multilayer separation membrane of the present invention includes: a porous adsorption layer including substantially a polymer having chelating functional groups; and a porous clarification layer, and the porous clarification layer is disposed neater to a raw water-side than the porous adsorption layer.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: August 7, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Masayuki Hanakawa, Koichi Takada, Takahiro Tokuyama, Kenta Iwai
  • Patent number: 10017603
    Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: July 10, 2018
    Assignee: Evonik Degussa GmbH
    Inventors: Gauri Sankar Lal, Gamini Ananda Vedage, Stephen Michael Boyce, Dilipkumar Nandlal Shah, Atteye Houssein Abdourazak
  • Patent number: 9950502
    Abstract: Described is paper or cardboard packaging produced from mineral oil contaminated, (e.g., recycled) paper, wherein the packaging includes a barrier layer obtainable by applying an aqueous polymer dispersion comprising a copolymer obtainable by emulsion polymerization of C1-C4 alkyl (meth)acrylates, acid monomers, e.g., acrylic acid or methacrylic acid, 0-20 wt % of acrylonitrile and 0 to 10 wt % of further monomers in an aqueous medium in the presence of a carbohydrate compound, preferably in the form of a degraded starch, wherein the glass transition temperature of the copolymer is in the range from +10 to +45° C. The barrier layer may be situated on one of the surfaces of the packaging or form one of multiple layers of a multilayered packaging coating or be situated as a coating on one side of an inner bag situated within the packaging.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: April 24, 2018
    Assignee: BASF SE
    Inventors: Hermann Seyffer, Carmen-Elena Cimpeanu, Heiko Diehl, Darijo Mijolovic, Andre Van Meer, Jan Van Delft, Christof Van Sluijs
  • Patent number: 9840070
    Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl-or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: December 12, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Dakai Ren, Andreas Lutz
  • Patent number: 9711378
    Abstract: The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 ?m as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: July 18, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuaki Sumita, Tatsuya Uehara, Naoyuki Kushihara
  • Patent number: 9580601
    Abstract: A polyurethane based asphalt composition includes an asphalt component and a polyurethane resin system that is the reaction product of an isocyanate component that includes at least one polyisocyanate and an isocyanate-reactive component that includes a cardanol-modified epoxy polyol. The cardanol-modified epoxy polyol is a reaction product of an epoxy component and an epoxy-reactive component at a ratio of epoxy groups to epoxy reactive groups from 1:0.95 to 1:5. The epoxy-reactive component includes a cardanol component.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: February 28, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Wei Li, Yi Zhang, Huan Chen
  • Patent number: 9567409
    Abstract: Disclosed is a method for preparing a vinyl aromatic hydrocarbon-conjugated diene block copolymer using a coupling reaction with improved ion stability. The method comprises (a) polymerizing a vinyl aromatic hydrocarbon monomer in a hydrocarbon solvent with an organic lithium compound as a polymerization initiator to prepare a first mix solution comprising a vinyl aromatic hydrocarbon block; and (b) adding a conjugated diene monomer to the first mix solution of step (a) to form a conjugated diene block on an end of the vinyl aromatic hydrocarbon block and to thereby prepare a second mix solution comprising a vinyl aromatic hydrocarbon block-conjugated diene block, wherein the method further comprises (c) adding a Lewis acid to the first mix solution before, during or after polymerization of the vinyl aromatic hydrocarbon monomer of step (a).
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: February 14, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Choon-Hwa Lee, Moon-Seok Chun
  • Patent number: 9475967
    Abstract: A pressure sensitive adhesive composition is described comprising at least 50 wt-% of polymerized units derived from alkyl meth(acrylate) monomer(s); and 0.2 to 15 wt-% of at least one cross-linking monomers comprising a (meth)acrylate group and a C6-C20 olefin group, the olefin group being optionally substituted. In another embodiment, an adhesive composition is described comprising a syrup comprising i) a free-radically polymerizable solvent monomer; and ii) a solute (meth)acrylic polymer comprising polymerized units derived from one or more alkyl (meth)acrylate monomers; wherein the syrup comprises at least one crosslinking monomer or the (meth)acrylic solute polymer comprises polymerized units derived from at least one crosslinking monomer, the crosslinking monomer comprising a (meth)acrylate group and a C6-C20 olefin group, the olefin group being optionally substituted. In yet other embodiments, methods of preparing adhesive compositions are described.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: October 25, 2016
    Inventors: Corinne E. Lipscomb, Duane D. Fansler, Kevin M. Lewandowski, Jonathan E. Janoski, Jayshree Seth, Arlin L. Weikel, John W. Vanderzanden
  • Patent number: 9273205
    Abstract: A vibration damping material according to one aspect of the present invention comprises a composition as a main component, the composition being prepared by mixing based on 100 parts by weight of acrylic rubber, at least, in an external ratio, 0.01 to 15 parts by weight of organic peroxide that can crosslink between epoxy-based crosslinking points with each other, 25 to 50 parts by weight of carbon black having a mean particle diameter of 22 to 45 nm, and 15 to 35 parts by weight of carbon black having a mean particle diameter of 70 to 85 nm; and crosslinking crosslinking points in the acrylic rubber with each other through the organic peroxide.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: March 1, 2016
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Teruaki Yuoka, Takashi Kurachi
  • Patent number: 9045617
    Abstract: There is provided a ring-opening polymer of cyclopentene wherein a cis ratio of the cyclopentene-derived structural units is 30% or more, a weight average molecular weight (Mw) is 100,000 to 1,000,000, and a functional group containing a structure represented by the general formula (1) or (2) is included at an end of the polymer chain. —Y—H??(1) (in the above general formula (1), Y represents an oxygen atom or a sulfur atom.) —NH-Q??(2) (in the above general formula (2), Q represents a hydrogen atom or a hydrocarbon group or a silyl group which may have a substituent group.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: June 2, 2015
    Assignee: ZEON CORPORATION
    Inventors: Yasuo Tsunogae, Yoshihisa Takeyama
  • Publication number: 20150132566
    Abstract: Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.
    Type: Application
    Filed: May 15, 2013
    Publication date: May 14, 2015
    Inventors: Thorsten Ganglberger, Birgit Wenidoppler, Herwig Englisch, Mark Whiter
  • Patent number: 8991321
    Abstract: The invention relates to a polyethylene composition comprising a mixture of flame retardants which are bromine-containing polymers. The polyethylene composition is useful in the manufacture of pallets. A process for making the polyethylene composition through a masterbatch route is also disclosed.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: March 31, 2015
    Assignee: Bromine Compounds Ltd.
    Inventors: Yoav Bar-Yaakov, Yaniv Hirschsohn, Ita Finberg, Pierre Alexandre Georlette
  • Patent number: 8969503
    Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: March 3, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Fabio Aguirre Vargas, Raymond J. Thibault, John Beckerdite
  • Publication number: 20150037497
    Abstract: An epoxy adhesive composition is provided that has superior wash-off resistance after pre-gelling, and may be used, e.g., in manufacturing processes, e.g., in the automobile industry. The compositions comprise an epoxy resin, a gelling agent, and a phenolic agent, and may optionally comprise other components. Methods of making and using the compositions are also provided.
    Type: Application
    Filed: January 17, 2013
    Publication date: February 5, 2015
    Inventor: Andreas Lutz
  • Patent number: 8916656
    Abstract: A glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator, at least two resins and radicial photoinitiators. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. The other resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. Also, the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 23, 2014
    Assignee: Marabu GmbH & Co., KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Publication number: 20140370265
    Abstract: The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.
    Type: Application
    Filed: September 12, 2012
    Publication date: December 18, 2014
    Inventors: Justina S. Lee, Hyung-Jin Song, Andrew J. Ouderkirk, David J. Plaut
  • Publication number: 20140357794
    Abstract: The present invention is directed to a method of making a copolymer, comprising the steps of at least partially epoxidizing a polyisoprene to produce an epoxidized polyisoprene; reacting the epoxidized polyisoprene with a dithiol to produce a thiol functionalized polyisoprene; and reacting the thiol functionalized polyisoprene with a thiolophile-functionalized polymer derived from a monomer having a hydrogen bond donor site and hydrogen bond acceptor site to form the copolymer.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 4, 2014
    Inventors: Arindam Mazumdar, Frank James Feher
  • Patent number: 8859672
    Abstract: A poly(arylene ether)-poly(hydroxy ether) block copolymer includes at least one poly(hydroxy ether) block and at least one poly(arylene ether) block, and the mole ratio of poly(hydroxy ether) blocks to poly(arylene ether) blocks is 0.95:1 to about 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be prepared by reacting a telechelic poly(arylene ether) having terminal hydroxyl groups with a telechelic poly(hydroxy ether) epoxy resin having terminal epoxy groups, wherein the mole ratio of the telechelic poly(hydroxy ether) to the telechelic poly(arylene ether) is 0.95:1 to 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be shaped into an article by extrusion, thermoforming, or molding, and is a compatibilizing agent for non-polar and polar polymers.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: October 14, 2014
    Assignee: Sabic Global Technologies B.V.
    Inventor: Edward Norman Peters
  • Publication number: 20140242301
    Abstract: A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 28, 2014
    Applicant: HENKEL AG & CO. KGAA
    Inventor: Chunfu Chen
  • Publication number: 20140235792
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Application
    Filed: April 29, 2014
    Publication date: August 21, 2014
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George C. Jacob, Marty J. Null
  • Publication number: 20140224529
    Abstract: To provide a flame-retardant resin composition that has superior adhesion subsequent to curing and molding when used as a printed wiring board adhesive and that provides superior printed wiring board electrical characteristics; and a flexible printed wiring board metal-clad laminate, a coverlay, a flexible printed wiring board adhesive sheet, and a flexible printed wiring board employing this resin composition. (SOLUTION) The flame-retardant resin composition comprises a thermosetting resin, a hardener, and a phosphorus-containing polymer.
    Type: Application
    Filed: June 4, 2012
    Publication date: August 14, 2014
    Applicant: ARISAWA MFG. CO., LTD.
    Inventors: Shu Dobashi, Yuji Toyama, Tsuneo Koike, Makoto Tai, Marc-Andre Lebel, Jan-Pleun Lens
  • Patent number: 8795732
    Abstract: This invention relates to a composite material for biomedical applications, in particular dental applications, which possesses self-healing capacity and is able to incorporate a system for the release of active ingredients at the stage of application and use.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: August 5, 2014
    Inventors: Vittoria Vittoria, Gianfranco Peluso, Loredana Tammaro, Liberata Guadagno, Marialuigia Raimondo, Orsolina Petillo, Sabrina Margarucci, Anna Calarco
  • Publication number: 20140178656
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 26, 2014
    Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
    Inventor: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
  • Patent number: 8721946
    Abstract: Composition comprising polypropylene and (a) at least one phenolic antioxidant (A) (b) at least one hindered amine light stabilizer (B) (c) at least one slip agent (C) being a fatty acid amide, (d) a bisphenol A epoxy resin with an average molecular weight (Mw) below 2000 g/mol (D), and (e) talc (E).
    Type: Grant
    Filed: January 19, 2009
    Date of Patent: May 13, 2014
    Assignee: Borealis AG
    Inventors: Klaus Lederer, Erwin Kastner
  • Publication number: 20140107295
    Abstract: An epoxy resin composition, a cured object thereof, and an optical semiconductor sealing material using the cured object are described. The epoxy resin composition includes an alicyclic epoxy resin (A) and a vinyl polymer particle (B). An acetone soluble part of the vinyl polymer particle (B) is 30 mass % or more. The mass average molecular weight of the acetone soluble part is 100,000 or more. The volume average primary particle diameter (Dv) is 200 nm or more. The epoxy resin composition is rapidly turned into a gel state by heating for a short time, and the transparency of the obtained cured object is good.
    Type: Application
    Filed: May 29, 2012
    Publication date: April 17, 2014
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Youko Hatae, Toshihiro Kasai
  • Patent number: 8653202
    Abstract: An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: February 18, 2014
    Assignee: TORAY Industries, Inc.
    Inventors: Koichi Fujimaru, Toshihisa Nonaka
  • Patent number: 8592523
    Abstract: A composition of matter comprising an article derived from a composition containing: a. from about 30 to 80 wt. % of a polycarbonate component, b. from about 5 to about 50 wt. % of a polyester component, wherein when polybutylene terephthalate is present in the composition, the polybutylene terephthalate is present in conjunction with at least one other polyester that is not polybutylene terephthalate; c. about 2 to about 25 wt. % of an impact modifier; and d. a gloss reducing effective amount of a multifunctional additive comprising at least one epoxy group. The invention also includes injection molding processes, thermoforming processes for making articles.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: November 26, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Claire Qing Yu, Kenneth Frederick Miller, Donald Howard Ellington, Yantao Zhu
  • Publication number: 20130289211
    Abstract: The invention discloses a cross-linked polymer particle for an epoxy resin, an epoxy resin composition containing the cross-linked polymer particle, the epoxy resin and a curing agent, and an epoxy cured material having qualities of colorless transparency and crack resistance as a result of curing the resin composition. The cross-linked polymer particle for the epoxy resin contains a (meth)acrylate monomer unit and a crosslinking monomer unit, wherein a volume average primary particle diameter is 0.5 to 10 ?m, and a glass transition temperature of the monomer components excluding the crosslinking monomer is 30° C. or more by FOX formula calculation, and the refractivity at 23° C. is 1.490 to 1.510.
    Type: Application
    Filed: January 10, 2012
    Publication date: October 31, 2013
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Hiroyuki Nishii, Toshihiro Kasai
  • Patent number: 8557918
    Abstract: Compositions comprising a plurality of carbon nanotubes, a host polymer, and A block copolymer comprising a first block and a second block, wherein no block is compatible with the host polymer. In one aspect, the block copolymer is amphiphilic. In another aspect, the block copolymer may comprise a first block and a second block, wherein at least one of the first and second blocks comprises repeating units derived from a monomer having the general formula: (R)2C?C(R)(Rf) wherein Rf is selected from fluorine, a C1 to C10 fluorinated or perfluorinated alkyl group, and a C1 to C10 fluorinated or perfluorinated alkoxy group; each R is independently selected from F, H, Cl, Rf, a C1 to C10 alkyl group, and R2A, wherein R2 is a C1 to C10 alkylene group and A is selected from CO2M and SO3M, wherein M is selected from H, an ammonium and organo onium group.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: October 15, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: James M. Nelson, Ryan E. Marx, John W. Longabach
  • Publication number: 20130253139
    Abstract: Nanoparticle compositions including calcite and a surface-modifying agent bonded to the calcite are described. The surface-modifying agent includes a binding group bonded to the calcite and a compatiblizing segment. The compatiblizing segment includes at least one of a polyethylene oxide, a polypropylene oxide, a polyester, a polyamide, or a combination thereof. The composition includes less than 2 wt. % solvents and/or resins. Methods of preparing nanoparticle compositions are also described.
    Type: Application
    Filed: December 12, 2011
    Publication date: September 26, 2013
    Applicant: eM Innovative Properties Company
    Inventors: Peter D. Condo, William J. Schultz, Chad A. Haraldson, Jung-Sheng Wu
  • Patent number: 8524833
    Abstract: A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: September 3, 2013
    Assignee: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon Sim, Ki-Jeong Moon, Hae-Sang Jun
  • Publication number: 20130186541
    Abstract: A barrier layer is provided for impeding the flow of inflation gas through an inflatable article, the barrier layer constructed of a material that is based upon a cross-linkable rubber composition, the cross-linkable rubber composition comprising, per 100 parts by weight of rubber (phr), between 50 phr and 90 phr of a butyl rubber and between 10 phr and 50 phr of a total amount of a GCO copolymer comprising epichlorohydrin derived units and allyl glycidyl ether derived units and a GECO terpolymer comprising epichlorohydrin derived units, allyl glycidyl ether derived units and ethylene oxide derived units, wherein the GECO terpolymer is between 1 percent by weight and 50 percent by weight of the total and also including a sulfur cure system.
    Type: Application
    Filed: September 30, 2010
    Publication date: July 25, 2013
    Applicants: MICHELIN RECHERCHE ET TECHNIQUE S.A., COMPAGNIE GENERALE DES ESTABLISSEMENTS MICHELIN
    Inventor: Brian R Bergman
  • Patent number: 8491749
    Abstract: A two-part structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and a reactive liquid modifier. The structural adhesive may also include secondary curatives, initiators, reactive diluents and combinations thereof. The structural adhesives may be used to replace or augment conventional joining means such as welds or mechanical fasteners in bonding parts together.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: July 23, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Ilya Gorodisher, Alphonsus V. Pocius, Babu N. Gaddam
  • Publication number: 20130158198
    Abstract: The invention relates to an epoxy resin composition and preparation thereof. The composition comprises the following blended components: 100 weight parts of epoxy resins; 30 to 120 weight parts of anhydride curing agents; 1 to 45 weight parts of powdery nitrile rubbers; no curing accelerator is included in the composition. The composition of the invention has both higher heat resistance and higher toughness, and is suitable for the fields which require high heat resistance, such as circuit board, electronics packaging, binder and electrical insulating coating etc.
    Type: Application
    Filed: June 3, 2011
    Publication date: June 20, 2013
    Inventors: Guicun Qi, Jinliang Qiao, Xiaohong Zhang, Jianming Gao, Zhihai Song, Binghai Li, Chuanlun Cai, Hongbin Zhang, Ya Wang, Jinmei Lai
  • Patent number: 8450433
    Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: May 28, 2013
    Inventor: Young-Min Kim
  • Patent number: 8436126
    Abstract: The present invention provides a resin composition for an adhesive sheet, comprising an acrylic copolymer containing (A) an acrylate ester, methacrylate ester, or a mixture thereof, (B) acrylonitrile, methacrylonitrile, or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent comprises at least one selection from Lewis acid-amine complexes.
    Type: Grant
    Filed: July 17, 2007
    Date of Patent: May 7, 2013
    Assignee: Arisawa Mfg. Co., Ltd.
    Inventors: Shinichi Hasegawa, Fumiki Higuchi, Toru Ueki
  • Patent number: 8436095
    Abstract: Disclosed are curable powder coating compositions that include a film-forming resin composition that includes (a) a first film-forming resin, (b) a second film-forming resin that is different from and incompatible with the first film-forming resin, and (c) a compatibilizing agent that includes a first portion that is compatible with the first film-forming resin and a second portion that is compatible with the second film-forming resin. The compatibilizing agent is present in such compositions in an amount sufficient to result in a coating composition that, when deposited onto at least a portion of a substrate and cured, produces a mid-gloss coating.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: May 7, 2013
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Anthony M. Chasser, Michael P. Makowski, Brian E. Woodworth
  • Patent number: 8389630
    Abstract: Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: March 5, 2013
    Assignee: Kaneka Corporation
    Inventors: Hitoshi Tamai, Kohei Ogawa, Yoshiki Nakagawa
  • Publication number: 20130020724
    Abstract: The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is 2000 Pa or more.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 24, 2013
    Inventors: Sadahito Misumi, Takeshi Matsumura, Kazuhito Hosokawa, Hiroyuki Kondo
  • Patent number: 8349989
    Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: January 8, 2013
    Assignee: Air Water Inc.
    Inventors: Kiyotaka Murata, Yoshihisa Sone