Abstract: The present invention relates to a pressure-sensitive adhesive tape comprising or consisting of a moisture-curing composition comprising or consisting of: A 5 to 60 parts by weight of at least one film-former component; B 40 to 95 parts by weight of at least one epoxide component; C 10 to 500 parts by weight of at least one moisture-activatable curing agent; D optionally 0.1 to 15 parts by weight of at least one stabilizer, and E optionally 0.1 to 200 parts by weight of at least one additive, based in each case on the moisture-curing composition, with the parts by weight of components A and B adding up to 100 and with the moisture-curing composition being characterized in that the moisture-activatable hardener C comprises or consists of at least one blocked amine. The invention further relates to a method for assembling two components using such adhesive tape.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

Abstract: The present invention is directed to a vulcanizable rubber composition comprising at least one diene based elastomer and an in-situ resin, the in-situ resin comprising a methylene acceptor and a methylene donor, wherein one of the methylene acceptor and methylene donor is microencapsulated.

Abstract: Toughened thermosetting resins comprising thermosetting resins and rubber particles having an average particle size in the range of 20 to 500nm. The toughened resins are obtained by mixing a fully vulcanized powdery rubber having an average particle size in the range of 20 to 500nm with thermosetting resin prepolymers and then curing them. The toughened thermosetting resins comprise rubber phases having a small, uniform and stable particle size, which results in a very significant toughening effect, especially when crazes rapidly grow (as in a standard Izod impact test). The toughened thermosetting resins are excellent in impact resistance, strength, modulus and heat resistance, and when appropriately toughened, the thermosetting resins can be enhanced in terms of impact strength, glass transition temperature and heat distortion temperature.

Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan ? in a viscoelastic spectrum and a value of the tan ? at ?40° C. thereof is 0.1 or more.

Abstract: A polyphenylene sulfide resin composition including 100 parts by weight of a resin composition that consists of 99 to 60 wt % of a polyphenylene sulfide resin (a), and 1 to 40 wt % of at least one type of noncrystalline resin (b) selected from the group consisting of polyetherimide resin and polyether sulfone resin and 0.1 to 10 parts by weight of a compound (c) containing at least one group selected from epoxy group, amino group and isocyanate group, wherein the non-crystalline resin (b) forms an island phase and the number-average dispersed particle size of the noncrystalline resin (b) is 1,000 nm or less.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25° C. and is free of a solvent.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.

Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.

Abstract: An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after exposure to a hot and humid environment. The adhesive sheet includes a base material and, formed thereon, an adhesive layer having an adhesive composition including an acrylic copolymer (A) containing 20 to 95% by weight of a structural unit derived from a benzyl (meth)acrylate, an epoxy thermosetting resin (B), and a thermosetting agent (C).

Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.

Abstract: An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the underfill composition. A method includes assembly of the underfill composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the underfill composition.

Abstract: Resins for powder coatings which are thermally and radiation curable containing both olefinically unsaturated groups and at least one other reactive group in the same molecules selected from epoxide groups and acid groups, a method for their preparation, and the use thereof in powder coating compositions.

Abstract: Comb polymers prepared by reacting an epoxy resin and a lactone are disclosed. These comb polymers find particular application as additives for powder coating compositions, to improve various performance properties thereof. Powder coating composition comprising the described comb polymers are also disclosed.

Abstract: A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.

Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification.

Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition having an epoxy group at a main chain terminus thereof.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Abstract: A method for making a one-component epoxy resin system comprises reacting (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation in the presence of a latent hardener (C) and an expanding agent (E), each of which remains unreacted under the reaction conditions for (A) and (B), to yield a product with a Kofler Heat Bank melting point of less than 55° C. and a melting point stability of at least six months at normal workshop temperatures.

Abstract: This invention relates to a jointing compound of an acrylate/acrylonitrile copolymer containing 2 to 8 carbon atoms in the alcohol component as binder and fatty compounds as plasticizer and also fillers and auxiliaries. Epoxystearic acid methyl ester in particular may be used as the fatty compound while a butyl acrylate/acrylonitrile copolymer in particular may be used as the acrylate/acrylonitrile copolymer. The combination of the two substances results in jointing compounds characterized by a dramatic improvement in elasticity (resilience). Accordingly, they are particularly suitable for substrates with different coefficients of thermal expansion.

Abstract: An adhesive for use on metal substrates, and particularly on copper substrates, comprises (a) carboxyl benzotriazole, (b) an epoxy resin having a reactive double bond, (c) a radical curing resin, and (d) a radical initiator. The combination of elements (a) and (b) in a radical curing resin system composed of the elements (c) and (d) provides improved adhesion strength to copper metal compared to compositions containing (c) and (d) without (a) and (b).

Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: A photosensitive composition comprising, (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200′ooo or less; (B) at least one photoinitiator compound of formula I, R1, is lenear or banched C1-C12alkyl; R2 is linear or branched C1-C4alkyl; R3 and R4 independently of one another are linear or branched C1-C8alkyl; and (C) a monomeric, oligoneric or polymeric compound having at least one olefinic double bond, is especially suitable for preparting photoresists, in particular color filters.

Abstract: A composition useful as a sealing element for electrochromic devices comprises (a) an epoxy resin component including at least two of a dicyclopentadiene epoxy resin, a naphthalene epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin and a novolac epoxy resin; (b) a toughening agent; and (c) a latent curative.

Abstract: An article comprises a substrate wherein at least a portion of its surface is provided with a thermosettable adhesive composition prepared from a polyepoxide resin, a curing agent and a plurality of microspheres. The cured composition forms a semi-structural bond with said substrate which is inseparable at the use temperature and is cleanly removable from said substrate when heated to a temperature of greater than the use temperature.

Abstract: A sealant composition comprising a curable epoxy-containing material, a thermoplastic polyamide component having a melting point lower than a curing temperature of the epoxy-containing material, and a curative for the epoxy-containing material. After curing of the epoxy-containing material, the sealant composition exhibits an elongation at −20° C. of at least 2. The sealant composition is capable of effectively sealing discontinuities while maintaining enough flexibility to absorb applied stress, thereby preventing the formation of defects in the sealant which permit the intrusion of dirt, moisture, and other undesirable substances.

Abstract: Coating composition suitable for multilayer lacquering, containing, in addition to organic solvent, anti-sagging agents, optionally pigments, extenders and additives, a binder/crosslinkin agent system containing A) from 20 to 80 wt. % of carboxyl-functional (meth)acrylic copolymers and/or carboxyl-functional polyesters having an acid number of from 20 to 300, B) from 20 to 80 wt. % of epoxy-functional crosslinking agents, the percentages by weight of A) and B) adding up to 100 wt. %. C) from 0 to 30 wt. % of polymer polyol C), based on the sum of the weights of A) and B), E) from 0 to 20 wt. % of further crosslinking agents, based on the sum of the weights of A, B, and C), F) from 0 to 10 wt. % of monoepoxides, based on the sum of the weights of A) and B), and D) as anti-sagging agents, from 0.1 to 3 wt.

Abstract: A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.

Abstract: The present invention provides a cationically electrodepositable coating composition comprising: (A) a water-soluble or water-dispersible resin obtained by reacting a hydroxyl group of a bisphenol A type epoxy resin with a cyclic ester compound, (B) a vinyl resin having a solubility parameter value of less than 9.6, (C) polyalkylene glycol having a solubility parameter value of less than 9.6, and (D) a pigment component having an average particle diameter of 0.5 &mgr;m or less.

Abstract: An epoxy based adhesive composition contains: (i) a barbituric acid-modified bismaleimide; (ii) an epoxy resin selected from the group consisting of tetraglycidylmethylenedianiline, diglycidyl ortho-phthalate, diglycidyl ether of bisphenol A, polyglycidyl ether of novolac, and epoxy cresol novolac; (iii) an elastomer such as a carboxylated acrylontrile rubber containing between 19 and 41 wt % of acrylontrile; (v) a hardening agent and (vi) a catalyst.

Abstract: A method for the manufacture of a one-component epoxy resin system comprises mixing at 15-30° C. and reacting at room temperature over 2-14 days (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation to yield a product with a Kofler Heat Bank melting point of less than 55° C. and a melting point stability of at least six months at normal workshop temperatures in the presence of (C) a hardener for (A) and the reaction product of (A) and (B) which is different from (B) and remains unreacted with (A) and (B) during the their reaction, (E) an expanding agent and (D) additives other than the expanding agent, provided that the reaction between (A) and (B) does not generate enough heat to activate a reaction between the remaining epoxy groups and hardener (C) or expanding agent (E).

Abstract: A thermosetting adhesive comprising a polyepoxide resin, a curing agent such as an imidazole and polymeric or elastomeric microspheres is removable when heated to a temperature greater than the use temperature of from about room temperature to about 185° C.

Abstract: Reaction products of a microgel that contains carboxylic acid groups with a nitrogen-containing base have a high latency and high stability towards mechanical influences and are suitable as hardeners for one-component epoxy resin systems.

Abstract: The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 &mgr;m-thick film form at a wavelength of 500 nm is not less than 10% of the light transmittance of the air, which is useful as adhesives, film materials, and molding materials for encapsulating electronic components.

Abstract: A resin composition for powder coating, which comprises the following components (A), (B) and (C): (A) a carboxyl group-containing resin having a number average molecular weight of from 1,000 to 20,000, an acid value of from 5 to 200 and a glass transition temperature of from 30 to 120.degree. C.; (B) tris(.beta.-methylglycidyl) isocyanurate of formula (1); and (C) as a ring opening polymerization inhibitor, at least one compound selected from the group consisting of amines having in their molecules a bond of formula (2); and onium salts.

Abstract: Curable compositions, which comprise the following components:(A) a polymer component consisting of one or more than one of the following components:polymers based on acrylate monomers and/or methacrylate monomers containing free carboxyl groups, and carboxyl-terminated polyesters;(B) a crosslinker for component (A) selected from the group consisting of:(B1) one or more than one compound having a molecular weight of less than 800 and containing at least two (2-oxo-1,3-dioxolan-4-yl)methyl groups per molecule, and(B2) a mixture consisting of one or more than one compound having a molecular weight of less than 800 and containing at least two (2-oxo-1,3-dioxolan-4-yl)methyl groups per molecule, and of one or more than one epoxy resin, at least 60 percent of the total number of (2-oxo-1,3-dioxolan-4-yl)methyl groups and epoxy groups of the mixture being (2-oxo-1,3-dioxolan-4-yl)methyl groups;(C) a catalyst for accelerating the crosslinking reaction between the components (A) and (B), and(D) a solvent for the comp

Abstract: The present invention provides a modeling paste comprising a latent material which can be applied as a thick layer to a substrate and which after activation rapidly crosslinks to a machinable surface.

Abstract: A composition is useful as a prepreg containing reinforcing fibers comprises an epoxy resin, a thermoplastic elastomer of a polyamide and/or polyester block copolymer, a curing agent such as dicyandiamide, and optionally a thermoplastic resin such as a polyvinyl formal resin.