Abstract: The invention concerns an adhesive composition consisting of at least one ethylene polymer or copolymer, said composition comprising at least one unsaturated carboxylic acid ester comonomer, and at least one functional comonomer, useful in an extrusion-coating process for application on a support or in an extrusion-lamination process for bonding together several supports of different type or not, in a wide temperature range. The invention is characterized in that said composition has an unsaturated carboxylic acid ester content higher than 5 wt % and in that the functional comonomer consists of at least one reactive function in the form of an acid group, anhydride or epoxy, whereof the proportion is less than 1 wt % of the composition.

Abstract: The present invention discloses stimuli-sensitive protein conjugate which can make supramolecular protein assemblies and methods for using the same. The present invention provides simple and rational process for construction of said stimuli-sensitive spherical protein assemblies through supramolecular chemical strategy.

Abstract: To obtain a hydrophilic macromonomer mixture which is a highly polymerized hydrophilic macromonomer, has few components not bonded to the polymer chain after polymerization, and is less likely to leaching. Provided is a macromonomer mixture containing macromonomer A being a macromonomer having a group obtained by further introducing a polymerizable group into a reactive group derived from a polymerization initiator at an end thereof; and macromonomer B being a macromonomer having a group obtained by further introducing a polymerizable group into a reactive group derived from a chain transfer agent at an end thereof.

Abstract: A curable thermosetting resin composition, including a multicomponent copolymer and an epoxy resin. The multicomponent copolymer is a ternary or quaternary copolymer having structural units selected from the group consisting of unit (I), unit (II), unit (III) and (IV). The structural unit (I) is the structural unit (II) is the structural unit (III) is and the structural unit (IV) is where m, n, r and s are natural numbers denoting the molar fraction of corresponding building blocks in the copolymers respectively, R is selected from the group consisting of hydrogen, aromatic group and aliphatic group, and AR is an aromatic group; and the epoxy resin is one or more selected from a group consisting of aromatic epoxy compound, alicyclic epoxy compound and aliphatic epoxy compound.

Abstract: Disclosed is a halogen-free high-frequency resin composition calculated according to parts by weight, and including 20-50 parts by weight of dicyclopentadiene epoxy resin, 10-40 parts by weight of styrene-maleic anhydride copolymer, 10-30 parts by weight of benzoxazine resin, 5-20 parts by weight of polyfunctional epoxy resin and 20-40 parts by weight of at least one phosphorus-containing flame retardant. A copper clad laminate made of the halogen-free high-frequency resin composition has excellent properties including a low dielectric constant, a low dielectric loss, a high heat resistance, a low water absorption, a low coefficient of expansion and a high PCB manufacturability.

Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: An adhesive resin composition of the present invention includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.

Abstract: Crosslinker/accelerator system for thermally crosslinking polyacrylates with functional groups that are adapted to react with epoxy groups in a crosslinking reaction, comprising at least one epoxy group-containing substance and at least one substance that accelerates the crosslinking reaction at a temperature below the melting temperature of the polyacrylate.

Abstract: A hydrolyzed divinylarene dioxide resin composition including the reaction product of (a) a divinylarene dioxide, and (b) water; a process for making the hydrolyzed divinylarene dioxide resin composition; and a curable hydrolyzed divinylarene dioxide resin composition made therefrom. The cured product made from the above hydrolyzed divinylarene dioxide resin composition offers improved properties such as a lower viscosity and a high heat resistance compared to known cured products prepared from known epoxy resins.

Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a terpolymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

Abstract: Disclosed is a polymer including a polymer polymerized of a phosphorous-based monomer, a polymer polymerized of a nitrogen-based monomer, or a polymer polymerized of the phosphorous-based monomer and the nitrogen-based monomer. The phosphorous-based monomer has the formula as follows: and the nitrogen-based monomer has the formula as follows: R1 and R3 consists of hydrogen, a phenyl group, a C7-12 alkyl phenyl group, a C1-12 alkyl group, a C2-12 ether group, a C1-12 alkoxyl group, or a C1-12 hydroxylalkyl group, respectively. R2 and R4 consists of a phenylene group, a C7-12 alkyl phenylene group, a C1-12 alkylene group, a C2-12 ether group, a C1-12 alkylene glycol group, or a C1-12 hydroxylalkylene group, respectively.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention discloses a cross-linked polymer particle for an epoxy resin, an epoxy resin composition containing the cross-linked polymer particle, the epoxy resin and a curing agent, and an epoxy cured material having qualities of colorless transparency and crack resistance as a result of curing the resin composition. The cross-linked polymer particle for the epoxy resin contains a (meth)acrylate monomer unit and a crosslinking monomer unit, wherein a volume average primary particle diameter is 0.5 to 10 ?m, and a glass transition temperature of the monomer components excluding the crosslinking monomer is 30° C. or more by FOX formula calculation, and the refractivity at 23° C. is 1.490 to 1.510.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: The present invention relates to a transparent resin composition which comprises (a) a (meth)acrylate based resin comprising one or more (meth)acrylate based derivatives; and (b) an aromatic based resin having a chain having the hydroxy group containing portion and an aromatic moiety.

Abstract: The present invention provides a heat-curing resin composition which is curable without UV irradiation or the like and in which exudation of unreacted epoxy resin and the like at the time of pressure thermoforming is satisfactory. The heat-curing resin composition comprises: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for the epoxy resin, wherein the curing agent contains organic acid dihydrazide, and part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group.

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.

Abstract: The present invention provides a resin composition for an adhesive sheet, comprising an acrylic copolymer containing (A) an acrylate ester, methacrylate ester, or a mixture thereof, (B) acrylonitrile, methacrylonitrile, or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent comprises at least one selection from Lewis acid-amine complexes.

Abstract: Disclosed herein a process for the preparation of reactive solution of polymerizable polymers comprising polymerizable reactive functionality and wherein one approach discloses a polymerizable polymer comprising a (i) N-vinyl amide monomer; (ii) dual functional monomer; and (iii) polymerizable monomelic solvent. An additional approach reveals about polymerizable polymer comprising (i) a base polymer made from N-vinyl amide monomer and a co-monomer with the proviso for grafting; (ii) graft functional monomer; and (iii) a polymerizable monomelic solvent to enable a medium for polymerization. Also, discloses about the compositions comprising reactive solution of polymerizable polymer and its various possible applications.

Abstract: A thermosetting resin composition for producing a color filter for a CMOS image sensor is provided. The thermosetting resin composition comprises an organic solvent and a self-curing copolymer having structural units represented by Formulae 1, 2, 3 and 4, which are described in the specification.

Abstract: A cationically polymerizable composition comprising (i) a cationically polymerizable resin, (ii) an onium salt, (iii) an azo or peroxide initiator, exhibits a lower cure temperature upon the addition of (iv) a catalytic or substoichiometric amount of an electron-rich vinyl resin to the reaction.

Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: The present invention is directed to a bio-based composition comprising a polycondensate of a dimer of a fatty alcohol and a dimer of a fatty acid, and an epoxidized fatty acid ester as a cross-linking agent, wherein the polycondensate and the epoxidized fatty acid ester are capable of reacting with each other.

Abstract: A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

Abstract: Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: A thermoplastic resin composition can include (A) about 30 to about 99 parts by weight of an epoxy group-containing styrenic polymer comprising (A1) about 5 to about 100% by weight of an epoxy group-containing vinyl copolymer and (A2) about 0 to about 95% by weight of a rubber modified styrenic copolymer resin; and (B) about 1 to about 70 parts by weight of a polyester resin. The resin composition may further comprise (C) about 3 to about 20 parts by weight of a bromine-containing flame retardant, per 100 parts by weight of a base resin comprising (A) and (B); and (D) about 0.1 to about 6 parts by weight of a flame retardant aid, per 100 parts by weight of a base resin comprising (A) and (B).

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a crosslinking agent of a strene-maleic anhydride copolymer and a co-crosslinking agent is an optionally brominated bisphenol A and/or an optionally brominated bisphenol A diglycidyl ether.

Abstract: It is an object of the invention to provide a rubbery polymer-containing resin composition useful as a raw material for a molded article and a cured product having high transparency and excellent mechanical strength: namely, an object of the invention is to provide, for example, a cycloaliphatic epoxy resin composition capable of improving the toughness thereof while maintaining the mechanical strength and transparency of the cycloaliphatic epoxy resin without lowering the heat resistance, a production method thereof and a cured product thereof. A rubbery polymer-containing resin composition of the invention, for example, a cycloaliphatic epoxy resin composition of the invention is a cycloaliphatic epoxy resin composition comprising 100 parts by weight of a cycloaliphatic epoxy resin and 1 to 60 parts by weight of polymer particles with a volume average particle diameter (Mv) of not smaller than 0.01 ?m and not larger than 0.

Abstract: A crosslinker for polymerizing a film-forming material including an alkyl or aromatic compound comprising at least two functional groups reactive with a film-forming resin and at least one pendent group having a nonionic metal coordinating structure. Coating compositions can include a film-forming material and the crosslinker. The coating compositions can be used to coat a substrate, such as a metal substrate. Applied coating layers on substrates can be cured to form coating films.

Abstract: Provided herein are one-solution type thermosetting resin compositions that may be useful to form protective films for color filters used in liquid crystal displays or image sensors. According to some embodiments, the resin compositions may include a self-curable copolymer and an epoxy compound. The protective films may exhibit desirable flatness, adhesiveness, transmittance, heat resistance and chemical resistance. Also provided are methods of forming a film on a substrate, and substrates having a film formed thereon. In addition, provided herein are color filters including a film formed from a composition according to an embodiment of the invention, and liquid crystal displays and image sensors including such color filters.

Abstract: An antireflection film composition, wherein an etching speed is fast, thus, when used as a resist lower layer, a film loss of a resist pattern and deformation of the pattern during etching can be minimized, and because of a high crosslinking density, a dense film can be formed after thermal crosslinking, thus, mixing with an upper layer resist can be prevented and the resist pattern after development is good is provided. The antireflection film composition comprising; at least a polymer having a repeating unit represented by the following general formula (I).

Abstract: Polyarylenesulfide resin compositions are provided having a dramatically improved adhesiveness with regard to the cured epoxy resin, while maintaining characteristics of polyarylenesulfide resins such as a heat resistivity and a chemical resistivity. The above described polyarylenesulfide resin compositions are obtained by comprising as essential components the allylenesulfide resin (A), bisphenol-type epoxy resin (B), and an oxazoline-group-containing amorphous polymer (C). The thus obtained polyarylenesulfide resin compositions can be used as superior engineering plastics in wide application fields such as electronic and other devices.

Abstract: Provided are a low temperature-cured polymer gate insulation layer and an organic thin film transistor having the same. The gate insulation layer includes an acrylate-based compound, an anhydride-based compound, and an epoxy-based compound each by 0.1 weight % or more.

Abstract: A unique combination of a hydrophilic polyol (A) and a hydrophobic polyol (B) having a terminal ethylene oxide cap are used in a resin composition and a polyurethane system, and are used to form a polyurethane article, such as a polyurethane foam. The hydrophilic polyol (A) is ethylene oxide (EO) rich and the hydrophobic polyol (B) is propylene oxide (PO) rich. The hydrophilic polyol (A) and the hydrophobic polyol (B) are present in the resin composition and the polyurethane system in a weight ratio (A:B) of from 1.5:1 to 20:1. The polyurethane article exhibits excellent comfort for use in vehicle applications, such as automotive and motorcycle seating, due to reduced resonance frequency and reduced peak vibration transmissivity relative to previous polyurethane articles.

Abstract: A thermoplastic resin composition can include (A) about 30 to about 99 parts by weight of an epoxy group-containing styrenic polymer comprising (A1) about 5 to about 100% by weight of an epoxy group-containing vinyl copolymer and (A2) about 0 to about 95% by weight of a rubber modified styrenic copolymer resin; and (B) about 1 to about 70 parts by weight of a polyester resin. The resin composition may further comprise (C) about 3 to about 20 parts by weight of a bromine-containing flame retardant, per 100 parts by weight of a base resin comprising (A) and (B); and (D) about 0.1 to about 6 parts by weight of a flame retardant aid, per 100 parts by weight of a base resin comprising (A) and (B).

Abstract: Resins for powder coatings which are thermally and radiation curable containing both olefinically unsaturated groups and at least one other reactive group in the same molecules selected from epoxide groups and acid groups, a method for their preparation, and the use thereof in powder coating compositions.

Abstract: A composition contains a polyester; an aromatic epoxy compound, in an amount sufficient to provide 5 to 300 milliequivalents of epoxy per kilogram of polyester; and 0.5 to 6 weight percent, based on the weight of the polyester, and an ethylene-glycidyl methacrylate containing copolymer; and/or a copolyester copolymer, wherein the copolyester comprises, based on the weight of the copolyester, 15 to 95 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a C2-C6 aliphatic diol, and 5 to 85 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a poly(alkylene oxide) glycol having a molecular weight of 400-6,000 and a carbon to oxygen ratio of 2.0-4.3. The compositions have excellent hydrolytic resistance, and are suitable for making automotive and electronic parts.

Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

Abstract: The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living-radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition-having an epoxy group at a main chain terminus thereof.

Abstract: Reactive, non-isocyanate coating compositions prepared by mixing epoxy, tertiary amine, anhydride, hydroxy- and, optionally, acid functional compounds, a system of making the coating composition, a method of coating the composition on a substrate and a substrate coated with the composition.