Polymer Derived From Ethylenic Reactants Only Derived From Heterocyclic Reactant Patents (Class 525/117)
  • Patent number: 10125209
    Abstract: To obtain a hydrophilic macromonomer mixture which is a highly polymerized hydrophilic macromonomer, has few components not bonded to the polymer chain after polymerization, and is less likely to leaching. Provided is a macromonomer mixture containing macromonomer A being a macromonomer having a group obtained by further introducing a polymerizable group into a reactive group derived from a polymerization initiator at an end thereof; and macromonomer B being a macromonomer having a group obtained by further introducing a polymerizable group into a reactive group derived from a chain transfer agent at an end thereof.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: November 13, 2018
    Assignee: Johnson & Johnson Vision Care, Inc.
    Inventors: Kazuhiko Fujisawa, Masataka Nakamura
  • Patent number: 9963530
    Abstract: A curable thermosetting resin composition, including a multicomponent copolymer and an epoxy resin. The multicomponent copolymer is a ternary or quaternary copolymer having structural units selected from the group consisting of unit (I), unit (II), unit (III) and (IV). The structural unit (I) is the structural unit (II) is the structural unit (III) is and the structural unit (IV) is where m, n, r and s are natural numbers denoting the molar fraction of corresponding building blocks in the copolymers respectively, R is selected from the group consisting of hydrogen, aromatic group and aliphatic group, and AR is an aromatic group; and the epoxy resin is one or more selected from a group consisting of aromatic epoxy compound, alicyclic epoxy compound and aliphatic epoxy compound.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: May 8, 2018
    Assignee: CHANGZHOU BAMSTONE COMPOSITES CO., LTD.
    Inventors: Wei Liu, Ruimin Xiao, Lu Wang
  • Publication number: 20150147799
    Abstract: Disclosed is a halogen-free high-frequency resin composition calculated according to parts by weight, and including 20-50 parts by weight of dicyclopentadiene epoxy resin, 10-40 parts by weight of styrene-maleic anhydride copolymer, 10-30 parts by weight of benzoxazine resin, 5-20 parts by weight of polyfunctional epoxy resin and 20-40 parts by weight of at least one phosphorus-containing flame retardant. A copper clad laminate made of the halogen-free high-frequency resin composition has excellent properties including a low dielectric constant, a low dielectric loss, a high heat resistance, a low water absorption, a low coefficient of expansion and a high PCB manufacturability.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Inventors: Hailin Li, Faquan Tu, Tsung-Lieh Weng, Yongxin Jiang, Feng Tang, Quansheng Zhu
  • Patent number: 8927677
    Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: January 6, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Radhakrishnan Karunakaran, Rajesh Turakhia
  • Patent number: 8901207
    Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: December 2, 2014
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Akinobu Hayakawa, Hideaki Ishizawa, Kohei Takeda, Ryohei Masui
  • Publication number: 20140322474
    Abstract: An adhesive resin composition of the present invention includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.
    Type: Application
    Filed: December 7, 2012
    Publication date: October 30, 2014
    Inventors: Shinichi Usugi, Noboru Kawasaki, Jun Kamada, Takuzo Aida
  • Publication number: 20140264959
    Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: DENSO CORPORATION
    Inventors: Hiroyuki Okuhira, Akira Takakura, Hiroshi Katou
  • Patent number: 8802777
    Abstract: Crosslinker/accelerator system for thermally crosslinking polyacrylates with functional groups that are adapted to react with epoxy groups in a crosslinking reaction, comprising at least one epoxy group-containing substance and at least one substance that accelerates the crosslinking reaction at a temperature below the melting temperature of the polyacrylate.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: August 12, 2014
    Assignee: tesa SE
    Inventors: Stephan Zöllner, Kay Brandes, Sven Hansen, Esther Von Possel
  • Patent number: 8766018
    Abstract: A hydrolyzed divinylarene dioxide resin composition including the reaction product of (a) a divinylarene dioxide, and (b) water; a process for making the hydrolyzed divinylarene dioxide resin composition; and a curable hydrolyzed divinylarene dioxide resin composition made therefrom. The cured product made from the above hydrolyzed divinylarene dioxide resin composition offers improved properties such as a lower viscosity and a high heat resistance compared to known cured products prepared from known epoxy resins.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: July 1, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Maurice J. Marks, E. Joseph Campbell
  • Publication number: 20140128545
    Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a terpolymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.
    Type: Application
    Filed: June 30, 2011
    Publication date: May 8, 2014
    Applicant: DOW Global Technologies LLC
    Inventors: Jia Wen Xiong, Hongyu Chen, Michael Mullins, Chao Zhang, Annie Gui Hong Liao, Wayne Yi Zhang
  • Patent number: 8716401
    Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: May 6, 2014
    Assignee: Lintec Corporation
    Inventors: Yasunori Karasawa, Isao Ichikawa
  • Publication number: 20140121323
    Abstract: Disclosed is a polymer including a polymer polymerized of a phosphorous-based monomer, a polymer polymerized of a nitrogen-based monomer, or a polymer polymerized of the phosphorous-based monomer and the nitrogen-based monomer. The phosphorous-based monomer has the formula as follows: and the nitrogen-based monomer has the formula as follows: R1 and R3 consists of hydrogen, a phenyl group, a C7-12 alkyl phenyl group, a C1-12 alkyl group, a C2-12 ether group, a C1-12 alkoxyl group, or a C1-12 hydroxylalkyl group, respectively. R2 and R4 consists of a phenylene group, a C7-12 alkyl phenylene group, a C1-12 alkylene group, a C2-12 ether group, a C1-12 alkylene glycol group, or a C1-12 hydroxylalkylene group, respectively.
    Type: Application
    Filed: December 30, 2013
    Publication date: May 1, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Lung-Chang LIU, Po-Jen YANG
  • Patent number: 8617930
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: December 31, 2013
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Publication number: 20130289211
    Abstract: The invention discloses a cross-linked polymer particle for an epoxy resin, an epoxy resin composition containing the cross-linked polymer particle, the epoxy resin and a curing agent, and an epoxy cured material having qualities of colorless transparency and crack resistance as a result of curing the resin composition. The cross-linked polymer particle for the epoxy resin contains a (meth)acrylate monomer unit and a crosslinking monomer unit, wherein a volume average primary particle diameter is 0.5 to 10 ?m, and a glass transition temperature of the monomer components excluding the crosslinking monomer is 30° C. or more by FOX formula calculation, and the refractivity at 23° C. is 1.490 to 1.510.
    Type: Application
    Filed: January 10, 2012
    Publication date: October 31, 2013
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Hiroyuki Nishii, Toshihiro Kasai
  • Publication number: 20130230727
    Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Application
    Filed: September 28, 2012
    Publication date: September 5, 2013
    Applicant: ISOLA USA CORP.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Patent number: 8513358
    Abstract: The present invention relates to a transparent resin composition which comprises (a) a (meth)acrylate based resin comprising one or more (meth)acrylate based derivatives; and (b) an aromatic based resin having a chain having the hydroxy group containing portion and an aromatic moiety.
    Type: Grant
    Filed: January 7, 2009
    Date of Patent: August 20, 2013
    Assignee: LG Chem, Ltd.
    Inventors: Dong-Ryul Kim, Boong-Goon Jeong, Dae-Woo Nam, Myeong-Geun Ko
  • Publication number: 20130183520
    Abstract: The present invention provides a heat-curing resin composition which is curable without UV irradiation or the like and in which exudation of unreacted epoxy resin and the like at the time of pressure thermoforming is satisfactory. The heat-curing resin composition comprises: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for the epoxy resin, wherein the curing agent contains organic acid dihydrazide, and part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group.
    Type: Application
    Filed: November 16, 2011
    Publication date: July 18, 2013
    Applicant: DEXERIALS CORPORATION
    Inventor: Toshiki Natori
  • Patent number: 8445591
    Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 21, 2013
    Assignee: Brewer Science Inc.
    Inventors: Gu Xu, Kimberly A. Yess, Tony D. Flaim
  • Patent number: 8436126
    Abstract: The present invention provides a resin composition for an adhesive sheet, comprising an acrylic copolymer containing (A) an acrylate ester, methacrylate ester, or a mixture thereof, (B) acrylonitrile, methacrylonitrile, or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent comprises at least one selection from Lewis acid-amine complexes.
    Type: Grant
    Filed: July 17, 2007
    Date of Patent: May 7, 2013
    Assignee: Arisawa Mfg. Co., Ltd.
    Inventors: Shinichi Hasegawa, Fumiki Higuchi, Toru Ueki
  • Publication number: 20130085230
    Abstract: Disclosed herein a process for the preparation of reactive solution of polymerizable polymers comprising polymerizable reactive functionality and wherein one approach discloses a polymerizable polymer comprising a (i) N-vinyl amide monomer; (ii) dual functional monomer; and (iii) polymerizable monomelic solvent. An additional approach reveals about polymerizable polymer comprising (i) a base polymer made from N-vinyl amide monomer and a co-monomer with the proviso for grafting; (ii) graft functional monomer; and (iii) a polymerizable monomelic solvent to enable a medium for polymerization. Also, discloses about the compositions comprising reactive solution of polymerizable polymer and its various possible applications.
    Type: Application
    Filed: November 19, 2010
    Publication date: April 4, 2013
    Applicant: ISP Investments Inc.
    Inventors: David K. Hood, Osama M. Musa, Surya Kamin, John Mckittrick
  • Patent number: 8389621
    Abstract: A thermosetting resin composition for producing a color filter for a CMOS image sensor is provided. The thermosetting resin composition comprises an organic solvent and a self-curing copolymer having structural units represented by Formulae 1, 2, 3 and 4, which are described in the specification.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: March 5, 2013
    Assignee: Cheil Industries Inc.
    Inventors: O Bum Kwon, Kil Sung Lee, Jae Hyun Kim, Jung Hyun Kim
  • Patent number: 8324319
    Abstract: A cationically polymerizable composition comprising (i) a cationically polymerizable resin, (ii) an onium salt, (iii) an azo or peroxide initiator, exhibits a lower cure temperature upon the addition of (iv) a catalytic or substoichiometric amount of an electron-rich vinyl resin to the reaction.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: December 4, 2012
    Inventors: Laxmisha M. Sridhar, Osama M. Musa
  • Patent number: 8313836
    Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: November 20, 2012
    Assignee: Isola USA Corp.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Patent number: 8304034
    Abstract: The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: November 6, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Hyun-Moo Choi, O-Bum Kwon, Sun-Yul Lee
  • Patent number: 8227084
    Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: July 24, 2012
    Assignee: Isola USA Corp.
    Inventors: Martin Choate, Jyoti Sharma, Steve Peters, Kevin Rafferty
  • Publication number: 20120165457
    Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Application
    Filed: September 2, 2011
    Publication date: June 28, 2012
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Publication number: 20120156484
    Abstract: The present invention is directed to a bio-based composition comprising a polycondensate of a dimer of a fatty alcohol and a dimer of a fatty acid, and an epoxidized fatty acid ester as a cross-linking agent, wherein the polycondensate and the epoxidized fatty acid ester are capable of reacting with each other.
    Type: Application
    Filed: June 2, 2010
    Publication date: June 21, 2012
    Applicants: NITTO DENKO CORPORATION, NITTO EUROPE N.V.
    Inventors: Richard Vendamme, Walter Alfons Eevers
  • Publication number: 20120129414
    Abstract: A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.
    Type: Application
    Filed: November 24, 2010
    Publication date: May 24, 2012
    Inventors: Chung-Hao CHANG, Hsiu-Lien Wu, Han-Shiang Huag, Chia-Hsiu Yeh
  • Publication number: 20120024580
    Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.
    Type: Application
    Filed: November 1, 2010
    Publication date: February 2, 2012
    Inventors: Hsuan Hao HSU, Jiun Jie Huang, Mei Ling Chu, Hsien Te Chen
  • Publication number: 20110256342
    Abstract: Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.
    Type: Application
    Filed: December 3, 2009
    Publication date: October 20, 2011
    Inventors: Hideaki Toshioka, Yasuhiro Okuda
  • Patent number: 8022140
    Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: September 20, 2011
    Assignee: Isola USA Corp.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Patent number: 7981960
    Abstract: A thermoplastic resin composition can include (A) about 30 to about 99 parts by weight of an epoxy group-containing styrenic polymer comprising (A1) about 5 to about 100% by weight of an epoxy group-containing vinyl copolymer and (A2) about 0 to about 95% by weight of a rubber modified styrenic copolymer resin; and (B) about 1 to about 70 parts by weight of a polyester resin. The resin composition may further comprise (C) about 3 to about 20 parts by weight of a bromine-containing flame retardant, per 100 parts by weight of a base resin comprising (A) and (B); and (D) about 0.1 to about 6 parts by weight of a flame retardant aid, per 100 parts by weight of a base resin comprising (A) and (B).
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: July 19, 2011
    Assignee: Cheil Industries Inc.
    Inventors: Sung Hee Ahn, Se Bum Son, In Hwan Oh, Sung Duk Hwang
  • Patent number: 7968194
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 7968195
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 7897258
    Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a crosslinking agent of a strene-maleic anhydride copolymer and a co-crosslinking agent is an optionally brominated bisphenol A and/or an optionally brominated bisphenol A diglycidyl ether.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: March 1, 2011
    Assignee: Isola USA Corp.
    Inventors: Franz Tikart, Karl-Heinz Leis, Karl Walter Kopp
  • Publication number: 20110015347
    Abstract: It is an object of the invention to provide a rubbery polymer-containing resin composition useful as a raw material for a molded article and a cured product having high transparency and excellent mechanical strength: namely, an object of the invention is to provide, for example, a cycloaliphatic epoxy resin composition capable of improving the toughness thereof while maintaining the mechanical strength and transparency of the cycloaliphatic epoxy resin without lowering the heat resistance, a production method thereof and a cured product thereof. A rubbery polymer-containing resin composition of the invention, for example, a cycloaliphatic epoxy resin composition of the invention is a cycloaliphatic epoxy resin composition comprising 100 parts by weight of a cycloaliphatic epoxy resin and 1 to 60 parts by weight of polymer particles with a volume average particle diameter (Mv) of not smaller than 0.01 ?m and not larger than 0.
    Type: Application
    Filed: January 27, 2009
    Publication date: January 20, 2011
    Inventors: Shinya Hongo, Kazuhiro Yoshida
  • Patent number: 7772334
    Abstract: A crosslinker for polymerizing a film-forming material including an alkyl or aromatic compound comprising at least two functional groups reactive with a film-forming resin and at least one pendent group having a nonionic metal coordinating structure. Coating compositions can include a film-forming material and the crosslinker. The coating compositions can be used to coat a substrate, such as a metal substrate. Applied coating layers on substrates can be cured to form coating films.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: August 10, 2010
    Assignee: BASF Coatings GmbH
    Inventors: Timothy S. December, Sergio Gonzalez, Günther Ott, Karl-Heinz Grosse-Brinkhaus
  • Patent number: 7722932
    Abstract: Provided herein are one-solution type thermosetting resin compositions that may be useful to form protective films for color filters used in liquid crystal displays or image sensors. According to some embodiments, the resin compositions may include a self-curable copolymer and an epoxy compound. The protective films may exhibit desirable flatness, adhesiveness, transmittance, heat resistance and chemical resistance. Also provided are methods of forming a film on a substrate, and substrates having a film formed thereon. In addition, provided herein are color filters including a film formed from a composition according to an embodiment of the invention, and liquid crystal displays and image sensors including such color filters.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: May 25, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: O Bum Kwon, Hyun Moon Choi, Sun Yul Lee, Kil Sung Lee
  • Patent number: 7687228
    Abstract: An antireflection film composition, wherein an etching speed is fast, thus, when used as a resist lower layer, a film loss of a resist pattern and deformation of the pattern during etching can be minimized, and because of a high crosslinking density, a dense film can be formed after thermal crosslinking, thus, mixing with an upper layer resist can be prevented and the resist pattern after development is good is provided. The antireflection film composition comprising; at least a polymer having a repeating unit represented by the following general formula (I).
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: March 30, 2010
    Assignee: Shin Etsu Chemical Co., Ltd.
    Inventors: Jun Hatakeyama, Kazumi Noda, Seiichiro Tachibana, Takeshi Kinsho, Tsutomu Ogihara
  • Patent number: 7601782
    Abstract: Polyarylenesulfide resin compositions are provided having a dramatically improved adhesiveness with regard to the cured epoxy resin, while maintaining characteristics of polyarylenesulfide resins such as a heat resistivity and a chemical resistivity. The above described polyarylenesulfide resin compositions are obtained by comprising as essential components the allylenesulfide resin (A), bisphenol-type epoxy resin (B), and an oxazoline-group-containing amorphous polymer (C). The thus obtained polyarylenesulfide resin compositions can be used as superior engineering plastics in wide application fields such as electronic and other devices.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: October 13, 2009
    Assignee: Dainippon Ink & Chemicals, Inc.
    Inventors: Kiyotaka Kawashima, Tsuneyuki Adachi
  • Patent number: 7586119
    Abstract: Provided are a low temperature-cured polymer gate insulation layer and an organic thin film transistor having the same. The gate insulation layer includes an acrylate-based compound, an anhydride-based compound, and an epoxy-based compound each by 0.1 weight % or more.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: September 8, 2009
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Gi Heon Kim, Sung Min Yoon, In Kyu You, Seung Youl Kang, Seong Deok Ahn, Kyu Ha Baek, Kyung Soo Suh
  • Publication number: 20090012195
    Abstract: A unique combination of a hydrophilic polyol (A) and a hydrophobic polyol (B) having a terminal ethylene oxide cap are used in a resin composition and a polyurethane system, and are used to form a polyurethane article, such as a polyurethane foam. The hydrophilic polyol (A) is ethylene oxide (EO) rich and the hydrophobic polyol (B) is propylene oxide (PO) rich. The hydrophilic polyol (A) and the hydrophobic polyol (B) are present in the resin composition and the polyurethane system in a weight ratio (A:B) of from 1.5:1 to 20:1. The polyurethane article exhibits excellent comfort for use in vehicle applications, such as automotive and motorcycle seating, due to reduced resonance frequency and reduced peak vibration transmissivity relative to previous polyurethane articles.
    Type: Application
    Filed: July 5, 2007
    Publication date: January 8, 2009
    Inventors: Raymond A. Neff, Jon P. Pavlinac, Mark J. Hughes, Berend Eling, Juergen Mertes, stephan Goettke
  • Publication number: 20080221255
    Abstract: A thermoplastic resin composition can include (A) about 30 to about 99 parts by weight of an epoxy group-containing styrenic polymer comprising (A1) about 5 to about 100% by weight of an epoxy group-containing vinyl copolymer and (A2) about 0 to about 95% by weight of a rubber modified styrenic copolymer resin; and (B) about 1 to about 70 parts by weight of a polyester resin. The resin composition may further comprise (C) about 3 to about 20 parts by weight of a bromine-containing flame retardant, per 100 parts by weight of a base resin comprising (A) and (B); and (D) about 0.1 to about 6 parts by weight of a flame retardant aid, per 100 parts by weight of a base resin comprising (A) and (B).
    Type: Application
    Filed: February 26, 2008
    Publication date: September 11, 2008
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Sung Hee AHN, Se Bum SON, In Hwan OH, Sung Duk HWANG
  • Patent number: 7390849
    Abstract: Resins for powder coatings which are thermally and radiation curable containing both olefinically unsaturated groups and at least one other reactive group in the same molecules selected from epoxide groups and acid groups, a method for their preparation, and the use thereof in powder coating compositions.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: June 24, 2008
    Assignee: Surface Specialties Italy s.r.l.
    Inventors: Roberto Cavalieri, Sergio Gazzea
  • Publication number: 20080090965
    Abstract: A composition contains a polyester; an aromatic epoxy compound, in an amount sufficient to provide 5 to 300 milliequivalents of epoxy per kilogram of polyester; and 0.5 to 6 weight percent, based on the weight of the polyester, and an ethylene-glycidyl methacrylate containing copolymer; and/or a copolyester copolymer, wherein the copolyester comprises, based on the weight of the copolyester, 15 to 95 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a C2-C6 aliphatic diol, and 5 to 85 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a poly(alkylene oxide) glycol having a molecular weight of 400-6,000 and a carbon to oxygen ratio of 2.0-4.3. The compositions have excellent hydrolytic resistance, and are suitable for making automotive and electronic parts.
    Type: Application
    Filed: October 16, 2006
    Publication date: April 17, 2008
    Inventor: Sung Dug Kim
  • Patent number: 7202304
    Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: April 10, 2007
    Assignee: Intel Corporation
    Inventors: Saikumar Jayaraman, Rahul Manepalli
  • Patent number: 7196141
    Abstract: The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living-radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition-having an epoxy group at a main chain terminus thereof.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: March 27, 2007
    Assignee: Kaneka Corporation
    Inventors: Kenichi Kitano, Yoshiki Nakagawa, Masayuki Fujita
  • Patent number: 7108919
    Abstract: Reactive, non-isocyanate coating compositions prepared by mixing epoxy, tertiary amine, anhydride, hydroxy- and, optionally, acid functional compounds, a system of making the coating composition, a method of coating the composition on a substrate and a substrate coated with the composition.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: September 19, 2006
    Inventors: Mohamad Deeb Shalati, James Henry McBee, Ferry Ludovicus Thys, William Jay DeGooyer
  • Patent number: 7041736
    Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: May 9, 2006
    Assignee: Intel Corporation
    Inventors: Saikumar Jayaraman, Rahul Manepalli
  • Patent number: 7019075
    Abstract: A two-part acrylic structural adhesive comprises a first package containing from about 10 to about 90 percent by weight of at least one ethylenic unsaturated methacrylic ester selected from the group consisting of 1) an alkyl mono-, di- or tetra-substituted cyclohexyl methacrylate, wherein the substitutions occur in either the 3, 4, and/or 5 ring positions, and 2) a linear or branched C4–C10 alkyl methacrylate; from about 10 to about 80 percent by weight of a toughener, and an adhesion promoter; and a second package containing a bonding activator, and, optionally, an epoxy resin.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: March 28, 2006
    Assignee: Lord Corporation
    Inventors: Robin F. Righettini, Jeffrey A. Hatcher