Abstract: Polymers including ?-hydroxymethylacrylate units and methods of preparing polymers from ?-hydroxymethylacrylates are provided. Advantageously, ?-hydroxymethylacrylates may be used in an emulsion polymerization and function as a polymerizable surfactant. The ability of the ?-hydroxymethylacrylates to be used as a polymerizable surfactant allows for emulsion polymerization systems to be prepared without other surfactants.

Abstract: An adhesive composition for polarizing plates includes a (meth)acrylic copolymer, an isocyanate crosslinking agent, and a silane coupling agent. The molar ratio (A) of the number of moles of hydroxyl groups in the (meth)acrylic copolymer may be about 2.5 mol % to about 4 mol %, the molar ratio (B) of the number of moles of alkoxy silane groups in the silane coupling agent may be about 50 mol % to about 80 mol %, and the molar ratio (C) of the number of moles of isocyanate groups of the isocyanate crosslinking agent may be about 20 mol % to about 50 mol %, based on the total number of moles of alkoxy silane groups of the silane coupling agent and isocyanate groups of the isocyanate crosslinking agent. An adhesive film is formed from the adhesive composition, a polarizing plate includes the adhesive film, and an optical display includes the polarizing plate.

Abstract: The disclosure relates to solving problems associated with conventional latent epoxy curing agents by providing a new class of latent epoxy curing agents. In particular, the disclosure relates to epoxy curing agents with improved storage stability and low use level (e.g., less than about 10 wt % relative to the epoxy compound) by forming solid solutions of certain classes of amines in polyphenolic resins.

Abstract: This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Preformed stabilizers useful for the production of low viscosity, high solids polymer polyols are produced by free-radical polymerization of: (a) at least one ethylenically unsaturated macromolecule or macromer with (b) at least three different ethylenically unsaturated monomers in the presence of (c) at least one free-radical polymerization initiator, and, optionally, (d) a liquid diluent, and, optionally, (e) a chain transfer agent.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Crosslinker/accelerator system for thermally crosslinking polyacrylates with functional groups that are adapted to react with epoxy groups in a crosslinking reaction, comprising at least one epoxy group-containing substance and at least one substance that accelerates the crosslinking reaction at a temperature below the melting temperature of the polyacrylate.

Abstract: An acrylic adhesive composition includes: an acrylic resin; an epoxy resin; and a cationic photoinitiator, the acrylic adhesive composition having a storage modulus of about 6×106 dyne/cm2 to about 1×108 dyne/cm2 at 25° C. and a storage modulus of about 5×103 dyne/cm2 to about 1×106 dyne/cm2 at 80° C. A polarizing plate includes a polarizing film and an adhesive layer on one or both sides of the polarizing film, the adhesive layer including a cured product of the acrylic adhesive composition. A liquid crystal display including a liquid crystal panel and the polarizing plate on one or both sides of the liquid crystal panel is also disclosed.

Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

Abstract: The present invention provides methods, admixture compositions for treating clay-bearing aggregates used for construction purposes, and aggregate compositions for construction purposes. The clay-bearing aggregates are treated with a cationic copolymer made from two and preferably three different monomer components. Cementitious compositions containing the treated aggregates are also described.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Preformed stabilizers useful for the production of low viscosity, high solids polymer polyols are produced by free-radical polymerization of: (a) at least one ethylenically unsaturated macromolecule or macromer with (b) at least three different ethylenically unsaturated monomers in the presence of (c) at least one free-radical polymerization initiator, and, optionally, (d) a liquid diluent, and, optionally, (e) a chain transfer agent.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Provided is an underfill material which enables a semiconductor chip to be mounted at a low pressure, and a method for manufacturing a semiconductor device by using the underfill material. The method comprises: a semiconductor chip mounting step configured to mount a semiconductor chip having a solder bump on a substrate via an underfill film including a film forming resin having a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, an epoxy resin, and an epoxy curing agent; and a reflow step configured to solder-bond the semiconductor chip and the substrate by a reflow furnace. The film forming resin of the underfill material has a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, and accordingly, the viscosity at the time of heat melting can be reduced, and a semiconductor chip can be mounted at a low pressure.

Abstract: A pre-adhesive composition is described comprising an acid-functional (meth)acryloyl copolymer and epoxy resin, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a (e.g. pressure-sensitive) adhesive.

Abstract: Two component resin system consisting of a first component A and a second component B characterized in that component A comprises: a. a compound capable of undergoing a radical copolymerization selected from the group consisting of unsaturated polyester resins, vinyl ester resins and mixtures thereof, b. an epoxide functional resin as compound capable of reacting with an aliphatic amine and in that component B comprises a mixture of c. an aliphatic amine d. a perester.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: An adhesive composition for use in bonding of a polarizing plate is prepared from acrylic-based polymer graft-polymerized and modified by a reactive silane coupling agent with a specific grafting position and an ordinary cross-linking agent. Compared with unmodified acrylic-based copolymers, the adhesive composition thus synthesized demonstrates high adhesion property, cohesion property, elasticity property and high durability and, when used in bonding of the polarizing plate, flexibly follows dimensional changes of the polarizing plate in a high-temperature high-humidity atmosphere, alleviates the phenomenon where the polarizing plate demonstrates uneven distribution of residual stress due to dimensional changes of the polarizing plate, and prevents light leakage and uneven color which might otherwise occur to the polarizing plate due to the aging, cracking, or peeling of a conventional adhesive.

Abstract: The present invention provides methods, admixture compositions for treating clay-bearing aggregates used for construction purposes, and aggregate compositions for construction purposes. The clay-bearing aggregates are treated with a cationic copolymer made from two and preferably three different monomer components. Cementitious compositions containing the treated aggregates are also described.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1; and (C) a thermosetting or thermoplastic composition.

Abstract: A composition is provided that includes a polymer binder, and one or more classes of particle constituents. At least one class of particle constituents includes semiconductive particles that individually have a band gap that is no greater than 2 eV. As VSD material, the composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage that exceeds the characteristic voltage level.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The present invention relates to a method for producing a cured product of a thermosetting resin composition, the method including: heating a thermosetting resin composition including the following ingredients (A) to (C) at a temperature of 100 to 200° C. for 1 to 60 minutes; and then further heating the thermosetting resin composition at a temperature of 220 to 350° C. for 10 to 6,000 minutes, thereby curing the thermosetting resin composition: (A) an allylated phenol resin; (B) an epoxy resin; and (C) a curing accelerator.

Abstract: Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.

Abstract: Ink receiving particles is provided. The ink receiving particles includes polymer particles, the polymer particles including a resin including an acidic group and a polyoxyethylene chain, the acidic group at least partially having a salt structure.

Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.

Abstract: A crosslinker for polymerizing a film-forming material including an alkyl or aromatic compound comprising at least two functional groups reactive with a film-forming resin and at least one pendent group having a nonionic metal coordinating structure. Coating compositions can include a film-forming material and the crosslinker. The coating compositions can be used to coat a substrate, such as a metal substrate. Applied coating layers on substrates can be cured to form coating films.

Abstract: A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ?-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size?10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout.

Abstract: The present invention is generally directed to methods of making ceramics with nanoscale/microscale structure involving self-assembly of precursor materials such as, but not limited to, inorganic-based block co-polymers, inorganic-/organic-based hybrid block co-polymers, and other similar materials, and to the structures made by such methods. Where such precursor materials are themselves novel, the present invention is also generally directed to those materials and their synthesis.

Abstract: An antireflection film composition, wherein an etching speed is fast, thus, when used as a resist lower layer, a film loss of a resist pattern and deformation of the pattern during etching can be minimized, and because of a high crosslinking density, a dense film can be formed after thermal crosslinking, thus, mixing with an upper layer resist can be prevented and the resist pattern after development is good is provided. The antireflection film composition comprising; at least a polymer having a repeating unit represented by the following general formula (I).

Abstract: An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after exposure to a hot and humid environment. The adhesive sheet includes a base material and, formed thereon, an adhesive layer having an adhesive composition including an acrylic copolymer (A) containing 20 to 95% by weight of a structural unit derived from a benzyl (meth)acrylate, an epoxy thermosetting resin (B), and a thermosetting agent (C).

Abstract: The invention relates to preparations based on polymerizable polyether materials and a fluidity improver and to the use thereof in producing dental materials, especially impression materials.

Abstract: A composition is provided that includes a polymer binder, and one or more classes of particle constituents. At least one class of particle constituents includes semiconductive particles that individually have a band gap that is no greater than 2 eV. As VSD material, the composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage that exceeds the characteristic voltage level.

Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.

Abstract: Onium-modified polymers, such as polyethers and alkylimidazolium-modified polymers are provided. The polymers have desirable properties such as moisture absorbing capability, low volatile organic compounds (VOCs) emission, and enhanced electrical conductivity. A method to prepare the polymers is also provided, in which green solvents such as ionic liquids are utilized as both reaction media and reactants.

Abstract: A novel polymeric co-initiator is disclosed comprising a dendritic polymer core with at least one co-initiating functional group as an end group. The polymeric co-initiators are useful in radiation curable compositions such as varnishes, lacquers and printing inks and are especially useful in radiation curable inkjet inks. The dendritic polymeric core is preferably a hyperbranched polymer.

Abstract: A process for the preparation of an oligonucleotide is provided. The process comprises the assembly of an oligonucleotide attached to a solid support, wherein the solid support is prepared by a process comprising polymerisation of a monomer which comprises a protected hydroxypolyC2-4 alkyleneoxy chain attached to a polymerisable unit wherein the protected hydroxypolyC2-4 alkyleneoxy chain contains from 2 to 10 C2-4 alkyleneoxy groups and wherein the hydroxypolyC2-4 alkyleneoxy chain is protected with an acid-labile protecting group, preferably an optionally substituted trityl group.

Abstract: A new underlayer composition that exhibits high etch resistance and improved optical properties is disclosed. The underlayer composition comprises a vinyl or acrylate polymer, such as a methacrylate polymer, the polymer comprising at least one substituted or unsubstituted naphthalene or naphthol moiety, including mixtures thereof. Examples of the polymer of this invention include: where each R1 is independently selected from an organic moiety or a halogen; each A is independently a single bond or an organic moiety; R2 is hydrogen or a methyl group; and each X, Y and Z is an integer of 0 to 7, and Y+Z is 7 or less. The organic moiety mentioned above may be a substituted or unsubstituted hydrocarbon selected from the group consisting of a linear or branched alkyl, halogenated linear or branched alkyl, aryl, halogenated aryl, cyclic alkyl, and halogenated cyclic alkyl, and any combination thereof.

Abstract: This invention relates to methods of making graft copolymers, and articles having such graft copolymers. The methods may provide better control than in radicalization or photoinitiated polymerization techniques. For example, a graft copolymer can be prepared by reacting an alkoxide ion with a polymer. The alkoxide, in turn, can be provided by any suitable technique, for example, by reacting an alcohol with a base. In some embodiments of the invention, the graft copolymers may be a normally hydrophobic polymer, such as a polysulfone, that has been made more hydrophilic due to the attachment of hydrophilic side groups such as polyethylene glycol or polypropylene glycol. The copolymers of the invention have many uses, for example, in films or porous membranes.

Abstract: A process for efficiently preparing polymer conjugates such as branched PEG-polypeptide conjugates, in large scale without column chromatography clean up of the activated PEG linkers to remove impurities is disclosed.

Abstract: Liquid rubbers that are ordinarily immiscible in liquid thermoset resins can be made miscible by the addition of at least one non-functional aromatic end-group to the polymer chains of such liquid rubber compositions. Such addition may be initiated by high-temperature peroxides in non-functional aromatic solvents. The liquid rubbers are found to improve the fracture toughness of cured thermoset resins while maintaining dimensional and heat resistance.

Abstract: The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living-radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition-having an epoxy group at a main chain terminus thereof.

Abstract: Graft copolymers providing soil release benefits in laundry detergent compositions contain backbone units derived from an ethylenically unsaturated monomer, hydrophilic uncharged side chains, and cationically chargeable or charged side chains containing a tertiary or quaternary nitrogen atom. Preferred copolymers have a methacrylate backbone with polyethylene oxide and 2-dimethylaminoethyl methacrylate (DMAEMA) side chains. The graft copolymers may be prepared by radical polymerisation.

Abstract: A process is disclosed for formation of a preformed stabilizer for use in formation of graft polyols. The preformed stabilizer has a reduced level of transesterification products and results in less reactor fouling. The preformed stabilizer is prepared in the presence of phosphorous compounds, which reduces the unwanted transesterification products.

Abstract: The invention provides methods for the preparation of multiblock copolymers, dispersions of multiblock copolymers, vesicles and micelles containing multiblock copolymers, and oxidative degradation products of multiblock copolymers.

Abstract: A method for preparing hydrophilic pressure sensitive adhesive (PSA) compositions is provided, wherein the method enables preparation of adhesives having a particular, optimized degree of adhesion. That is, the hydrophilic PSA is comprised of a hydrophilic polymer and a complementary short-chain plasticizing agent, wherein the hydrophilic polymer and plasticizing agent are capable of hydrogen bonding or electrostatic bonding to each other and are present in a ratio that optimizes key characteristics of the adhesive composition, such as adhesive strength, cohesive strength and hydrophilicity. The adhesive is useful in a wide variety of contexts, e.g., as a biomedical adhesive for application to the skin or other body surface, and as such finds utility in the areas of drug delivery systems (e.g., topical, transdermal, transmucosal, iontophoretic), medical skin coverings and wound healing products and biomedical electrodes.