Abstract: Polymerization-induced phase separation enables fine control over thermoset network morphologies, yielding heterogeneous structures with domain sizes tunable over 1-100 nm. However, the controlled chain-growth polymerization techniques exclusively employed to regulate morphology at these length scales are unsuitable for most thermoset materials typically formed through step-growth mechanisms. By employing binary mixtures in place of the classic constituents of phase-separating thermosets—resin, curing agent, and secondary polymer—facile tunability over morphology can be achieved through a single compositional parameter. Indeed, this method yields morphologies spanning nano-scale to macro-scale, controlled by the relative reactivities and thermodynamic compatibility of the network components. Due to the connection between chain dynamics and microstructure in these materials, the tunable morphology enables exquisite control over glass transition and other physical and mechanical properties.

Abstract: A method of manufacturing a sandwich panel (100) includes: a step of preparing a plurality of sheet-like prepregs (211); a step of performing a first heating and pressurization process through a release film (25) on upper and lower surfaces of a laminate where the plurality of prepregs (211) are laminated such that the laminate is integrated to obtain a composite facing material (40); and a step of disposing the composite facing material (40) on each of an upper surface side and a lower surface side of a sheet-like core layer (10) having a honeycomb structure and integrating the laminate through a second heating and pressurization process, in which a pressure of the first heating and pressurization process is higher than or equal to a pressure of the second heating and pressurization process.

Abstract: Provided is a resin composition that is capable of producing a cured product having excellent environmental suitability, high strength, and excellent flame retardancy, and that is suitably usable as a matrix resin for fiber-reinforced plastics. A resin composition contains (A) an epoxy resin, (B) a cyanate resin, (C) an aromatic amine curing agent that is liquid at 25° C., and (D) a phosphorus-containing compound represented by formula (1). Preferably, in formula (1), R1 and R2 each independently represent an alkyl group or an aryl group, and X and Y are an oxygen atom.

Abstract: An exemplary shingle includes at least one coated shingle sheet defining a headlap portion and a tab portion each having opposed upper and lower surfaces. A first line of adhesive is adhered to one of the upper surface of the headlap portion and the lower surface of the tab portion, and includes a first thermally activated adhesive material. A second line of adhesive is adhered to one of the upper surface of the headlap portion and the lower surface of the tab portion, and includes a second thermally activated adhesive material having a minimum activation temperature less than a minimum activation temperature of the first thermally activated adhesive material.

Abstract: An apparatus and method for making molded products for marine, automotive, recreational, and other applications. The apparatus and method for making the molded products generally includes a closed mold and an inline mixer for adding a catalyst to a filled resin. The method may include adding a cotton material to a resin to create the filled resin, adding a catalyst to the filled resin, and mixing the catalyst and the filled resin to create a catalyzed, filled resin. The method may also include adding the catalyzed, filled resin to a mold and allowing the catalyzed, filled resin to harden in the mold.

Abstract: A method of producing a powder mass for a lithium battery, the method comprising: (a) providing a solution containing a sulfonated elastomer dissolved in a solvent or a precursor in a liquid form or dissolved in a solvent; (b) dispersing a plurality of particles of a cathode active material in the solution to form a slurry; and (c) dispensing the slurry and removing the solvent and/or polymerizing/curing the precursor to form the powder mass, wherein the powder mass comprises multiple particulates and at least a particulate comprises one or a plurality of particles of a cathode active material being encapsulated by a thin layer of sulfonated elastomer having a thickness from 1 nm to 10 ?m, a fully recoverable tensile strain from 2% to 800%, and a lithium ion conductivity from 10?7 S/cm to 5×10?2 S/cm at room temperature.

Abstract: A composition includes an epoxy-based curable adhesive having at least one an epoxy resin modified acrylonitrile-butadiene copolymer and at least one thermoplastic elastomer. The at least one thermoplastic elastomer is present in the curable adhesive as a penetrating polymer network. Further, an expandable article is composed of the composition, a reinforcing element includes a support and an expandable article, a method for reinforces cavities of structural components, and the composition is used as a shape memory material.

Abstract: A thermoplastic resin composition includes a first copolymer including a conjugated diene-based polymer, a unit derived from an aromatic vinyl-based monomer, and a unit derived from a vinyl cyan-based monomer; a second copolymer including a unit derived from an aromatic vinyl-based monomer and a unit derived from a vinyl cyan-based monomer; and, with respect to 100 parts by weight of the sum of the first copolymer and the second copolymer, 2.0 to 10 parts by weight of a third copolymer having a soft segment including a unit derived from a polyalkylene glycol and a hard segment including unit derived from an aromatic dicarboxylic acid or aromatic dicarboxylate and a unit derived from a linear aliphatic diol; and 2.5 to 10 parts by weight of a fourth copolymer including an aromatic dicarboxylic acid-derived unit, a unit derived from a linear aliphatic diol, and a unit derived from a cyclic aliphatic diol.

Abstract: Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.

Abstract: The hydrogenated block copolymer according to the present invention is a hydrogenated block copolymer containing, in the molecule, a polymer block (C) having a conjugated diene compound as a main component, a polymer block (B) having a conjugated diene compound as a main component, and a polymer block (S) having a vinyl aromatic compound as a main component.

Abstract: The present invention relates to a polymer compound used as a polymer modifier, a conjugated diene-based polymer including a functional group derived therefrom, and a method for preparing a modified and conjugated diene-based polymer using the polymer compound. A rubber modifier compound obtained therefrom is used as a modifier for rubber, particularly, as a modifier of a conjugated diene-based polymer and is bonded to a chain of the conjugated diene-based polymer to easily introduce a functional group having affinity with a filler.

Abstract: This document relates to non-aqueous compositions including a maleic anhydride copolymer and a polyamine or polyaziridine crosslinker. The maleic anhydride copolymer includes repeat units I and II: Each R1 is independently —H, —(C1-C5)alkyl, —C?O(O)(C1-C5)alkyl, or aryl; and each R2 is independently —H, —(C1-C5)alkyl, —C?O(O)(C1-C5)alkyl, and aryl.

Abstract: A macromolecule includes a functional group including imine functionality bonded to a polymer chain. Where desired, the functional group also can contain additional (e.g., amine and/or silane) functionality. The material can be provided by reacting a polymer including carbonyl functionality with a compound including a primary amino group. The functional group can interact with particulate filler such as, e.g., carbon black and silica.

Abstract: An optically active composition is described. The composition may include a copolymer of two or more polyepoxides covalently linked by a fused arene.

Abstract: The semiconductive roller according to the present invention includes: a roller body having an outer peripheral surface made of a semiconductive rubber composition; and an oxide film covering the outer peripheral surface of the roller body, while the semiconductive rubber composition contains a base polymer and a crosslinking component for crosslinking the base polymer, the base polymer is a mixture of a bicopolymer E containing epichlorohydrin and nitrile-butadiene rubber N, the mass ratio E/N of the bicopolymer E and the nitrile-butadiene rubber N in the mixture is 50/50 to 80/20, and the crosslinking component includes a thiourea-based crosslinking component for crosslinking the bicopolymer E and a sulfur-based vulcanizing component for vulcanizing the nitrile-butadiene rubber N.

Abstract: An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.

Abstract: An object of the present invention is to provide a method for producing composite particles of at least one of a curing agent and a curing accelerator which have excellent release properties for at least one of the curing agent and curing accelerator, exhibit excellent rapid curability when contained in a curable resin composition, and have excellent storage stability; and the composite particles of at least one of the curing agent and the curing accelerator. Another object of the present invention is to provide to a thermosetting resin composition that contains the composite particles of at least one of the curing agent and the curing accelerator. The method of the present invention includes the steps of: preparing an emulsion in which droplets containing a compound for forming shells are dispersed in an aqueous medium; impregnating the droplets with at least one of a curing agent and a curing accelerator; and forming shells each enclosing the at least one of the curing agent and the curing accelerator.

Abstract: The present disclosure provides a liquid curing agent composition comprising at least 50% by weight of a polyamine and 0.2% to 10% by weight of dicyandiamide, the amine/epoxy composition and the product from the cured amine/epoxy composition.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: To provide a polymer composition, for example, a polymer composition which contains an alloy resin of polycarbonate and acrylonitrile-butadiene-styrene or acrylonitrile-styrene and in which the impact resistance strength of a degraded thermoplastic resin is improved. A polymer composition contains polycarbonate and acrylonitrile-butadiene-styrene or acrylonitrile-styrene, and further contains a polyester-based thermoplastic elastomer having an ester bond and a compatibilizing agent having compatibility with the polycarbonate and the acrylonitrile-butadiene-styrene or the acrylonitrile-styrene, in which the compatibilizing agent is a compound having an epoxy group in the main chain in the compound.

Abstract: Provided is a curable epoxy resin composition capable of forming a cured product that has heat resistance, light resistance, and thermal shock resistance at high levels and particularly offers excellent reflow resistance after moisture absorption. The curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by Formula (1), a curing agent (C), and a curing accelerator (D). The composition includes methylnorbornane-2,3-dicarboxylic anhydride as an essential component of the curing agent (C) and has a succinic anhydride content of 0.4 percent by weight or less based on the total amount of the curing agent (C): wherein R1 and R2 are identical or different and each represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.

Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.

Abstract: A thermoplastic elastomer composition having a continuous phase and a dispersed phase, wherein the continuous phase comprising (A) an epoxy-modified polyamide resin, and the dispersed phase comprising (B) a halogenated isoolefin-paraalkylstyrene copolymer rubber, wherein the thermoplastic elastomer composition is obtained by melt-kneading (B) halogenated isoolefin-paraalkylstyrene copolymer rubber, (C) a polyamide resin, and (D) a polyfunctional epoxy compound having two or more epoxy groups per molecule in an amount of 0.05 parts by weight or more and less than 3 parts by weight with respect to 100 parts by weight of polyamide resin (C), at a temperature which is equal to or more than the melting point of polyamide resin (C), and epoxy-modified polyamide resin (A) is produced by the reaction of polyamide resin (C) with polyfunctional epoxy compound (D) during the melt-kneading.

Abstract: An acrylic resin that can have excellent transparency, flowability and scratch-resistance property is prepared by polymerizing a monomer mixture comprising about 10 to about 25% by weight of (meth)acrylic acid alkyl ester monomer, about 50 to about 80% by weight of aromatic vinyl compound, and about 10 to about 25% by weight of vinyl cyanide compound.

Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a hydroxy-functional methacrylate. In certain embodiments, the presence of both types of capping on the toughener leads to higher impact peel strengths and a greater level of cohesive failure, than when the toughener is capped with a phenol an hydroxy-functional acrylate or hydroxy-functional methacrylate alone.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.

Abstract: A composition for an adhesive material, comprising at least one epoxide resin mixture and a hardening accelerator, in which the epoxide resin mixture has 25 to 80% by weight of a first epoxide resin—whereby the first epoxide resin is a bifunctional aliphatic, cycloaliphatic or aromatic epoxide resin—and 12.5 to 40% by weight of a second epoxide resin—whereby the second epoxide resin is a polyfunctional aliphatic or aromatic epoxide resin—and in which the hardening accelerator is an imidazole derivative, which is not soluble in the epoxide resin mixture at temperatures of below 50° C.

Abstract: A curable resin composition which contains a curable resin (A) having two or more polymerizable unsaturated bonds in a molecule, and polymer microparticles (B), and which optionally further contains an epoxy resin (C) and a low-molecular-weight compound (D) having a molecular weight less than 300 and having at least one polymerizable unsaturated bond in a molecule, wherein the content of component (B) is 1 to 100 parts by mass per 100 parts by mass of the sum of component (A) and component (D), the content of the epoxy resin (C) is less than 0.5 parts by mass per 100 parts by mass of the sum of component (A) and component (D), component (A) has an epoxy (meth)acrylate content less than 99 parts by mass per 100 parts by mass of the whole component (A), and component (B) has been dispersed in the state of primary particles in the curable resin composition.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: [Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [?] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.

Abstract: A process for the preparation of a 1,3-butadiene and styrene copolymer comprising the following steps: a) anionically polymerizing a blend comprising from 5% by weight to 40% by weight of styrene and from 60% by weight to 95% by weight of 1,3-butadiene, with respect to the overall weight of the mixture, in the presence of at least one hydrocarbon solvent, of at least one lithium-based catalyst having the general formula LiR1 wherein R1 represents a linear or branched C3-C10 alkyl group, and of least one polar modifier; b) optionally, reacting the copolymer obtained in step (a) with at least one chain-end monomer selected from 1,3-butadiene, styrene and ?-methylstyrene; c) reacting from 10% by weight to 70% by weight, preferably from 20% by weight to 50% by weight, of the lithium-terminated polymeric chains present in the copolymer obtained in step (a) or in step (b), with at least one coupling agent selected from liquid polyepoxides having at least three reactive sites capable of reacting with the carbon-lith

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: An implant having shape forming and hardening functionality is described. The implant is formed from shape memory materials. The implant is formed from a shape memory alloy, shape memory polymer, or combinations thereof, to provide them with the ability to be compressed into a shape that facilitates minimally invasive insertion. Subsequent to such insertion, the shape memory materials provide the implant with the ability to regain its original shape and size. Subsequently, the implant becomes rigid, thereby providing strength, structural integrity and support.

Abstract: The invention relates to a crosslinkable polymer powder composition redispersible in water, obtainable by means of free radical polymerization, in an aqueous medium, of one or more monomers from the group consisting of vinyl esters of straight-chain or branched alkylcarboxylic acids having 1 to 15 C atoms, methacrylates and acrylates of alcohols having 1 to 15 C atoms, vinylaromatics, olefins, dienes and vinyl halides, no epoxide-functional comonomers being copolymerized, and subsequent drying of the polymer dispersion obtained thereby, wherein, before and/or during the polymerization and/or before the drying of the polymer dispersion obtained thereby, an epoxy resin is added and, if appropriate after the drying, a curing agent crosslinking with the epoxy resin is added.

Abstract: A binder for an electrode of a lithium battery, an electrode including the binder, and a lithium battery including the binder. The binder includes an epoxy-phenolic resin and a rubber-based resin, and prevents deformation of an electrode even when expansion and contraction of an active material occur from charging and discharging operations of a lithium battery, and thus improves lifetime of the lithium battery.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The instant invention relates to epoxy resin compositions comprising an epoxy resin, a block copolymer having at least one block predominantly composed of methyl methacrylate units or a core shell component and a hardener of the polyoxyalkyleneamine type. The epoxy materials cured from these compositions have high impact resistance.

Abstract: Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.

Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

Abstract: Disclosed is an epoxy resin composition, which includes (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent; and (C) polystyrene.

Abstract: A mixture comprising at least one polyfunctional chain extender having at least three reactive groups, and at least one mono- or difunctional hydrolysis stabilizer, where the chain extenders and the hydrolysis stabilizers react with the terminal groups of polymers in the molten or solid state of the polymers to form a chemical bond. Use of such mixtures as stabilizers for polymers. Methods for stabilizing polymers with respect to molecular weight loss, where an effective amount of such a mixture is added to the polymer.

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Provided are a rubber composition for a tread, capable of improving the fuel economy and abrasion resistance in a balanced manner while achieving a good appearance and a good cure rate; and a pneumatic tire containing the rubber composition. The present invention relates to a rubber composition for a tread, including: a solution-polymerized styrene-butadiene rubber, carbon black, silica, and polyethylene glycol, wherein a rubber component of the rubber composition contains 60 mass % or more of the solution-polymerized styrene-butadiene rubber based on 100 mass % of the rubber component, and the rubber composition includes, per 100 parts by mass of the rubber component, 10 parts by mass or less of the carbon black, 50 parts by mass or more of the silica, and 0.1 to 3.5 parts by mass of the polyethylene glycol.