Contacting Two Or More Solid Polymers With A Phenolic Reactant; Or Contacting A Solid Polymer With A Phenolic Reactant And Subsequently Contacting The Treated Polymer With An Additional Solid Polymer Patents (Class 525/133)
  • Patent number: 5710212
    Abstract: A thermoplastic resin composition includes 40-75 parts by weight of a polyamide resin (A), 5-30 parts by weight of a modified polyphenylene ether (B) which is a polyphenylene ether modified with an .beta., .beta.-unsaturated carboxylic acid or a derivative thereof, 1-30 parts by weight of an aromatic vinyl compound-aliphatic hydrocarbon copolymer (C), and 1-30 parts by weight of an ethylene-.alpha.-olefin copolymer (D) or a polypropylene resin (E) with the total amount of the components (A), (B), (C), and (D) or (E) being 100 parts by weight. The polyamide resin (A) is present as a matrix phase and the other components (B), (C), and (D) or (E) are present as a disperse phase consisting of core-shell structure grains, in each of which grains the modified polyphenylene ether (B) forms a shell phase, the aromatic vinyl compound-aliphatic hydrocarbon copolymer (C) forms an intermediate phase and the ethylene-.alpha.-olefin copolymer(D) or the polypropylene resin (E) forms a core phase.
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: January 20, 1998
    Assignee: Ube Industries, Ltd.
    Inventors: Yukihiko Asano, Kazuhiro Doi
  • Patent number: 5703164
    Abstract: Disclosed is a styrene polymer composition comprising, in a specified proportion,(A) a styrene polymer having no functional group,(B) either of polyphenylene ether having a polar group or a mixture of polyphenylene ether having a polar group and a styrene polymer having no functional group; and(C) polyamide.These polymer compositions are excellent in impact resistance, water resistance, and mechanical properties, and are suitable for various purposes.
    Type: Grant
    Filed: February 12, 1997
    Date of Patent: December 30, 1997
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventor: Akikazu Nakano
  • Patent number: 5698632
    Abstract: Compatibilized blends of poly(phenylene ether) resins and polyester resins are provided from nucleophile containing poly(phenylene ether) resins and polyester resins and compatibilizer compounds to afford articles having good impact, ductility and tensile properties. The compositions may further comprise impact modifiers, metal salts, reinforcing agents, flame retardants and flow promoters. Articles made from the compositions are useful for automotive components.
    Type: Grant
    Filed: January 4, 1996
    Date of Patent: December 16, 1997
    Assignee: General Electric Company
    Inventors: Sterling Bruce Brown, Chorng-Fure Robin Hwang, Farid Fouad Khouri, Steven Thomas Rice, James Joseph Scobbo, Jr., John Bennie Yates
  • Patent number: 5677380
    Abstract: A planarizing material comprising a resin capable of having its practical temperature for a planarizing step set at a level lower than 200.degree. C., and a melamine-type heat-curing agent and/or an epoxy-type heat-curing agent.
    Type: Grant
    Filed: March 24, 1995
    Date of Patent: October 14, 1997
    Assignee: Tosoh Corporation
    Inventors: Kosaburo Matsumura, Mitsumasa Akashi, Yoshitaka Tsutsumi, Masazumi Hasegawa
  • Patent number: 5658984
    Abstract: A permanent anti-static polycarbonate resin composition is comprises(a) 50-95 parts by weight of an aromatic polycarbonate resin,(b) 2-40 parts by weight of a block copolyamide resin,(c) 0-50 parts by weight of an aromatic polyester resin, and(d) 1-30 parts by weight of a multi-layered polymer having a structure comprising a core composed of a rubber-like polymer prepared from an alkyl acrylate monomer in which the carbon number of the alkyl group is 2-8, and an outer shell layer formed on the surface of the core and composed of a glass-like polymer prepared from an aromatic vinyl monomer or an aromatic vinyl monomer and a vinyl monomer copolymerizable therewith.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: August 19, 1997
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Kazuhiko Ishii, Goro Shimaoka, Michio Nakata
  • Patent number: 5648424
    Abstract: Disclosed is a molded product of a thermoplastic resin composition which comprises:(a) a non-crystalline thermoplastic resin,(b) a crystalline thermoplastic resin and(c) an inorganic filler, if necessary,wherein a portion in which Component (a) takes a structure forming a matrix and a portion in which Component (b) takes a structure forming a matrix coexist.
    Type: Grant
    Filed: November 7, 1995
    Date of Patent: July 15, 1997
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Chiyo Miwa, Hironari Sano, Koji Nishida, Yoshihiro Kurasawa
  • Patent number: 5643988
    Abstract: The present invention relates to a shaped article of a liquid crystalline polymer containing (A) 100 parts by weight of a liquid crystalline polyester and/or liquid crystal polyesteramide capable of forming an anisotropic melt and (B) 0.01 to 2 parts of an olefinic polymer and having a retention rate of a weld strength of 15% to 100%, which has excellent heat stability, mechanical properties, dimensional stability and mold releasability and is suitable for various application uses such as electrical and electronical related devices, accurate machine related devices, office related devices, automobile related parts.
    Type: Grant
    Filed: April 5, 1996
    Date of Patent: July 1, 1997
    Assignee: Toray Industries, Inc.
    Inventors: Kiyokazu Nakamura, Norio Kitajima, Toshihide Inoue
  • Patent number: 5639833
    Abstract: The invention is directed to molding materials containingA) from 1 to 99% by weight of polyarylene ethers having repeating units I ##STR1## where t and q may each be an integer 0, 1, 2 or 3,T, Q and Z may each be a chemical bond or --O--, --S--, --SO.sub.2 --, S.dbd.O, C.dbd.O, --N.dbd.N--, R.sup.a C.dbd.CR.sup.b -- or --CR.sup.c R.sup.d --, with the proviso that at least one of the groups T, Q and Z is --SO.sub.2 -- or C.dbd.O,R.sup.a and R.sup.b,R.sup.c and R.sup.d, andAr and Ar.sup.1 are as defined in the specification,B) from 1 to 99% by weight of copolyamides containingb.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,b.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,b.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine,b.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms andb.sub.5) from 0 to 4 mol % of further polyamide-forming monomers which differ from b.sub.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: June 17, 1997
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Herbert Fisch, Gunter Pipper, Axel Gottschalk
  • Patent number: 5635560
    Abstract: The invention relates to mixtures of polycarbonate, phenolically hydroxyfunctional branched dimeric fatty acid polyesters and optionally graft polymer, which are distinguished by a good low-temperature strength and stress cracking resistance and good mould release properties.
    Type: Grant
    Filed: July 20, 1995
    Date of Patent: June 3, 1997
    Assignee: Bayer AG
    Inventors: Burkhard Kohler, Dieter Wittmann, Wolfgang Ebert, Horst Beicher, Werner Tischer, Klaus Horn
  • Patent number: 5633319
    Abstract: Non-delaminating resinous compositions are prepared by blending at least one polyetherimide, at least one liquid crystalline polyester in an amount to provide lower melt viscosity, and a compatibilizing amount of at least one polyepoxy compound. The compositions may also contain a minor proportion of at least one non-liquid crystalline polyester such as poly(ethylene terephthalate) or poly(ethylene 2,6-naphthalenedicarboxylate).
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: May 27, 1997
    Assignees: General Electric Company, E. I. Du pont de Nemours & Company
    Inventors: Norberto Silvi, Sterling B. Brown, Mark H. Giammattei, King L. Howe
  • Patent number: 5622755
    Abstract: A pair of flanges are mounted on a spool of a photographic film cassette so as to come into contact with end faces or outermost convolution of a film roll wound on the spool, so that a film leader can be advanced out of the cassette shell by rotating the spool in an unwinding direction. The flanges are formed from a polyphenylene ether group resin composition, which is composed by mixing styrene group resin with polyphenylene ether resin in a weight ratio from 60:40 to 10:90, and mixing 6 to 19 parts by weight of elastomer per 100 parts by weight of said mixture of styrene group resin and polyphenylene ether resin.
    Type: Grant
    Filed: October 13, 1995
    Date of Patent: April 22, 1997
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Kazunori Mizuno, Takeshi Nabeta, Mikio Shimizu
  • Patent number: 5612401
    Abstract: Improved compositions are provided which comprise a poly(phenylene ether) resin, a poly(arylene sulfide) resin, a polyester resin, and a compatibilizer compound. The compositions can further comprise functionalizing agents, impact modifiers, flame retardants, and reinforcing fillers to provide compositions that exhibit improved tensile strength and elongation characteristics. Articles molded from these compositions are useful in the electrical connector industry.
    Type: Grant
    Filed: April 17, 1996
    Date of Patent: March 18, 1997
    Assignee: General Electric Company
    Inventors: Sterling B. Brown, Kevin H. Dai, Chorng-Fure R. Hwang, Steven T. Rice, James J. Scobbo, Jr., John B. Yates
  • Patent number: 5596040
    Abstract: A thermoplastic resin composition comprising:(a) about 20 to 80% by weight of polyphenylene ether resin comprising at least one structural unit in its backbone represented by the formula: ##STR1## wherein (b) about 0.01 to 10% by weight of a modified aromatic hydrocarbon-formaldehyde resin produced by modifying an aromatic hydrocarbon-formaldehyde resin which is obtained by reacting alkyl benzene with formaldehyde, using a modifying agent reactive with its methylol group, methylene ether group, or acetal group;(c) about 2 to 30% by weight of a rubber-like polymer; and(d) about 20 to 80% by weight of a polyamide resin; and a method for its preparation.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: January 21, 1997
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Shinya Miya, Yuichi Kano, Hisayuki Kuwahara, Takeshige Kasuya, Yosio Fukaya
  • Patent number: 5585437
    Abstract: The present invention relates to a thermoplastic resin composition which comprises (C) 0.1 through 30 parts by weight of an adduct of alkylene oxide with a saponified copolymer of ethylene and vinyl ester of saturated carboxylic acid based on 100 parts by weight of a mixture of a crystalline thermoplastic resin (A) and a polyphenylene ether resin (B).In the resin composition, the crystalline thermoplastic resin (A) forms a continuous phase and the polyphenylene ether resin (B) forms a dispersed phase.The present invention provides a novel thermoplastic resin composition containing a polyphenylene ether resin, which has excellent flow properties, impact resistance and heat resistance.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: December 17, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Tadayuki Ohmae, Sumio Hara, Hiroomi Abe, Kenji Nagaoka
  • Patent number: 5569710
    Abstract: Polymer blends of at least one polar polymer are prepared by admixture with a poly(vinyl alcohol) and a (meth)acrylate copolymer also containing vinyl amide and/or unsaturated acid units. The ternary compositions have attractive processing and performance properties.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: October 29, 1996
    Assignee: Rohm and Haas Company
    Inventors: Edward E. LaFleur, William J. Work, Robert M. Amici, Newman M. Bortnick, Norman L. Holy
  • Patent number: 5561193
    Abstract: Thermoplastic molding materials containA) from 5 to 95% by weight of a partly aromatic, semicrystalline copolyamide composed essentially ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acida.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acida.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together being 100%, andB) from 5 to 95% by weight of a polyphenylene etherC) from 0 to 30% by weight of an elastomeric polymer,D) from 0 to 45% by weight of a fibrous or particulate filler or of a mixture thereof,E) from 0 to 20% by weight of a flameproofing agent andF) from 0 to 30% by weight of conventional additives and processing assistants,the percentages A) to F) summing to 100%.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: October 1, 1996
    Assignee: BASF Aktiengesellschaft
    Inventors: Axel Gottschalk, Herbert Fisch, Gunter Pipper, Martin Weber
  • Patent number: 5559186
    Abstract: A thermoplastic resin composition having excellent appearance and moldability contains:(A) 1 to 99% by weight of a polyphenylene ether resin,(B) 99 to 1% by weight of a polystyrene resin prepared by copolymerization of: (i) a styrene compound, 100 to 500 ppm by weight of a compound containing 2-6 vinyl groups, and if necessary, a compound capable of copolymerizing with the styrene compound, or (ii) a polystyrene resin obtained by copolymerization of a styrene compound, 100 to 500 ppm by weight of a compound containing 2-6 vinyl groups, a first rubber, and if necessary, a compound capable of copolymerizing with said styrene compound, or a mixture of (i) and (ii). Component (C) is a second rubber which can be present in amounts of about 0 to 100 parts by weight relative to (A) and (B).
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: September 24, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takeshi Fujii, Yasuro Suzuki, Hayato Kihara, Takashi Anbo
  • Patent number: 5559185
    Abstract: A thermoplastic resin composition superior in impact resistance, heat resistance, flexural rigidity, processability and solvent resistance which comprises: (A) 100 parts by weight of a resin composition comprising 5-95% by weight of a polyphenylene ether, or a polyphenylene ether and polystyrene, and 95-5% by weight of a polyamide resin; (B) 5-50 parts by weight of a modified saturated rubber obtained by grafting 5-100 parts by weight of an aromatic vinyl compound on 100 parts by weight of a saturated type rubber and allowing 0.05-10 parts by weight of a compatibilizing agent to react with said rubber; and (c) 0.05-20 parts by weight of a compatibilizing agent.
    Type: Grant
    Filed: January 13, 1995
    Date of Patent: September 24, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroomi Abe, Taichi Nishio, Yasurou Suzuki, Mitsuji Tsuji, Takashi Sanada
  • Patent number: 5554693
    Abstract: Thermoplastic compositions are provided containing polyphenylene ether resin, polyamide resin and terpene phenol having a hydroxyl value of 45 or above. The compositions have outstanding coating film adhesion.
    Type: Grant
    Filed: September 11, 1995
    Date of Patent: September 10, 1996
    Assignee: General Electric Company
    Inventors: Takashi Ohtomo, Koji Myojo, Hiroshi Kubo
  • Patent number: 5552480
    Abstract: There is disclosed a thermoplastic resin composition comprising as principal components a [A] thermoplastic resin having a functional group reactive with an amino group, a [B] olefinic polymer and/or styrenic polymer, the subtotal of the above [A]+[B] being 100 parts by weight, and 0.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: September 3, 1996
    Assignees: Idemitsu Petrochemical Co., Ltd., Dai-ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Yasuhisa Sugita, Naoki Kitazawa, Hiroshi Hotta
  • Patent number: 5548011
    Abstract: The invention relates to blends of polycarbonates, branched, phenolic hydroxy functional dimeric fatty acid polyesters and at least one component selected from polyisobutylene, silicones and mineral oils.
    Type: Grant
    Filed: August 31, 1995
    Date of Patent: August 20, 1996
    Assignee: Bayer AG
    Inventors: Burkhard Kohler, Wolfgang Ebert, Klaus Horn, Richard Weider, Thomas Scholl
  • Patent number: 5543452
    Abstract: A flame-resistant polyamide resin composition comprising components:(A) a polyamide or a blend of a polyamide with another polymer,(B) a flame retardant comprising a brominated styrene or styrene derivative polymer having acid anhydride groups, and(C) a flame retardant comprising a brominated polystyrene.
    Type: Grant
    Filed: April 20, 1995
    Date of Patent: August 6, 1996
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Junichi Nakahashi, Itaru Natori
  • Patent number: 5543448
    Abstract: Blends of polycarbonate and polyester are admixed in compositions with poly(phenylene ether), and/or with a poly(phenylene ether) concentrate containing poly(phenylene ether), polystyrene, a vinyl aromatic copolymer, polyamide, polycarbonate, polyester, poly(alkyl acrylate), and/or poly(alkyl methacrylate).
    Type: Grant
    Filed: January 26, 1995
    Date of Patent: August 6, 1996
    Assignee: The Dow Chemical Company
    Inventor: Michael K. Laughner
  • Patent number: 5532067
    Abstract: Compatible polymer blends containing A) 0.5-99.5 wt. %, preferably 50 to 90 wt. % of a polyphenylene ether, synthesized from units of formula (I) ##STR1## where R.sub.1 stands for an optionally substituted cycloalkyl group or alkoxyl group having 1 to 8 carbon atoms or an optionally substituted aryl group having 6 to 10 carbon atoms or for chlorine, where R.sub.2 stands for an optionally substituted cycloalkyl group or alkoxyl group having 1 to 8 carbon atoms or an optionally substituted aryl group having 6 to 10 carbon atoms or for chlorine, and B) 99.5-0.5 wt. %, preferably 50 to 10 wt. % of a polyaryl(meth)acrylate containing 20-100 wt. % of monomers of the formula (II) ##STR2## where R.sub.3 stands for hydrogen or methyl, Q stands for an alkylidene group having 1 to 6 carbon atoms or a group --(CH.sub.2).sub.m --O--, where m denotes a number from 2 to 6,x stands for zero or 1 andR.sub.
    Type: Grant
    Filed: August 22, 1994
    Date of Patent: July 2, 1996
    Assignee: Roehm GmbH Chemische Fabrik
    Inventors: Jens-Dieter Fischer, Werner Siol
  • Patent number: 5530047
    Abstract: A polymer composition for electrical part material comprising, (I) a polymer blend which comprises (A) at least one polymer selected from specific types of polyether imides and polyesters, and (B) at least one polymer selected from specific types of polyphenylene ethers, polyolefins, and polycarbonates, and (II) a copolymer of maleic anhydride and vinyl type compound or (II') an epoxy-modified styrene-type copolymer. The composition has excellent compatibility, heat resistance, mechanical characteristics, platability, moldability, and electric characteristics. It is an ideal material for use as an electrical part material due to its low dielectric constant and low dielectric dissipation factor at high frequency.
    Type: Grant
    Filed: April 10, 1995
    Date of Patent: June 25, 1996
    Assignees: Cosmo Research Institute, Cosmo Oil Co., Ltd.
    Inventors: Fumie Watanabe, Takashi Mizoguchi, Masatoshi Iwafune
  • Patent number: 5523360
    Abstract: A process for the modification of a polyphenylene ether resin composition is claimed, said process being carried out in a temperature range of between the melting point and the degradation point of said resin composition and in the presence of an effective amount of a citraconimide compound to reduce the melt viscosity of said resin composition, said citraconimide compound being represented by formula (I), wherein X is selected from the group consisting of hydrogen, C.sub.1 -C.sub.18 alkyl groups, C.sub.2 -C.sub.18 alkenyl groups, C.sub.2 -C.sub.18 alkynyl groups, C.sub.3 -C.sub.18 cycloalkyl groups, C.sub.3 -C.sub.18 cycloalkenyl groups, C.sub.3 -C.sub.18 cycloalkynyl groups, C.sub.6 -C.sub.18 aryl groups, C.sub.7 -C.sub.30 aralkyl groups, C.sub.7 -C.sub.30 alkaryl groups, and C.sub.7 -C.sub.30 alkernaryl groups, all of which may be linear or branched and unsubstituted or substituted with one or more amino, carboxy, cyano, halogens, esters, oxiranes, ethers, nitro, hydroxy and alkoxy groups.
    Type: Grant
    Filed: February 2, 1995
    Date of Patent: June 4, 1996
    Assignee: Akzo Nobel N. V.
    Inventors: Jernej Jelenic, Auke G. Talma, Peter Hope
  • Patent number: 5520849
    Abstract: New electrically conductive polymer compositions comprisei) an electrically conductive polymer a) of one or more oxidatively polymerizable aromatic compounds andii) a polymer d) having ammonium, phosphonium or sulfonium groups in the polymer chain(s).The polymer compositions comprising polymers a) and d) are prepared by oxidative polymerization of one or more aromatic compounds in the presence of a polymer b) having ammonium, phosphonium or sulfonium groups in the polymer chain(s) and containing a polydentate anionic complex which has a redox potential sufficient for enabling oxidative polymerization of the aromatic compounds. Said polymer b) which has a non-metallic anionic complex such as S.sub.2 O.sub.8.sup.2- is also novel.
    Type: Grant
    Filed: June 23, 1994
    Date of Patent: May 28, 1996
    Assignees: The Dow Chemical Company, Deborah C. Dulude
    Inventor: Jurgen Eiffler
  • Patent number: 5504158
    Abstract: There is provided in accordance with the present invention polyphenylene ether/polyalkyleneterephthalamide compositions of high dimensional stabilities that are suitable for high temeprature applications comprising from about 20 to about 70 weight % of a functionalized polyphenylene ether; from about 20 to about 70 weight % of a polyalkyleneterephthalamide, wherein the polyalkyleneterephthalamide is derived from terephthalic acid and an .alpha.,.omega.-alkanediamine having 10 to 14 methylene groups; and from about 0 to about 20 weight % of a functionalized elastomeric polymer, wherein the blend absorbs less than 2 wt % of moisture and has a dimensional growth in water of less than 0.5%.
    Type: Grant
    Filed: January 10, 1995
    Date of Patent: April 2, 1996
    Assignee: AlliedSignal Inc.
    Inventors: Murali K. Akkapeddi, Jeffrey H. Glans
  • Patent number: 5504130
    Abstract: Disclosed are compositions having the characteristic of improved flow for compositions comprising a poly(phenylene ether) resin, a polyester resin, a polycarbonate resin, a reinforcing filler, a terpene phenol resin. The compositions may further comprise at least one additional material from the group consisting of impact modifiers, non-elastomeric polymers of an alkenyl aromatic compound and an additive package. The heat distortion temperature of the compositions can be further improved with the addition of an optional non-reinforcing filler in combination with a poly(tetrafluoroethylene) resin without significant loss of the physical properties.
    Type: Grant
    Filed: September 1, 1994
    Date of Patent: April 2, 1996
    Assignee: General Electric Company
    Inventor: Geoffrey H. Riding
  • Patent number: 5504139
    Abstract: The present invention provides a polymeric composition including a blend of at least two different polymers selected from the group consisting of polystyrene, polycarbonate, polyetherimide, polyolefin, polysulphone, polyethersulphone, polyacetal, nylon, polyester, polyphenylene sulphide, polyphenylene oxide and polyetheretherketone and at least one elastomer having a tensile modulus less than about 50,000 p.s.i. Alternatively or additionally, the elastomer may be functionalized to graft with at least one of the polymers. The present invention also provides a method of making a tribological wear system by melt-mixing the polymeric composition to improve the wear resistance of a polymeric composite whose surface bears against another surface, thereby causing friction and wear of the polymeric composite.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: April 2, 1996
    Assignee: Kawasaki Chemical Holding Co., Inc.
    Inventors: Mark Davies, Anne E. Bolvari
  • Patent number: 5502098
    Abstract: A polymer composition for electrical part material comprising, (I) a polymer blend which comprises (A) at least one polymer selected from specific types of polyether imides and polyesters, and (B) at least one polymer selected from specific types of polyphenylene ethers, polyolefins, and polycarbonates, and (II) a copolymer of maleic anhydride and vinyl type compound or (II') an epoxy-modified styrene-type copolymer. The composition has excellent compatibility, heat resistance, mechanical characteristics, platability, moldability, and electric characteristics. It is an ideal material for use as an electrical part material due to its low dielectric constant and low dielectric dissipation factor at high frequency.
    Type: Grant
    Filed: June 27, 1994
    Date of Patent: March 26, 1996
    Assignees: Cosmo Research Institute, Cosmo Oil Co., Ltd.
    Inventors: Fumie Watanabe, Takashi Mizoguchi, Masatoshi Iwafune
  • Patent number: 5500478
    Abstract: Thermoplastic resin compositions consisting of 1 to 40 wt % a polyether ester amide (A) and 99 to 60 wt % of at least one thermoplastic resin (B) selected from styrene based resins, further containing (C) 0.1-10% of a modified vinyl polymer containing carboxyl groups, are permanently antistatic, excellent in mechanical properties represented by impact resistance, heat resistance moldability and also in the appearance and gloss of the moldings, and suitable for housings of optical or magnetic recording media.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: March 19, 1996
    Assignee: Toray Industries, Inc.
    Inventors: Tadao Fukumoto, Masatoshi Iwamoto, Akihiko Kishimoto
  • Patent number: 5489640
    Abstract: Disclosed are compositions having the characteristic of improved heat distortion temperature for compositions comprising a poly(phenylene ether) resin, a polyester resin, a polycarbonate resin, a reinforcing filler, and a heat enhancing non-fibrous filler in combination with a poly(tetrafluoroethylene) resin. The compositions may further comprise at least one additive from the group consisting of impact modifiers, non-elastomeric polymers of an alkenyl aromatic compound and an additive package. The flow of such compositions can be further improved with the addition of an optional flow promoting terpene phenol material without significant loss of the physical properties.
    Type: Grant
    Filed: September 1, 1994
    Date of Patent: February 6, 1996
    Assignee: General Electric Company
    Inventor: Geoffrey H. Riding
  • Patent number: 5484846
    Abstract: Thermoplastic molding compounds containingA. 10 to 99 parts by weight polycarbonate or polyester carbonateB. 0 to 90 parts by weight of a rubber-free resin compatible or partly compatible with component A.,C. 0 to 90 parts by weight of a rubber-modified resin compatible or partly compatible with component A.,D. 0.5 to 10 parts by weight, based on 100 parts by weight of A+B+C, of a rubber component having a glass transition temperature below 0.degree. C. which is incompatible with component A,characterized in that component D is used in the form of a powder mixture D* produced froma. 1 to 50 parts by weight of an ungrafted particulate rubber component having a glass transition temperature below 0.degree. C. and an average particle diameter d.sub.50 of 0.05 to 5 .mu.m in latex form andb. 50 to 99 parts by weight of component B, component C or a mixture of components B and C in latex form,the components mentioned under a. and b.
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: January 16, 1996
    Assignee: Bayer AG
    Inventors: Dieter Wittman, Jochen Schoeps, Horst Beicher, Karl-Erwin Piejko, Kurt Weirauch
  • Patent number: 5475058
    Abstract: The present invention provides a resin composition which is lowly water-absorbent and is excellent in properties such as mechanical strength, flexibility and heat resistance while improving the compatibility of the conventional resin composition comprising a polyamide resin and a thermoplastic polyester resin, and which comprises 100 parts by weight of a mixture composed of:(A) 10 to 90% by weight of a polyamide resin having a molar ratio of the terminal carboxyl group to the terminal amino group of 1.5 or more, and(B) 90 to 10% by weight of a thermoplastic polyester resin, and incorporated therein, and(C) 0.1 to 10 parts by weight of a vinylic copolymer comprising 40 to 99% by weight of a specified vinyl monomer and 60 to 1% by weight of a specified vinyl monomer having a glycidyl ester group.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: December 12, 1995
    Assignees: Polyplastics Co., Ltd., Daicel Chemical Industries, Ltd.
    Inventors: Hiroo Horiuchi, Mitsuo Wada, Naoki Wakita, Kazushi Watanabe
  • Patent number: 5475054
    Abstract: A resin composition comprising (A) a polyphenylene ether resin, (B) a polyolefin resin, and optionally (C) an elastomer, and (D) an aliphatic polycarboxylic acid derivative represented by the following general formula:(R.sub.1 O).sub.m R(COOR.sub.2).sub.n (CORN.sub.3 R.sub.4).sub.swherein R represents a saturated hydrocarbon group having 2 to 20 carbon atoms with a linear or branched chain; R.sub.1 represents a hydrogen atom or an alkyl, aryl, acyl or carbonyldioxy group having 1 to 10 carbon atoms; each R.sub.2 represents a hydrogen atom or an alkyl or aryl group having 1 to 20 carbon atoms; R.sub.3 and R.sub.4 each represents a hydrogen atom or an alkyl or aryl group having 1 to 10 carbon atoms; m represents a number equal to 1 or 2; (n+s) is larger than or equal to 2 and, n and s are each larger than or equal to 0; (OR.sub.1) is in an alpha or beta position with respect to a carbonyl group, and in which at least two carbonyl groups are separated by 2 to 6 carbon atoms.
    Type: Grant
    Filed: September 28, 1994
    Date of Patent: December 12, 1995
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroomi Abe, Kenji Nagaoka, Takashi Sanada
  • Patent number: 5470913
    Abstract: The invention relates to polymer mixtures which comprise a polyphenylene ether, a polyamide and an agent to improve the impact resistance.
    Type: Grant
    Filed: October 26, 1989
    Date of Patent: November 28, 1995
    Assignee: General Electric Company
    Inventors: Roelof van der Meer, Charles F. Pratt, Johannes W. J. de Munck, Jean M. H. Heuschen
  • Patent number: 5470909
    Abstract: A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in % by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: November 28, 1995
    Assignee: Fujitsu Limited
    Inventors: Kota Nishii, Kouichi Kimura, Masanobu Ishizuka, Katsura Adachi
  • Patent number: 5466737
    Abstract: A polyimide resin composition for sliding members which has high heat resistance and sliding properties and excels in wear resistance under sliding conditions at high PV values and which can keep low the rate of shrinkage due to crystallization treatment. The composition is made up of 100 parts by weight of resin composition comprising 50-90% by weight of a thermoplastic polyimide resin and 50-10% by weight of graphite obtained by graphitizing a non-phenolic resin material and containing 97% or more of fixed carbon; 5-20 parts by weight of tetrafluoroethylene resin; and 5-30 parts by weight of a powdery hardened phenolic resin.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: November 14, 1995
    Assignee: NTN Corporation
    Inventors: Yoshio Oki, Takumi Shimokusuzono
  • Patent number: 5461092
    Abstract: A polycarbonate blend of good impact and flexural strength, good heat distortion and weldline properties, and good solvent resistance prepared by admixing with polycarbonate an aromatic polyester, an olefinic epoxide-containing modifier, and a rubber-modified styrene/acrylonitrile copolymer.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: October 24, 1995
    Assignee: The Dow Chemical Company
    Inventor: Michael K. Laughner
  • Patent number: 5457159
    Abstract: Process for the preparation of plastoelastomeric preparations comprising an elastomeric phase of an EPDM elastomer and a plastomeric phase of a thermoplastic olefinic polymer, wherein the elastomeric phase is dynamically vulcanized with a vulcanizing binary agent consisting of an alkylphenol-formaldehydic resin and sodium bisulphite.
    Type: Grant
    Filed: December 9, 1993
    Date of Patent: October 10, 1995
    Assignee: Paranova Articoli Tecnici S.r.l.
    Inventors: Roberto Fassina, Alessandro Fassina
  • Patent number: 5447789
    Abstract: Promoting adhesion (without need for an adhesive) of polyurethane to polyvinyl chloride sheet plasticized with ethylene/carbon monoxide polymer by adding an effective amount of a phenolic resin; particularly novolac resins.
    Type: Grant
    Filed: September 30, 1993
    Date of Patent: September 5, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Elizabeth R. Griffin
  • Patent number: 5444123
    Abstract: Halogen-free flameproofed thermoplastic molding materials based on polyphenylene ethers and polystyrene containing, as essential components,A) from 5 to 92% by weight of one or more polyphenylene ethers,B) from 5 to 92% by weight of a vinylaromatic polymer andC) from 3 to 25% by weight of a flameproofing agent based onC1) from 20 to 100% by weight (based on the total amount of C) of a polymeric phosphorus compound which is obtained by polymerizing or copolymerizing one or more compounds of the following structure: ##STR1## where ##STR2## R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.10 and R.sup.11 are each hydrogen, alkyl, cycloalkyl, aralkyl or aryl,R.sup.7, R.sup.8 and R.sup.9 are each alkylidene, cycloalkylidene, aralkylidene or arylidene,m, p, q, r, s, t, u and v are each 0 or 1,n is 0, 1 or 2,U is COO, O, S or NR.sup.9,V, W, X and Y are each O, S or NR.sup.9 andZ is O, S or NR.sup.10 R.sup.
    Type: Grant
    Filed: February 28, 1994
    Date of Patent: August 22, 1995
    Assignee: BASF Aktiengesellschaft
    Inventors: Doris Zeltner, Norbert Niessner, Friedrich Seitz, Ranier Neumann, Stefan Seelert
  • Patent number: 5434220
    Abstract: A polyphenylene ether resin composition containing (A) 100 parts by weight of a polyphenylene-ether-base resin composed of 100-60 wt. % of a polyphenylene ether resin and 0-40 wt. % of a polystyrene resin and (B) 1-40 parts by weight of a dicarboxylic acid ester copolymer obtained from a vinyl monomer and an unsaturated dicarboxylic acid ester as copolymerizable components. The dicarboxylic acid ester copolymer has a weight average molecular weight not greater than 60,000. The polyphenylene ether resin composition, if necessary, can further comprise (C) 1-40 parts by weight of conductive carbon or an A-B-A' type or A-B'-B" type block copolymer elastomer. Owing to its excellent mechanical properties, heat resistance and moldability, the resin composition is useful in the fields of automotive vehicles, home electronic or electric appliances and industrial parts or components.
    Type: Grant
    Filed: August 10, 1994
    Date of Patent: July 18, 1995
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Tomoyuki Nakata, Minoru Takiguchi
  • Patent number: 5428091
    Abstract: A thermoplastic resin composition which comprises 100 parts by weight of a composition comprising 95-5 % by weight of at least one polyolefinresin (A) selected from homopolymers of ethylene or .alpha.-olefin or copolymers thereof and these homopolymers or copolymers modified with a polyfunctional compound (E) and/or an unsaturated monomer (L) and 5-95 % by weight of at least one polyphenylene-ether-resin (B) selected from polyphenylene ether, modified polyphenylene ether with the above (E) and/or (L) and a composition comprising the polyphenylene or modified polyphenylene ether and an aromatic vinyl polymer resin (M) and 0.001-10 parts by weight of a dinitrodiamine (D) of the following formula (I). ##STR1## (wherein X represents a divalent chain aliphatic group, a cyclic aliphatic group or an aromatic group which may contain a halogen or an oxygen atom, R.sup.1 represents a hydrogen atom, a chain aliphatic group, a cyclic aliphatic group or an aromatic group and when both of X and R.sup.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: June 27, 1995
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Hiroomi Abe, Takeshi Fujii, Masashi Yamamoto, Shinichi Yachigo, Hideo Nagasaki, Naoki Inui
  • Patent number: 5424341
    Abstract: A blend of polycarbonate and chlorinated polyethylene which has a desirable balance of impact and ignition resistance properties.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: June 13, 1995
    Assignee: The Dow Chemical Company
    Inventors: Samuel A. Ogoe, David W. Liou, Oliver C. Ainsworth, James R. Bethea, John W. Muskopf, Craig L. Werling, Edwin J. Wilson, John W. Cocup
  • Patent number: 5420199
    Abstract: A thermoplastic resin composition consisting essentially of (a) 50 to 90 % by weight of polybutylene terephthalate (component A), (b) 5 to 40 % by weight of modified polyolefin modified by an unsaturated monomer having a glycidyloxy group and an unsaturated monomer having a carboxyl group or an acid anhydride group (component B), (c) 5 to 40 % by weight of polycarbonate (component C); and molded articles prepared from the above thermoplastic resin composition.The thermoplastic resin composition of the invention can give molded articles having excellent toughness, rigidity, strength and dimensional stability.
    Type: Grant
    Filed: February 28, 1994
    Date of Patent: May 30, 1995
    Assignee: Teijin Limited
    Inventor: Hiroki Fujie
  • Patent number: 5418291
    Abstract: A resin composition comprising(a) a polyphenylene ether resin or a mixture of it and a polystyrene resin,(b) a co-oligomer of ethylene and an alpha-olefin,(c) optionally an elastomeric hydrogenated A-B-A block copolymer, and(d) optionally an elastomeric hydrogenated A-B block copolymer.The chemical resistance of the polyphenylene ether is improved.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: May 23, 1995
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hideo Uno, Hiroshi Murayama, Yasumasa Norisue, Ryu Iwasaki
  • Patent number: 5418275
    Abstract: There are disclosed a polystyrene composition which comprises 100 parts by weight of a syndiotactic polystyrene (SPS)(a) and 1 to 100 parts by weight of a high molecular compound comprising 5 to 95% by weight of polyphenylene ether (PPO) and/or modified PPO and 95 to 5% by weight of a rubbery elastomer (b) and optionally, 1 to 350 parts by weight of an inorganic filler (d) and also a polystyrene composition which comprises 100 parts by weight of the component (a), 0.1 to 30 parts by weight of the component (b) and 1 to 100 parts by weight of a rubbery elastomer (c) and optionally, 1 to 350 parts by weight of the component (d). The above compositions are greatly improved in impact resistance, elongation and retention of physical properties during recycling without detriment to heat resistance and modulus of elasticity.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: May 23, 1995
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Akihiko Okada, Nobuyuki Sato
  • Patent number: RE35398
    Abstract: Heat shrinkable thermoplastic compositions are prepared by blending an ethylene copolymer resin with an EPDM rubber and dynamically vulcanizing the rubber. The ethylene copolymer resin is a copolymer of ethylene with an alkyl ester of an alpha, beta monoethylenically unsaturanated monocarboxylic acid as well as copolymers of ethylene with the acid per se. The preferred copolymer is ethylene-vinylacetate copolymer. Uncured rubber can be included in the composition.
    Type: Grant
    Filed: September 25, 1995
    Date of Patent: December 10, 1996
    Assignee: Advanced Elastomer Systems, L.P.
    Inventors: Donald R. Hazelton, Robert C. Puydak