Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications.

Abstract: The present invention provides a composition comprising a solvated aromatic amine and a liquid carrier, wherein said solvated aromatic amine is the reaction product of an aromatic amine and at least one of any anhydride, an isocyanate or an acid in the liquid carrier. The present invention also provides a method of preparing a composition comprising a solvated aromatic amine and a liquid carrier, said method comprising the steps of providing a reaction mixture comprising: a) an aromatic amine; b) at least one of an anhydride, an isocyanate or an acid; and c) a liquid carrier; and heating the reaction mixture at an elevated temperature to provide the solvated aromatic amine in the liquid carriers. The present invention further provides the use of the compositions for the preparation of the curable compounds and for gasoline resistant coatings.

Abstract: Disclosed herein is a blend comprising: (a) 5 to 50 percent by weight of the micronized poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 9 microns or less; (b) 50 to 95 percent by weight of a thermoplastic polyurethane; wherein the weight percents are based on the total weight of the blend. Also disclosed are processes for preparing such blends as well as articles derived therefrom.

Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

Abstract: A poly(phenylene ether)-poly(hydroxy ether) block copolymer is used to compatibilize blends of polar polymers and non-polar polymers. The resulting compatibilized blends exhibit physical property improvements relative to blends without a compatibilizer and blends with a poly(hydroxy ether).

Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).

Abstract: Disclosed are random copoly(phosphonate carbonate)s with the high molecular weight and narrow molecular weight distribution exhibiting a superior combination of properties compared to prior art.

Abstract: An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.

Abstract: A thermoplastic polymer composition capable of exhibiting excellent impact resistance, durability and destaticizing property containing (A) 50 to 95% by mass of an aliphatic polyester-based resin and (B) 5 to 50% by mass of a block copolymer of (B1) a hard segment block with at least one of a polyamide, polyester, polyolefin or polyurethane, and (B2) a soft segment block having an ether bond.

Abstract: A thermoplastic composition comprising recovered poly(arylene ether), less than or equal to 0.1 weight percent based on the total weight of the thermoplastic composition of a second recovered thermoplastic that gives off greater than or equal to 10 percent by mass of volatiles at a processing temperature for the thermoplastic composition; 0.025 to 4.0 weight percent, based on the total weight of the thermoplastic composition, of a third recovered thermoplastic selected from the group consisting of polyolefin, acrylonitrile-butadiene-styrene, polycarbonate, polycarbonate/acrylonitrile-butadiene-styrene blend, polymethyl methacrylate, polyamide, polyester, polycarbonate/polyester blend and combinations of two or more of the foregoing third recovered thermoplastics, wherein combinations of two or more of the foregoing third recovered thermoplastics are present in an amount of less than or equal to 10 weight percent, based on the total weight of the thermoplastic composition; and an optional virgin thermoplastic.

Abstract: The present invention provides a thermoplastic polymer composition capable of exhibiting excellent impact resistance, durability and destaticizing property. The present invention relates to a thermoplastic polymer composition comprising (A) 50 to 95% by mass of an aliphatic polyester-based resin and (B) 5 to 50% by mass of a block copolymer comprising (B1) a hard segment block comprising at least one polymer selected from the group consisting of a polyamide, a polyester, a polyolefin and a polyurethane, and (B2) a soft segment block having an ether bond, with the proviso that a total amount of the components (A) and (B) is 100% by mass.

Abstract: A thermoplastic composition comprising recovered poly(arylene ether), less than or equal to 0.1 weight percent based on the total weight of the thermoplastic composition of a second recovered thermoplastic that gives off greater than or equal to 10 percent by mass of volatiles at a processing temperature for the thermoplastic composition; 0.025 to 4.0 weight percent, based on the total weight of the thermoplastic composition, of a third recovered thermoplastic selected from the group consisting of polyolefin, acrylonitrile-butadiene-styrene, polycarbonate, polycarbonate/acrylonitrile-butadiene-styrene blend, polymethyl methacrylate, polyamide, polyester, polycarbonate/polyester blend and combinations of two or more of the foregoing third recovered thermoplastics, wherein combinations of two or more of the foregoing third recovered thermoplastics are present in an amount of less than or equal to 10 weight percent, based on the total weight of the thermoplastic composition; and an optional virgin thermoplastic.

Abstract: A thermoplastic composition comprising recovered poly(arylene ether), less than or equal to 0.1 weight percent based on the total weight of the thermoplastic composition of a second recovered thermoplastic that gives off greater than or equal to 10 percent by mass of volatiles at a processing temperature for the thermoplastic composition; 0.025 to 4.0 weight percent, based on the total weight of the thermoplastic composition, of a third recovered thermoplastic selected from the group consisting of polyolefin, acrylonitrile-butadiene-styrene, polycarbonate, polycarbonate/acrylonitrile-butadiene-styrene blend, polymethyl methacrylate, polyamide, polyester, polycarbonate/polyester blend and combinations of two or more of the foregoing third recovered thermoplastics, wherein combinations of two or more of the foregoing third recovered thermoplastics are present in an amount of less than or equal to 10 weight percent, based on the total weight of the thermoplastic composition; and an optional virgin thermoplastic.

Abstract: A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.

Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.

Abstract: The present invention is one liquid type cyanate-epoxy composite resin composition comprised of cyanate ester resin (A), epoxy resin (B), and potential curing agent (C), characterized in that the above potential curing agent is the potential curing agent containing phenol resin (b) as well as modified amine (a) which has one or more amino groups having an active hydrogen within a molecule obtained by reacting polyamine compound (a-1) with epoxy compound (a-2). The one liquid type cyanate-epoxy composite resin composition having storage stability, curing properties and high heat resistance properties at the same time can be realized by this composition.

Abstract: A moisture-curable adhesive composition that may be formulated to be free of volatile organic compounds, or substantially free of volatile organic compounds which is safe for chronic exposure, resistant to combustion, and provides a high peel strength useful for securing a rubber membrane material to a rigid roof deck includes a polymer having silicon-containing hydrolyzable terminal groups, a phenolic resin, and a non-polymeric silicon-containing hydrolyzable compound, wherein the ratio of the amount of polymer having silicon-containing hydrolyzable terminal groups by weight to the amount of phenolic resin by weight is greater than 2:1.

Abstract: The present invention relates to a styrenic thermoplastic resin composition, and more particularly to a styrenic thermoplastic resin composition comprising a non-halogen flame-retardant having superior flame-retarding properties and impact strength. The present invention provides a flame-retarding styrenic thermoplastic resin composition comprising a) 100 weight parts of a base resin comprising i) 10 to 50 weight parts of a rubber-modified styrene-containing graft copolymer, ii) 5 to 20 weight parts of phenol novolac resin, and iii) 20 to 70 weight parts of a styrene-containing copolymer; and b) 5 to 20 weight parts of an aromatic phosphate. In addition, the a) base resin may further comprise iv) 10 to 40 weight parts of a thermoplastic polyurethane resin.

Abstract: A polyphenylene ether resin composition comprising a polyphenylene ether, wherein the polyphenylene ether has a polymer chain comprising recurring units each represented by the following formula (1): and has the following characteristics (a), (b) and (c): (a) when the polyphenylene ether is analyzed by 1H-NMR, the polyphenylene ether exhibits a triplet signal (S1) at 3.55 ppm, wherein the triplet signal (S1) has a relative intensity of 0.05 to 0.25 in terms of the percentage of the integrated intensity of the triplet signal (S1), based on the integrated intensity of a signal (S2) observed at 6.47 ppm; (b) the polyphenylene ether exhibits an absorbance of from 0.01 to 0.40 at a wavelength of 480 nm; and (c) the polyphenylene ether has a weight average molecular weight of from 30,000 to 100,000.

Abstract: Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group.

Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.

Abstract: The present invention relates to a styrenic thermoplastic resin composition, and more particularly to a styrenic thermoplastic resin composition comprising a non-halogen flame-retardant having superior flame-retarding properties and impact strength. The present invention provides a flame-retarding styrenic thermoplastic resin composition comprising a) 100 weight parts of a base resin comprising i) 10 to 50 weight parts of a rubber-modified styrenic-containing graft copolymer, ii) 5 to 20 weight parts of phenol novolac resin, and iii) 20 to 70 weight parts of a styrene-containing copolymer; and b) 5 to 20 weight parts of an aromatic phosphate. In addition, the a) base resin may further comprise iv) 10 to 40 weight parts of a thermoplastic polyurethane resin.

Abstract: A polymer composition comprising chains of at least one aromatic polymer or a mixture thereof together with at least one chain linking component wherein the at least one aromatic polymer comprises polymer chains of number average molecular weight (Mn) in a first range and characterised by a polymer flow temperature, and having at least one reactive end group, and wherein the at least one chain linking component comprises at least two linking sites, characterised in that a plurality of the polymer chain end groups are adapted to react with the linking sites at chain linking temperature in excess of the polymer flow temperature to form linked polymer chains of number average molecular weight (Mn) in a second range which is in excess of the first range, substantially thermoplastic in nature; process for the preparation thereof; prepreg, composite or shaped product obtained therewith and the use thereof.

Abstract: A functionalized poly(arylene ether) having a pendant carbon—carbon double bond is prepared by reacting the hydroxy end group of a poly(arylene ether) with a polyisocyanate compound to produce a urethane-capped poly(arylene ether) having pendant isocyanate functionality, which is then reacted with a polyfunctional compound having a carbon—carbon double bond and a hydroxy, thiol, or amino group. The functionalized poly(arylene ether) is useful as a component of a curable composition in which its carbon—carbon double bond copolymerizes with one or more olefinically unsaturated comonomers.

Abstract: A low molecular weight engineering thermoplastic polyurethane (ETPU) can be homogeneously melt blended with a polyarylene ether (PAE) to give a low viscosity melt processable blend, and subsequently cooled to form a heterogeneous dispersion of the ETPU in the PAE that has two Tgs, one that is close to the Tg of the pure ETPU, and one that is close to the Tg of the pure PAE. As such, the composite blend retains the properties of the polyarylene ether.

Abstract: Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system.

Abstract: A hyperbranched polyetherketone and a heat-resistant blend of polyvinylchloride with the same. The polyethereketone is synthesized by self-polycondensation of 3,5-bis[4-[(2,3,4,5,6-pentafluorophenyl)carbonyl]phenoxy]-4-hydroxbenzophenone or 3,5-difluoro-4-hydroxybenzophenone, and then substituting 50 to 80 mole % of fluorine atoms present in the side chains and ends of the PEK molecule by polar groups. In addition, a blend of polyvinylchloride can be manufactured using the hyperbranched polyetherketone by a melt blending technique applicable for industrial purpose at a temperature of 180 to 120° C., and thus the blend of polyvinylchloride with the polyetherekentone can be applied to high temperature end-use products such as hot water pipes.

Abstract: Phenolic resin polyols are disclosed. The polyols, which contain aliphatic or mixed phenolic and aliphatic hydroxyl groups, are the reaction products of aralkylated phenols or phenol aralkylation polymers with an oxyalkylating agent selected from alkylene oxides and alkylene carbonates. The phenolic resin polyols are versatile intermediates for many polymer systems, including urethanes, epoxies, alkyds, acrylates, and polyesters.

Abstract: A nonaqueous, heat-cured, two-component coating has a combination of good scratch resistance and resistance to etching by acid rain and comprises a solvent-containing polyol component and a cross-linking component. The cross-linking component comprises at least one aliphatic and/or cycloaliphatic polyisocyanate having 2 to 6 NCO functional groups per molecule in which 0.1 to 95 mol % of the isocyanate groups of the polyisocyanate are reacted with an N-alkyl-3-aminopropyltrialkoxysilane and/or an N-aryl-3-aminopropyltrialkoxysilane. The weight ratio of the polyol to the cross-linking component in the coating is 6:1 to 1:2.

Abstract: Provided are star-shaped non-vinyl polymers of a variety of compositions and a method for manufacturing such star-shaped polymers. The star-shaped polymers include a plurality of non-vinyl polymeric arms covalently linked to a crosslinked core. The core is made from crosslinkable non-vinyl reactants. The method involves reacting functionalized non-vinyl polymer pre-arms with the crosslinkable non-vinyl reactants.

Abstract: A blend of a polyarylene ether and a dispersible reactive solvent such as a thermoplastic polyurethane or a cyclopentadiene can be processed at temperatures below the oxidative degradation temperature of the polyarylene ether, yet form an article upon cooling that substantially retains the properties of the polyarylene ether.

Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.

Abstract: The invention provides a composition for a platable resinous substrate having enhanced heat performance comprising: a thermoplastic mixture of at least one polyphenylene ether and at least one poly(alkenylaromatic) compound, at least one rubber compound, and at least one inorganic filler material.

Abstract: The invention relates to modified polymeric aromatic isocyanates having allophanate linkages prepared by (a) reacting a polymeric aromatic isocyanate with a monofunctional aliphatic alcohol to form an intermediate modified polymeric isocyanate; and (b) reacting the intermediate modified polymeric isocyanate at an elevated temperature in the presence of a divalent metal catalyst. The invention also relates to foundry binder systems which use these modified polyisocyanates. These modified polyisocyanates, along with a phenolic resole resin, are added to a foundry aggregate to form a foundry mix which is shaped and cured with a gaseous amine curing catalyst by the cold-box process.

Abstract: The invention relates to polyurethane compositions with a low content of monomeric diisocyanates. Trifunctional isocyanates optionally reduced in their functionality to 3.0.+-.0.7 with a monofunctional terminator are preferably used for this purpose. In this way, the compositions contain considerably smaller quantities of readily volatile isocyanates. The compositions are suitable for use as reactive hotmelt adhesives, lamination adhesives, adhesive/sealing compounds, primers and for the production of foam plastics from non-reusable pressurized containers (aerosol cans). The low content of volatile monomeric diisocyanates enables the need for safety measures in the workplace to be significantly reduced, in addition to which the disposal of residues remaining in the containers is made considerably easier.

Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.

Abstract: A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.

Abstract: Polyoxymethylene with improved acid stability, process for production and use thereof. By adding 0.01 to 5 parts of an alkali metal salt of a polybasic acid, for example oxalic acid, citric acid and/or 0.01 to 5 parts of a polyalkylene glycol, for example polyethylene glycol and/or 0.1 to 100 parts of a thermoplastic polyurethane, each related to 100 parts of a polyoxymethylene, this polymer is stabilized against attack by acids, wherein in particular the combination of an alkali metal salt, in particular an oxalate, with small proportions of a thermoplastic polyurethane is advantageous. The proportion of thermoplastic polyurethane may be reduced when the thermoplastic polyurethane has a Shore A hardness of 70 to 96. The weight loss of a stabilized POM under the action of acid may be less than 3% of that of an unstabilized POM. The products are useful when exposed to acidic agents such as irrigation systems, dishwashers, sanitary installations.

Abstract: The present invention relates to a resin composition comprising (A) polyphenylene ether, (B) polyarylene sulfide and (C) polyisocyanate, wherein the polyisocyanate is an organic compounds having the general formula: ##STR1## wherein n is an integer of 1 or more.

Abstract: This invention is a quaternary ammonium/isocyanate compound having the formulaOCN-Z-Q.sup.+ A.sup.-,whereinZ is a divalent organic moiety;Q is a quaternary ammonium moiety; andA is a monovalent anionic counterion.Use of this quaternary ammonium/isocyanate compound or its amine/isocyanate compound enables one to convert any hydroxy containing binder into a self-wetting binder.

Abstract: The present invention relates to electrostatic dissipative polymeric compositions comprising a polyether polyurethane which can be blended with one or more base polymers. In some applications, the polyurethane is useful without further blending. Further, the polyurethane blends can be blended with glass beads or glass fibers which have a synergist effect when combined with the electrostatic dissipative agent.

Abstract: A resin composition having an excellent impact property comprising a polyphenylene ether and a polyarylene sulfide is provided. The resin composition comprises (A) a polyphenylene ether and (B) a polyarylene sulfide having the terminal SM group (wherein M is hydrogen or an alkali metal) of at least 5.times.10.sup.-6 gram equivalents/g.

Abstract: This invention is a quaternary ammonium/isocyanate compound having the formulaOCN--Z--Q.sup.+ A.sup.-,whereinZ is a divalent organic moiety;Q is a quaternary ammonium moiety; andA is a monovalent anionic counterion. Use of this quaternary ammonium/isocyanate compound or its amine/isocyanate compound enables one to convert any hydroxy containing binder into a self-wetting binder.

Abstract: A flame-retardant aromatic polycarbonate resin composition has excellent flame retardancy and high transparency without impairing excellent properties inherent to an aromatic polycarbonate resin, and is free from corroding a molding machine or a processing machine, the flame-retardant resin composition comprising 100 parts by weight of an aromatic polycarbonate resin, 0.01 to 1 part by weight of (a) a perfluoroalkane-sulfonic acid alkali salt and 0.02 to 2 parts by weight of (b) a halogenated triaryl phosphate of the formula [1], ##STR1## wherein each of Ar.sup.1, Ar.sup.2 and Ar.sup.3 is independently an aromatic hydrocarbon, and at least one halogen atom is substituted on ring-forming carbon of each aromatic hydrocarbon group.

Abstract: The invention describes a thermoplastic composition made of a continuous phase made of crystalline thermoplastic resin A, a dispersed phase made of polyphenylene ether resin B, and an amide compound C represented by formula 1,R.sub.4 --CONH--R.sub.2 --HNOC--R.sub.1 --CONH--R.sub.3 --HNOC--R.sub.5( 1)wherein R.sub.1, R.sub.2, and R.sub.3 represent divalent hydrocarbon groups, which may be identical or different, and R.sub.4 and R.sub.5 represent monovalent hydrocarbon groups, which may be identical or different. The amide compound is present in an amount between about 0.1 and about 30 parts by weight per 100 parts by weight of the resins A and B mixed together.

Abstract: A polymer composition especially suitable for producing fiber-reinforced structures having advantageous fracture toughness comprises a polyarylsulphone component and a thermoset resin component, each of which components is present at least partly as a phase continuous in at least one dimension. Preferred polyarylsulphones contain repeating units (PhSO.sub.2 Ph).sub.n and (Ph).sub.a linked through ether and/or thioether, where Ph is phenylene, n=1 to 2 and a=1 to 3; and such polyarylsulphones having amino end groups are provided as new compounds. The compositions can be made by spinodal decomposition of a mixture of the polyarylsulphone and a thermoset resin precursor.

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B) , an average particle diameter in said dispersing phase having of 0.01-10 .mu..

Abstract: The present inventions provides polyphenylene ether (PPE)/polyamide (PA) resin compositions having excellent dimensional stability when they absorb moisture, and good mechanical and other properties. Resin compositions of (A) 10-80 wt. parts PPE resins and (B) 90-20 wt. parts PA resins, in which the PA resins (a) are polymers formed by condensation of linear aliphatic diamines with linear aliphatic dicarboxylic acids and aromatic dicarboxylic acids, and (b) have terminal amino group contents of at least 0.4 mequiv/g.