Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: Processability of a paint film is improved and a water-soluble paint in which coloring during heating to a high temperature is minimized and which has excellent productivity and a coated can having a paint film of such a water-soluble paint are provided. A water-soluble paint including a polymer emulsion (C) and a phenolic resin (D) is provided; wherein the polymer emulsion (C) includes a shell part containing an acrylic polymer (A) having a carboxyl group and a core part containing an acrylic polymer (B) having an amide group, wherein the phenolic resin (D) includes a bifunctional phenolic resin (D2) based on a bifunctional phenol and a trifunctional phenolic resin (D3) based on a trifunctional phenol, and a mass ratio ((D2)/(D3)) between the bifunctional phenolic resin (D2) and the trifunctional phenolic resin (D3) is 95/5 to 40/60.

Abstract: Embodiments of the invention relate to ink compositions suitable for applications in the printing industry, for example continuous inkjet printing, including ultra-high speed continuous inkjet printing. The ink compositions use volatile organic solvents, a colorant, and one or more binder resins including a resin that is a phenolic resole resin, wherein the ink composition is free of methanol, halogens, halogenated compounds and bisphenol-A. A phenolic resole resin of the ink composition preferably contains less than 0.1% by weight of free formaldehyde. The one or more binder resins including the phenolic resole resin may be present in an amount that is from about 5% to about 30% by weight of the ink composition.

Abstract: A functional phenylene ether oligomer of the structure wherein Q1, Q2, Q3, Q4, x, y, and R are as defined herein. A curable composition includes the functional phenylene ether oligomer, and a thermoset composition includes a cured product derived from the curable composition.

Abstract: A solvent-free resin composition is provided. The solvent-free resin composition includes: (A) an epoxy resin component, including at least two multi-functional epoxy resins, each of which has at least three epoxy groups in a molecule; (B) an epoxy resin hardener; and (C) inorganic fillers, including a hollow filler and a non-hollow spherical filler, wherein the weight ratio of the hollow filler to the non-hollow spherical filler is from 1:5 to 6:1.

Abstract: Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains: (A) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 50 to 140; (B) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 150 to 500; and (C) a curing accelerator, in which the cyanate ester compound (A) is in an amount of 20 to 85% by mass per a total of 100% by mass of the components (A) and (B), and the cyanate ester compound (B) is in an amount of 15 to 80% by mass per the total of 100% by mass of the components (A) and (B).

Abstract: The present invention relates to a method for the manufacture of a poly(aryl ether) such as a poly(aryl ethersulfone) or a poly(aryl ether ketone) including the use of an organic base having a pKa of at least 10.

Abstract: A process for manufacturing a three-dimensional object from a powder by selective sintering the powder using electromagnetic radiation. The powder comprises recycled PAEK. In one embodiment, the powder comprises recycled PEKK. In one embodiment, the powder comprises first recycle PEKK and second recycle PEKK. In one embodiment, the powder consists essentially of recycled PEKK. The process may include the step of maintaining a bed of a selective laser sintering machine at approximately 300 degrees Celsius and applying a layer of the powder to the bed. The average in-plane tensile strength of the three-dimensional object is greater than that of a three-dimension object manufactured by selective sintering using a powder comprising an unused PEKK powder.

Abstract: A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

Abstract: A polymer-bonded polycyclic aromatic hydrocarbon compound of general formula (1): (P—O)x-Q-(Y)w??(1) wherein P represents a polymeric moiety having at least three repeating units which comprise an optionally substituted phenyl ring; Q represents a perylene, quaterrylene or terrylene moiety; Y is selected from (i) halogen and (ii) optionally substituted N-heterocycloaliphatic groups having from 3 to about 8 ring members which are bonded to Q through an N atom, provided that at least one Y represents (ii); x represents an integer of from 1 to 4; w represents an integer of from 1 to 4. Also, are provided processes of producing the compounds, polymers, markings and articles, and methods of authenticating.

Abstract: A medical device comprises parts made by injection moulding and parts made by machining such that the respective parts have similar colors, measured on the L*, a*, b* scale. The parts made by injection moulding may be made in a process which involves introducing molten material comprising polymeric material such as PEEK into a mould, wherein a mould surface which contacts the molten material is at a temperature of at least 210° C. and maintaining the molten material in the mould for at least 90 seconds.

Abstract: The embodiments herein relate to a benzoxazine resin composition, a prepreg, and a carbon fiber-reinforced composite material. More specifically, the embodiments herein relate to a benzoxazine resin composition that provides a carbon fiber-reinforced composite material that is suitable for use as a manufacture material due to its superior mechanical strength in extreme use environments, such as high temperature and high moisture, as well as a prepreg, and a carbon fiber-reinforced composite material. An embodiment comprises a benzoxazine resin composition having a multifunctional benzoxazine resin; a multifunctional epoxy resin that is a liquid at 40° C. and has three or more glycidyl groups; a sulfonate ester; and optionally at least one thermoplastic resin. The resin may include an interpenetrating network structure after curing.

Abstract: A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): X is ?R is H or C1-6 alkyl group; Y independently is a moiety polymerized by at least two different phenol-based compounds; and Z independently is H, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group.

Abstract: A composition contains (a) 1 to 40 weight percent of poly(phenylene ether) particles having a mean particle size of 1 to 40 micrometers; and (b) 60 to 99 weight percent of a polyoxymethylene; wherein polystyrene is absent from the poly(phenylene ether) particles; wherein the composition comprises less than 0.1 volume percent, based on the total volume of the composition, of particulate metals, metalloids, oxides thereof, and combinations thereof, wherein the metals and metalloids are selected from iron, copper, aluminum, magnesium, lead, zinc, tin, chromium, nickel, tungsten, silicon, gold, silver, platinum, and alloys thereof. The poly(phenylene ether) particles reduce the density and increase the char yield of the polyoxymethylene. When the composition is prepared at a temperature below the glass transition temperature of the poly(phenylene ether), increased flexural strength can also be obtained. The composition is useful as a molding composition for a variety of articles.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A film is used as a TAB leader tape. The film comprises 45 parts by mass or more of a polyphenylene ether-based resin and 55 parts by mass or less of at least one component selected from a thermoplastic resin and a plasticizer based on 100 parts by mass of the film. The film optionally includes inorganic filler and other additional components.

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000.

Abstract: The disclosure is directed to an adhesive material which can be applied underwater comprising hydrophilic adhesive molecules. In other embodiments, the adhesive material may also include hydrophilic polymers and/or an oxidizing agent.

Abstract: Provided herein are NDGA polymers and metal complexes of such polymers, preferably those metal complexes of the polymers that are insoluble or substantially insoluble in an aqueous solvent, and processes for making the same.

Abstract: Method for increasing at least one of the solubility and dispersibility of a quaterrylene and/or terrylene dye in a liquid medium, including binding the quaterrylene or terrylene dye to a polymer which is soluble in the liquid medium. Various aspects relate without limitation to polymer-bonded quaterrylene or terrylene dyes, processes, markings, security features, articles and dye-doped polymers.

Abstract: The invention includes a cross-linking composition comprising a cross-linking compound and a cross-linking reaction additive selected from an organic acid and/or an acetate compound, wherein the cross-linking compound has the structure according to formula (IV): wherein the cross-linking reaction additive is capable of reacting with the cross-linking compound to form a reactive oligomer intermediate, which is capable of cross-linking an organic polymer. Also included is an organic polymer composition for use in forming a cross-linked organic polymer, comprising a cross-linking compound of Formula (IV), a cross-linking reaction additive and at least one organic polymer. In one embodiment, the at least one organic polymer has at least one halogen-containing reactive group and is dehalogenated by reacting with an alkali metal compound.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: Disclosed herein is a two-component structural adhesive based on organic compounds containing radically polymerizable multiple bonds, in particular substituted acrylates and/or methacrylates, which on account of their lack of acids are particularly suited for adhering rare earth permanent magnets based on neodymium-iron-boron.

Abstract: Processes for the continuous production of conjugated polymers are disclosed. The processes provide excellent control over reaction parameters and are highly reproducible. The conjugated polymers find use in heterojunction devices.

Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound to into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000.

Abstract: The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

Abstract: Binder compositions for making fiberglass products and methods for making and using same are provided. The binder composition can include a phenol-aldehyde resin or a mixture of Maillard reactants and one or more modifiers selected from the group consisting of a copolymer comprising one or more vinyl aromatic derived units and at least one of maleic anhydride and maleic acid; an adduct of styrene, at least one of maleic anhydride and maleic acid, and at least one of an acrylic acid and an acrylate; and one or more latexes.

Abstract: The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.

Abstract: A medical device comprises parts made by injection moulding and parts made by machining such that the respective parts have similar colours, measured on the L*, a*, b* scale. The parts made by injection moulding may be made in a process which involves introducing molten material comprising polymeric material such as PEEK into a mould, wherein a mould surface which contacts the molten material is at a temperature of at least 210° C. and maintaining the molten material in the mould for at least 90 seconds.

Abstract: A toughening agent for use in making composites comprises an epoxy curing agent and a thermoplastic. Compositions, composites that comprise the toughening agent and associated methods of making and using the toughening agent are also disclosed.

Abstract: One embodiment of the invention includes a shape memory polymer which functions similar to a traditional mechanical clamp. A shape memory polymer may exhibit adhesive properties when heated above its glass transition temperature. The shape memory polymers may function as a reversible dry adhesive clamp.

Abstract: The present description discloses a polymeric composition which is a melt-processed alloy comprised of (a) a polyarylene sulfide resin, (b) a polyaryl-ether-ketone resin, and a reactive compound which results in (c) a graft copolymer of the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin in addition to the starting resins. Exemplary melt-processed polymeric compositions can be made by reacting an alkoxy silane with the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin to produce a graft copolymer of a portion of one or both of the resins, sufficient to render the composition uniform and homogeneous. It is normally preferred for the exemplary organosilane compound, to be an amino silane. The subject invention further reveals an insulated wire comprising (1) an electrical conductor and (2) a layer of the melt-processed alloy composition; and fiber reinforced composites comprising fibers substantially fully impregnated with the alloy polymeric composition.

Abstract: Disclosed herein are the compounds shown below. Also disclosed are methods of making the compounds. R1=—O—; R2=any alkyl chain; R3=—CH3, —CN, —COOCH3, -tetrazole, -imidazole, or -triazole; R4=—H or —R5; R5=—H, -halogen, —C?CH, or —C?C—; n is a positive integer; and m is a positive integer.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: A positive displacement pump and methods of making a positive displacement pump having a component, the component having a density ranging from more than 0 to 3 g/cm3, a glass transition temperature (Tg) greater than or equal to 150° C., and a yield strength retention greater than 90% after soaking in engine oil for 7 days at 150° C.

Abstract: An intermediate transfer member that includes a sulfonated poly(ether ether ketone) polymer, an optional conductive component, an optional polymer, and an optional release additive.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A thermoplastic composition is prepared by melt blending a poly(arylene ether) and an other resin, where the poly(arylene ether) has a particular molecular weight distribution. The thermoplastic composition exhibits significantly increased melt flow compared to compositions containing poly(arylene ether)s with similar intrinsic viscosities but different molecular weight distributions. The increased melt flow facilitates preparation of the thermoplastic composition and subsequent article fabrication procedures.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A poly(phenylene ether)-poly(hydroxy ether) block copolymer is used to compatibilize blends of polar polymers and non-polar polymers. The resulting compatibilized blends exhibit physical property improvements relative to blends without a compatibilizer and blends with a poly(hydroxy ether).

Abstract: Blend (B) comprising at least one polyarylene in a form other than fibers, and at least one poly(aryl ether ketone). Blend (T) comprising at least one polyarylene, at least one poly(aryl ether ketone) and at least one poly(aryl ether sulfone). Article or part of an article comprising the blend (B) or the blend (T).

Abstract: Described are polyesters comprising (a) a dicarboxylic acid component comprising terephthalic acid residues; optionally, aromatic dicarboxylic acid residues or aliphatic dicarboxylic acid residues; 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues; and cyclohexanedimethanol residues. The polyesters have a desirable combination of inherent viscosity and glass transition temperature (“Tg”). The polyesters can have an inherent viscosity from 0.35 to 1.2 dL/g as determined in 60/40 (wt/wt) phenol/tetrachloroethane at a concentration of 0.5 g/100 ml at 25° C. and a Tg of 85 to 115° C. The polyesters may be manufactured into articles such as fibers, films, bottles or sheets.

Abstract: The invention is generally directed to baby bottles and other articles produced by blow molding from polymeric materials having glass transition temperatures ranging from 100° C. to 130° C., as well as to processes for producing them. These articles can be exposed to boiling water and can be produced by using a suitable combination of a stretch ratio of less than 3 and a preform temperature at least 20° C. greater than the glass transition temperature (Tg) of the polymeric material.