Solid Polymer Derived From Imide Reactant Patents (Class 525/422)
  • Patent number: 12043737
    Abstract: A molded article which exhibits an improved vibration-damping effect. The vibration-damping molded article includes a resin composition including at least a thermoplastic resin A, an olefin-based elastomer B having a reactive functional group, and an inorganic filler C, wherein the inorganic filler C is coated with the olefin-based elastomer B.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: July 23, 2024
    Assignee: POLYPLASTICS CO., LTD.
    Inventor: Takanobu Teraoka
  • Patent number: 12007531
    Abstract: The present disclosure relates to a contact lens containing ceria particles. Further, the present disclosure relates to a method for manufacturing a contact lens containing ceria particles. The method includes preparing ceria particles; preparing poly-2-hydroxyethyl methacrylate (PHEMA or poly-HEMA) in a form of cross-linked hydrogel; mixing the ceria particles and the monomer mixture for poly-2-hydroxyethyl methacrylate (PHEMA or poly-HEMA) with each other to form a mixture; and injecting the mixture in a mold having a contact lens shape; and performing photo-curing polymerization of the mixture. The contact lens effectively eliminates the reactive oxygen species and harmful radicals that are identified as a cause of eye diseases.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: June 11, 2024
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Jae Yun Kim, Bong Guen Cha, Seung Woo Choi
  • Patent number: 11692090
    Abstract: A polymer composition of cross-linked fluoropolymers is provided, that is generated using a fluoropolymer compatibilizer. The cross-linked fluoropolymers have excellent mechanical and dielectric characteristics at high temperatures, making them useful for such applications as insulation for automotive communications cables and PCB laminates.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: July 4, 2023
    Assignees: DAIKIN AMERICA, INC., DAIKIN INDUSTRIES, LTD.
    Inventors: Arthur W. Martin, Kyle R. Ptak, Lensey H. Smith, Dakarai Kameron Brown
  • Patent number: 11518882
    Abstract: A resin composition includes the following components or a prepolymerized product thereof. (A) 100 parts by weight of a prepolymer and (B) 5 parts by weight to 30 parts by weight of a diallyl bisphenol resin, wherein the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: December 6, 2022
    Assignee: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
    Inventors: Teng Xu, Zhilong Hu, Shuwen Liu, Cheng Li, Yuhui Liu
  • Patent number: 10935699
    Abstract: An amorphous, optically transparent, colorless shape memory assisted self-healing coating for optical glassware applications that uses a combination of surface shape memory and self-healing properties to repair damaged sites on glass substrates when exposed to a thermal stimulus. The coating includes a miscible combination of a network polymer and a linear polymer having glass transition temperate between room temperature and about 40 degrees C. The coating can be used for corrective eyewear, for windshields and windows in automobiles and motorcycles, as well for as optical coatings wherever needed.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: March 2, 2021
    Assignee: Syracuse University
    Inventors: Patrick T. Mather, Erika Rodriguez, Xiaofan Luo, Sabrina Crandall
  • Patent number: 10629342
    Abstract: A rare earth bonded magnet comprises a rare earth-iron-based magnetic powder and a thermosetting resin composition. The thermosetting resin composition is obtained by blending a dicyclopentadiene type epoxy resin as a base resin and dicyandiamide as a curing agent. The dicyclopentadiene type epoxy resin includes a predetermined structure wherein an average value of a repeating unit n is 1 to 3.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 21, 2020
    Assignee: MINEBEA MITSUMI INC.
    Inventors: Shiho Ohya, Yu Okawara, Susumu Teraoka, Toshinori Suzuki, Akihiro Yamane
  • Patent number: 9267005
    Abstract: Disclosed is a flexible maleimide polymer. The flexible maleimide polymer includes a reaction product of reactants (a)-(c). The reactant (a) is maleimide, a compound with a structure represented by Formula (I), a compound with a structure represented by Formula (II), or combinations thereof wherein R1 is —(CH2)10—CO2H, and R2 is H, OH, SO3Na, NO2, CN or CO2H. The reactant (b) is a compound with a structure represented by formula (III) wherein A is R3 is H or methyl group, x is between 1-12, R4 is H or methyl group, and y and z are both between 1-5. The reactant (c) is a compound with a structure represented by formula (IV), or a compound with a structure represented by formula (V) wherein R5 and R6 are independent H or C1-4 alkyl group.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: February 23, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Li-Fu Huang, Li-Duan Tsai, Wei-Hsin Wu
  • Patent number: 9051416
    Abstract: Uncured thermosetting resins are loaded with relatively high amounts of solid thermoplastic resin particles to form a resin precursor. The resin precursor is heat treated so as to produce an uncured resin composition wherein the thermoplastic resin particles become substantially dissolved in the thermosetting resin without causing cure of the resin mixture. Heat treatment of highly loaded thermosetting resins in accordance with the present invention provides uncured resin compositions that are well suited for use in fabricating composite structures and particularly prepreg for use in lightning protection surface coatings.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: June 9, 2015
    Assignee: Hexcel Corporation
    Inventor: Cary Joseph Martin
  • Patent number: 9012537
    Abstract: There may be provided a process for producing a polyimide siloxane solution composition having a further improved long-term viscosity stability; and a polyimide siloxane solution composition. In the process for producing the polyimide siloxane solution composition by polymerizing/imidizing a tetracarboxylic acid component and a diamine component consisting of (a) a diaminopolysiloxane, (b) a diamine having a polar group and (c) a diamine other than (a) and (b) in a solvent, the tetracarboxylic acid component and the diamine component excluding (b) the diamine having a polar group are polymerized/imidized to provide a reaction mixture solution, and then (b) the diamine having a polar group is added to the reaction mixture solution last, and the mixture is polymerized/imidized.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 21, 2015
    Assignee: Ube Industries, Ltd.
    Inventors: Susumu Takasaki, Hiroo Yamashita, Seiichirou Takabayashi, Tomoko Hayashida, Mitsuo Yamanaka, Takafumi Hirakawa
  • Patent number: 8986846
    Abstract: A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: March 24, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Jun Lee, Mahn Jong Kim, Kwang Hee Kim
  • Patent number: 8946322
    Abstract: Thermosetting resins are provided that are toughened with an irradiated thermoplastic toughening agent and which have reduced levels of solvent-induced micro crack formation. The thermoplastic toughening agent is treated with a sufficient amount of high-energy radiation (e.g. electron beam or gamma rays) to cause a reduction in solvent-induced micro crack formation in the cured resin when compared to the same toughened thermosetting resin in which the non-irradiated version of the thermoplastic toughening agent is used.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: February 3, 2015
    Assignee: Hexcel Composites Ltd
    Inventors: John L. Cawse, Stephen Mortimer, Chrisopher J. Wade
  • Publication number: 20140275335
    Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: ITEQ CORPORATION
    Inventors: Meng-Song YIN, Li-Chun CHEN
  • Patent number: 8722187
    Abstract: The disclosure relates to a process that includes blending a polyimide resin and a primary alky amine organic compound to produce an aryl amine functionalized polyimide, having aryl amine functionality in excess of any anhydride functionality. The polyimide resin can have a weight average molecular weight (Mw) from 5,000 to 100,000 daltons. The organic compound can include at least one primary aliphatic amine without a direct linkage of a nitrogen to an aryl group and without a functionality selected from a halogen functionality, a hydroxyl functionality, a sulfonic acid functionality, a sulfonic acid salt functionality, and combinations thereof. The disclosure also relates to alkyl imide functionalized polyimides also with aryl amine functionalized polyimides, having aryl amine functionality in excess of any anhydride functionality and articles produced therefrom.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: May 13, 2014
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Robert R. Gallucci, Roy Odle, Daniel F. Lowery, Richard Peters
  • Patent number: 8697813
    Abstract: The present invention relates to a reversible fluorescence photoswitch based on the dye-crosslinked dendritic nanoclusters for high-contrast imaging of living biological systems. The dendritic nanocluster according to the present invention consists of two or more dendrimers crosslinked each other to have a globular shape overall, and thereby enhancing the fluorescence intensity and improving the detection sensitivity of the monomeric dendrimers. In addition, the dendritic nanocluster according to the present invention was found to internalize into a living zebrafish by both skin permeation and microinjection, independently. Further, the dendritic nanocluster according to the present invention showed low toxicity and thus it could be useful for both in vivo and in vitro imaging as well as the ex vivo cell tracking applications.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: April 15, 2014
    Assignee: Korea Research Institute of Bioscience and Biotechnology
    Inventors: Yoonkyung Kim, Hye-youn Jung, Bong Hyun Chung
  • Patent number: 8653202
    Abstract: An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: February 18, 2014
    Assignee: TORAY Industries, Inc.
    Inventors: Koichi Fujimaru, Toshihisa Nonaka
  • Publication number: 20140000948
    Abstract: There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.
    Type: Application
    Filed: January 17, 2012
    Publication date: January 2, 2014
    Inventors: Shunsuke Nagai, Masato Miyatake, Tomohiko Kotake, Shintaro Hashimoto, Yasuo Inoue, Shin Takanezawa, Hikari Murai
  • Patent number: 8557928
    Abstract: A liquid crystal alignment agent is provided that includes a polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. In Chemical Formulae 1 and 2, each X1, X2, Y1 and Y2 is the same as in the detailed description.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: October 15, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Eun-Ha Kim, Myoung-Youp Shin, Jae-Deuk Yang, Yong-Sik Yoo, Guk-Pyo Jo, Jung-Gon Choi
  • Patent number: 8557912
    Abstract: An aromatic vinyl-based thermoplastic resin composition includes a rubber-modified acrylic graft copolymer and a branched aromatic vinyl copolymer resin including a silicon compound.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: October 15, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Jin Hwa Chung, Kee Hae Kwon, Il Jin Kim, Kwang Soo Park, Ja Kwan Koo
  • Patent number: 8541108
    Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyimide polymer and a hydroxyl terminated polybutadiene. A method of manufacturing a fuser member containing a polyimide polymer and a hydroxyl terminated polybutadiene is presented.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: September 24, 2013
    Assignee: Xerox Corporation
    Inventor: Jin Wu
  • Publication number: 20130237040
    Abstract: The present invention relates to a resin composition containing: a polyimide silicone which has, in a silicone moiety therein, a crosslinking site at which a crosslinking reaction occurs upon heating at a second temperature, in which the crosslinking reaction proceeds by heating a third temperature that exceeds the second temperature further than the second temperature; and a solvent which vaporizes upon heating at a first temperature that is lower than the second temperature.
    Type: Application
    Filed: April 19, 2013
    Publication date: September 12, 2013
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventor: Junichi KAKUTA
  • Publication number: 20130136714
    Abstract: PEO-PPO-PEO polymers and vinyl monomers are used to prepare several block copolymers via consecutive atom transfer radical polymerization (ATRP). The block copolymers provide good delivery characteristics and can be used as a gene/drug delivery carrier for therapy and diagnosis.
    Type: Application
    Filed: August 10, 2012
    Publication date: May 30, 2013
    Applicant: KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Li-Fang Wang, Shih-Jer Huang, Zhi-Rong Hsu
  • Patent number: 8362151
    Abstract: The present invention provides novel hybrid polymer useful for alignment layers for inducing alignment of a liquid crystal medium. Hybrid polymers of this invention are prepared from a) at least one component selected from the group consisting of oligomer(s) and polymer(s) within the class of polyimides, poly(amic acids) and esters thereof wherein the at least one component comprises at least one initiator generating moiety, and b) at least one component selected from the group consisting of addition monomer(s) and addition polymer(s), wherein the two components are covalently bonded to form a copolymer. The invention further describes liquid crystal elements such as all liquid crystal display products or modes, liquid crystal devices and liquid crystal optical films comprising the novel hybrid polymer alignment layers.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: January 29, 2013
    Assignee: Elsicon, Inc.
    Inventors: Chunhong Li, Wayne Gibbons
  • Patent number: 8349539
    Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: January 8, 2013
    Assignee: Eternal Chemical Co., Ltd.
    Inventors: Meng-Yen Chou, Chuan-Zong Lee
  • Patent number: 8344074
    Abstract: The invention relates to a liquid dispersant based on polyamine-graft-polyacrylate blend, its preparation and its use in solvent borne systems, especially to a polyamine-g-polyacrylate grafted copolymer blend of the general formula (1) or a mixture of formula (1) and YT-(A1,A2)-Y1 wherein T is a polyamine or polyimine, A1 is a bridging bond which is selected from amide or amide, A2 is a —N—C— bridging bond, Y is an acrylate residue of the general formula (2), wherein, R1 and R2 are, independently, hydrogen or C1-20alkyl, aryl, heteroaryl, substituted aryl. n is a number of 1-1000, wherein the polyamine-g-polyacrylate grafted copolymer blend has an average molecular weight of 50 000 g/mol to 150 000 g/mol and a polydispersity Mw/Mn is greater than 3.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: January 1, 2013
    Assignee: BASF SE
    Inventors: Huiguang Kou, Yanfei Liu
  • Patent number: 8338510
    Abstract: Various embodiments provide a photosensitive siloxane composition containing (a) polysiloxane, (b) a quinone diazide compound, (c) a solvent, and (d) one or more kinds of specified imidosilane compounds. Various embodiments also provide a cured film obtained by applying and/or patterning the photosensitive siloxane composition. Various embodiments further provide a device including the cured film.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: December 25, 2012
    Assignee: Toray Industries, Inc.
    Inventor: Mitsuhito Suwa
  • Patent number: 8328906
    Abstract: The present disclosure relates to a high molecular weight, monoesterified polyimide polymer. Such high molecular weight, monoesterified polyimide polymers are useful in forming crosslinked polymer membranes for the separation of fluid mixtures. According to its broadest aspect, the method of making a crosslinked membrane comprises the following steps: (a) preparing a polyimide polymer comprising carboxylic acid functional groups from a reaction solution comprising monomers and at least one solvent; (b) treating the polyimide polymer with a diol at esterification conditions in the presence of dehydrating conditions to form a monoesterified polyimide polymer; and (c) subjecting the monoesterified fiber to transesterification conditions to form a crosslinked fiber membrane, wherein the dehydrating conditions at least partially remove water produced during step (b). The crosslinked membranes can be used to separate at least one component from a feed stream including more than one component.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: December 11, 2012
    Assignees: Chevron U.S.A. Inc., Georgia Tech Research Corporation
    Inventors: Stephen J. Miller, Imona C. Omole, William J. Kronos
  • Patent number: 8329264
    Abstract: Disclosed are a liquid crystal alignment agent, and a liquid crystal alignment film and a liquid crystal display (LCD) including the same. The liquid crystal alignment agent includes a polymer of polyamic acid, a polyimide, or a combination thereof, and an epoxy compound represented by the following Chemical Formula 1. In the above Chemical Formula 1, each substituent is the same as defined in the specification.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: December 11, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Bum-Jin Lee, Won-Seok Dong, Mi-Ra Im, Dong-Seon Uh
  • Patent number: 8309637
    Abstract: The present disclosure relates to a composition with improved flame resistance, to articles made from the composition, and to methods that include processing the composition. The composition can include from 15 to 85 percent by weight of a polyetherimide (PEI), from 15 to 85 percent by weight of a polyphenylsulfone (PPSU), a polyetherimide-siloxane copolymer in an amount up to 12 percent by weight, and from 0 to 0.30 percent by weight of a stabilizer.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: November 13, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Mark Sanner, Robert Russell Gallucci, Rajendra K. Singh
  • Patent number: 8293141
    Abstract: An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
    Type: Grant
    Filed: February 16, 2008
    Date of Patent: October 23, 2012
    Assignee: International Business Machines Corporation
    Inventors: Michael Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca S. Northey, Michael B. Vincent
  • Publication number: 20120220734
    Abstract: The present invention relates to a reversible fluorescence photoswitch based on the dye-crosslinked dendritic nanoclusters for high-contrast imaging of living biological systems. The dendritic nanocluster according to the present invention consists of two or more dendrimers crosslinked each other to have a globular shape overall, and thereby enhancing the fluorescence intensity and improving the detection sensitivity of the monomeric dendrimers. In addition, the dendritic nanocluster according to the present invention was found to internalize into a living zebrafish by both skin permeation and microinjection, independently. Further, the dendritic nanocluster according to the present invention showed low toxicity and thus it could be useful for both in vivo and in vitro imaging as well as the ex vivo cell tracking applications.
    Type: Application
    Filed: August 26, 2011
    Publication date: August 30, 2012
    Applicant: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECH
    Inventors: Yoonkyung Kim, Hye-Youn Jung, Bong Hyun Chung
  • Publication number: 20120196989
    Abstract: The present invention relates to the field of polymer chemistry and more particularly to homopolymers and block copolymers and methods of preparing the same.
    Type: Application
    Filed: March 13, 2012
    Publication date: August 2, 2012
    Applicant: Intezyne Technologies, Incorporated
    Inventors: Kurt Breitenkamp, Kevin N. Sill
  • Patent number: 8114387
    Abstract: Copolymers having linked internal polyether blocks and internal polyamide blocks have advantageous physical properties and solvent-gelling abilities. The copolymer may be prepared from a reaction mixture that contains 1,4-cyclohexane dicarboxylic acid (CHDA) and poly(alkyleneoxy) diamine (PAODA). Optionally, the reaction mixture contains no monofunctional compound reactive with either amine or carboxylic acid groups, however some of this monofunctional compound may be present. Dimer diamine and/or dimer acid may be present in the reaction mixture. A copolymer may also be prepared from a reaction mixture containing dimer acid and at least two diamine compound(s) including PAODA and short-chain aliphatic diamine having 2-6 carbons (SDA), wherein: a) the reaction mixture comprises x grams of PAODA and y grams of SDA, and x/(x+y) is 0.8-0.98; b) the reaction mixture weighs z grams, and x/z is at least 0.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: February 14, 2012
    Assignee: Arizona Chemical Company, LLC
    Inventor: Mark S. Pavlin
  • Publication number: 20120035332
    Abstract: Methods and facilities are provided for extracting a metal, such as an actinide from a solid, such as an ore. A novel class of dendritic macromolecules is provided for use in such extraction having a core, a hyperbranched structure, and a plurality of units satisfying the formula —NR2(C?O)R1, in which R1 is not a continuation of the hyperbranched structure.
    Type: Application
    Filed: September 30, 2011
    Publication date: February 9, 2012
    Inventors: Mamadou S. Diallo, Jean Frechet, Emine Boz
  • Patent number: 8106142
    Abstract: Polyacetylinic oligomers suitable for high-temperature polymer-matrix composites are provided. The polyacetylinic oligomers have the formula: D-A-D wherein D is an endcap including at least one crosslinking functionality; and A is backbone selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone. At least one ethynyl functional group, however, is incorporated into the backbone such that crosslinking is not only realized at the endcaps but also at the ethynyl groups within the backbone of the oligomer itself.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: January 31, 2012
    Assignee: The Boeing Company
    Inventors: Thomas K. Tsotsis, Norman R. Byrd
  • Patent number: 8097657
    Abstract: The present invention relates to organic polymer porous materials, and in particular, to an organic polymer porous material that functions as a reusable insoluble solid catalyst and a method for producing the same. The organic polymer porous material of the present invention is characteristic in that the amount of immobilized bases is high and the specific surface area is large. The object has been achieved by an organic polymer porous material including a polymer (PA) obtained by polymerizing a polymerizable composition (A) containing a compound (a) obtained by reacting a dendrimer (a1) having at least an amino group as a reactive functional group or a polyethyleneimine (a2) having at least an amino group as a reactive functional group with a compound (a3) having a vinyl group and a group that can react with the reactive functional group.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: January 17, 2012
    Assignees: DIC Corporation, Kawamura Institute of Chemical Research
    Inventors: Shinji Kato, Shin Ogasawara
  • Patent number: 8066799
    Abstract: The present disclosure relates to a high molecular weight, monoesterified polyimide polymer. Such high molecular weight, monoesterified polyimide polymers are useful in forming crosslinked polymer membranes for the separation of fluid mixtures. According to its broadest aspect, the method of making a crosslinked membrane comprises the following steps: (a) preparing a polyimide polymer comprising carboxylic acid functional groups from a reaction solution comprising monomers and at least one solvent; (b) treating the polyimide polymer with a diol at esterification conditions in the presence of dehydrating conditions to form a monoesterified polyimide polymer; and (c) subjecting the monoesterified fiber to transesterification conditions to form a crosslinked fiber membrane, wherein the dehydrating conditions at least partially remove water produced during step (b). The crosslinked membranes can be used to separate at least one component from a feed stream including more than one component.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: November 29, 2011
    Assignees: Chevron U.S.A. Inc., Georgia Tech Research Corporation
    Inventors: Stephen J. Miller, Imona C. Omole, William J. Kronos
  • Patent number: 8063168
    Abstract: An oligomer having di-phenylethynyl endcaps is disclosed. The capped oligomer has the formula: D-A-D wherein D is a di-phenylethynyl endcap; and A is an oligomer selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: November 22, 2011
    Assignee: The Boeing Company
    Inventors: Thomas K. Tsotsis, Norman R. Byrd
  • Patent number: 8039057
    Abstract: A polyimide film having a polyimide as the primary constituent and containing at least a polymeric electroconductive material, wherein in a weight-decrease vs. temperature-increase curve when the polyimide film is heated gradually from 30° C., a weight-decrease rate at a first inflection point, where an amount of difference in weight-decrease rates decreases first from 30° C., is in the range of ?1.9% or more and ?1.4% or less.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: October 18, 2011
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Seiichi Kato, Shoichi Morita, Masao Ohkubo, Yoko Miyamoto, Akira Tateishi
  • Patent number: 8030433
    Abstract: Tailorable polyimide resin systems suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods. An exemplary resin system includes first and second prepolymer components present in respective amounts to provide the desired processibility. The cured polyimide system exhibits high glass transition temperature and other properties required for gas turbine engine applications. The first and second prepolymer components independently comprise a monomeric mixture or a reaction product of a diamine component, a dianhydride component, and an end group component.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 4, 2011
    Assignee: General Electric Company
    Inventors: Stephen Mark Whiteker, Lisa Vinciguerra Shafer, Warren Rosal Ronk
  • Patent number: 8017699
    Abstract: The present disclosure relates to a composition with improved flame resistance, to articles made from the composition, and to methods that include processing the composition. The composition can include from 15 to 85 percent by weight of a polyetherimide (PEI), from 15 to 85 percent by weight of a polyphenylsulfone (PPSU), a polyetherimide-siloxane copolymer in an amount up to 12 percent by weight, and from 0 to 0.30 percent by weight of a stabilizer.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: September 13, 2011
    Assignee: SABIC Innovative Plastics IP B.V.
    Inventors: Mark Sanner, Robert Russell Gallucci, Rajendra K. Singh
  • Patent number: 8013251
    Abstract: An electrical wire comprising a conductor and a covering disposed over the conductor. The covering comprises a thermoplastic composition. The thermoplastic composition comprises a blend of an aromatic polyketone and a polysiloxane/polyimide block copolymer. The composition can further comprise one or more additives.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: September 6, 2011
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Yashpal Bhandari, Gurulingamurthy Haralur, Kapil Sheth
  • Patent number: 8013076
    Abstract: A composition comprises a blend of an aromatic polyketone and a polysiloxane/polyimide block copolymer. The composition can further comprise one or more additives.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: September 6, 2011
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Gurulingamurthy M. Haralur, Ganesh Kailasam, Kapil Sheth
  • Patent number: 8008360
    Abstract: A proton exchange membrane and method for formation the same is disclosed. When forming the proton exchange membrane, first, a bismaleimide and barbituric acid are copolymerized to form a hyper-branched polymer. Next, the solvent of the sulfonated tetrafluorethylene copolymer (Nafion) aqueous solution is replaced with dimethyl acetamide (DMAc). 10 to 15 parts by weight of the hyper-branched polymer is added to 90 to 85 parts by weight of the Nafion in the DMAc solution, stood and heated to 50° C. for inter-penetration of the hyper-branched polymer and the Nafion. The heated solution is coated on a substrate, baked, and pre-treated to remove residue solvent to complete formation of the proton exchange membrane.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: August 30, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chung-Liang Chang, Jing-Pin Pan, Tsung-Hsiung Wang, Yueh-Wei Lin, Ya-Tin Hsu
  • Patent number: 7989081
    Abstract: A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: August 2, 2011
    Assignees: Mitsubishi Gas Chemical Company, Inc., PI R&D Co., Ltd.
    Inventors: Mitsuru Nozaki, Morio Gaku, Yasuo Tanaka, Eiji Nagata, Yasuo Kikuchi, Masashi Yano
  • Patent number: 7981518
    Abstract: A thermoplastic resin composition comprising 100 parts by mass of a polyamide resin composition (A) and 0.1 to 10 parts by mass of a carbodiimide compound (B) having two or more carbodiimide groups. The polyamide resin composition (A) contains a polyamide resin (a-1) and nylon 11 and/or nylon 12 (a-2) in an amount of 5 to 95% by mass of the component (a-1) and 95 to 5% by mass of the component (a-2) each based on a total amount of the components (a-1) and (a-2). The polyamide resin (a-1) is constituted by diamine units 70 mol % or more of which are derived from m-xylylenediamine and dicarboxylic acid units 70 mol % or more of which are derived from a C4 to C20 ?,?-linear aliphatic dicarboxylic acid. The thermoplastic resin composition is excellent in barrier property, strength and impact resistance, in particular, barrier property to alcohol-containing fuels, and suitably used as various shaped articles such as fuel containers, tubes and parts.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: July 19, 2011
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventor: Kazunobu Sato
  • Publication number: 20100242723
    Abstract: The present invention discloses blend polymer membranes comprising thermally rearranged polymers derived from aromatic polyimides containing ortho-positioned functional groups and methods for making and using these blend polymer membranes. The blend polymer membranes described in the current invention are prepared by heat treatment of blend polymer membranes comprising aromatic polyimides containing ortho-positioned functional groups such as —OH or —SH groups. In some instances, an additional crosslinking step is performed to improve the selectivity of the membrane. These blend polymer membranes have improved flexibility, reduced cost, improved processability, and enhanced selectivity and/or permeability compared to the comparable polymer membranes that comprise a single polymer.
    Type: Application
    Filed: March 27, 2009
    Publication date: September 30, 2010
    Inventors: Chunqing Liu, Man-Wing Tang
  • Publication number: 20100204412
    Abstract: An oligomer having di-phenylethynyl endcaps is disclosed. The capped oligomer has the formula: D-A-D wherein D is a di-phenylethynyl endcap; and A is an oligomer selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 12, 2010
    Inventors: Thomas K. Tsotsis, Norman R. Byrd
  • Patent number: 7763188
    Abstract: An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: July 27, 2010
    Assignee: International Business Machines Corporation
    Inventors: Michael Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca S. Northey, Michael B. Vincent
  • Patent number: 7750092
    Abstract: A composition having a bismaleimide oligomer and preparation methods thereof are provided. The composition having a bismaleimide oligomer comprises a bismaleimide oligomer, wherein the bismaleimide oligomer is in an amount of more than 75 parts by weight, based on 100 parts by weight of the composition. Specifically, the bismaleimide oligomer is prepared by reacting bismaleimide monomers with batch-added barbituric acid.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: July 6, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Tsung-Hsiung Wang, Jing-Pin Pan, Shur-Fen Liu, Yueh-Wei Lin
  • Publication number: 20090162538
    Abstract: A composition for fixing wound items comprising A) 0 to 90 wt % of at least one ?, ?-unsaturated polyester and/or polyester imide resin based on at least one unsaturated mono-, di- or tricarboxylic acids and/or mono-, di- or tricarboxylic acid group containing molecules, at least one polyol and/or, in case of an unsaturated polyester imide, at least one imide having 5-membered cyclic imide moieties, B) 0.1 to 80 wt % of at least one inorganic and/or organic-inorganic hybrid component having functionalities to react with component A) and C), C) 2 to 80 wt % of at least one monomeric and/or oligomeric unsaturated component to react with component A) and B), and D) 0 to 15 wt % of customary additives, the wt % being based on the total weight of the composition. The composition provides excellent thermal transfer properties and a high level of electrical insulation properties with excellent adhesion and thermal stability.
    Type: Application
    Filed: December 3, 2008
    Publication date: June 25, 2009
    Inventors: Frank-Rainer Boehm, Michael Herm, Murat Gueltekin, Barbara Trappmann