Abstract: The present invention provides a thermoplastic resin composition that excels in the slidability and mold release ability at molding of thermoplastic resin by virtue of mixing of a small amount of a polyorganosiloxane-containing graft copolymer excellent in powder characteristics. The present invention can solve the above-mentioned problem by providing thermoplastic resin composition comprising 0.01 to 5% by weight of a polyorganosiloxane-containing graft copolymer (C) and 99.

Abstract: A modified polyimide resin favorably employable for manufacturing an insulation film of an electric-electronic device is composed of recurring units (I) derived from a biphenyltetracarboxylic acid compound, a diamine compound, and a monoamine compound having at least one hydroxyl group and recurring units (II) derived from diisocyanate and polybutadiene having hydroxyl group at each terminal, which optionally contains further recurring units (III) derived from diisocyanate and a compound having hydroxyl group at each terminal and further having a reactive substituent.

Abstract: The present invention is related to a polyimide, which has high ionic conductivity and good structural stability, does not decompose even under low humidity, and is inexpensive, and a polymer electrolyte and a fuel cell using the same.

Abstract: A solvent-free polyimide silicone resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following formula (1-1) and repeating units represented by the following formula (1-2), a film of said resin with a thickness of 100 ?m prepared on a quartz glass substrate having a light transmittance of 80% or higher at wavelengths of from 350 nm to 450 nm, (b) a reactive diluent, and (c) a photopolymerization initiator wherein X is a tetravalent organic group, Y is a divalent organic group, and Z is a divalent organic group represented by the following formula (2), wherein R1 may be different from each other and is a monovalent hydrocarbon group having 1 to 8 carbon atoms, which group may be substituted, R2 is a monovalent hydrocarbon group having a photopolymerizable group, a and b are each an integer of from 1 to 100 with a+b?100.

Abstract: A thermoplastic composition comprises a polysiloxane/polyimide block copolymer and a polyester/polyether block copolymer. The polysiloxane/polyimide block copolymer has 5 to 50 weight percent (wt %) polysiloxane, based on the total weight of the polysiloxane/polyimide block copolymer. The polyester/polyether block copolymer has 5 to 30 wt % polyether based on the total weight of the polyester/polyether block copolymer. In some embodiments the polysiloxane/polyimide block copolymer is present in an amount of 75 to 99 wt % and the polyester/polyether block copolymer is present in an amount of 1 to 25 wt %, with the weight percent of the block copolymers based on the combined weight of the two block copolymers.

Abstract: A process for producing compositions having improved gas barrier properties, and compositions containing a polyester resin and one or more of another thermoplastic resin and a filler, and may be used to form containers that exhibit improved resistance to gas permeation.

Abstract: The present invention relates to novel polyaspartimides, their method of production and the use of these polyaspartimides as reactive components for polyisocyanates in two-component polyurethane coating compositions. The polyaspartimides are prepared by reacting a polyether amine with a maleimide.

Abstract: The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of at least one secondary monoamine and at least one maleimide, and is suitable for use in coatings and castings.

Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k?2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for micro-electronics.

Abstract: Compositions containing oxetane compounds having ester, amide, urea, carbamate, carbonate, or carbonyl functionality one carbon atom removed from the oxetane ring cure at high temperatures are suitable for use as underfill materials within a semiconductor package, particularly in applications using lead free solder electrical interconnections.

Abstract: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.

Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: Disclosed are copolymers based on aspartic acid or its precursor molecules and methods of their production. The copolymers are water-soluble over a wide range of composition and molecular weight. Their preparation involves conversion of a polysuccinimide to copolymers of defined composition, containing aspartate and succinimide residues and/or residues of asparagine. In particular, the copolymers include water-soluble terpolymers of aspartate, asparagine, and succinimide.

Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.

Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.

Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.

Abstract: The invention relates to new thermoplastically processible transparent polyamide molding materials based on copolyamides containing diamines and dicarboxylic acids with aromatic cores which exhibit a high index of refraction nD20 over 1.59 and a low density under 1.3 g/cm3. At the same time, a low birefringence, high hardness, and scratchresistance are achieved. The polyamide molding materials are fabricated by means of conventional pressure reactors (autoclaves) according to a modified technique. The granulate that is produced from the inventive molding materials is reshaped by thermoplastic processes like injection molding, particularly in multichamber cavity tools. The invention also relates to the utilization of the inventive molding materials for producing optical lenses.

Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.

Abstract: A new class of hybrid organic-inorganic materials, and methods of synthesis, that can be used as a proton exchange membrane in a direct methanol fuel cell. In contrast with Nafion® PEM materials, which have random sulfonation, the new class of materials have ordered sulfonation achieved through self-assembly of alternating polyimide segments of different molecular weights comprising, for example, highly sulfonated hydrophilic PDA-DASA polyimide segment alternating with an unsulfonated hydrophobic 6FDA-DAS polyimide segment. An inorganic phase, e.g., 0.5–5 wt % TEOS, can be incorporated in the sulfonated polyimide copolymer to further improve its properties. The new materials exhibit reduced swelling when exposed to water, increased thermal stability, and decreased O2 and H2 gas permeability, while retaining proton conductivities similar to Nafion®. These improved properties may allow direct methanol fuel cells to operate at higher temperatures and with higher efficiencies due to reduced methanol crossover.

Abstract: A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obtained by reacting an aromatic tetracarboxylic dianhydride including 2,2?,3,3?-biphenyltetracarboxylic dianhydride, an aromatic diamine compound, and a reactive crosslinking agent including an amino group or acid anhydride group and a crosslinkable group in the molecule, and includes a crosslinkable group at the molecular terminal.

Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.

Abstract: Copolymers having linked internal polyether blocks and internal polyamide blocks have advantageous physical properties and solvent-gelling abilities. The copolymer may be prepared from a reaction mixture that contains 1,4-cyclohexane dicarboxylic acid (CHDA) and poly(alkyleneoxy) diamine (PAODA). Optionally, the reaction mixture contains no monofunctional compound reactive with either amine or carboxylic acid groups, however some of this monofunctional compound may be present. Dimer diamine and/or dimer acid may be present in the reaction mixture. A copolymer may also be prepared from a reaction mixture containing dimer acid and at least two diamine compound(s) including PAODA and short-chain aliphatic diamine having 2-6 carbons (SDA), wherein: a) the reaction mixture comprises x grams of PAODA and y grams of SDA, and x/(x+y) is 0.8-0.98; b) the reaction mixture weighs z grams, and x/z is at least 0.

Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).

Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.

Abstract: It is disclosed that a coated polyamide molding product, characterized in that, a polyamide molding product obtained from a polyamide resin composition containing a polyamide resin (A), a thermoplastic resin composition (B) having functional groups reacting with the polyamide resin and, if necessary, an inorganic filler (C) is coated with a thermoplastic resin elastomer (D) which is compatible with the thermoplastic resin composition which is the above-mentioned component (B).

Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.

Abstract: The present invention provides novel hybrid polymer optical alignment layers for inducing alignment of a liquid crystal medium. Hybrid polymers of this invention are prepared from at least one component selected from the group consisting of monomer, macromonomer and polymer within the class of polyimides, poly(amic acids) and esters thereof and at least one component selected from the group consisting of addition monomer and functionalized addition polymer wherein the two components are covalently bonded to form a copolymer. The invention further describes liquid crystal displays comprising the novel branched hybrid polymer optical alignment layers.

Abstract: The present invention relates to novel aspartates, their method of production and the use of these aspartates as reactive components for polyisocyanates in two-component polyurethane coating compositions and for preparing polyurethane prepolymers. The aspartates are prepared by first reacting a di- or polyamine with an unsaturated ester and then reacting the resultant product with a maleimide.

Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.

Abstract: The present invention provides novel hybrid polymer optical alignment layers for inducing alignment of a liquid crystal medium. Hybrid polymers of this invention comprise at least one component of a macromonomer or polymer within the class of polyimide, polyamic acids and esters thereof, and at least one additional component from the group consisting of an addition monomer, monomers and addition polymer that are covalently bonded with the first component to form a copolymer. The invention further describes liquid crystal displays comprising the novel branched hybrid polymer optical alignment layers.

Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: A UV-protective composition comprising a water-soluble polyaminoamide containing 1,3-diimine groups, wherein the polyaminoamide containing 1,3-diimine groups absorbs ultraviolet light radiation having a wavelength of about 200 nm to about 420 nm, and methods of treating substrates with the UV-protective polyaminoamide containing 1,3-diimine groups.

Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.

Abstract: A host-guest polymer system including a polymer with an isoimide group and an organic chromophore and capable of converting into a side-chain polymer system, a side-chain nonlinear optical polymer derived from the host-guest polymer system, and a method for synthesizing the side-chain nonlinear optical polymer are provided. The method for synthesizing the side-chain nonlinear optical polymer involves forming a nonlinear optical polymer film based on a host-guest system in which an organic chromophore having a reactive group capable of nucleophilic reaction with an isoimide group is dispersed in a matrix including a polymer with the isoimide group having the following formula: Next, the nonlinear optical film is poled at a first temperature in an electric field; and the organic chromophore is reacted with the polymer while poling at a second temperature which is higher than the first temperature, to synthesize the side-chain nonlinear optical polymer.

Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least (a) 10-90 wt. % primary aminocarbonamide; (b) 10-90 wt. % aminocarboxylic acid and/or lactam; (c) 0-4 wt. % water; the amounts being relative to the sum of the compounds (a+b+c). Preferably the sum of the compounds (a+b+c) is at least 75 wt. % of the total composition, more preferably 85 wt. %, most preferably 90 wt. %. The polyamide obtained with the process has a &eegr;rel of more than 2.2. The process is eminently suitable for the preparation of polyamide-6 (polycapronamide) from a composition comprising 6-aminocapronamide, 6-aminocaproic acid and/or &egr;-caprolactam. This composition is preferably obtained via the reductive amination of a 5-formylyalerate ester, preferably 5-formylmethylvalerate in water.

Abstract: Disclosed are copolymers based on aspartic acid or its precursor molecules and methods of their production. The copolymers are water-soluble over a wide range of composition and molecular weight. Their preparation involves conversion of a polysuccinimide to copolymers of defined composition, containing aspartate and succinimide residues and/or residues of asparagine. In particular, the copolymers include water-soluble terpolymers of aspartate, asparagine, and succinimide.

Abstract: Light emitting devices are described which incorporate, as the light emitting element, a dendrimer of which the constituent dendrons include a conjugated dendritic structure comprising aryl and/or heteroaryl groups connected to each other via bonds between Sp2 hybridised ring atoms of said aryl or heteroaryl groups.

Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.

Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.

Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.

Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.

Abstract: An electrically conductive thermoplastic composition with a superior ability to be heated rapidly in an electromagnetic field comprises a polyetherimide resin, a polyester resin, and electrically conductive filler. Such compositions display good dimensional stability at elevated temperatures especially when heated rapidly using electromagnetic radiation, which renders them useful in articles and operations where rapid assembly is important.

Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.

Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide

Abstract: A conductive polymer gel composition including a copolymer with alkenyl monomer units and maleimide monomer units, a crosslinking agent, and an electrolyte solution. The conductive polymer has a current resistance less than or equal to 10−4 ohms and can be used to provide electrolyte cells.

Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.