Solid Polymer Derived From Imide Reactant Patents (Class 525/422)
  • Patent number: 7465780
    Abstract: The present invention is related to a polyimide, which has high ionic conductivity and good structural stability, does not decompose even under low humidity, and is inexpensive, and a polymer electrolyte and a fuel cell using the same.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: December 16, 2008
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Myung-sup Jung, Do-yun Kim, Min-ju Jeong
  • Patent number: 7432313
    Abstract: A solvent-free polyimide silicone resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following formula (1-1) and repeating units represented by the following formula (1-2), a film of said resin with a thickness of 100 ?m prepared on a quartz glass substrate having a light transmittance of 80% or higher at wavelengths of from 350 nm to 450 nm, (b) a reactive diluent, and (c) a photopolymerization initiator wherein X is a tetravalent organic group, Y is a divalent organic group, and Z is a divalent organic group represented by the following formula (2), wherein R1 may be different from each other and is a monovalent hydrocarbon group having 1 to 8 carbon atoms, which group may be substituted, R2 is a monovalent hydrocarbon group having a photopolymerizable group, a and b are each an integer of from 1 to 100 with a+b?100.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: October 7, 2008
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Yoneda, Michihiro Sugo
  • Publication number: 20080223602
    Abstract: A thermoplastic composition comprises a polysiloxane/polyimide block copolymer and a polyester/polyether block copolymer. The polysiloxane/polyimide block copolymer has 5 to 50 weight percent (wt %) polysiloxane, based on the total weight of the polysiloxane/polyimide block copolymer. The polyester/polyether block copolymer has 5 to 30 wt % polyether based on the total weight of the polyester/polyether block copolymer. In some embodiments the polysiloxane/polyimide block copolymer is present in an amount of 75 to 99 wt % and the polyester/polyether block copolymer is present in an amount of 1 to 25 wt %, with the weight percent of the block copolymers based on the combined weight of the two block copolymers.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 18, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Robert Russell Gallucci, Gurulingamurthy M. Haralur, Sanjay Mishra, Mark Sanner
  • Patent number: 7358324
    Abstract: A process for producing compositions having improved gas barrier properties, and compositions containing a polyester resin and one or more of another thermoplastic resin and a filler, and may be used to form containers that exhibit improved resistance to gas permeation.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: April 15, 2008
    Assignee: Dak Americas LLC
    Inventors: Chi-Chin Chen, Peter S. Kezios, Helen Codd, Karl Buchanan
  • Patent number: 7307140
    Abstract: The present invention relates to novel polyaspartimides, their method of production and the use of these polyaspartimides as reactive components for polyisocyanates in two-component polyurethane coating compositions. The polyaspartimides are prepared by reacting a polyether amine with a maleimide.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: December 11, 2007
    Assignee: Bayer MaterialScience LLC
    Inventors: Karsten Danielmeier, Charles A. Gambino, Rolf Gertzmann, Richard R. Roesler, Terrell D. Wayt, Edward P. Squiller, Michele E. Honko, Karen Marie Henderson
  • Patent number: 7294683
    Abstract: The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of at least one secondary monoamine and at least one maleimide, and is suitable for use in coatings and castings.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: November 13, 2007
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Kevin C. Olson, Gregory J. McCollum, Linda K. Anderson
  • Patent number: 7244803
    Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k?2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for micro-electronics.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: July 17, 2007
    Assignee: Infineon Technologies AG
    Inventors: Recai Sezi, Andreas Walter, Anna Maltenberger, Klaus Lowack, Marcus Halik
  • Patent number: 7230055
    Abstract: Compositions containing oxetane compounds having ester, amide, urea, carbamate, carbonate, or carbonyl functionality one carbon atom removed from the oxetane ring cure at high temperatures are suitable for use as underfill materials within a semiconductor package, particularly in applications using lead free solder electrical interconnections.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: June 12, 2007
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Osama M. Musa
  • Patent number: 7147906
    Abstract: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: December 12, 2006
    Assignee: General Electric Company
    Inventors: Eugene David Herrmann, James Anthony Cella, John Bradford Reitz, Racid Kerboua, Irene Dris
  • Patent number: 7129318
    Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: October 31, 2006
    Assignee: I.S.T. (MA) Corporation
    Inventors: Gary L. Deets, Jianming Xiong
  • Patent number: 7108807
    Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: September 19, 2006
    Assignee: Infineon Technologies AG
    Inventors: Recai Sezi, Andreas Walter, Klaus Lowack, Anna Maltenberger, Robert Banfic
  • Patent number: 7091305
    Abstract: Disclosed are copolymers based on aspartic acid or its precursor molecules and methods of their production. The copolymers are water-soluble over a wide range of composition and molecular weight. Their preparation involves conversion of a polysuccinimide to copolymers of defined composition, containing aspartate and succinimide residues and/or residues of asparagine. In particular, the copolymers include water-soluble terpolymers of aspartate, asparagine, and succinimide.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: August 15, 2006
    Assignee: Aquero Company
    Inventor: C. Steven Sikes
  • Patent number: 7074880
    Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: July 11, 2006
    Assignee: Aspen Aerogels, Inc.
    Inventors: Wendell Rhine, Jing Wang, Redouane Begag
  • Patent number: 7071282
    Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: July 4, 2006
    Assignee: General Electric Company
    Inventors: Havva Acar, Daniel Joseph Brunelle
  • Patent number: 7053168
    Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 30, 2006
    Assignee: General Electric Company
    Inventors: Norberto Silvi, Mark Howard Giammattei, Paul Edward Howson, Farid Fouad Khouri
  • Patent number: 7053169
    Abstract: The invention relates to new thermoplastically processible transparent polyamide molding materials based on copolyamides containing diamines and dicarboxylic acids with aromatic cores which exhibit a high index of refraction nD20 over 1.59 and a low density under 1.3 g/cm3. At the same time, a low birefringence, high hardness, and scratchresistance are achieved. The polyamide molding materials are fabricated by means of conventional pressure reactors (autoclaves) according to a modified technique. The granulate that is produced from the inventive molding materials is reshaped by thermoplastic processes like injection molding, particularly in multichamber cavity tools. The invention also relates to the utilization of the inventive molding materials for producing optical lenses.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: May 30, 2006
    Assignee: Ems-Chemie AG
    Inventor: Friedrich Severin Bühler
  • Patent number: 7026436
    Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 11, 2006
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Kuppusamy Kanakarajan
  • Patent number: 7022810
    Abstract: A new class of hybrid organic-inorganic materials, and methods of synthesis, that can be used as a proton exchange membrane in a direct methanol fuel cell. In contrast with Nafion® PEM materials, which have random sulfonation, the new class of materials have ordered sulfonation achieved through self-assembly of alternating polyimide segments of different molecular weights comprising, for example, highly sulfonated hydrophilic PDA-DASA polyimide segment alternating with an unsulfonated hydrophobic 6FDA-DAS polyimide segment. An inorganic phase, e.g., 0.5–5 wt % TEOS, can be incorporated in the sulfonated polyimide copolymer to further improve its properties. The new materials exhibit reduced swelling when exposed to water, increased thermal stability, and decreased O2 and H2 gas permeability, while retaining proton conductivities similar to Nafion®. These improved properties may allow direct methanol fuel cells to operate at higher temperatures and with higher efficiencies due to reduced methanol crossover.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: April 4, 2006
    Assignee: Sandia Corporation
    Inventor: Christopher J. Cornelius
  • Patent number: 7019103
    Abstract: A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obtained by reacting an aromatic tetracarboxylic dianhydride including 2,2?,3,3?-biphenyltetracarboxylic dianhydride, an aromatic diamine compound, and a reactive crosslinking agent including an amino group or acid anhydride group and a crosslinkable group in the molecule, and includes a crosslinkable group at the molecular terminal.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: March 28, 2006
    Assignees: JSR Corporation, Ube Industries, Ltd.
    Inventors: Rikio Yokota, Kohei Goto, Hideki Ozawa
  • Patent number: 6956100
    Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: October 18, 2005
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masahiro Imaizumi, Toyofumi Asano, Masaki Shinmoto
  • Patent number: 6956099
    Abstract: Copolymers having linked internal polyether blocks and internal polyamide blocks have advantageous physical properties and solvent-gelling abilities. The copolymer may be prepared from a reaction mixture that contains 1,4-cyclohexane dicarboxylic acid (CHDA) and poly(alkyleneoxy) diamine (PAODA). Optionally, the reaction mixture contains no monofunctional compound reactive with either amine or carboxylic acid groups, however some of this monofunctional compound may be present. Dimer diamine and/or dimer acid may be present in the reaction mixture. A copolymer may also be prepared from a reaction mixture containing dimer acid and at least two diamine compound(s) including PAODA and short-chain aliphatic diamine having 2-6 carbons (SDA), wherein: a) the reaction mixture comprises x grams of PAODA and y grams of SDA, and x/(x+y) is 0.8-0.98; b) the reaction mixture weighs z grams, and x/z is at least 0.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: October 18, 2005
    Assignee: Arizona Chemical Company
    Inventor: Mark S. Pavlin
  • Patent number: 6949618
    Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: September 27, 2005
    Assignee: Chisso Corporation
    Inventor: Takashi Kato
  • Patent number: 6949619
    Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: September 27, 2005
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuhiro Ichiroku, Masachika Yoshino, Hideki Akiba, Toshio Shiobara
  • Patent number: 6930165
    Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: August 16, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6924034
    Abstract: It is disclosed that a coated polyamide molding product, characterized in that, a polyamide molding product obtained from a polyamide resin composition containing a polyamide resin (A), a thermoplastic resin composition (B) having functional groups reacting with the polyamide resin and, if necessary, an inorganic filler (C) is coated with a thermoplastic resin elastomer (D) which is compatible with the thermoplastic resin composition which is the above-mentioned component (B).
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: August 2, 2005
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tsutomu Tamura, Yoshinobu Hanaoka, Tomohide Nakagawa
  • Patent number: 6919418
    Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: July 19, 2005
    Inventors: Farid Fouad Khouri, Daniel Joseph Brunelle, Donald Scott Johnson
  • Patent number: 6919404
    Abstract: The present invention provides novel hybrid polymer optical alignment layers for inducing alignment of a liquid crystal medium. Hybrid polymers of this invention are prepared from at least one component selected from the group consisting of monomer, macromonomer and polymer within the class of polyimides, poly(amic acids) and esters thereof and at least one component selected from the group consisting of addition monomer and functionalized addition polymer wherein the two components are covalently bonded to form a copolymer. The invention further describes liquid crystal displays comprising the novel branched hybrid polymer optical alignment layers.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: July 19, 2005
    Assignee: Elsicon, Inc.
    Inventors: Wayne M. Gibbons, Michael G. P. Reppy, Patricia A. Rose, Hanxing Zheng
  • Patent number: 6911501
    Abstract: The present invention relates to novel aspartates, their method of production and the use of these aspartates as reactive components for polyisocyanates in two-component polyurethane coating compositions and for preparing polyurethane prepolymers. The aspartates are prepared by first reacting a di- or polyamine with an unsaturated ester and then reacting the resultant product with a maleimide.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: June 28, 2005
    Assignees: Bayer MaterialScience LLC, Bayer MaterialScience AG
    Inventors: Karsten Danielmeier, Charles A. Gambino, Rolf Gertzmann, Richard R. Roesler, Terrell D. Wayt, Michele E. Vargo, Edward P. Squiller, Karen M. Henderson
  • Patent number: 6906165
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: June 14, 2005
    Assignee: Rhodia Engineering Palstics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6900271
    Abstract: The present invention provides novel hybrid polymer optical alignment layers for inducing alignment of a liquid crystal medium. Hybrid polymers of this invention comprise at least one component of a macromonomer or polymer within the class of polyimide, polyamic acids and esters thereof, and at least one additional component from the group consisting of an addition monomer, monomers and addition polymer that are covalently bonded with the first component to form a copolymer. The invention further describes liquid crystal displays comprising the novel branched hybrid polymer optical alignment layers.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: May 31, 2005
    Assignee: Elsicon, Inc
    Inventors: Wayne M. Gibbons, Michael G. P. Reppy, Patricia A. Rose, Hanxing Zheng
  • Patent number: 6887967
    Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: May 3, 2005
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
  • Patent number: 6887400
    Abstract: A UV-protective composition comprising a water-soluble polyaminoamide containing 1,3-diimine groups, wherein the polyaminoamide containing 1,3-diimine groups absorbs ultraviolet light radiation having a wavelength of about 200 nm to about 420 nm, and methods of treating substrates with the UV-protective polyaminoamide containing 1,3-diimine groups.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: May 3, 2005
    Assignee: Nalco Company
    Inventors: Mingli Wei, Yin Z. Hessefort, Wayne M. Carlson
  • Patent number: 6884865
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: April 26, 2005
    Assignee: Rhodia Engineering Plastics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6828413
    Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least (a) 10-90 wt. % primary aminocarbonamide; (b) 10-90 wt. % aminocarboxylic acid and/or lactam; (c) 0-4 wt. % water; the amounts being relative to the sum of the compounds (a+b+c). Preferably the sum of the compounds (a+b+c) is at least 75 wt. % of the total composition, more preferably 85 wt. %, most preferably 90 wt. %. The polyamide obtained with the process has a &eegr;rel of more than 2.2. The process is eminently suitable for the preparation of polyamide-6 (polycapronamide) from a composition comprising 6-aminocapronamide, 6-aminocaproic acid and/or &egr;-caprolactam. This composition is preferably obtained via the reductive amination of a 5-formylyalerate ester, preferably 5-formylmethylvalerate in water.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: December 7, 2004
    Assignee: OSM IP Asseta, B.V.
    Inventors: Cornelis E. Koning, Rudy Rulkens, Nicolaas F. Haasen, Albert A. Van Geenen
  • Patent number: 6828409
    Abstract: A host-guest polymer system including a polymer with an isoimide group and an organic chromophore and capable of converting into a side-chain polymer system, a side-chain nonlinear optical polymer derived from the host-guest polymer system, and a method for synthesizing the side-chain nonlinear optical polymer are provided. The method for synthesizing the side-chain nonlinear optical polymer involves forming a nonlinear optical polymer film based on a host-guest system in which an organic chromophore having a reactive group capable of nucleophilic reaction with an isoimide group is dispersed in a matrix including a polymer with the isoimide group having the following formula: Next, the nonlinear optical film is poled at a first temperature in an electric field; and the organic chromophore is reacted with the polymer while poling at a second temperature which is higher than the first temperature, to synthesize the side-chain nonlinear optical polymer.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: December 7, 2004
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seung Koo Park, Jung Yun Do, Jung Jin Ju, Suntak Park, Myung-Hyun Lee
  • Patent number: 6825313
    Abstract: Disclosed are copolymers based on aspartic acid or its precursor molecules and methods of their production. The copolymers are water-soluble over a wide range of composition and molecular weight. Their preparation involves conversion of a polysuccinimide to copolymers of defined composition, containing aspartate and succinimide residues and/or residues of asparagine. In particular, the copolymers include water-soluble terpolymers of aspartate, asparagine, and succinimide.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: November 30, 2004
    Assignee: Aquero Company
    Inventor: C. Steven Sikes
  • Publication number: 20040169463
    Abstract: Light emitting devices are described which incorporate, as the light emitting element, a dendrimer of which the constituent dendrons include a conjugated dendritic structure comprising aryl and/or heteroaryl groups connected to each other via bonds between Sp2 hybridised ring atoms of said aryl or heteroaryl groups.
    Type: Application
    Filed: January 20, 2004
    Publication date: September 2, 2004
    Inventors: Paul Leslie Burn, Ifor David Samuel, Shih-Chun Lo
  • Patent number: 6784275
    Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: August 31, 2004
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
  • Patent number: 6784276
    Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: August 31, 2004
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang
  • Patent number: 6780963
    Abstract: The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 24, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masahiro Sawada, Kunihiro Ohuchi
  • Patent number: 6780960
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Patent number: 6777525
    Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: August 17, 2004
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 6774205
    Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: August 10, 2004
    Assignee: BASF Aktiengesellschaft
    Inventors: Paul-Michael Bever, Ulrike Breiner, Bernd-Steffen von Bernstorff, Gerhard Conzelmann
  • Patent number: 6734262
    Abstract: An electrically conductive thermoplastic composition with a superior ability to be heated rapidly in an electromagnetic field comprises a polyetherimide resin, a polyester resin, and electrically conductive filler. Such compositions display good dimensional stability at elevated temperatures especially when heated rapidly using electromagnetic radiation, which renders them useful in articles and operations where rapid assembly is important.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: May 11, 2004
    Assignee: General Electric Company
    Inventor: Niraj C. Patel
  • Patent number: 6713597
    Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: March 30, 2004
    Assignee: General Electric Company
    Inventor: Martin John Lindway
  • Patent number: 6710160
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 23, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6706823
    Abstract: A conductive polymer gel composition including a copolymer with alkenyl monomer units and maleimide monomer units, a crosslinking agent, and an electrolyte solution. The conductive polymer has a current resistance less than or equal to 10−4 ohms and can be used to provide electrolyte cells.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: March 16, 2004
    Assignee: Bridgestone Corporation
    Inventors: Xiaorong Wang, Victor J. Foltz, James E. Hall
  • Patent number: 6693162
    Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: February 17, 2004
    Assignee: Kaneka Japan Corporation
    Inventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
  • Publication number: 20040006180
    Abstract: The present invention relates to a sealant composition comprising i) at least a copolymer of propylene and &agr;-olefins, and ii) at least a copolymer of ethylene and alkyl acrylate, wherein the alkyl acrylate is present in an amount ranging from about 1 to less than 9 weight percent, relative to the weight of the sealant composition. It also relates to a multilayer film or a packaging comprising a sealant layer comprising such a composition.
    Type: Application
    Filed: May 2, 2003
    Publication date: January 8, 2004
    Inventors: Yves M. Trouilhet, Bernard Rioux, Jacques Andre, Sebastian Landeck
  • Publication number: 20030166792
    Abstract: The invention relates to a novel and inexpensive process for the nitration and amination of aryl polymers and also to their use as blend components for producing polymer blend membranes. Such polymer blend membranes are used in membrane processes, in particular as polymeric electrolyte in electromembranes, e.g. for electrodialysis and fuel cells.
    Type: Application
    Filed: January 13, 2003
    Publication date: September 4, 2003
    Inventor: Wei Cui