Mixed With Silicon Containing Reactant Or Polymer Derived From Patents (Class 525/431)
  • Patent number: 10882993
    Abstract: The invention relates to a polymer composition and a fiber-composite semi-finished product, the surface thereof being at least partially formed from the polymer composition. The invention also relates to an associated production method for the fiber-composite semi-finished product. Said polymer composition is characterized in that it contains 100 parts by weight of a polyamide and 0.5-20 parts by weight of one or more adhesion-promoting additives.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: January 5, 2021
    Assignees: VOLKSWAGEN AKTIENGESELLSCHAFT, EVONIK DEGUSSA GMBH
    Inventors: Christian Klemt, René Hunger, Kathrin Lehmann
  • Patent number: 10851260
    Abstract: This invention relates to a hybrid composite polymer matrix, assembled by integrating two polymer networks, as an anti-scratch coating for automobiles. The two types of particulate silane cross-liners are utilized to construct two respective hybrid polymer networks with a unique chain-from-particle structure. At least one hybrid network is a covalently bound network that is interlocked with at least one physically bound hybrid network.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: December 1, 2020
    Assignee: Agency for Science, Technology and Research
    Inventors: Liang Hong, Siok Wei Tay, William Sai Yau Wong
  • Patent number: 10626218
    Abstract: A (A) polyamic acid solution which can be (i) used to form a film that does not peel off even in a case where the film has a large thickness, and (ii) stably stored at a room temperature, and (B) a laminate that can be suitably used for production of a flexible device. An alkoxysilane-modified polyamic acid solution that can be obtained by reacting (a) an alkoxysilane compound containing the amino group and (b) a polyamic acid solution, and has a molar ratio of 0.980 or more and 0.9995 or less, which molar ratio is obtained by dividing a total number of moles of an aromatic tetracarboxylic dianhydride by a total number of moles of an aromatic diamine.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: April 21, 2020
    Assignee: KANEKA CORPORATION
    Inventors: Takahiro Akinaga, Yuki Takiguchi, Shinji Ozawa
  • Patent number: 10435510
    Abstract: The present invention provides (A) a polyamic acid solution which can be (i) used to form a film that does not peel off even in a case where the film has a large thickness, and (ii) stably stored at a room temperature, and (B) a laminate that can be suitably used for production of a flexible device. An alkoxysilane-modified polyamic acid solution of the present invention can be obtained by reacting (a) an alkoxysilane compound containing the amino group and (b) a polyamic acid solution, and has a molar ratio of 0.980 or more and 0.9995 or less, which molar ratio is obtained by dividing a total number of moles of an aromatic tetracarboxylic dianhydride by a total number of moles of an aromatic diamine.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: October 8, 2019
    Assignee: KANEKA CORPORATION
    Inventors: Takahiro Akinaga, Yuki Takiguchi, Shinji Ozawa
  • Patent number: 10316210
    Abstract: This invention relates to a hybrid composite polymer matrix, assembled by integrating two polymer networks, as an anti-scratch coating for automobiles. The two types of particulate silane cross-liners are utilized to construct two respective hybrid polymer networks with a unique chain-from-particle structure. At least one hybrid network is a covalently bound network that is interlocked with at least one physically bound hybrid network.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: June 11, 2019
    Assignee: AGENCY FOR SCIENCE, THECNOLOGY, AND RESEARCH
    Inventors: Liang Hong, Siok Wei Tay, William Sai Yau Wong
  • Patent number: 10308787
    Abstract: The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin-curing agent; and (C) a filler. This can provide a resin composition and a resin film that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection performance, good adhesion properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably. The present invention also provides a method for producing the resin film, a semiconductor device molded with the resin film, and a method for producing the semiconductor device.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: June 4, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazunori Kondo, Yoichiro Ichioka, Michihiro Sugo
  • Patent number: 10308767
    Abstract: Provided are a polyamic acid solution that can be formed into a film without peeling even when the film is thick and can be stably stored at room temperature, and a laminate that can be suitably used for production of a flexible device. In the alkoxysilane-modified polyamic acid solution according to the present invention, an additive amount of an alkoxysilane compound that contains an amino group is more than 0.050 parts by weight and less than 0.100 parts by weight.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: June 4, 2019
    Assignee: KANEKA CORPORATION
    Inventors: Takahiro Akinaga, Yuki Takiguchi, Shinji Ozawa
  • Patent number: 10213961
    Abstract: The invention relates to a plastic-metal hybrid component and to a corresponding method for producing a plastic-metal hybrid component. The production method has the following steps: (i) providing a fiber composite semifinished product based on polyamide, at least one part of the surface of the semifinished product being made of a polymer composition which contains the following: a) 100 wt. % of a polyamide; and b) 0.5 to 20 wt. % of one or more adhesive additives of the formula (I); (ii) providing a metal main part; (iii) optionally pretreating the surface of the metal main part in order to produce functionalities; (iv) introducing the main metal part and the fiber composite semifinished product into a pressing tool and closing the tool; and (v) bonding the fiber composite semifinished product and the metal main part by means of a compression process under the effect of pressure and temperature.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: February 26, 2019
    Assignee: VOLKSWAGEN AKTIENGESELLSCHAFT
    Inventors: Christian Klemt, René Hunger, Hansjörg Kurz
  • Patent number: 10155864
    Abstract: The present invention has an object to obtain a polyimide film that has a sufficiently smooth surface without peeling even in a case where the polyimide film is a thick film and that is excellent in adhesion to an inorganic substrate. An alkoxysilane-modified polyamic acid solution of the present invention contains: an alkoxysilane-modified polyamic acid; and a surface control agent, the alkoxysilane-modified polyamic acid solution having a specific viscosity, the alkoxysilane-modified polyamic acid being obtained by reacting a polyamic acid with an alkoxysilane compound containing an amino group, and the polyamic acid being obtained by reacting a diamine with a tetracarboxylic dianhydride.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: December 18, 2018
    Assignee: Kaneka Corporation
    Inventors: Mari Uno, Etsuo Horii
  • Patent number: 10005902
    Abstract: A thermoplastic composition comprises, based on the total weight of the thermoplastic composition, 10 to 45 wt. % of a poly(etherimide); 35 to 90 wt. % of a poly(carbonate-siloxane); 0.5 to 20 wt. % of compatibilizer polycarbonate component comprising a poly(carbonate-arylate ester); up to 15 wt. % of an ultraviolet light stabilizer; and 0 to 30 wt. % of TiO2; wherein a sample of the composition has a notched Izod impact energy of at least 200 J/m at 23° C. measured in accordance to ASTM D256; and an at least 50% higher notched Izod impact energy value compared to the composition without the compatibilizer component measured in accordance to ASTM D256.
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: June 26, 2018
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Paul Dean Sybert, Mark Adrianus Johannes Van Der Mee, Roland Sebastian Assink, Robert Dirk Van De Grampel, Aditya Narayanan, Feng Cao, Kapil Chandrakant Sheth, Hao Zhou, Xiaoyu Sun, Remco Wirtz
  • Patent number: 9975997
    Abstract: A composition including a polyamic acid modified with an alkoxysilane group; and an oligo silica compound, wherein the polyamic acid modified with an alkoxysilane group includes a reaction product of (i) a condensation reaction product of an acid anhydride and a diamine, and (ii) a reactive organosilane compound, wherein the oligo silica compound includes a condensation reaction product of an organosilane diol and a an alkoxysilane compound, wherein an amount of silicon atoms in the composition is less than or equal to about 15 wt % based on a total weight of solid contents in the composition.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: May 22, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyunjeong Jeon, Min Sang Kim, Sang Soo Jee, Byunghee Sohn
  • Patent number: 9771498
    Abstract: The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: September 26, 2017
    Assignee: Henkel IP & Holding GmbH
    Inventors: Dwight Heinrich, Tina Nataniel
  • Patent number: 9758690
    Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: September 12, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko Ishiguro, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Patent number: 9735369
    Abstract: Disclosed are an organic compound represented by the Chemical Formula 1, an organic optoelectric device including the organic compound, and a display device including the organic optoelectric device.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: August 15, 2017
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Han-Ill Lee, Eun-Sun Yu, Dong-Min Kang, Eui-Su Kang, Dong-Kyu Ryu, Sang-Shin Lee, Yu-Na Jang, Soo-Young Jeong, Su-Jin Han, Jin-Seok Hong
  • Patent number: 9598542
    Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 21, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 9567458
    Abstract: This invention relates to a mixture of a polydiorganosiloxane polyamide-containing material and an organic polymer.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: February 14, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Audrey A. Sherman, David S. Hays, Stephen A. Johnson, Timothy J. Hebrink, Jeffrey O. Emslander, Danny L. Fleming
  • Patent number: 9527977
    Abstract: Disclosed and claimed herein are hybrid aerogels which are compositions of tetraalkoxysilanes and bis-(trialkoxysilyl) imides that exhibit low thermal conductivities and high compressive strengths. Methods for their preparation are also provided.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: December 27, 2016
    Assignee: ASPEN AEROGELS, INC.
    Inventors: Wenting Dong, Wendell E. Rhine, Decio Coutinho
  • Patent number: 9303119
    Abstract: A current breaker case including a polycarbonate resin composition that includes a polycarbonate-polyorganosiloxane copolymer and has a viscosity-average molecular weight of 18000 to 25000.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: April 5, 2016
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Yusuke Aoki, Noritada Takeuchi
  • Patent number: 9181431
    Abstract: A thermoplastic composition comprises a polymer blend. The polymer blend comprises a first polyimide and a second polyimide. The first polyimide has repeating units derived from a first dianhydride and a first diamine. The second polyimide has repeating units derived from a second dianhydride and a second diamine. Either the first dianhydride and the second dianhydride are the same or the first diamine and the second diamine are the same.
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: November 10, 2015
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Michael Stephen Donovan, Robert Russell Gallucci, Roy Ray Odle, Kapil Chandrakant Sheth
  • Patent number: 9045638
    Abstract: Provided is a curable composition. The curable composition, which may provide an encapsulating material, of which processibility and workability before curing are effectively maintained and which has excellent light transmissivity, light extraction efficiency, hardness, crack resistance, adhesion strength and thermal shock resistance after curing, is provided. Further, the curable composition may show effectively controlled tackiness in the surface and may not show whitening under the high temperature or high humidity condition before or after curing.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: June 2, 2015
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Cheong, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim
  • Publication number: 20150119526
    Abstract: A thermoplastic resin composition having advantages including tensile strength, sliding properties and heat resistance is obtained by blending (I) a thermoplastic resin containing N, S or Cl with (II) an acrylic-modified polyorganosiloxane obtained from emulsion/graft polymerization of a mixture comprising (i) a polyorganosiloxane, (ii) a (meth)acrylate monomer, and (iii) a copolymerizable monomer.
    Type: Application
    Filed: October 30, 2014
    Publication date: April 30, 2015
    Applicant: Nissin Chemical Industry Co., Ltd.
    Inventors: Kentaro WATANABE, Yukihiro MASUDA
  • Publication number: 20150094429
    Abstract: A method of making a polybenzoxazole (PBO) membrane from a self-cross-linked aromatic polyimide polymer membrane is provided. These membranes are useful in the separation of gas mixtures and liquid mixtures. The PBO membrane is made by fabricating a self-cross-linkable aromatic polyimide polymer membrane comprising both hydroxyl functional groups and carboxylic acid functional groups; cross-linking the polymer to form a self-cross-linked aromatic polyimide polymer membrane by heating the membrane at 250° to 300° C. under an inert atmosphere; and thermal heating the self-cross-linked aromatic polyimide polymer membrane at a temperature from about 350° to 500° C. under an inert atmosphere to convert the self-cross-linked aromatic polyimide polymer membrane into a PBO membrane. A membrane coating step may be added by coating the selective layer surface of the PBO membrane with a thin layer of high permeability material.
    Type: Application
    Filed: September 27, 2013
    Publication date: April 2, 2015
    Applicant: UOP LLC
    Inventors: Chunqing Liu, Zara Osman, Angela N. Troxell
  • Patent number: 8937127
    Abstract: A composition comprising: a first polymer comprising a poly(etherimide-siloxane) copolymer comprising (a) a repeating polyetherimide unit, and (b) a poly(siloxane) block unit, a second polymer different from the first polymer and comprising bromine; and optionally, a third polymer comprising a polycarbonate different from the first polymer and second polymer; wherein polysiloxane block units are present in the composition in an amount of at least 0.3 wt %, and bromine is present in the composition in an amount of at least 7.8 wt %, each based on the sum of the wt % of the first, second, and third polymers; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: January 20, 2015
    Assignee: SABIC Global Technologies B.V.
    Inventors: Paul D. Sybert, Thomas L. Evans
  • Patent number: 8936744
    Abstract: There are provided a fluorine-containing photocurable resin composition and a method of preparing a mold comprising the same and more particularly, a photocurable resin composition having chemical resistance, mechanical properties and high transmittance, etc. as well as being easily wetted with and released from thermosetting or photocurable resins for pattern formation regardless of additional surface treatment, as opposed to the existing polymer resin materials used for resin molds, and a method of preparing a resin mold using the same.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: January 20, 2015
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Jae-won Yoo, Byung-uk Kim, Un-yong Kim, Eun-jin Kwak
  • Publication number: 20140355173
    Abstract: A uniaxially-stretched, high yield extruded film comprising a polyetherimide comprising units derived from polymerization of an aromatic dianhydride with a diamine selected from a meta-phenylene diamine, a para-phenylene diamine, and a combination thereof, wherein the polyetherimide is endcapped with an a substituted or unsubstituted aromatic primary monoamine; and wherein the high yield extruded film comprises at least 90 weight % of the polyetherimide before extrusion.
    Type: Application
    Filed: May 30, 2014
    Publication date: December 4, 2014
    Applicant: SABIC GLOBAL TECHNOLOGIES BV
    Inventors: Roy Ray Odle, Matthew Frank Niemeyer, Mark A. Sanner, Anne E. Bolvari, Neal Pfeiffenberger
  • Patent number: 8829153
    Abstract: To provide a polyamic acid ester-containing polyimide precursor composition having a good storage stability, from which a polyimide film having a high imidization degree and excellent adhesion to an inorganic substrate can be obtained. A polyimide precursor composition comprising a polyamic acid ester, a thermal imidization accelerator and a solvent, wherein the thermal imidization accelerator is a compound which has a carboxy group and an amino group or an imino group which is deprotected by heat to show basicity, and which will not accelerate the imidization of the polyamic acid ester before the protecting group leaves, and a polyimide precursor composition containing a silane coupling agent.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: September 9, 2014
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Naoki Sakumoto, Masato Nagao, Yuho Noguchi
  • Patent number: 8796393
    Abstract: There is provided a simple production method of polyhydroxyimide and a positive photosensitive resin composition containing the polyhydroxyimide. A production method of a polyhydroxyimide comprising: adding an acid component that is at least one type of carboxylic acid having a pKa of 0 to 5 to a polyhydroxyimide precursor of Formula (1): (where X is a tetravalent aliphatic or aromatic group, Y is an organic group containing an aromatic group substituted with at least one OH group, and n is an integer of 1 or more); and heating the resultant mixture to a temperature of 50 to 100° C. to prepare a poly imide of Formula (2): (where X, Y and n are the same as those defined above) having a weight average molecular weight of 3,000 to 100,000.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: August 5, 2014
    Assignee: Nissan Chemical Industries, Ltd.
    Inventor: Kazuya Ebara
  • Patent number: 8784711
    Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: July 22, 2014
    Assignee: Hutchinson
    Inventors: Nicolas Garois, Philippe Sonntag, Grégory Martin, Matthieu Vatan, Jacques Drouvroy
  • Patent number: 8779073
    Abstract: A method for preparing a modified thermoplastic resin by mixing a thermoplastic resin having a tg of 95° C. or greater and having a melt processing temperature of 250° C. or greater with a silicone base comprised of 100 parts by weight of a diorganopolysiloxane gum and having an average of at least 2 alkenyl groups per molecule in conjunction with 0 to 50 parts by weight of a reinforcing filler along with a radical initiator. The silicone base and this combination are dynamically vulcanized to cure the silicone base at an elevated temperature.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: July 15, 2014
    Inventors: Veerag Mehta, David Romanesko
  • Patent number: 8742031
    Abstract: Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: June 3, 2014
    Assignees: Solpit Industries, Ltd., Sojitz Corporation
    Inventor: Hiroshi Itatani
  • Patent number: 8729178
    Abstract: A polysiloxane-grafted polyimide resin composition includes a polysiloxane-grafted polyimide resin, and a solvent. The polysiloxane-grafted polyimide resin is represented by formula (I): wherein W represents a tetravalent organic group, R represents a trivalent organic group, and X represents a polysiloxane-containing group.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: May 20, 2014
    Assignee: Chi Mei Corporation
    Inventors: Yu-Hao Liang, Li-Tao Hsu, Huai-Pin Hsueh
  • Publication number: 20140054228
    Abstract: The present disclosure describes an additive that may be used in the manufacture of thin-film polyamide composite membranes. Thin-film polyamide composite membranes are used in filtration processes, such as reverse osmosis and nanofiltration. The additive may be an amino-siloxane compound. The amino-siloxane compound includes repeated groups of silicon bonded to oxygen with at least one amine functional group. Optionally, the amino-siloxane compound may also include a hydrophilic group. The additive reacts with an aqueous phase and an organic phase to form a thin polyamide film on a porous substrate.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 27, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Xingpeng ZHANG, Lawrence C. COSTA, Steven John HARROLD, Babu NARAYANSWAMY
  • Publication number: 20140031499
    Abstract: Disclosed is a polyimide composition including a copolymer including first and/or second repeating unit including an imide repeating unit, or an amic acid repeating unit to form an imide repeating unit through imidization, and a third repeating unit including an amid repeating unit, wherein at least one terminal end of the copolymer is substituted with a substituted or unsubstituted siloxane or silanol group; and an inorganic particle or a precursor thereof.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 30, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chung Kun CHO, Mikhail KOVALEV, Kalinina FEDOSYA, Dmitry ANDROSOV
  • Patent number: 8597788
    Abstract: Disclosed herein are polysiloxane/polyimide block copolymer blends and the application of these blends in conductive wires.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: December 3, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Susanta Banerjee, Robert Russell Gallucci, Gurulingamurthy M. Haralur, Ganesh Kailasam, William A. Kernick, III, Utpal Mahendra Vakil
  • Patent number: 8598273
    Abstract: Polymer electrolytes offer increased safety and stability as compared to liquid electrolytes, yet there are a number of new challenges that polymer electrolytes introduce. A polymer electrolyte, as disclosed herein, is a block copolymer that has a block that provides mechanical strength and a novel, ionically-conductive polymer block with a backbone that is both highly flexible and highly conductive with high conductivity pendant chains attached, thus increasing the concentration of lithium coordination sites and improving ionic conductivity. Previous strategies for comb-type conductive polymers have focused on attaching either conductive pendant chains to a flexible non-conductive backbone or conductive pendant groups to a marginally flexible conductive backbone.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: December 3, 2013
    Assignee: Seeo, Inc.
    Inventors: Hany Basam Eitouni, Bing R. Hsieh
  • Patent number: 8592528
    Abstract: Polyamic acid including structural units of the following Chemical Formulae 1 and 2 is provided: In Chemical Formulae 1 and 2, each substituent is as defined in the detailed description.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: November 26, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eunseog Cho, Youngsuk Jung, Sangmo Kim, Byung-Hee Sohn, Yooseong Yang
  • Patent number: 8586689
    Abstract: A polymer including a structural unit represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above formula at least one of Ra and Rb is either Chemical Formula 3 or Chemical Formula 4, as shown below. The polymer also includes units selected from polyamic acid, polyimide, polyaramid, polyamide, polyurethane, polycarbonate and polyacetal units and mixtures of such units.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: November 19, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Suk Jung, Yoo Seong Yang, Tai Gyoo Park, Sang Mo Kim, Eun Seog Cho
  • Publication number: 20130255490
    Abstract: The present invention generally relates to a crosslinked silane-modified molecularly self-assembling material, cured manufactured article comprising the crosslinked silane-modified molecularly self-assembling material, semipermeable membrane comprising the crosslinked silane-modified molecularly self-assembling material, method of using the semipermeable membrane to separate an acid gas from a separable gas mixture comprising the acid gas and a permeation-resistant gas, and method of preparing the cured manufactured article from a curable manufactured article comprising a shaped reactive silane-modified molecularly self-assembling material.
    Type: Application
    Filed: December 20, 2011
    Publication date: October 3, 2013
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Scott T. Matteucci, William J. Harris, Pushkala Krishnamurthy
  • Patent number: 8491997
    Abstract: Disclosed herein are polysiloxane/polyimide block copolymer blends and the application of these blends in conductive wires.
    Type: Grant
    Filed: June 22, 2006
    Date of Patent: July 23, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Susanta Banerjee, Robert Russell Gallucci, Gurulingamurthy M Haralur, Ganesh Kailasam, William A Kernick, III, Utpal Mahendra Vakil
  • Publication number: 20130153833
    Abstract: An intermediate transfer member that includes a mixture of a poly(amic acid amideimide), a phosphite, an optional polymer, an optional conductive filler component and an optional release layer.
    Type: Application
    Filed: December 18, 2011
    Publication date: June 20, 2013
    Applicant: XEROX CORPORATION
    Inventor: Jin Wu
  • Publication number: 20130150514
    Abstract: A method for making a polyamide composition, in particular for molding, prepared by mixing a polyamide material, a powder made from airbag scraps, and optionally reinforcing fillers is desribed. Also described, is a method for recycling used airbags.
    Type: Application
    Filed: August 19, 2011
    Publication date: June 13, 2013
    Applicant: RHODIA OPERATIONS
    Inventor: Charlotte Basire
  • Publication number: 20130131282
    Abstract: There is provided a simple production method of polyhydroxyimide and a positive photosensitive resin composition containing the polyhydroxyimide. A production method of a polyhydroxyimide comprising: adding an acid component that is at least one type of carboxylic acid having a pKa of 0 to 5 to a polyhydroxyimide precursor of Formula (1): (where X is a tetravalent aliphatic or aromatic group, Y is an organic group containing an aromatic group substituted with at least one OH group, and n is an integer of 1 or more); and heating the resultant mixture to a temperature of 50 to 100° C. to prepare a poly imide of Formula (2): (where X, Y and n are the same as those defined above) having a weight average molecular weight of 3,000 to 100,000.
    Type: Application
    Filed: January 16, 2013
    Publication date: May 23, 2013
    Applicant: Nissan Chemical Industries, Ltd.
    Inventor: Nissan Chemical Industries, Ltd.
  • Publication number: 20130108854
    Abstract: The disclosure relates to a process that includes blending a polyimide resin and a primary alky amine organic compound to produce an aryl amine functionalized polyimide, having aryl amine functionality in excess of any anhydride functionality. The polyimide resin can have a weight average molecular weight (Mw) from 5,000 to 100,000 daltons. The organic compound can include at least one primary aliphatic amine without a direct linkage of a nitrogen to an aryl group and without a functionality selected from a halogen functionality, a hydroxyl functionality, a sulfonic acid functionality, a sulfonic acid salt functionality, and combinations thereof. The disclosure also relates to alkyl imide functionalized polyimides also with aryl amine functionalized polyimides, having aryl amine functionality in excess of any anhydride functionality and articles produced therefrom.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 2, 2013
    Inventors: Robert R. Gallucci, Roy Odle, Daniel F. Lowery, Richard Peters
  • Publication number: 20130109815
    Abstract: A method of making a thermoplastic composition comprises melt blending two polysiloxane/polyimide block copolymers. Both of the block copolymers have extended polysiloxane blocks.
    Type: Application
    Filed: April 19, 2012
    Publication date: May 2, 2013
    Inventors: Susanta Banerjee, Robert Russell Gallucci, Gurulingamurthy M. Haralur, Ganesh Kailasam, William A. Kernick, III, Utpal Mahendra Vakil
  • Patent number: 8431671
    Abstract: Devices including a polydiorganosiloxane polyamide containing material having a microstructured surface are disclosed herein. Such devices can optionally include a flex circuit attached to the microstructured surface and can be useful, for example, in fluid handling applications.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: April 30, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Audrey A. Sherman, Mark R. Richmond, Raymond P. Johnston, Mieczyslaw H. Mazurek, John C. Hulteen
  • Patent number: 8420770
    Abstract: An inkjet ink capable of forming a polyimide film having, for example, strong mechanical strength, is provided. The inkjet ink contains: a polyamic acid (A) having a weight-average molecular weight of 50,000-500,000; one or more of an amic acid compound (B1) and an amic acid compound (B2), in which the amic acid compound (B1) is prepared from a compound (a3) having two or more anhydride groups and a monoamine (a5), and the amic acid compound (B2) is prepared from a diamine (a4) and a compound (a6) having one anhydride group; and a solvent (C).
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: April 16, 2013
    Assignee: JNC Corporation
    Inventors: Tomotsugu Furuta, Satoshi Tanioka
  • Patent number: 8389648
    Abstract: A composition, comprising, based on the total weight of the polymer components in the composition, 1 to 40 wt. % of an aromatic polycarbonate, 30 to 98.8 wt. % of a polysiloxane-polycarbonate block copolymer, and 0.1 to 10 wt. % of a polysiloxane-polyimide block copolymer comprising more than 20 wt. % polysiloxane blocks, based on the total weight of the polysiloxane-polyimide copolymer. The compositions provide articles with low haze, high luminous transmittance, and good hydro-aging properties. The articles can further be formulated to have excellent flame retardance, particularly when KSS is used.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: March 5, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Purushotham Adoni, Dibakar Dhara, Sriramakrishna Maruvada, Roopali Rai, Veeraraghavan Srinivasan
  • Publication number: 20130034740
    Abstract: Using nano-particles to topographically enhance the reacting surface of an inorganic fiber used as a reinforcement medium in an embedding matrix is described.
    Type: Application
    Filed: September 9, 2011
    Publication date: February 7, 2013
    Applicant: Apple Inc.
    Inventors: Marta M. GIACHINO, Michael K. Pilliod
  • Patent number: 8367771
    Abstract: A composition for producing an organic insulator is provided which comprises an organic-inorganic hybrid material (as defined). The hybrid material shows high solubility in organic solvents and monomers, and superior adhesion to substrates. In addition, the hybrid material displays a high dielectric constant and a high degree of crosslinking. Based on these advantages, the composition comprising the organic-inorganic hybrid material can be utilized during the fabrication of various electronic devices by a wet process. A method for producing the organic insulator while utilizing the composition also is provided, as well as the resulting organic insulator, and an organic thin film transistor which incorporates the resulting insulating layer.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: February 5, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Han Shin, Jae Jun Lee, Chang Ju Kim, Sang Yoon Lee
  • Patent number: 8349971
    Abstract: The present invention provides a process for preparing a solvent-soluble polyimide copolymer synthesized from a 6,6-imide segment having an imide oligomer with PMDA at both ends produced by adding 4 molar equivalents of pyromellitic dianhydride (PMDA) and 2 molar equivalents of diaminotoluene (DAT) to an imide oligomer produced by heating 1 molar equivalent of biphenyltetracarboxylic dianhydride (BPDA) and 2 molar equivalents of diaminodiphenyl ether (DADE) at 160-200° C. in the presence of a catalyst in an organic polar solvent.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: January 8, 2013
    Assignees: Solpit Industries, Ltd., Sojitz Corporation
    Inventor: Hiroshi Itatani