Abstract: An enameling lacquer comprises a base first polymer and a copolymer which is compatible with said first polymer and which contains polymeric chains selected from polysiloxanes, fluorated chains and alkane chains. The lacquer is of particular application to an enameled wire comprising at least one layer of an enamel obtained by reticulation of the lacquer.

Abstract: Solid blends of rubbery polymers and amorphous or crystalline polymers, said blends being free-flowing at temperatures lower than the glass transition temperature or crystalline melting temperature of the amorphous or crystalline polymer, are prepared by intimate mixing procedures. In general, said mixing conditions include high shear conditions sufficient to convert polymer A to dispersed particles coated with polymer B and produce a free-flowing blend.

Abstract: There is disclosed a method for preparing a thermoplastic elastomer, said method comprising:(I) first mixing(A) a thermoplastic resin selected from polyolefins, polyamides, thermoplastic polyurethanes or styrenic block copolymers,(B) at least one silanol-terminated diorganopolysiloxane having a viscosity of at least 10 Pa-s at 25.degree. C.,(C) optionally, up to 300 parts by weight of a filler for each 100 parts by weight of said diorganopolysiloxane, said filler being selected from the group consisting of(i) a reinforcing filler for said diorganopolysiloxane and(ii) a silicone resin,(D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and(E) a condensation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane; and(II) dynamically curing said diorganopolysiloxane (B).

Abstract: Process for preparing a thermosetting coating composition comprising;(a) mixing(i) a cleavable carbonyl polymer having an activated carbonyl group adjacent to oxygen or nitrogen, in the backbone, and having a molecular weight greater than 5,000(ii) a multifunctional compound having a molecular weight less than 5,000 having a functional group capable of reacting with the cleavable carbonyl polymer to cleave the polymer at the carbonyl group and bond with the cleaved polymer, the compound having a crosslinking group;(b) reacting the mixture in an extruder, at 50 to 350.degree. C. for 15 to 600 seconds, to cleave the polymer, and react the cleaved polymer with the functional group on the multifunctional compound(c) quenching the reaction mixture cooling prior to equilibrium reaction, to produce a functionalized cleaved polymer having crosslinking groups derived from the multifunctional compound and capable of crosslinking by heat reaction outside the extruder.

Abstract: The invention relates to a composition, to a process for its preparation and to a method of coating shaped articles or elastomeric materials, where the composition can be prepared using(1) polymer components selected from the group consisting of(A1) polyorganosiloxanes comprising units (T units) of the formula (R.sub.1 Si--O.sub.3/2) and optionally, units (M units) of the formula (R.sub.3 Si--O.sub.1/2)(A2) polyorganosiloxanes comprising units (Q units) of the formula (Si--O.sub.4/2) and, optionally, units (M units) of the formula (R.sub.3 Si--O.sub.1/2)in whichR is identical or different and represents unhalogenated or halogenated hydrocarbon radicals having 1 to 18 carbon atom(s) per radical or OR.sup.1, whereR.sup.1 is identical or different and represents hydrogen or a monovalent, unsubstituted or substituted hydrocarbon radical having 1 to 8 carbon atom(s),with the proviso that there are from 0.01% to 3.0% by weight, preferably from 0.01% to 1% by weight, of Si-bonded radicals OR.sup.

Abstract: The invention relates to a polymeric blend having a major amount of an elastomeric material and a minor amount of at least one particulate polyimide. Additionally, the polymeric blend may further contain lubricants.

Abstract: Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a 4,4'-(hexafluoroisopropylidene)diphthalic acid dianhydride, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

Abstract: Higher generation radially layered copolymeric dendrimers having a hydrophilic poly(amidoamine) or a hydrophilic poly(propyleneimine) interior and a hydrophobic organosilicon exterior are prepared by first reacting a hydrophilic dendrimer having --NH.sub.2 surface groups with an organosilicon compound, and then hydrosilating the resulting copolymeric dendrimer with another organosilicon compound in the presence of a noble metal catalyst. In an alternate embodiment, the radially layered copolymeric dendrimers are prepared by reacting a hydrophilic dendrimer having --NH.sub.2 surface groups directly with an organosilicon dendron or organosilicon hyperbranched polymer.

Abstract: Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

Abstract: A thermoplastic resin composition containing a polyetherimide resin, a siloxane-polyetherimide copolymer and a branched polycarbonate resin exhibits exhibit high heat distortion temperature, improved room temperature impact properties and improved impact strength and ductility at low temperatures.

Abstract: Disclosed are aromatic brominated polycarbonate/polyester carbonate/silicone polyimide compositions having improved flame resistance and reduced drippage and heat release rate, comprising by weight:(A) from about 20 to about 77 parts of an aromatic brominated polycarbonate resin;(B) from about 20 to about 77 parts of a polyester carbonate resin;(C) from about 0.5 to about 10 parts of a silicone-polyimide resin;(D) from about 0 to about 25 parts of an aromatic polycarbonate having a molecular weight of from about 40,000 to about 90,000; the sum of (A)-(D) being 100 parts by weight;(E) from about 0.05 to about 2.0 parts of a metal salt of a halogenated monomeric or polymeric aromatic sulfonic acid or mixtures thereof, wherein the metal salt is selected from the group consisting of alkali metal salts, alkaline earth metal salts, and mixtures of the metal salts; and(F) from about 0.1 to about 5.0 parts by weight of filler or a pigment.

Abstract: A waterproof and breathable, fire-resistant laminate is provided for use in tents, garments, shoes, and covers, especially in industrial, military and emergency situations. The laminate permits water vapor evaporation while simultaneously preventing liquid water penetration. Further, the laminate is fire-resistant and significantly reduces the danger of toxic compound production when exposed to flame or other high heat source. The laminate may be applied to a variety of substrates and is comprised of a silicone rubber and plurality of fire-resistant, inherently thermally-stable polyimide particles.

Abstract: A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption.

Abstract: A crosslinked nylon block copolymer comprising a copolymer containing a polyamide block and an elastomeric block, irradiation crosslinked, including a compound which promotes crosslinking therein. In process form, the present invention comprises supplying a nylon block copolymer, containing a polyamide block and an elastomeric block, along with crosslinking promotor and exposing the block copolymer to irradiation, sufficient to crosslink the copolymer and improve mechanical properties therein. The crosslinked nylon block copolymers here have particular utility in both the medical and wire and cable industries.

Abstract: A nonaqueous sizing for glass fibers useful for reinforcement of polymers. The sizing composition comprises one or more film formers miscible with the polymer to be reinforced and one or more coupling agents. The sizing composition of the invention provides a glass fiber which may be wirecoated with the polymer to be reinforced, eliminating the need for extrusion or pultrusion processing to make glass/polymer composite fibers, compound or pellets.

Abstract: A thermoplastic resin composition containing a polyetherimide resin; a siloxane-polyetherimide copolymer; one or more resins selected from the group consisting of polycarbonate resins and copolyester-carbonate resins; and one or more component selected from glycidyl ester impact modifiers and siloxane-polycarbonate copolymers exhibits improved ductility and low temperature impact properties.

Abstract: Novel methods and compositions for improving the flame retardant capabilities of aromatic-based polymers like polycarbonate are disclosed. Other important polymer properties are substantially maintained, such as transparency. One aspect of the invention is directed to a flame retardance additive which comprises a copolymer of an aryl-containing silicone compound and a diorganic polysiloxane compound. In some preferred embodiments, the aryl-containing silicone compound is triphenyl- or diphenyl-based. This invention is also directed to new polymer compositions, which comprise an aromatic-based polymer and the flame retardance additive described above. The polymer compositions can be molded into a variety of articles which have a very useful combination of properties.

Abstract: A solvent-soluble siloxane polyimide comprising a copolymer obtained by reaction of a diamine compound mixture comprising a diaminopolysiloxane, an alicyclic diamine and an aromatic diamine with an aromatic tetracarboxylic acid anhydride, followed by polyimidization reaction of the resulting polyamic acid forms a heat-resistant adhesive by adding an epoxy resin, a diamine-based curing agent and an organic solvent thereto, The formed adhesives provides a distinguished curling resistance without any warp when the resulting siloxane polyimide soluble in ordinary organic solvents is used as a main component of the adhesive for bonding between a base material and a copper foil of a flexible printed substrate.

Abstract: Dendritic polymer based networks consisting of well-defined hydrophilic and oleophilic (i.e., hydrophobic) domains, are capable of performing as nanoscopic sponges for electrophilic guest moieties such as (i) inorganic and organic cations; (ii) charged or polarized molecules containing electrophilic constituent atoms or atomic groups; and (iii) other electrophilic organic, inorganic, or organometallic species. As a result of such performance, the networks yield novel nanoscopic organo-inorganic composites which contain organosilicon units as an integral part of their covalently bonded matrix.

Abstract: Blends containing a polyetherimide and from about 8 to about 20 wt. % of a modifier formulation comprising an acrylate rubber and a polycarbonate, and a method for improving the ESCR properties of polyetherimides.

Abstract: Dendrimer-based networks are prepared from copolydendrimer precursors having well defined hydrophilic polyamidoamine (PAMAM) or polypropyleneimine (PPI) interiors, and organosilicon outer layers ending with .tbd.Si--OCH.sub.3 surface groups. These networks have precisely controllable size, shape, and spatial distribution, of nanoscopic hydrophilic and hydrophobic domains. Such constructs are prepared by crosslinking one type of copolydendrimer precursor, or by crosslinking mixtures of different copolydendrimers having different generations of PAMAM or PPI dendrimers in the interior, surrounded by different organosilicon exteriors. Crosslinking can be controlled by adding difunctional, trifunctional, or polyfunctional low molecular weight or oligomeric crosslinking agents; or by exposing a copolydendrimer having hydrolyzable surface groups to atmospheric moisture. Elastomeric dendrimer-based networks have low glass temperatures of -15.degree. C.

Abstract: A solvent-soluble siloxane polyimide comprising a copolymer obtained by reaction of a diamine compound mixture comprising a diaminopolysiloxane and an alicyclic diamine with an aromatic tetracarboxylic acid anhydride, followed by polyimidization reaction of the resulting polyamic acid forms a heat-resistant adhesive by adding an epoxy resin, a diamine-based curing agent and an organic solvent thereto, The formed adhesives show a distinguished heat-resistant adhesiveness when the resulting siloxane polyimide soluble in ordinary organic solvents is used as a main component of the adhesive for bonding between a base material and a copper foil of a flexible printed substrate. By further addition of a fluorinated resin to the heat-resistant adhesive, the adhesiveness can be more improved.

Abstract: A method of dispersing silicone compositions in organic thermoplastic materials is disclosed. The novel compositions produced by the method of the invention have a fine and relatively uniform dispersion or organosilicone in an organic thermoplastic. An organosilicone resin (A) and a predominantly linear silicone fluid (B) are first blended to substantial homogeneity to form an organosilicone alloy therefrom. The organosilicone alloy exhibits thermoplastic behavior and has a temperature-dependent complex viscosity .eta.*.sub.Si (T) associated therewith. Likewise the organic thermoplastic materials have a temperature-dependent complex viscosity, .eta.*.sub.OTP (T), associated therewith. The organic thermoplastic and the organosilicone alloy are thereafter mixed at a predetermined mixing temperature, T.sub.m, and a predetermined shear strain rate. The organic thermoplastic material and the organosilicone alloy are both in a flowable state at T.sub.m. The value of T.sub.m is selected to be about .+-.30.degree. C.

Abstract: Organosiloxane compositions exhibiting excellent vibration damping properties comprise(A) from 70 to 99.9 weight percent of a liquid polyorganosiloxane,(B) from 0.1 to 10 weight percent of hollow particles of a thermoplastic organic resin, and(C) from 0 to 20 weight percent of a thickener.

Abstract: This invention discloses a novel process to prepare multi-block copolymers with high molecular weights from two immiscible polymer segments. In one embodiment, the two polymer segments are reacted in a solvent mixture which comprises N-methyl-2-pyrrolidinone and diglyme. Such polymers are useful for alignment layer applications in display devices.

Abstract: Thermoplastic molding materials containA) from 1 to 99% by weight of a partly aromatic copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 25 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100%,B) from 1 to 99% by weight of a polyetherimide,C) from 0 to 30% by weight of a polymeric component having OH groups,D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof,E) from 0 to 40% by weight of rubber impact modifiers andF) from 0 to 40% by weight of conventional additives and processing assistants.

Abstract: A heat resistant resin composition comprising, as the main components,(A) 100 parts by weight of an organic solvent-soluble polyimide resin having a glass transition temperature of 350.degree. C. or less,(B) 5 to 100 parts by weight of an epoxy compound having at least two epoxy groups in one molecule, and(C) 0.1 to 20 parts by weight of a compound having an active hydrogen group which can react with the epoxy compound (B),a heat resistant film adhesive comprising, as the main components, the above components (A), (B) and (C), and a process for producing a heat resistant film adhesive by casting a solution of the above heat resistant resin composition on one side or both sides of a support.

Abstract: A novel silicone system comprising a methoxy terminated silane or polysiloxane, an adhesion promoter and water, useful as a filler alone or in combination with other fillers is disclosed.

Abstract: The present invention provides a novel silicate group-containing polyimide which is excellent in mechanical properties, heat resistance and electrical properties and has an excellent film forming ability. Further, the present invention provides a film-formable heat resistant material having an excellent solvent resistance, elasticity and adhesive property. The silicate group-containing polyimide has a repeated unit represented by the following Formula (1): ##STR1## wherein Ar.sub.1 represents a tetravalent organic group; R.sub.1 and R.sub.2 each are a single bond or represent an alkylene group having 1 to 4 carbon atoms or a phenylene group; R.sub.3 to R.sub.7, R.sub.9 and R.sub.10 each represent a hydrocarbon group having 1 to 6 carbon atoms; R.sub.8 represents an ethylene group or an alkylene group having 3 to 6 carbon atoms; m and n represent independently an integer of 1 to 10; and k represents an integer of 0 to 2.

Abstract: The present invention provides a polyimide resin composition comprising:(a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.

Abstract: Novel organic fluorine compounds are of formula (1): ##STR1## wherein R.sup.1 and R.sup.2 are monovalent hydrocarbon groups, Q.sup.1 is a group of formula (2) or (3): ##STR2## wherein R.sup.3 is a divalent hydrocarbon group which may have an intervening oxygen, nitrogen or silicon atom, R.sup.4 and R.sup.5 are divalent hydrocarbon groups, Rf.sup.1 is a divalent perfluoroalkylene or perfluoropolyether group, and letter a is an integer of 0-10. A curable composition comprising (A) a fluorinated amide compound having at least two aliphatic unsaturated groups of formula (1), (B) a fluorinated organohydrogensiloxane containing at least one monovalent perfluoroalkyl ether or perfluoroalkyl group and at least two hydrosilyl groups, and (C) a platinum group compound cures into elastomers solvent and chemical resistance.

Abstract: A transparent ocular lens material comprising a silicon-containing polymer having a recurring unit represented by the general formula (I): ##STR1## wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is independently hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms or a group represented by the general formula (lI): ##STR2## in which each of R.sup.5, R.sup.6 and R.sup.7 is independently an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms or phenyl group. The ocular lens material has excellent transparency, high oxygen permeability and heat resistance, and excellent ultraviolet-ray absorbing properties and forming and processing properties, and has a relatively high refractive index.

Abstract: The present invention provides curable resin compositions containing finely divided particles of a cured organosiloxane material with microparticles of silica bound to the surfaces of the particles. The particle size of the cured organosiloxane material and the particle size and properties of the silica are within specified limits.

Abstract: The present invention relates to new carbosilane dendrimers, to a method of preparing them, and to their use.

Abstract: Polymer blend for insulating electrical wires comprises a first polymer (polyester) having an inherent L.O.I. not higher than 21% and up to 40% by weight of a polyimide-siloxane (PIS) copolymer. Preferred polyesters are polybutylene terephthalate or polyester-ester block copolymers. Preferred wire constructions have core insulation layer of polyethylene or polyester overlaid with jacket of the polyester/PIS copolymer blend.

Abstract: Graft copolymers obtained by(A) polymerizing 10 to 89 wt % of a mixture consisting essentially of either(a1) from 70 to 99.89 wt % of a C.sub.1 -C.sub.18 -alkyl ester of acrylic acid,(a2) from 0.1 to 10 wt % of a polyfunctional monomer,(a3) from 0 to 29.89 wt % of an ethylenically unsaturated monomer which differs from (a1) and (a2), is copolymerizable therewith and carries no acid group and(a4) from 0.01 to 10 wt % of a copolymerizable monomer containing at least one acid groupor(a5) from 49.99 to 99.99 wt % of at least one diene,(a6) from 0 to 50 wt % of a monomer which is copolymerizable therewith and carries no acid group and(a7) from 0.01 to 10 wt % of a copolymerizable monomer containing at least one acid groupin the presence of from 1 to 80 wt % of a cross-linked silicone rubber to form a copolymer A,and(B) polymerizing 10 to 89 wt % of a mixture consisting essentially of(b1) from 50 to 99.99 wt % of a styrene compound of the formula (I) ##STR1## where R.sup.1 and R.sup.

Abstract: A method and composition for improving the impact resistance of thermoplastics is disclosed. An impact resistant thermoplastic is formed by forming a silicone containing thermosetting component, compounding it with a thermoplastic to form a silicone-thermoplastic mixture, disposing a catalyst on the mixture, and activating the catalyst while compounding the mixture with a thermoplastic. The silicone containing thermosetting component includes a first silicone compound containing hydride groups and a second silicone compound containing unsaturated groups. Activating the catalyst, preferably a platinum complex, causes the thermosetting component to cure, creating a silicone-thermoplastic semi-interpenetrating polymer network having higher impact resistance than the unmodified thermoplastic.

Abstract: Novel intermediate compounds capable of being applied to a semiconductor precursor by spin-on methods which exhibit good planarity and gap-fill characteristics, the cured composites of which are capable of withstanding temperatures in excess of 500.degree. C. The disclosure further encompasses a process for fabricating semiconductor devices utilizing the intermediate compounds and its composite.

Abstract: A re-moldable cross-linked resin comprising polymer chains which are connected to one another via Diels-Alder adducts obtainable from a dienophile and a diene, the latter being a 2,5-dialkyl substituted furan.

Abstract: The invention is directed to molding materials containingA) from 1 to 99% by weight of polyarylene ethers having repeating units I ##STR1## where t and q may each be an integer 0, 1, 2 or 3,T, Q and Z may each be a chemical bond or --O--, --S--, --SO.sub.2 --, S.dbd.O, C.dbd.O, --N.dbd.N--, R.sup.a C.dbd.CR.sup.b -- or --CR.sup.c R.sup.d --, with the proviso that at least one of the groups T, Q and Z is --SO.sub.2 -- or C.dbd.O,R.sup.a and R.sup.b,R.sup.c and R.sup.d, andAr and Ar.sup.1 are as defined in the specification,B) from 1 to 99% by weight of copolyamides containingb.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,b.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,b.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine,b.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms andb.sub.5) from 0 to 4 mol % of further polyamide-forming monomers which differ from b.sub.

Abstract: The compositions of this invention comprise uncrosslinked reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one metal-containing polymer comprising a metal-nitrogen polymer.Preferred compositions of this invention comprise reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one of: silicon-nitrogen polymers, aluminum-nitrogen polymers and boron-nitrogen and polymer combinations thereof comprising a multiplicity of sequentially bonded repeat units the compositions comprising the reaction products of the reaction mixtures, and the compositions obtained by crosslinking the reaction products of the reaction mixtures. The crosslinking may be effected through at least one of thermal-based, radiation-based free radical-based or ionic-based crosslinking mechanisms.

Abstract: A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.

Abstract: A method for producing halogen-free, antimony-free and phosphorous-free polyamide fibers is described by incorporating an additive into the polyamide which comprises a vulcanizable mixture of silicones and a catalyst in a thermoplastic matrix. The fibers have improved flame retardancy and are used for the manufacture of carpets.

Abstract: A polyimide resin having excellent storage stability which cures to give a highly adherent, highly heat-resistant, and highly moisture-resistant film is disclosed, said resin being prepared by reacting(A) a tetracarboxylic dianhydride and(B) a diamino-functional siloxane compound having the general formula ##STR1## in which each R.sup.1 is independently selected from C.sub.1 to C.sub.20 monovalent hydrocarbon radicals, each R.sup.2 is independently selected from C.sub.1 to C.sub.20 divalent hydrocarbon radicals, R.sup.3 is selected from the group consisting of hydrogen and --SiR.sup.1.sub.3 wherein R.sup.1 is defined as above, a is an integer from 1 to 20, b is an integer from 1 to 20, c is an integer from 0 to 20, and d is an integer from 1 to 20.

Abstract: The invention relates to molecular composites including a rigid reinforcing thermoplastic polymer dispersed on a molecular scale in a flexible organosiloxane/thermoplastic polymer copolymer, to a process for the preparation of the said composites and to a material with a surface enriched in siloxane, obtained from the said molecular siloxane composites, and to the uses of said composites and of the said material, in particular for aerospace construction.

Abstract: A method for producing halogen-free, antimony-free and phorphorous-free polyamide fibers is described by incorporating an additive into the polyamide which comprises a vulcanizable mixture of silicones and a catalyst in a thermoplastic matrix. The fibers have improved flame retardancy and are used for the manufacture of carpets.

Abstract: The compositions of this invention comprise uncrosslinked reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one metal-containing polymer comprising a metal-nitrogen polymer.Preferred compositions of this invention comprise reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one of: silicon-nitrogen polymers, aluminum-nitrogen polymers and boron-nitrogen and polymer combinations thereof comprising a multiplicity of sequentially bonded repeat units the compositions comprising the reaction products of the reaction mixtures, and the compositions obtained by crosslinking the reaction products of the reaction mixtures. The crosslinking may be effected through at least one of thermal-based, radiation-based free radical-based or ionic-based crosslinking mechanisms.

Abstract: This invention relates to polymers having enhanced hydrophilicity and thermal regulative properties. Exemplary polymers include aliphatic polyamide polymers and polyester polymers. The polymer has bonded thereto a hydrophilic polysiloxane having an affinity for the polymer and having a molecular weight greater than about 1000 g/mol preferably greater than about 2000 g/mol, and preferably greater than about 4000 g/mol. The polymer has substantially no polymerization with the hydrophilic polysiloxane. Alternatively, an aliphatic polyamide polymer is provided having enhanced hydrophilicity and thermal regulative properties. The polymer has bonded thereto an anionic hydrophilic polysiloxane having an affinity for the aliphatic polyamide polymer. The aliphatic polyamide polymer has substantially no polymerization with the anionic hydrophilic siloxane.

Abstract: The compositions of this invention comprise uncrosslinked reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one metal-containing polymer.Preferred compositions of this invention comprise reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one of: at least one of: a polymer selected from the group consisting of silicon-nitrogen polymers, aluminum-nitrogen polymers and boron-nitrogen polymers comprising a multiplicity of sequentially bonded repeat units.

Abstract: Thermoplastic molding compositions comprising blends of a block polysiloxane--polycarbonate copolymer and a polyamide resin are useful for extruding articles such as films.