Abstract: A method for producing halogen-free, antimony-free and phosphorous-free polyamide fibers is described by incorporating an additive into the polyamide which comprises a vulcanizable mixture of silicones and a catalyst in a thermoplastic matrix. The fibers have improved flame retardancy and are used for the manufacture of carpets.

Abstract: Structures containing a dielectric material having a polymeric reactive ion etch barrier embedded therein. The preferred dielectric materials are polymers, preferably polyimide materials. The RIE etch barrier is a copolymer having an aromatic component having high thermal stability and having a cross-linking component selected from metallacyclobutane, metallabutene and vinyl groups. The etch barrier is deposited as a solvent free liquid which can fill gaps between the dielectric material and electrical conductors embedded therein. The liquid polymer is cured to a solid insoluble state. The structures with electrical conductors embedded therein are useful for electronic applications.

Abstract: The instant invention pertains to a curable resin composition comprised of A) 100 parts by weight curable resin, and B) 0.1-500 parts by weight of an organopolysiloxane having organic groups that contain epoxy groups, which is expressed by the formula: ##STR1## wherein R.sup.1 is a univalent hydrocarbon group excluding alkenyl groups, R.sup.2 is a hydrogen atom or a univalent hydrocarbon group excluding alkenyl groups, R.sup.3 is an alkoxysilylalkyl group or an organic group that contains epoxy groups, a is 0 or a positive integer, b is a positive integer and c is a positive integer, where a/c has the value of 0 to 4, b/c has the value of 0.05 to 4 and (a+b)/c has the value of 0.2 to 4. The curable resin composition of the instant invention has superior flowability that produces a hardened resin with superior flexibility and adhesion.

Abstract: Methods are disclosed for the blending of inherently incompatible polymer systems to provide compositions comprising (i) 1 to 99.99 percent by weight of a diorganopolysiloxane; and (ii) 0.01 to 99 percent by weight of an organopolysiloxane-grafted rigid linear aromatic polymer selected from the group consisting of organopolysiloxane-grafted polyimide and organopolysiloxane-grafted polybenzobisoxazole.

Abstract: Moisture-curing polyamides containing reactive alkoxysilane groups and a process for their preparation are provided. The reactive alkoxysilane groups contain organic groups which are not reactive during the production process, the intended application or the curing process. These moisture-curing polyamides have low melt viscosities and are useful as sealing compounds, hotmelt adhesives and encapsulating materials.

Abstract: A free-flowing silicone polymer powder, having an average particle size of 1 to 1000 microns and prepared by mixing a polydiorganosiloxane with a silica filler, is uniformly dispersed in an organic resin using conventional equipment, such as a single screw or, preferably, a twin screw extruder. When employed at a concentration of about 0.5 to 25 parts by weight of powder per 100 parts by weight of resin, a significant improvement in the burn character of the modified resin is obtained such that the rate of heat release, generation of smoke and evolution of toxic carbon monoxide gas is significantly reduced relative to the unmodified resin.

Abstract: A process is disclosed for preparing a masterbatch composition of elastomer with a high concentration of aramid fibers, as the sole particulate component, distributed therethroughout.

Abstract: A cured resin product has a strain energy release rate (GIC) of at least 400 J/m.sup.2, a flexural modulus of at least 300 Kg/mm.sup.2, and a glass transition temperature (Tg) of at least 120.degree. C. The cured resin composition comprises a thermoset resin component (A), optionally including a curing agent (B), and a thermoplastics resin component (C), the thermoplastics resin and thermoset resin components (C) and (A) being present at least partly in respective phases (1) and (2) each being elongate in at least one direction and each preferably having a three dimensionally continuous structure. Phase (1) may contain a silicon containing compound providing a concentration therein of elemental silicon higher than that in any other phase, and/or the cured resin product may additionally include regions where one of the phases (1) and (2) essentially surrounds the other.

Abstract: A polyimidesiloxane film having a low heat conductivity without damaging the heat resistance intrinsic of polyimide, a high hardness and a superior adherence onto its substrate, is provided, which polyimidesiloxane film comprises a cross linked copolymer having repetition units expressed by the formula (1): ##STR1## wherein R.sup.1 independently is a tetravalent organic group, R.sup.2 independently is a divalent organic group of 2 to 30 C, R.sup.3 independently is represented by 4 specified formulas, R.sup.4 and R.sup.5 each are a specified organic group, and n, p, q, and r each have a value within a range satisfying 3 specified equations, and which film exhibited a heat resistance of 511.degree. C. or higher, a hardness of 3H or higher and a heat conductivity of 0.160 or lower.

Abstract: A thermoplastic composition which comprises a siloxane polycarbonate block copolymer wherein the polysiloxane segments of the copolymer are of the formula: ##STR1## where R.sup.1, R.sup.2, Y, D, A, X, A' and E are as defined herein, and high heat polycarbonates containing recurring or repeating polycarbonate units of the formula: ##STR2## wherein Z is --O--, --N(R.sup.3)-- or a mixture thereof and R.sup.3 is selected from hydrogen, hydrocarbyl and halogen-substituted hydrocarbyl.

Abstract: A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).

Abstract: A polycarbonate pellet having a size between 200 and 1,500 microns, not inclusive, is produced by extruding molten polycarbonate through a die and cutting such extrudate with a die face cutter.

Abstract: Polymeric inorganic-organic compositions are obtained by intimately mixing a hydrolyzable precursor of an inorganic gel of silicon, titanium, or zirconium with an organic polymer and with an organic carboxylic acid having a pK.sub.a value of at most 4.0, present in an amount of at least 2 moles per mole of inorganic component, under conditions such that a homogeneous solution of all three components is initially formed, agitating the solution at 0.degree.-100.degree. C. until gelation of the inorganic component occurs, and recovering the inorganic-organic composition. Water need not be present as an initial reactant. Such compositions often are transparent, always have improved toughness, as compared with inorganic gels alone, and are believed to have a structure in which the organic polymer is entrapped in the inorganic gel in such an intimate manner that these two components cannot be separated from each other by physical means without destruction of the organic polymer.

Abstract: This invention relates to polymers having enhanced durable hydrophilicity and rewetting properties. The polymer has bonded thereto a hydrophilic copolymer. The copolymer comprises the reaction product of a primary hydroxylate having rewetting properties and a silane. The aliphatic polyamide or polyester polymer has an affinity for the hydrophilic copolymer and has substantially no polymerization with the hydrophilic copolymer. The present invention also provides a process of treating polymers to impart hydrophilicity and rewetting properties.

Abstract: There is disclosed a polyamide molding composition characterized by excellent moldability, release and lubricity, said composition comprising:(A) 100 parts by weight of a polyamide resin;(B) 0.1 to 120 parts by weight of a polydiorganosiloxane that contains neither carboxyl nor amino groups; and(C) a polysiloxane selected from the group consisting of carboxyl-containing polydiorganosiloxane and amino-containing polydiorganosiloxane, the amount of said polysiloxane (C) being 0.01 to 50 parts by weight for each 100 parts by weight of said component (B).

Abstract: An adhesive silicone rubber composition of addition reaction curing type comprising (a) an organopolysiloxane containing an alkenyl group; (b) an organohydrogenpolysiloxane having at least one hydrogen atom directly attached to a silicon atom in a molecule; (c) an addition reaction catalyst; and (d) an adhesive agent selected from compounds of the following formulae (I), (II) and (III):A-(D-B).sub.x -D-A (I)C-(B-D).sub.

Abstract: A composition useful in the fabrication of extruded articles contains a thermoplastic resin such as polyethylene and from 100-3,000 parts per million of a lubricant which is (i) an organosilicon resinous copolymer having a number average molecular weight of between 1,200-10,000 and R.sub.3 SiO.sub.1/2, R.sub.2 SiO.sub.2/2, RSiO.sub.3/2 and SiO.sub.4/2 units, wherein R is a C.sub.1 -C.sub.6 alkyl, aryl, alkenyl and/or trifluoropropyl radical(s); or (ii) the organosilicon resinous copolymer and a siloxane polymer R.sub.3 SiO(R.sub.2 SiO).sub.n SiR.sub.3 wherein R is as defined heretofore and n is 1-100,000; or (iii) the organosilicon resinous copolymer and an absorbing filler such as silica; or (iv) the organosilicon resinous copolymer, the siloxane polymer and an absorbing filler.

Abstract: This invention relates to heat-resistant polyimide blends and laminates thereof, which have excellent heat and moisture resistance, and excellent mechanical properties, including outstanding toughness. The blends contain a thermoplastic polyimide component and a thermosetting imide oligomer. The weight ratio of the thermoplastic component to thermosetting component is selected in the range of 99/1 to 5/95. The thermoplastic polyimide component has a number average molecular weight of 10,000 or more.

Abstract: A process is disclosed for preparing a masterbatch composition of elastomer with a high concentration of aramid fibers, as the sole particulate component, distributed therethroughout.

Abstract: A free-flowing silicone polymer powder, having an average particle size of 1 to 1000 microns and prepared by mixing a polydiorganosiloxane with a silica filler, is uniformly dispersed in an organic resin using conventional equipment, such as a single screw or, preferably, a twin screw extruder. When employed at a concentration of about 0.5 to 25 parts by weight of powder per 100 parts by weight of resin, a significant improvement in the burn character of the modified resin is obtained such that the rate of heat release, generation of smoke and evolution of toxic carbon monoxide gas is significantly reduced relative to the unmodified resin.

Abstract: This invention is directed to a non-halogen flame retardant thermoplastic molding composition having in combination a high molecular weight linear polyester and a non-halogen flame retardant. The flame retardant may be either a copolymer of polyetherimide-organopolysiloxane or a blend thereof with a polyphenylene sulfide, and/or a polyetherimide. The molding composition of the invention may also contain a filler.

Abstract: A release agent comprising a resin containing siloxane segments is described. The resin has been modified with a silane coupling agent containing at least one free isocyanate group and contains one or more hydrolyzable silyl groups in side chains of its molecule.

Abstract: A novel organic/inorganic hybrid material has been discovered comprising a functionalized silsesquioxane and an organic component having reactive endgroups wherein the organic backbone of the organic component is selected from polyimides, polyquinoxolines, polyether ketones, polyether sulfones, and polyesters. The hybrid materials are useful as films that may be employed as reinforced plastics, lightweight metal replacements, and as coatings.

Abstract: A room temperature curable fluorine-containing organopolysiloxane composition comprising:(A) a fluorine-containing organosilicon compound having the general formula (1):R.sup.2 --NHCO--[Rf--CONH--R.sup.1 --Q--R.sup.1 --NHCO].sub.a --Rf--CONH--R.sup.2 (1)wherein a is an integer of 0 or more, Rf is a divalent perfluoroalkylene group or a divalent perfluoropolyether group, R.sup.1 is a divalent hydrocarbon group, R.sup.2 is a monovalent aliphatic unsaturated group-containing hydrocarbon group, and Q is a divalent siloxane group(B) a hydrogenorganopolysiloxane containing at least two Si--H groups in its molecule, and(C) a platinum family metal catalyst. The cured product of this composition exhibits good solvent resistance against non-polar solvents as well as polar solvents, in addition to good chemical resistance, heat resistance, release properties and water repellency.

Abstract: A polyimidesilicone resin precursor composition which comprises a polysiloxane of the following general formula ##STR1## wherein R is a monovalent organic group having up to 10 carbon atoms, R.sup.1 represents a hydrogen atom or a monovalent organic group having up to 10 carbon atoms, and m is an integer not smaller than 3, and a polyamic acid or a polyimide obtained from the polyamic acid. The composition is cured at a relatively low temperature within a short time to provide a cured film having improved solvent and heat resistances and good adhesion to various substrates.

Abstract: This invention relates to polymers having enhanced hydrophilicity and thermal regulative properties. Exemplary polymers include aliphatic polyamide polymers and polyester polymers. The polymer has bonded thereto a hydrophilic polysiloxane having an affinity for the polymer and having a molecular weight greater than about 1000 g/mol preferably greater than about 2000 g/mol, and preferably greater than about 4000 g/mol. The polymer has substantially no polymerization with the hydrophilic polysiloxane. Alternatively, an aliphatic polyamide polymer is provided having enhanced hydrophilicity and thermal regulative properties. The polymer has bonded thereto an anionic hydrophilic polysiloxane having an affinity for the aliphatic polyamide polymer. The aliphatic polyamide polymer has substantially no polymerization with the anionic hydrophilic siloxane.

Abstract: Oligosiloxanes of the formula I ##STR1## where R.sup.1 is a C.sub.1 -C.sub.4 -alkyl andn is from 2 to 50,are chiefly used for fabricating fiber-reinforced composite and ceramic materials.

Abstract: A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence.

Abstract: Flame retardant blends of poly(aryloxysiloxane) and organic polymers such as polyethers, polyesters, polyetherimides and terpolymers of acrylonitrile-butadiene-styrene are provided. In many instances, the flame retardant blends exhibit improved chemical resistance, impact resistance and have an improved heat deflection temperature as compared to the original polymeric materials.

Abstract: Crosslinkable compositions with a polyethylene base are described which comprise a major proportion, for example 65 to 95% by weight, of at least one polymer selected from the polyethylenes grafted by a silane and ethylene-triethoxyvinylsilane copolymers; a minor proportion, for example, from 5 to 35% by weight, of at least one polymer selected from the hydrophilic polymers which are incompatible with ethylene polymers; as well as, added to the total weight of polymers (a) and (b), a small proportion, for example, from 1 to 10% by weight, of at least one polymer selected from the copolymers and the terpolymers with an ethylene base to react chemically with said incompatible hydrophilic polymer; and a catalytic proportion, for example of 0.001 to 0.3% by weight, of at least one hydrolytic catalyst. These crosslinkable compositions can be shaped by extrusion, extrusion blow-molding or injection molding and then crosslinked by heating in the presence of water.

Abstract: The thermal properties, such as heat distortion temperature of biodegradable polymers, such as polylactic acid, polyglycolides, polybutyric acid and copolymers of butyric and valeric acid, may be increased by blending them with a polymer having Tg from 75.degree. C. to 200.degree. C. and a Hildebrand parameter (.sigma.) of not more than 3 MPA.sup.1/2 different from the biopolymer.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.

Abstract: Toner fusing rolls with improved properties are formed with an outer layer comprising an addition-cured silicone elastomer. Such as elastomer is formed by crosslinking hydride substituted organopolysiloxanes and polyimides substituted with unsaturated hydrocarbon radicals.

Abstract: Complex microspheres consist of polysiloxane and vinyl polymers which are unistructurally mixed together and substantially free of covalent bonds therebetween. Polysiloxane and vinyl polymer are contained at ratio of 97/3.about.30/70 by weight, the average diameter of the complex microspheres is 0.05.about.30 .mu.m, the standard deviation of their particle size is 1.0.about.2.5, and the ratio between their major and minor axes is 1.0.about.1.2. Thermoplastic films containing such complex microspheres at a specified rate have improved lubricity and anti-blocking properties.

Abstract: There is disclosed a novel epoxy-modified branched epoxy copolymerizate which can be copolymerized with other thermoplastics, such as polycarbonates, to modify melt flow.

Abstract: A class of catalysts for the anionic copolymerization of cyclic lactams in the presence of .omega.-(N-acyllactam)polyorganosiloxanes, .alpha.,.omega.-di-(N-acyllactam)polyorganosiloxanes or star-shaped .omega.-(N-acyllactam)polyorganosiloxanes is disclosed. The catalysts successfully protect the siloxane prepolymer from harmful depolymerization reactions at elevated temperatures while anionically polymerizing the cyclic lactams via ring-opening. Diblock, triblock, multiblock and star-block copolymers, e.g., of a polyorganosiloxane and a polyamide, with advantageously high polyorganosiloxane and polyamide block molecular weights and superior heat resistance can be synthesized with the catalysts. The composition of these block copolymers, with the structure AB, ABA, and star-(BA).sub.r, r .gtoreq.3, where A=polyamide and B=polyorganosiloxane, and the process for producing them are also described.

Abstract: A curable resin composition comprising a mixture or cocondensate of a compound containing imide and alkoxysilyl groups and an organosilane or organopolysiloxane is shelf stable and cures into a film which is improved in heat resistance, mechanical strength, electrical properties, solvent resistance and adhesion to substrates and thus suitable as a protective film on electronic parts.

Abstract: A polyimide resin is prepared by reaction of a tetracarboxylic dianhydride with a specified class of amino functional organosilicon compounds followed by cycloimidization of the resultant polyamide acid intermediate. The resin is characterized by an excellent adhesion to various types of inorganic substrates such as glass. The present method employs relatively low temperatures for the cycloimidization reaction.

Abstract: Solutions of polycondensates which have N-containing heterocyclic ring systems as structural units, or solutions of intermediates of these polycondensates, in inorganic solvents, contain from 0.1 to 20% by weight, based on the polycondensates or the intermediates thereof, of one or more azidosilanes of the general formulaN.sub.3 --R.sup.3 --Si--R.sup.1.sub.n (OR.sup.2).sub.3-n Iwhere R.sup.1 is C.sub.1 -C.sub.3 -alkyl, phenyl, benzyl or toluyl, R.sup.2 is C.sub.1 -C.sub.4 -alkyl, C.sub.2 -C.sub.4 -alkoxyalkyl, phenyl or benzyl, R.sup.3 is C.sub.1 -C.sub.8 -alkylene which may be interrupted by an oxygen atom, a sulfur atom or a --(N--R.sup.4) -group, where R.sup.4 is hydrogen, methyl, ethyl or phenyl, and n is 0, 1 or 2.

Abstract: A polyorganosiloxane series thermoplastic resin comprising a graft copolymer obtained from a vinyl monomer and a modified polyorganosiloxane, and a thermoplastic resin composition containing the same. The resin and the composition thereof have excellent slidability, abrasion resistance, weather resistance, cold resistance and impact resistance, and can be applied to new fields such as sliding parts, parts for cold district, outdoor parts, etc.

Abstract: Disclosed is method of making a polyimidesiloxane extended block copolymer containing at least one polyimide block made by reacting a dianhydride with a diamine that does not contain a siloxane group, and at least one polyimidesiloxane block made by reacting a dianhydride with a diamine that contains at least one siloxane group, where each polyimidesiloxane block is prepared using more than one mole of the dianhydride for each mole of the siloxane-containing diamine. That is, any siloxane-imide blocks in the polyimidesiloxane are formed from amic acid blocks terminated in anhydride groups and any imide blocks in the polyimidesiloxane are formed from amic acid blocks terminated in amine groups. The polyimidesiloxane block copolymers have higher glass transition temperatures than the corresponding non-extended block copolymers while retaining the same solubility.

Abstract: Toner fusing members coated with melamine-cured polyester-amide compositions are obtained wherein the polyester-amide component is a copolymer of one or more organic dicarboxylic acids with 2,2-bis(4-hydroxyphenyl)hexafluoropropane and an aminoalkyl-terminated organopolysiloxane.

Abstract: The impact resistance of polyimides is improved by the addition of impact modifiers comprising, as a first stage, an elastomeric polydiorganosiloxane optionally polymerized simultaneously with but separately from one or more vinyl monomers, and as at least one grafted subsequent stage a polymer or copolymer of acrylonitrile, methacrylonitrile, a vinyl aromatic compound, (meth)acrylic acid, alkyl (meth)acrylate or (meth)acrylamide monomer.

Abstract: A coating composition is disclosed comprising an organosilane polymer, a polyester or a copolymer thereof, an amino resin crosslinking agent, and a silsesquioxane compound. Such a composition is especially useful for providing a flexible finish on non-metallic parts of automobiles and trucks. This finish has the advantage of superior etch resistance and outstanding weatherability and durability characteristics.

Abstract: The disclosed heat resistant adhesive composition comprises a polyimidesiloxane obtained from a biphenyltetracarboxylic acid or its derivative and a diamine composition comprising a diaminopolysiloxane and an aromatic diamine, an epoxy compound having an epoxy group, and an epoxy compound-hardening agent. An adhesive film and a composite sheet utilizing the heat resistant resinous composition are also disclosed.

Abstract: Disclosed is a photosensitive resin composition for forming a polyimide film pattern. The composition contains a polyamic acid and at least one silyl ketone compound represented by general formula (II) given below, ##STR1## where each of R.sup.3 to R.sup.16 is a are substituted or unsubstituted alkyl group having 1 to 12 carbon atoms or a substituted or unsubstituted aromatic group having 6 to 14 carbon atoms, each of R.sup.5 to R.sup.16 may be a substituted or unsubstituted silyl group, and each of l, m, n, s, t and u is 0 or 1, at least one of l, m, n, s, t and u being 1. The composition further contains a sensitizer, as required. A semiconductor substrate is coated with the composition, followed by exposing the coating through a predetermined mask and subsequently developing and heat-treating the coating so as to form a polyimide film pattern.

Abstract: Polyester/silicon co-crosslinked polymer substrates at least partially degradable by hydrolysis, well adopted as matrices for the controlled release of a wide variety of active agents therefrom, are prepared by controlledly co-crosslinking (a) at least one diorganopolysiloxane having at least two hydroxyl groups per molecule and (b) an oligomeric polylactic and/or polyglycolic polyester .alpha.,.omega.-diol, with an effective co-crosslinking amount of (c) an organic polyisocyanate.

Abstract: A liquid crystal-aligning film affording a high pretilt angle and capable of realizing a liquid crystal display for STN mode having a superior display quality and a liquid crystal display element including such film are provided,which film comprises as its main component, a polyimide having a structural unit expressed by the formula ##STR1## wherein R.sub.1 to R.sub.6 each are H or 1-22C alkyl and may be the same as or different from one another,Y is ##STR2## R.sub.7 to R.sub.14 ; each are H or 1-3C alkyl and may be the same as or different from one another and Ar is a tetravalent aromatic group.

Abstract: The polyarylene sulfide resin composition is improved in impact strength and rigidity and useful as engineering plastics. It is prepred by mixing 100 parts by weight of a resin component comprising(A) 99 to 20 parts by weight of a polyarylene sulfide resin and(B) 1 to 80 parts by weight of a polyamide resin with(C) 0.5 to 50 parts by weight of an olefin copolymer comprising an .alpha.-olefin and a glycidyl ester of an .alpha., .beta.-unsaturated acid,(D) 0.01 to 5 parts by weight of an alkoxysilane compound and(E) 0 to 400 parts by weight of one or more fillers selected from among fibrous, powdery and flaky ones.

Abstract: A silicon-modified thermoplastic resin is prepared by heating a mixture comprised of 10 to 90% by weight of an imide group-containing thermoplastic resin and 90 to 10% by weight of a modified silicon compound having an amino group--NH.sub.2 at one end of the molecule and an alkyl group --C.sub.n H.sub.2n+1 (n is an integer of at least 1) at the other end of the molecule, to chemically bond the imide group-containing thermoplastic resin to the modified silicon compound.