Mixed With 1,2-epoxy Reactant Or Polymer Derived Therefrom Patents (Class 525/449)
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Patent number: 11180588Abstract: Compositions may include those of the formula: (I) wherein R1 is an alkyl chain having a carbon number in the range of greater than 40 to 200, R2 is a multiester, R3 is hydrogen, an ion, or an alkyl chain having a carbon number in the range of 1 to 200, m is an integer selected from 0 to 4, and n is an integer selected from the range of 0 to 4, wherein the sum of m and n is 1 or greater. Compositions may include a reaction product of a polyisobutylene-substituted succinic anhydride and a hydroxy-functional dendrimer, wherein the molar ratio of polyisobutylene-substituted succinic anhydride to hydroxy-functional dendrimer is within the range of 10:1 to 30:1.Type: GrantFiled: December 30, 2016Date of Patent: November 23, 2021Assignee: Stepan CompanyInventors: Rachael Anne Cole, Pradyumna Avinash Deshpande, Chandrashekhar Yeshwant Khandekar, Tore Nordvik, Loic Regnault De La Mothe, Elodie Shaw, Laure Canal, Marine Dugand, José Santiago
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Patent number: 10465115Abstract: The invention relates to cinnamic acid derivatives of formula S wherein the radicals have the meaning indicated in claim 1, to a process for their preparation and their use as self assembling photoalignment agent in liquid crystal mixtures. The invention further relates to a process for the fabrication of a liquid crystal (LC) display device with homogeneous alignment by photoaligning a liquid crystal mixture with positive or negative dielectric anisotropy comprising one or more compounds of formula S and optionally a polymerizable compound, to the liquid crystal mixture comprising the self assembling photoaligning agent and optionally the polymerizable compound and to the LC display produced by said process.Type: GrantFiled: November 18, 2016Date of Patent: November 5, 2019Assignee: MERCK PATENT GMBHInventors: Kevin Adlem, Alex Davis, Hassan Arasi, Joseph Sargent, Rachel Tuffin, Ian Charles Sage
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Patent number: 10330664Abstract: There is described herein methods and systems relating to the use of the interaction of different materials to perform early detection of component failure. In particular, when the debris in a fluid sample comes from more than one source, a “level of interaction” is determined in order to monitor the degradation of the parts or components associated with the debris, as a function of the composition of the particles found in the fluid sample.Type: GrantFiled: June 18, 2015Date of Patent: June 25, 2019Assignee: PRATT & WHITNEY CANADA CORP.Inventors: Maurice Jean, Daniel Meilleur
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Hyperbranched polyester with a hydrophobic nucleus for solubilizing poorly soluble active substances
Patent number: 10174156Abstract: The invention provides a composition comprising an active ingredient with a maximum solubility in water at 20° C. of 10 g/l, and a hyperbranched polyester based on a hydrophobic dicarboxylic acid and a trifunctional alcohol. The invention further relates to the hyperbranched polyester mentioned, to a process for preparation thereof and to the use thereof for solubilizing an active ingredient with a maximum solubility in water at 20° C. of 10 g/l in aqueous solutions.Type: GrantFiled: December 15, 2010Date of Patent: January 8, 2019Assignee: BASF SEInventors: Holger Türk, Monika Haberecht, Hiroe Yamada, Bernd Bruchmann, Daniel Schönfelder, Michael Ishaque, Ulrike Troppmann, Joachim Clauss, Chee Chin Liew -
Patent number: 9873762Abstract: The present invention relates to a polycarboxylic acid anhydride having a structural unit represented by the following Formula (1). The present invention provides a novel polycarboxylic acid anhydride. When the polycarboxylic acid anhydride is used, for example, as an epoxy resin-curing agent, the balance of the composition of the resin composition is stabilized, and a resin molded article having excellent heat resistance, transparency, thermal yellowing resistance, surface hardness, solvent resistance, flexibility, and adhesiveness is thus provided.Type: GrantFiled: April 18, 2014Date of Patent: January 23, 2018Assignee: NEW JAPAN CHEMICAL CO., LTD.Inventors: Hideyuki Yoshikawa, Takayuki Nagashimada, Maiko Yamazaki, Eriko Harada, Taiki Tsuji, Masahiko Yamanaka, Taro Yamazaki
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Patent number: 9453164Abstract: The invention relates to a horizontal liquid crystal alignment agent which provides a polymer (A) and a solvent (B). The polymer (A) is obtained by reacting a mixture comprising a tetracarboxylic acid dianhydride component (a) and a diamine component (b). The invention also provides a liquid crystal alignment film made by the liquid crystal alignment agent as mentioned above and a liquid crystal display element having the liquid crystal alignment film. The liquid crystal alignment film has high rubbing resistance.Type: GrantFiled: May 13, 2015Date of Patent: September 27, 2016Assignee: CHI MEI CORPORATIONInventor: Li-Tao Hsu
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Publication number: 20150080486Abstract: A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition.Type: ApplicationFiled: May 19, 2012Publication date: March 19, 2015Inventor: Robert Valentine Kasowski
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Patent number: 8969511Abstract: Polyether block copolymers of the general structure B-(A-OH)n are described, where n is greater than or equal to 2 and blocks A are made up of polyoxypropylene units and the central block B of polyoxytetramethylene, polyoxyethylene, polybutadiene, polyisoprene, polyacrylate, polymethacrylate, polyamide, polyurethane, or polyester units. These polyether block copolymers are suitable for the manufacture of compositions that serve as the basis for preparations for use as a one-component moisture-hardening or two-component adhesive or sealant, for assembly bonding, for areal bonding, and/or for coating, as a reactive melt adhesive or as a laminating adhesive.Type: GrantFiled: July 27, 2012Date of Patent: March 3, 2015Assignee: Henkel AG & Co. KGaAInventors: Lars Zander, Uwe Franken, Christiane Kunze, Michael Krebs, Johann Klein
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Publication number: 20150048539Abstract: A xylylenediamine-based polyamide resin/fiber composite material and molding are provided that do not exhibit a decline in properties under high temperatures and high humidities, and that exhibit a high elastic modulus and present little warping, and exhibit better recycle characteristics, a better moldability, and a better productivity than for thermosetting resins. The polyamide resin-type composite material comprises a fibrous material (B) impregnated with a polyamide resin (A) wherein at least 50 mole % of diamine structural units derived from xylylenediamine, and having a number-average molecular weight (Mn) of 6,000 to 30,000, and containing a component of a molecular weight of not more than 1,000 at 0.5 to 5 mass %.Type: ApplicationFiled: October 30, 2014Publication date: February 19, 2015Applicant: Mitsubishi Gas Chemical Company, Inc.Inventor: Jun MITADERA
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Patent number: 8956732Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).Type: GrantFiled: August 20, 2007Date of Patent: February 17, 2015Assignee: Hitachi Chemical Company, Ltd.Inventors: Masaki Takeuchi, Katsuyuki Masuda, Kenichi Tomioka, Takako Ejiri
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Patent number: 8945711Abstract: It is an object of the present invention to provide a water-based composite resin composition which has an excellent long-term storage stability and which enables formation of a coating film having an excellent water resistance and solvent resistance. The present invention relates to a water-based composite resin composition and a coating agent; the water-based composite resin composition containing composite resin particles (A) and an aqueous medium (B), the composite resin particles (A) containing polyester resin (a1) particles having a sulfonate group and an epoxy resin (a2) of which some or all parts are encapsulated in the polyester resin (a1) particles, wherein a mass ratio [(a1)/(a2)] of the polyester resin (a1) to the epoxy resin (a2) in the composite resin particles (A) is in the range of 95/5 to 30/70.Type: GrantFiled: March 9, 2012Date of Patent: February 3, 2015Assignee: DIC CorporationInventors: Tomokazu Higeshiro, Mitsuru Kitada
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Patent number: 8920788Abstract: Disclosed is a water-soluble high-molecular weight conjugate of physiologically active substances which enable medicament to release without depending on the enzymes in a living body and which is expected to have a useful therapeutic effect. A high-molecular weight conjugate of a physiologically active substance has a substituent group represented by a general formula (1) bonded to a side-chain carboxy group of a block copolymer which has a polyethylene glycol moiety and either a polyaspartic acid moiety or a polyglutamic acid moiety.Type: GrantFiled: March 17, 2009Date of Patent: December 30, 2014Assignee: Nippon Kayaku Kabushiki KaishaInventors: Masayuki Kitagawa, Chieko Seno
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Publication number: 20140364568Abstract: Thermoplastic polymer particles directly cross-linked together or cross-linked via a separate and independent polymer network to form an inter-penetrating network are disclosed herein, along with methods of manufacturing and use as interleaf tougheners of pre-pregs and composite articles.Type: ApplicationFiled: August 27, 2014Publication date: December 11, 2014Applicant: CYTEC TECHNOLOGY CORP.Inventors: Yi WEI, Alexandre BAIDAK, James Senger
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Publication number: 20140322541Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.Type: ApplicationFiled: August 10, 2013Publication date: October 30, 2014Applicant: Elite Electronic Material (Kunshan) Co., LtdInventors: RONG-TAO WANG, LI-CHIH YU, YU-TE LIN, YI-JEN CHEN, WENJUN TIAN, ZIQIAN MA, WENFENG LU
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Publication number: 20140309352Abstract: A curable polymer composition comprising: (A) a thermoset maleimide resin precursor component; and further comprising one or both of: (B) an arylsulphone-containing maleimide component; and (C) a polyarylpolymer thermoplastic toughening agent component, wherein in the absence of component (B), said component (C) comprises one or more maleimide pendant and/or end groups, and thermoset resins and composites derived therefrom.Type: ApplicationFiled: December 20, 2012Publication date: October 16, 2014Applicant: CYTEC INDUSTRIES INC.Inventors: Steven Richard Ward, Paul Mark Cross, Robin Maskell
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Patent number: 8841386Abstract: A method for forming a fiber is provided. The method comprises supplying at least one aromatic polyester to a melt processing device and modifying the aromatic polyester with at least one polyether copolymer within the device to form a thermoplastic composition having a melt flow rate that is greater than the melt flow rate of the aromatic polyester. The polyether copolymer contains a repeating unit (A) having the following formula: C2H4Ox??(A) wherein, x is an integer from 1 to 250, the polyether copolymer further containing a repeating unit (B) having the following formula: CnH2nOy??(B) wherein, n is an integer from 3 to 20; and y is an integer from 1 to 150.Type: GrantFiled: June 10, 2008Date of Patent: September 23, 2014Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Aimin He, Vasily A. Topolkaraev, Alan E. Wright, Gregory J. Wideman
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Publication number: 20140194575Abstract: A crosslinkable bioplasticizer is disclosed, a mixture of an epoxy-functional bio-derived plasticizer and an aromatic dianhydride. When heated, the mixture crosslinks, which can be accelerated by the addition of a Lewis Acid metal catalyst. The crosslinked bioplasticizer can be melt compounded into a thermoplastic resin or can be formed in situ in the thermoplastic resin. The crosslinking of the bioplasticizer can reduce blooming of the bioplasticizer to the surface of a plastic article made by extrusion, molding, calendering, or thermoforming techniques.Type: ApplicationFiled: July 25, 2012Publication date: July 10, 2014Applicant: PolyOne CorporationInventors: Roger W. Avakian, Ling Hu
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Patent number: 8765879Abstract: To provide a modified recycled polyester resin that has stable moldability, is capable of producing as a by-product only a small amount of gel-like material during the process of modification to allow stable cross-linking reaction, and can prevent the possibility of recleavage, and to provide a molded article using the same. The modified recycled polyester resin contains a recycled PET resin having a carboxyl group, and a modifying agent having an epoxy group and an oxazoline group, ends of the carboxyl group of the recycled PET resin being modified with the modifying agent, wherein a mole ratio between the oxazoline group and the epoxy group is within a range of 100:90 to 100:0.01, and an additive amount of the modifying agent is 0.001 to 15 parts by mass with respect to 100 parts by mass of the recycled PET resin.Type: GrantFiled: October 13, 2010Date of Patent: July 1, 2014Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Kyushu UniversityInventors: Tatsuya Hase, Makoto Mizoguchi
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Patent number: 8754171Abstract: Compositions comprising: (a) 30 to 65 weight percent of a polyester; (b) 7 to 25 weight percent of an ethylene copolymer toughener; (c) 5 to 25 weight percent of a copolyether ester elastomer having a shore D hardness of 20 to 50; optionally (d) 15 to 35 weight percent of a halogenated epoxy flame retardant; and (e) when (d) is present in the composition, optionally, 2 to 10 weight percent of a flame retardant synergist; wherein: the ratio of the combined weight of (b)+(c) relative to the weight of (a) ranges from 0.40 to 0.85; the ratio of the weight of (b) relative to that of (c) ranges from 0.3 to 2.5; and the Gardner impact of the composition, when molded, is at least 4.2 J, measured at ?40° C. according to ASTM D5420. Methods of making articles by molding these melt-mixed compositions.Type: GrantFiled: March 4, 2013Date of Patent: June 17, 2014Assignee: E I du Pont de Nemours and CompanyInventors: Masahiro Kurouchi, Hiroyuki Sumi
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Patent number: 8674032Abstract: The invention relates to a biodegradable multi-block copolymer, comprising at least two hydrolysable segments derived from pre-polymers A and B, which segments are linked by a multi-functional chain-extender and are chosen from the pre-polymers A and B, and triblock copolymers ABA and BAB, wherein the multi-block copolymer is amorphous at physiological (body) conditions. The invention further relates to a process for preparing said copolymer and to its use as a medical implant, a coating for a medical device or a drug delivery vehicle.Type: GrantFiled: June 6, 2013Date of Patent: March 18, 2014Assignee: Innocore Technologies B.V.Inventors: Catharina Everdina Hissink, Rob Steendam, Ronald Meyboom, Theodorus Adrianus Cornelius Flipsen
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Publication number: 20140031500Abstract: The present technology is an epoxy resin composition containing an epoxy resin (A), a urethane resin (B) in which the terminal isocyanate of the urethane prepolymer is blocked by at least one of an ?-polycaprolactam, an oxime, or a pyrazole, and in which bisphenol A is included in the backbone of the aforementioned urethane prepolymer, and a curing agent (C).Type: ApplicationFiled: April 2, 2012Publication date: January 30, 2014Applicant: THE YOKOHAMA RUBBER Co., LTD.Inventors: Misaki Matsumura, Kazunori Ishikawa
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Patent number: 8637593Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.Type: GrantFiled: July 30, 2010Date of Patent: January 28, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Hayato Kotani, Naoyuki Urasaki, Makoto Mizutani
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Patent number: 8585272Abstract: The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.Type: GrantFiled: January 9, 2009Date of Patent: November 19, 2013Assignee: Hitachi Chemical Company, Ltd.Inventors: Hayato Kotani, Naoyuki Urasaki, Makoto Mizutani
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Patent number: 8563663Abstract: The invention relates to a heat curable composition for fire-resistant or intumescent composite parts, which is free of any halogen additive or halogen structure in the components thereof, and which comprises: a) 100 parts by weight of a dry resin, including a1) an unsaturated polyester having an acid index lower than 10 and/or a2) a vinyl ester; b) 40 to 200 parts by weight of a reactive thinner among ethylenically unsaturated monomers; c) 20 to 110 parts by weight of a thermal expansion agent selected from melamine and derivatives thereof, guanidine, glycine, urea, triisiocynurates, and azodicarbinamide; d) 0 to 250 parts by weight of aluminium trihydrate; e) 10 to 80 parts by weight of a carbonisation precursor agent selected from multifunctional polyols; f) 50 to 200 parts by weight of a compound selected from a phosphorus derivative and/or a boric acid derivative; g) optionally at least one metal oxide; h) optionally other additives and fillers; i) optionally reinforcements containing natural or synthetiType: GrantFiled: December 2, 2009Date of Patent: October 22, 2013Assignee: CCP CompositesInventors: Serge Herman, Urbain Coudevylle, Thierry Foussard
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Patent number: 8529928Abstract: Biodegradable polymers incorporating biomolecules and methods of their use are provided. Certain aspects provide biomolecules crosslinked with diglycidyl esters. The disclosed compositions have numerous applications including cellular regeneration, wound healing, and cellular differentiation.Type: GrantFiled: July 6, 2007Date of Patent: September 10, 2013Assignee: Georgia Tech Research CorporationInventors: Yadong Wang, Blaine Zern, Christiane Gumera
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Patent number: 8445585Abstract: This invention relates to binder mixtures comprising mass fractions of from 70% to 98% of chain-extended epoxy amine adducts A and from 2% to 30% of carboxy functional polyesters B that contain a limited amount of aromatic constituents in mass fractions of up to 15% and have an acid number of from 4 mg/g to 50 mg/g, a method of making these binder mixtures, and a method of use thereof in coatings for metals, wood, cardboard, plaster, and concrete.Type: GrantFiled: January 8, 2008Date of Patent: May 21, 2013Assignee: Cytec Surface Specialties Austria GmbHInventors: Willi Paar, Roland Feola, Johann Gmoser, Rosemaria Grasboeck
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Publication number: 20130035411Abstract: Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE.Type: ApplicationFiled: October 11, 2012Publication date: February 7, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: International Business Machines Corporation
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Publication number: 20120328811Abstract: An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.Type: ApplicationFiled: June 24, 2011Publication date: December 27, 2012Applicant: Air Products and Chemicals, Inc.Inventors: Pritesh G. Patel, Peter Andrew Lucas, Jian Li, Williams Rene Edouard Raymond
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Publication number: 20120259072Abstract: Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE.Type: ApplicationFiled: April 11, 2011Publication date: October 11, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth G. Hougham, Xiao H. Liu
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Patent number: 8278398Abstract: Two-component epoxy-based structural adhesives are disclosed which exhibit excellent impact resistance, even when cured at approximately room temperature. The adhesives include an epoxy resin component which includes an epoxy resin and a reactive tougher. The adhesives also include a hardener component, which includes from 15 to 50 weight percent of an amine-terminated polyether, from 4 to 40 weight percent of an amine terminated rubber having a glass transition temperature of ?40° C. or below, and from 10 to 30 weight percent of an amine-terminated polyamide having a melting temperature of no greater than 50° C.Type: GrantFiled: August 12, 2008Date of Patent: October 2, 2012Assignee: Dow Global Technologies LLCInventors: Andreas Lutz, Beda Steiner
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Publication number: 20120237774Abstract: The present disclosure provides polyamides and amidoamine curing agents including the reaction product of (1) a modified amine component comprising at least one multifunctional amine of structure 1: wherein R1 is selected from C1-C16 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups; R2 and R4 are hydrogen, R3 is R1 or hydrogen, X, Y, and Z are independently selected from C2-C10 alkylene, hexylene and cycloalkylene groups, n=0, 1, 2, 3, 4, 5, 6, or 7; and (2) a fatty acid component. Exemplary fatty acid components include at least one of monomer fatty acids, dimer fatty acids, trimer fatty acids, polymer fatty acids, esters of monomer, dimer, trimer, and polymer fatty acids and combinations thereof. The method for making the curing agents and articles formed therefrom are also disclosed.Type: ApplicationFiled: March 15, 2011Publication date: September 20, 2012Applicant: Air Products and Chemicals, Inc.Inventors: Williams Rene Edouard Raymond, David Alan Dubowik, Gamini Ananda Vedage
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Patent number: 8268940Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.Type: GrantFiled: March 6, 2008Date of Patent: September 18, 2012Assignee: Nippon Steel Chemical Co., Ltd.Inventors: Akira Mori, Kiwamu Tokuhisa, Kazuhiko Nakahara, Masashi Kaji
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Publication number: 20120172542Abstract: A liquid crystal (LC) alignment agent is disclosed, which comprises polymer (A), tertiary hydramine (B) and epoxy group-containing compound (C). The LC alignment agent is added with a tertiary hydramine (B) and has an epoxy value of 0.065 to 0.900. The LC alignment agent can be employed to form a LC alignment film for enhancing the resulted LC alignment film with better rubbing resistance. A LC display (LCD) device that uses the LC alignment film has better voltage holding ratio (VHR) and process stability.Type: ApplicationFiled: December 19, 2011Publication date: July 5, 2012Applicant: CHI MEI CORPORATIONInventor: Tsung-Pei TSAI
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Publication number: 20120119172Abstract: The invention relates to the use of amino terminated phosphonamides and their oligomers, as flame retardant additives for a variety of polymers to impart flame retardancy while maintaining or improving processing characteristics and other important properties.Type: ApplicationFiled: November 11, 2011Publication date: May 17, 2012Applicant: FRX POLYMERS, INC.Inventors: Dieter FREITAG, Marc-Andre LEBEL, Lawino KAGUMBA, Marc E. LEBEL, Peter S. SCHULER
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Publication number: 20120108701Abstract: A resin blend composition of a polyamide resin and a polyester resin is described, which includes a polyamide resin, a polyester resin and an epoxy resin. The resin blend composition can have improved compatibility between the polyamide resin and the thermoplastic polyester resin, and therefore mechanical properties (strength, bending strength, elasticity, abrasion resistance, impact strength), chemical properties (solvent resistance), thermal resistance, dimensional stability, and paintability.Type: ApplicationFiled: June 18, 2010Publication date: May 3, 2012Inventors: Mok-Keun Lim, Kwang-Sang Lee, Yeong Chool Yu
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Patent number: 8114515Abstract: A composition comprises a thermally crosslinked reaction product of a polyester and a carboxy-reactive material. Methods for the manufacture of the composition and articles derived from the composition are also disclosed.Type: GrantFiled: February 5, 2007Date of Patent: February 14, 2012Assignee: Sabic Innovative Plastics IP B.V.Inventors: Christopher Luke Hein, Ganesh Kannan, Sreepadaraj Karanam, Claire Qing Yu
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Publication number: 20110319524Abstract: Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.Type: ApplicationFiled: May 30, 2011Publication date: December 29, 2011Applicants: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, ARKEMA FRANCEInventors: Ludwik Leibler, Damien Montarnal, Francois-Genes Tournilhac, Mathieu Capelot
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Patent number: 8080619Abstract: A styrenic thermoplastic resin composition of the present invention comprises about 100 parts by weight of base resin comprising (A) about 10 to about 99 parts by weight of styrenic resin containing an epoxy group and (B) about 1 to about 90 parts by weight of polyester resin; and (C) about 0.1 to about 97 parts by weight of amorphous modified polyester resin, based on the total weight of the base resin. A molded article produced from the styrenic thermoplastic resin composition of the present invention can have excellent impact resistance and paintability.Type: GrantFiled: July 8, 2009Date of Patent: December 20, 2011Assignee: Cheil Industries Inc.Inventors: Jae Won Lee, Jin Hwan Choi, Jun Myung Kim, Jee Kwon Park
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Patent number: 8080618Abstract: Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.Type: GrantFiled: June 3, 2009Date of Patent: December 20, 2011Assignee: Cheil Industries Inc.Inventors: Jun Myung Kim, Jin Hwan Choi, Jee Kwon Park, Jae Won Lee
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Patent number: 8058334Abstract: To provide a polyester resin composition having a high crystallization rate and excellent moldability. A polyester resin composition comprising (a) a polyester resin, (b) one or more sulfonamide compound metal salt having a structure represented by a general formula selected from the group consisting of the following general formula (1): the following general formula (2): and the following general formula (3): and (c) an aliphatic carboxylic acid diester compound of polyalkylene glycol represented by the following general formula (4): (in the formula (4), G represents an alkylene group having 2 to 4 carbon atoms; R4 and R5 each independently represent an alkyl or alkenyl group having 1 to 14 carbon atoms; and m represents a integral number of 2 to 30).Type: GrantFiled: August 9, 2007Date of Patent: November 15, 2011Assignee: Adeka CorporationInventors: Takahiro Horikoshi, Naoshi Kawamoto
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Patent number: 8017678Abstract: The present invention provides a polyester resin composition having an excellent crystallization rate. The polyester resin composition includes (a) a polyester resin containing (b) a sulfonamide compound metal salt which has a structure represented by the following general formula (1): (in the formula (1), R and R? each independently represent a hydrogen atom, a halogen atom, an alkali metal atom, an amino group, an alkyl group which has 1 to 10 carbon atoms and which may be branched or substituted, an alkoxy group which has 1 to 10 carbon atoms and which may be branched or substituted, or a cyclic group which has 3 to 30 carbon atoms and which may be substituted; R and R? may be bonded together to form a cyclic group; n represents a number of 1 or 2).Type: GrantFiled: April 13, 2007Date of Patent: September 13, 2011Assignee: Adeka CorporationInventors: Takahiro Horikoshi, Kazukiyo Nomura, Naoshi Kawamoto, Etsuo Tobita
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Patent number: 8003731Abstract: The invention relates to biodegradable polyester mixture, comprising i) from 5 to 80% by weight, based on the total weight of components i to ii, of at least one polyester based on aliphatic and aromatic dicarboxylic acids and on aliphatic dihydroxy compounds, and ii) from 20 to 95% by weight, based on the total weight of components i to ii, of at least one biodegradable homo- or copolyester selected from the group consisting of polylactide, polycaprolactone, polyhydroxyalkanoates, and polyesters composed of aliphatic dicarboxylic acids and of aliphatic diols, and iii) from 0.Type: GrantFiled: December 31, 2005Date of Patent: August 23, 2011Assignee: BASF SEInventors: Ursula Seeliger, Gabriel Skupin, Dirk Stärke
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Patent number: 7989556Abstract: An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.Type: GrantFiled: December 1, 2004Date of Patent: August 2, 2011Assignee: Toyo Boseki Kabushiki KaishaInventors: Kenji Shiga, Mitsuo Nishida
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Patent number: 7977429Abstract: Polymers having polyolefin segments as the side chain, with a structural unit represented by the following Formula (1): wherein A is an olefin polymer having a weight average molecular weight of 400 to 500,000; R is H, an alkyl group, or an aralkyl group; W and Z are each O, HN, or S; and x and y are each 0 or 1, with the proviso that at least one of them is 1. The polymer can be applied as an antistatic agent, a cosmetic additive, a releasing agent for toner, a pigment dispersant, a lubricant for vinyl chloride resins, a coating material, an emulsion composition and the like.Type: GrantFiled: January 20, 2005Date of Patent: July 12, 2011Assignee: Mitsui Chemicals, Inc.Inventors: Naoshi Nagai, Masahiko Mitsuzuka, Kazuoki Nakai, Motoaki Isokawa, Shiro Nakatsuka, Daiki Taneichi, Shirou Honma, Toshimitsu Narutaki
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Publication number: 20110105700Abstract: The present invention relates to a liquid crystal aligning agent containing a radiation sensitive polyorganosiloxane which is obtained by reacting at least one selected from the group consisting of a polyorganosiloxane having a recurring unit represented by the following formula (1), a hydrolysate thereof and a condensate of the hydrolysis with a cinnamic acid derivative having at least one group selected from the group consisting of a carboxyl group, a hydroxyl group, —SH, —NCO, —NHR (R is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms), —CH?CH2 and —SO2Cl: (in the formula (1), X1 is a monovalent organic group having an epoxy group, and Y1 is a hydroxyl group, an alkoxyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms).Type: ApplicationFiled: August 20, 2008Publication date: May 5, 2011Applicant: JSR CORPORATIONInventors: Toshiyuki Akiike, Tsutomu Kumagai
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Publication number: 20110082229Abstract: A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.Type: ApplicationFiled: February 20, 2009Publication date: April 7, 2011Applicant: GOO CHEMICAL CO., LTD.Inventors: Koichi Ikegami, Noboru Kohiyama, Teppei Nishikawa, Michiya Higuchi, Nobuhito Hamada, Hiroko Daido, Chieko Inui, Tatsuya Kubo
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Publication number: 20110061915Abstract: An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.Type: ApplicationFiled: May 14, 2009Publication date: March 17, 2011Applicant: KANEKA CORPORATIONInventor: Yoshihide Sekito
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Patent number: 7902302Abstract: Hydroxy-functional polyester-polyurethane dispersions comprising a reaction product of: (a) at least one, at least difunctional polyol component; (b) at least one ionizable compound having at least one acid group and at least one functional group capable of reacting with isocyanate groups, the at least one functional group selected from the group consisting of mono-, di-, and trihydroxycarboxylic acids, hydroxysulfonic acids, aminosulfonic acids, and aminocarboxylic acids; (c) at least one acid anhydride; and (d) at least one, at least difunctional polyisocyanate component; methods for preparing such dispersions; compositions containing such dispersions; and uses thereof.Type: GrantFiled: May 16, 2008Date of Patent: March 8, 2011Assignee: Bayer MaterialScience AGInventors: Harald Blum, Heino Müller
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Patent number: 7872078Abstract: The present invention is directed to curable film-forming compositions comprising: (a) a polymeric binder comprising a polyester having hydroxyl functional groups; and (b) a curing agent comprising a polyisocyanate having at least three isocyanate functional groups. In certain embodiments, after application to a substrate as a coating and after curing, the compositions demonstrate a Fisher microhardness of at least 120 at ambient temperatures of 15 to 25° C. and a softening point greater than or equal to 35° C. Additionally, in certain embodiments, after application to a substrate as a coating and after curing, the compositions demonstrate a 20° gloss recovery of at least 75% when subjected to the DRY ABRASION TEST METHOD.Type: GrantFiled: August 28, 2007Date of Patent: January 18, 2011Assignee: PPG Industries Ohio, Inc.Inventors: Lyle L. Foringer, Constantine A. Kondos, Richard J. Sadvary, Kurt G. Olson, Dennis A. Simpson
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Publication number: 20100307682Abstract: Thermally-activated and hardenable adhesive foil for adhesion of electronic components and flexible printed circuit paths having an adhesive material composed of at least a) one chemically crosslinked or at least partially crosslinked polyurethane, b) one at least bifunctional epoxy resin, c) one hardener for the epoxy resin, in which the epoxy groups react chemically with the hardener at high temperatures, in which at least one of the starting materials of the polyurethane is a hydroxyl-functionalized polycarbonate and at least one of the starting materials of the polyurethane has a functionality greater than twoType: ApplicationFiled: January 27, 2009Publication date: December 9, 2010Applicant: TESA SEInventors: Uwe Schümann, Alexander Steen