Abstract: Star polymers prepared by reacting a highly branched polymer and either a lactone or lactam are disclosed. These star polymers find particular application as additives for powder coating compositions, to improve various performance properties thereof. Powder coating composition comprising the described star polymers are also disclosed.

Abstract: Polymer compositions capable of a high degree of curing at relatively low temperatures, and prepregs, adhesives, films and composites formed therefrom are discussed. The polymer compositions include epoxy resin systems and a dual curing system including one or more curing agents containing one or more hydrazine-based curing agents having hydrazine functional groups and one or more amine-based curing agents containing one or more amine functional groups. The hydrazine-amine curing systems enable the polymer composition to achieve elevated levels of gelation or degree of cure at lower temperatures than are achievable with amine functional curing agents alone.

Abstract: [PROBLEMS] To provide a photosensitive resin composition which has excellent photosensitivity and gives a cured product reduced in warpage and excellent in flexing properties, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating, etc. [MEANS FOR SOLVING PROBLEMS] A urethane resin (A) soluble in aqueous alkali solutions and curable with active energy rays which is obtained by reacting a diisocyanate compound (a) with a tetrabasic acid dianhydride (b) to obtain a compound (E), reacting the compound (E) with a hydroxylated compound (c) having an unsaturated group and optionally with a hydroxylated compound (d) other than the compound (c) to obtain a compound (F), and further reacting hydroxy groups of the compound (F) with a diisocyanate compound (e).

Abstract: A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole.

Abstract: A two-component bonding agent composition. The composition contains: (a) an isocyanate component comprising a difunctional isocyanate-terminated prepolymer having polymerized residues of at least one difunctional aromatic isocyanate and at least one difunctional polymer of ethylene oxide, propylene oxide or a combination thereof; (b) a polyol component comprising a triglyceride having hydroxyl functional groups; and (c) an adhesion promoter.

Abstract: Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid.

Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Abstract: The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of at least one secondary monoamine and at least one maleimide, and is suitable for use in coatings and castings.

Abstract: The invention relates to a binder comprising crosslinker and branched, partially defunctionalized, acid-functional polyester based on: a. At least one multi-functional component; b. At least one di-functional component that is reactive towards a functional group on the multi-functional component; and c. At least one mono-functional component; wherein the polyester has a glass transition temperature of 40° C. or greater.

Abstract: A composition for forming a gas-barrier material, comprising a polycarboxylic acid-type polymer (A) and at least a bifunctional alicyclic epoxy compound (B). The composition for forming a gas-barrier material features excellent gas-barrier property, retort resistance and flexibility, can be cured at a low temperature in a short period of time without affecting the plastic base material, and contributes to improving the productivity.

Abstract: A high-functionality, highly branched or hyperbranched polycarbonate that has a weight average molecular weight of between 3,300 and 150,000, a degree of crosslinking of less than 15%, and a degree of branching ranging from 10% to 99.9%; the polycarbonate being made by a process comprising preparing one or more condensation products (K), and intermolecularly reacting the one or more condensation products (K) to form the polycarbonate.

Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols, epoxy-phosphorus acid reaction products, and an aqueous dispersion comprising the reaction product of trimellitic anhydride and a polyol, wherein the molar ratio of trimellitic anhydride to the polyol in the reaction product ranges from 1:2 to 1:4, and wherein the reaction product is further reacted with an anhydride to form another reaction product are disclosed. The binders are useful in primer formulations for automotive applications.

Abstract: A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.

Abstract: The present invention relates to a process for producing an acid anhydride-based epoxy resin curing agent, an acid anhydride-based epoxy resin curing agent, an epoxy resin composition, and a cured product and optical semiconductor device using the same. The process for producing an acid anhydride-based epoxy resin curing agent according to the present invention comprises heating a mixture containing a polyvalent carboxylic acid anhydride and a polyester resin in the presence of hydrogen gas and a hydrogenation catalyst.

Abstract: Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid.

Abstract: Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1): wherein m and n are average values satisfying the following formula: 0.005?n/(m+n)<0.05, m+n is a positive value of 2 to 200, Ar1 is a bivalent aromatic group, Ar2 is a phenolic hydroxyl group-containing bivalent aromatic group, and Ar3 is a bivalent aromatic group. Such a phenolic hydroxyl group-containing aromatic polyamide resin has a low ionic impurity content and improved adhesive properties as well as excellent properties inherent in conventional phenolic hydroxyl group-containing aromatic polyamide resins, such as the ability to allow a cured epoxy resin composition to have excellent flexibility, electrical properties, flame retardancy, and the like.

Abstract: The invention relates to novel polyester-polysiloxane block copolymers, to a process for their preparation and to the use of these polymers as a base oil or as an additive in lubricants, especially silicone oils.

Abstract: Non-aqueous, liquid coating compositions which contain at least one epoxy-functional binder A and at least one carboxyl-functional cross-linking resin B, wherein the at least one cross-linking resin B is present as particles having a melting temperature of 40 to 180° C.

Abstract: Fast-curing modified siloxane compositions comprise; (1) an alkoxy- or silanol-functional silicone intermediate, (2) at least one amine reactive ingredient selected from the group consisting of acetoacetate-functional ingredients, acrylate-functional ingredients, and mixtures thereof, (3) an epoxy-functional ingredient, (4) a curing agent selected from the group consisting of amines, aminosilanes, ketimines, aldimines and mixtures thereof, and (5) water. Other ingredients useful in forming fast-curing modified siloxane compositions of this invention include silanes, organometallic catalysts, solvents, pigments, fillers and modifying agents. The above-identified ingredients are combined and reacted to form a fully cured protective film comprising a cross-linked enamine polysiloxane and/or acrylate polysiloxane chemical structure in a reduced amount of time when compared to conventional epoxy siloxane compositions.

Abstract: Radiation curable compositions comprising at least one radiation curable oligomer obtained from the reaction of one or more carboxyl functional polyester (a) having a glass transition temperature TG and/or melting temperature Tm of less than 30° C., with (b1) one or more (meth)acrylated mono-epoxide, and/or (b2) one or more polyepoxide and one or more ?, ? unsaturated carboxylic acid.

Abstract: High-functionality, highly branched and high-functionality, hyperbranched polymers based on polyisobutene derivatives and a process for their preparation

Abstract: Curing agents for epoxy resins, consisting of A) a polyaminoamide adduct obtainable by reacting a1) a polyaminoamide containing imidazoline groups and prepared from a1-1) a polyethylenepolyamine having 3 or more nitrogen atoms in the molecule, and a1-2) a monofunctional fatty acid, with a2) a monofunctional, aromatic epoxide compound, and also curable compositions further comprising an epoxide compound, and the use of these curable compositions for producing mouldings and sheetlike structures, and also for applications in the adhesives and sealants sectors and for epoxy resin mortars, matrix resins, tooling resin or as coating materials, particular for wet concrete.

Abstract: An epoxy adhesive composition of an epoxy resin and an amine hardener includes a synergistic accelerator of an effective amount of short chain polyol and an effective amount of a dihydric phenol having between about 6 and about 24 carbon atoms. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating. The joined adherends having the dried epoxy resin composition is another disclosed embodiment.

Abstract: A composition for forming an article having an improved resistance to hydrolysis is disclosed. The composition comprises a polyalkylene terephthalate and/or polyester thereof, a triglyceride, an epoxy component, and a plasticizer. The polyalkylene terephthalate has terminal carboxyl groups and hydroxyl groups and internal ester linkages. The triglyceride has at least one acid component with 6 to 30 carbon atoms and at least one epoxy group for reacting with the carboxyl groups. The epoxy component has internal aromatic groups and at least one terminal epoxy group for reacting with the carboxyl groups. The plasticizer comprises an esterification product of a polyoxyalkylene glycol with 1 to 20 carbon atoms and an aliphatic carboxylic acid with 1 to 25 carbon atoms for improving melt flow properties and for reducing hydrolysis of the composition.

Abstract: Compounds exhibiting angiogenic properties incorporating the structure of Formula I: R3—NH—NH—C(?O)—R2—P—R1 ??(I) wherein P is a water-soluble, biodegradable polymer, R1 is hydrogen, lower alkyl, lower alkoxy or —R2—C(?O)—NH—NH—R3; each R2 is independently —CH2—, —NH— or O; and each R3 is independently hydrogen or a residue of a naturally occurring alpha-L-amino acid or dipeptide thereof. Polymer networks crosslinked with hydrazide compounds are also disclosed, together with implantable medical devices incorporating the compounds and crosslinked polymers, and angiogenesis-promoting treatment methods, including wound-treatment methods.

Abstract: Star polymers prepared by reacting a highly branched polymer and either a lactone or lactam are disclosed. These star polymers find particular application as additives for powder coating compositions, to improve various performance properties thereof. Powder coating composition comprising the described star polymers are also disclosed.

Abstract: The present invention provides thermoplastic hydroxy-functional polyesters. The polyesters have at least 10 sequential units, wherein the sequential units consist of units selected from units represented by the following formula (1) and units represented by the following formula (2); Wherein each of R1 independently represents hydrogen or a substituted or unsubstituted homoalkyl or heteroalkyl group; each of R2 independently represents hydrogen or a substituted or unsubstituted homoalkyl or heteroalkyl group; each of R3 independently represents hydrogen or a substituted or unsubstituted homoalkyl or heteroalkyl group; Each of R4 independently represents a substituted or unsubstituted homoalkyl or heteroalkyl group; and said moiety having no fewer than 1 unit represented by formula (1) and no fewer than 1 unit represented by formula (2).

Abstract: The present invention relates to a method for reducing adhesions associated with post-operative surgery. The present method comprises administering or affixing a polymeric composition preferably comprising chain extended, coupled or crosslinked polyester/poly(oxyalkylene) ABA triblocks or AB diblocks having favorable EO/LA ratios to a site in the body which has been subjected to trauma, e.g. by surgery, excision or inflammatory disease. In the present invention, the polymeric material provides a barrier to prevent or reduce the extent of adhesions forming.

Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

Abstract: Methods of carrying out a reactive extrusion processes are described that include combining at least one polymer, oligomer, or combination thereof, a carbon dioxide containing fluid, and at least one reactant in an extruder to form a mixture such that the carbon dioxide containing fluid comes into intimate contact with the at least one polymer, oligomer, or combination thereof and assists in a reaction between the at least one polymer, oligomer, or combination thereof and the at least one reactant, and wherein the at least one polymer, oligomer, or combination thereof is modified upon reaction with the at least one reactant.

Abstract: The present invention provides ultraviolet (UV) curable powders for powder coatings comprising one or more than one free radical curable epoxy resin and one or more than one second free radical curable resin, or, alternatively, one or more than one free radical curable unsaturated polyester resin in combination with one or more than one wax, and one or more than one free radical photoinitiator, wherein the coating powder has an average particle size of 5 to 25 microns. Further, the present invention provides a method for making a powder for thin (1.0 to 4.0 mil), smooth coatings having an average particle size of from 5 to 25 microns, the method preferably comprising jet milling dry powder or spray drying an aqueous emulsion, fluid mixture, or a supercritical suspension of a powder or of the composition for making the powder.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomic al in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of curing.

Abstract: A polyester composition prepared by melting and blending a polyester with a glycidyl ester compound, a glycidyl ether compound and a catalyst has good hydrolysis resistance and, when melted, gives little gas generation and undergoes little viscosity change. It is most favorable for parts of automobile, electric and electronic appliances such as connectors.

Abstract: A composition comprises a curing agent or coreactant and a glycidyl ester produced by reacting a carboxyl-functional polyester having an acid value of less than 280 mg KOH/gram with excess epihaloydrin in the presence of a base and, optionally, a catalyst, wherein the carboxyl-functional polyester is produced by reacting (a) at least on cyclohexyl anhydride A; (b) at least one di-secondary or di-primary hydroxyl compound B containing two (cyclo)aliphatic hydroxyl groups; (c) at least one di-secondary carboxylic acid or anhydride C; and (d) a monoglycidyl ester of an alpha,alpha-branched carboxylic acid D containing from 5 to 19 carbon atoms.

Abstract: A molding composition comprising an aggregate [Component (A)], a linear unsaturated polyester [Component (B)] and/or linear unsaturated polyester polyamide [Component (C)], and a radical generator [Component [D]), characterized in that each of Component (B) and Component (C) comprises a specific alkylene oxide adduct of bisphenol A in an amount of from 3 to 50 mol % based on the total amount of constituent monomers of each of Component (B) and Component (C) and a molded article obtained by molding the composition.

Abstract: By heating at above the melting point and/or glass transition point of the polycondensate and adding an aromatic dicyanate; or adding a mixture comprising an aromatic dicyanate and a polyfunctional compound selected from the class of sterically hindered hydroxyphenyl-alkyl-phosphonic esters and monoesters, diphosphonites and secondary aromatic amines; or adding a mixture comprising (i) an aromatic dicyanate, (ii) at least one polyfunctional compound selected from the class of sterically hindered hydroxyphenyl-alkyl-phosphonic esters and monoesters, diphosphonites and secondary amines, and (iii) a difunctional epoxide, it is possible to bring about an increase in the molecular weight and/or viscosity of virgin polycondensate and polycondensate recyclates.

Abstract: The present invention relates to a method for reducing adhesions associated with post-operative surgery. The present method comprises administering or affixing a polymeric composition preferably comprising chain extended, coupled or crosslinked polyester/poly(oxyalkylene) ABA triblocks or AB diblocks having favorable EO/LA ratios to a site in the body which has been subjected to trauma, e.g. by surgery, excision or inflammatory disease. In the present invention, the polymeric material provides a barrier to prevent or reduce the extent of adhesions forming.

Abstract: The present invention provides a method for forming a topcoat according to a 2-coat 1-bake system comprising the steps of applying to a substrate a thermosetting aqueous colored base coating composition, applying to the uncured surface of the base coat a clear coating composition, and curing the two coats by heating, wherein the clear coating composition is a thermosetting powder coating composition comprising: (A) an epoxy-containing resin; and (B) a curing agent containing acid anhydride (a) represented by formula X—COO—[CO—(CH2)m—COO]n—CO—X  (1) and at least one species selected from the group consisting of acid anhydride (b) represented by the formula HO—[CO—(CH2)p—COO]q—H  (2) and dibasic acid (c).

Abstract: A hyperbranched polyester polyol macromolecule, having a plurality of both embedded and exterior hydroxyl groups thereon, may be synthesized in a polymerization reaction having several steps. The hyperbranched polyol includes a central nucleus, a first chain extension, an intermediate substituent and a second chain extension. The central nucleus is a hydrocarbon structure with a plurality of oxygen atoms. The first chain extender is attached to the central nucleus and includes a carboxylic ester group and a plurality of hydroxyl groups. The intermediate substituent is attached to the first chain extender, and is a polyfunctional carboxylic acid or anhydride thereof. The preferred intermediate substituent is a cyclic compound. The second chain extension is attached to the intermediate substituent. The preferred second chain extension includes a glycidyl ester or epoxy. Methods of making a hyperbranched polyester polyol are also disclosed.

Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

Abstract: A heat sealable packaging film producing a peelable seal is formed from a blend of 99 to 75 weight percent of a copolyester and 1 to 25 weight percent of an epoxy-containing impact modifying polymer. The copolyester has a diacid component of at least 50 mole percent terephthalic acid, naphthalenedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, or mixtures thereof and diol component of about 90 to 35 mole percent ethylene glycol and 10 to 65 mole percent of at least one of diethylene glycol or 1,4-cyclohexanedimethanol.

Abstract: The present invention relates to powdered thermosetting compositions including a binder which comprises a carboxyl group containing amorphous isophthalic acid containing polyester, a carboxyl group containing semi-crystalline polyester, at least 10 parts by weight, based on the total weight of the binder, of a specific glycidyl group containing acrylic copolymer and a curing agent having functional groups reactive with the polyesters' carboxyl groups. The powdered thermosetting compositions are useful for the preparation of powdered paints and varnishes which give low gloss coatings having an outstanding flow, a remarkable weatherability and excellent mechanical properties.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomical in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of a bisphenol-A curing agent or a polyester curing agent; 0.1 to 20 parts by weight of a defoaming agent; and 0.1 to 20 parts by weight of a leveling agent.

Abstract: A resin blend that includes a copolymer of styrene and maleic anhydride (SMA), an epoxy resin (brominated, phosphonated, or bromine-free), and a multifunctional amine cross-linking agent is disclosed. The cross-linking agent generally contains at least two primary amino groups to promote formation of imide functionalities upon reaction with the anhydride moieties of the SMA copolymer. Particularly useful cross-linking agents include triazine-centered diamino and triamino compounds such as benzoguanamine, acetoguanamine, and melamine. The disclosed resin blend finds use as a polymer matrix in composite materials and as an impregnating resin in laminates. Compared to conventional SMA copolymer/epoxy resin blends, the disclosed resin exhibits lower dielectric constant and dissipation factor, as well as higher thermal and moisture resistance, making it especially useful in high-speed, low-loss printed wire board applications.

Abstract: The present invention provides a method for forming a topcoat according to a 2-coat 1-bake system comprising the steps of applying to a substrate a thermosetting aqueous colored base coating composition, applying to the uncured surface of the base coat a clear coating composition, and curing the two coats by heating, wherein the clear coating composition is a thermosetting powder coating composition comprising: (A) an epoxy-containing resin; and (B) a curing agent containing acid anhydride (a) represented by formula

Abstract: An adhesive powder for bonding flat, closed, or porous substrates, the adhesive powder being applied in the first step to a first substrate, an intermediate product that is non-adhesive at room temperature and stable in storage being produced, and the first substrate being bonded to a second substrate in a second step by applying an increased temperature and pressure, as a combination of the following components: i) a thermoplastic polymer having a proportion of 25 to 95% by weight; and ii) at least one epoxy resin that is solid at room temperature and has a proportion of 5 to 75% by weight; and, if desired, iii) at least one pre-adduct of epoxy resins and polyamines that is solid at room temperature and has a proportion of at most 25% by weight, a physical bonding taking place when the adhesive powder is applied to the first substrate in the first step, and the two substrates being bonded in the second step by the powder components being chemically cross-linked or post-cross-linked among one another, and bei

Abstract: A graft copolymer comprising a polyamide to which is grafted a glycidyl group-containing acrylate copolymer. The graft copolymer can be prepared by dispersing in an organic solvent a polyamide and a material which will react with the polyamide to form the graft copolymer of the polyamide and the acrylate copolymer and reacting the polyamide and the material so as to form said graft copolymer. The graft copolymer can exhibit improved toughness and reduced friability and can be used to form molded articles and in coating compositions, especially powder coating compositions. The coatings can exhibit transparency, reduced brittleness and increased chip resistance. The powder coatings can further exhibit high gloss and smoothness due to superior flow characteristics thereby enabling thinner coatings to be used that provide acceptable appearance.

Abstract: The present invention provides a thermosetting powder coating composition comprising: (A) an epoxy-containing resin; and (B) a curing agent containing acid anhydride (a) and at least one species selected from the group consisting of acid anhydride (b) and dibasic acid (c), the acid anhydride (a) being represented by formula X—COO—[CO—(CH2)m—COO]n—CO—X  (1) wherein the two X's are the same or different and independently represent a C4-12 alkyl group having a branched structure, R1—O—CO—R2—, R1—CO—R2— or R1—CO—NH—R2— in which R1 is a C1-10 monovalent saturated hydrocarbon group; R2 is a C1-10 bivalent saturated hydrocarbon group; m is an integer of 6 to 18; and n is an integer of 8 to 50, the acid anhydride (b) being represented by the formula HO—[CO—(CH2)p—COO]q—H  (2) wherein p is an integer of 6 to 18 and q is an integer of 2 to 18,

Abstract: The present invention provides a thermosetting powder coating composition comprising: (A) an epoxy-containing resin; and (B) a curing agent containing, as an essential ingredient, an acid anhydride (a) represented by the formula HOOC—(CH2)m—[COO—CO—(CH2)m]n—COOR1   (1) wherein R1 represents a C1-10 monovalent saturated hydrocarbon group, m is an integer of 6 to 18, and n is a number of 1 to 20 on average, the molar ratio of carboxyl groups to acid anhydride groups in the curing agent being in the range from 0.15:1 to 2.0:1, the molar ratio of the total of carboxyl groups and acid anhydride groups in the curing agent (B) to epoxy groups in the epoxy-containing resin (A) being in the range from 0.7:1 to 1.2:1.