Abstract: To achieve both formability and heat insulating properties, separator according to an aspect of the present invention insulates adjacent battery cells. Separator includes heat insulation sheet including a fiber material and a heat insulation material including higher heat insulating properties than the fiber material, and formed member including higher shape stability than the heat insulation sheet. This enables shape of heat insulation sheet including high flexibility to be maintained using formed member formed into a predetermined shape.

Abstract: Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains: (A) an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8?a?2.2; (B) a silver powder having a tap density of not lower than 3.0 g/cm3, a specific surface area of not larger than 2.0 m2/g and an aspect ratio of 1 to 30; (C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C. and being present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and (D) a catalyst.

Abstract: The present invention relates to a non-coating thermoplastic resin composition, a method for manufacturing a molded article by using the same, and a molded article manufactured by the same. More specifically, the present invention is characterized by providing the thermoplastic resin composition which contains polycarbonate, polysiloxane-polycarbonate copolymer, polyester, master-batched carbon black, and additives in specific contents and the molded article, which has excellent chemical resistance, mechanical properties, light resistance, hydrolysis resistance, and low glossiness, manufactured by using the same.

Abstract: Curable composition for producing coating systems having an anti-adhesive property containing at least one film-forming polymer and at least one organo-modified, branched siloxane of formula (I) or mixtures thereof.

Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.

Abstract: Provided are: a composition for an organic light emitting diode comprising an indole-based photocurable monomer, a non-indole-based photocurable monomer, and an initiator, and an organic light emitting display manufactured therefrom.

Abstract: Materials from the group consisting of a) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, in combination with one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates, wherein hybrid material and inorganic sol are crosslinked, b) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, c) one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates and d) one or more polyamides, polyimides and/or epox

Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.

Abstract: A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.

Abstract: The present invention relates to a resin composition for coating, and a coating film comprising a cured product thereof as a coating layer. Particularly, the present invention relates to a resin composition for coating, and a coating film comprising a cured product thereof as a coating layer, wherein the resin composition for coating comprises a siloxane resin that is chemically bonded by compounds comprising alkoxysilane and diol, which comprise epoxy or acryl within the chemical structures thereof.

Abstract: A resin composition including the following (A) to (D): (A) a resin containing epoxy groups in the range of 140 to 5000 g/eq as an epoxy equivalent; (B) a phenolic curing agent; (C) a curing accelerator; and (D) at least one compound selected among what is expressed by the following formulae (0-1) to (0-5). This provides a resin composition having small warpage and excellent adhesive force, a high adhesion resin composition film made into a film form from the composition, a semiconductor laminate having a cured product of the film and its production method, a semiconductor device obtained by dicing the semiconductor laminate into individual chips and its production method.

Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

Abstract: A method of transferring a device layer in a SOI wafer obtained by stacking a Si layer, an insulator layer, and the device layer to a transfer substrate, includes a step of temporarily bonding a surface on which the device layer is formed of the SOI wafer to a supporting substrate using an adhesive for temporary bonding, a step of removing the Si layer of the SOI wafer until the insulator layer is exposed and obtaining a thinned device wafer, a step of coating only the transfer substrate with an adhesive for transfer and then bonding the insulator layer in the thinned device wafer to the transfer substrate via the adhesive for transfer, a step of thermally curing the adhesive for transfer under a load at the same time as or after bonding, a step of peeling off the supporting substrate, and a step of removing the adhesive.

Abstract: A curable polyurethane type resin composition which is applicable for a sealing material for an electrical device used in a vehicle, enhances a hydrolysis resistance of a cured substance and can suppress a decrease in physical properties in high temperature and high moisture environments. The curable polyurethane type resin composition contains castor oil-type polyol, polyisocyanate, and epoxidized acrylic polymer. The electrical device has electrical components covered with a sealing material consisting of a cured substance of the curable polyurethane-type resin composition.

Abstract: The present invention relates to an anti-reflective coating solution composition and an anti-reflective coating film using the same. More particularly, an anti-reflective coating solution composition is provided, which has a low refractive index to thus improve transmittance and can also increase abrasion resistance to thus maintain an anti-reflective effect for a long period of time, whereby an anti-reflective coating film for improving solar cell module efficiency can be formed, and thus can be applied not only to a solar cell module glass but also to glass in a variety of fields.

Abstract: Provided are: a composition for a window film, containing a siloxane resin including chemical formula 1, a cross-linking agent, and an initiator; a flexible window film formed therefrom; and a flexible display device including the same.

Abstract: The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

Abstract: A process for producing SiOC-bonded polyether siloxanes by transesterification of alkoxysiloxanes with polyetherols in the presence of zinc acetylacetonate as catalyst is described.

Abstract: A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.

Abstract: The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1), component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.

Abstract: A method of forming an optical article includes the step of applying a silicone composition to a surface, wherein the silicone composition is a solid and has a glass transition temperature greater than room temperature. The silicone composition is heated to a temperature at or above the glass transition temperature such that the silicone composition flows. The silicone composition forms a light transmitting sheet upon cooling following the heating.

Abstract: Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si—H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6R7SiO2/2)D2(R8SiO2/2—Y1—SiO2/2R9)D3(R10SiO3/2)T1(R11SiO3/2)T2(R12SiO3/2)T3(SiO3/2—Y2—SiO3/2)T4(SiO4/2)Q1??[Chemical Formula 1] In the above Chemical Formula 1, R1 to R12, Y1, Y2, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Abstract: Provided is a conductive sheet composition including a polycarbonate resin, a rubber-modified vinyl-based graft copolymer, carbon nanotube, and a silicone particle to improve conductivity and mechanical physical properties and reduce surface gloss.

Abstract: Novel urethane- and silyl-containing prepolymers and compositions obtained as reaction products from alkoxysilyl-bearing compounds and isocyanate-bearing compounds, and a process for preparation thereof.

Abstract: Described is an epoxy composition containing: (a) an epoxy resin containing at least one epoxy group, (b) an anhydride hardener, (c) a hydroxyl-terminated polysiloxane, and (d) a functional silane having at least one functional group selected from the group consisting of an epoxy-reactive group, an anhydride-reactive group, and an epoxy- and anhydride-reactive group. Also describing a crosslinked epoxy composition and a method for preparing thereof.

Abstract: Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.

Abstract: Coating composition comprising the reaction product of a tetra-alkoxyorthosilicate or a partially condensed oligomer thereof and an epoxy resin containing hydroxyl groups, said coating composition having a solids content of at least 70 vol % and/or a volatile organic content (VOC) not exceeding 250 g/l. This coating composition gives fast curing at ambient and sub-ambient temperatures and an extended pot life.

Abstract: The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer (2) on at least a surface in contact with the molding material; as well as a compression molding method that uses the film; and a compression molding apparatus that uses the film. The release film for the compression molding of molding materials has good workability and has good releasability, and thereby, a compression molding method with which compression molding with good efficiency is possible and a compression molding apparatus with which molding with good efficiency is possible.

Abstract: A composition comprising: a first polymer comprising a poly(etherimide-siloxane) copolymer comprising (a) a repeating polyetherimide unit, and (b) a poly(siloxane) block unit, a second polymer different from the first polymer and comprising bromine; and optionally, a third polymer comprising a polycarbonate different from the first polymer and second polymer; wherein polysiloxane block units are present in the composition in an amount of at least 0.3 wt %, and bromine is present in the composition in an amount of at least 7.8 wt %, each based on the sum of the wt % of the first, second, and third polymers; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.

Abstract: Described is an epoxy composition containing: (a) an epoxy resin containing at least one epoxy group, (b) an anhydride hardener, (c) a hydroxyl-terminated polysiloxane, and (d) a functional silane having at least one functional group selected from the group consisting of an epoxy-reactive group, an anhydride-reactive group, and an epoxy- and anhydride-reactive group. Also describing a crosslinked epoxy composition and a method for preparing thereof.

Abstract: A resin composition which can be formed into a film for use in molding a large diameter thin film wafer is provided. The composition comprises components (A) a silicone resin containing repeating units represented by the following formulae (1-1), (1-2), and (1-3) and having a weight average molecular weight as measured by GPC in terms of polystyrene of 3,000 to 500,000, wherein r, s, and t are independently a positive integer; the silicon atom at the terminal of the units constituting the repeating units represented by the formulae (1-1), (1-2), and (1-3) is bonded to the terminal carbon atom of the X1, X2, or X3 in the same or different unit; R1 is independently a monovalent hydrocarbon group containing 1 to 8 carbon atoms; X1, X2, and X3 are independently a divalent group; (B) a thermosetting resin; and (C) a filler.

Abstract: The present invention is directed to a resin composition, comprising a blend of: (1) an epoxy polysiloxane resin; (2) an epoxyfluorosilicone resin; and (3) a fluorinated (or non-fluorinated) silane-modified polyacrylic resin. Further, the present invention is directed to a coating composition comprising the above resin blend composition and a curing agent. Further, the invention is directed to coating composition comprising an epoxy polysiloxane resin and a fluorinated (or non-fluorinated) silane-modified polyacrylic resin.

Abstract: Epoxy-polysiloxane based coating and flooring compositions exhibiting improved flexibility, and excellent weatherability and corrosion resistance after curing are described. The epoxy-polysiloxane polymer coating composition may be prepared by combining a polysiloxane, an epoxide resin material, and a cure system including a blend of at least one trialkoxy functional aminosilane and at least one amino functional polysiloxane resin, where the blend has an alkoxy content of 10% by weight to 25% by weight.

Abstract: The invention relates to silicone resins comprising metallosiloxane which contains for example Si—O-Aluminium bonds. It also relates to their use in thermoplastics, thermosettings organic polymers or any blends of the laters or rubbers or thermoplastic/rubbers blends compositions to reduce the flammability or to enhance scratch and/or abrasion resistance of the organic polymer compositions. It further relates to coatings containing such silicone resins for scratch and/or abrasion resistance enhancement or flame retardant properties.

Abstract: A composition containing a metal compound and a siloxane compound (A) represented by general formula (1): wherein X is represented by general formula X1 or X2: wherein the number of X1 is 1-8; the number of X2 is 0-7; the sum of the number of X1 and the number of X2 is 8; R1 to R4 represent a hydrogen atom, a C1-8 alkyl group, alkenyl group, alkynyl group, or a C6-8 aryl group, a hydrogen atom thereof optionally being substituted by a fluorine atom; R5 represents a C1-18 alkyl group, alkenyl group, alkynyl group or aryl group, a hydrogen atom thereof being optionally substituted by a fluorine atom, a carbon atom being optionally substituted by an oxygen atom or a nitrogen atom; R6 represents a hydrogen atom, a vinyl group or an allyl group; m and n represent an integer of 1-4; and 3?m+n.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: There is disclosed an adhesive composition comprising the following Components (A), (B) and (C), wherein a minimum melt viscosity of the composition is less than 500 Pa·s, a temperature which gives the minimum melt viscosity is less than 200° C., and, a melt viscosity at 200° C. of the composition is 500 Pa·s or more: (A) a polymer having a reactive functional group (B) a thermosetting resin (C) a compound having flux activity. As a result, there is provided an adhesive composition which can be suitably used for preparation of a semiconductor apparatus, particularly an adhesive composition which difficultly causes voids between bumps at the bonding, difficultly causes positional divergence of bumps, and difficultly causes voids after completion of solder bonding.

Abstract: Epoxy-polysiloxane based coating and flooring compositions exhibiting improved flexibility, and excellent weatherability and corrosion resistance after curing are described. The epoxy-polysiloxane polymer coating composition may be prepared by combining a polysiloxane, an epoxide resin material and a cure system including a blend of compounds selected from a dialkoxy functional aminosilane, a trialkoxy functional aminosilane, and an amino functional polysiloxane resin, where the blend has an average alkoxy functionality value ranging from 2.0 to 2.8.

Abstract: One aspect of the present invention provides a polymer having repeating units represented by the formulas (1-1), (1-2) and (1-3) and weight-average molecular weight of from 3,000 to 500,000, as determined by GPC using tetrahydrofuran as a solvent, reduced to polystyrene. Another aspect of the present invention provides an adhesive composition comprising (A) the polymer, (B) a thermosetting resin, and (C) a compound having flux activity. Further, the present invention provides an adhesive sheet having an adhesive layer made of the adhesive composition, a protective material for a semiconductor device, which has the adhesive layer, and a semiconductor device having a cured product obtained from the adhesive composition.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: The invention relates to emulsions containing hydroxyl compound bearing silyl groups, to the production and to the use thereof.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Abstract: A curable composition that includes (A) a silane compound copolymer that includes a specific repeating unit, (B) a silane coupling agent having a reactive cyclic ether structure, and (C) a curing agent so that the mass ratio “(A):((B)+(C))” of the silane compound copolymer (A) to the silane coupling agent (B) and the curing agent (C) in total is 95:5 to 70:30, a cured product obtained by curing the curable composition, and method for using of the curable composition as an optical device-securing adhesive or an optical device sealing material, are disclosed. The curable composition produces a cured product that does not show coloration (i.e., does not show a deterioration in transparency) even when exposed to high-energy light or subjected to a high temperature, exhibits excellent transparency for a long time, and has high adhesion even at a high temperature.

Abstract: A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.

Abstract: Disclosed herein are epoxy-based compositions that include a polysiloxane flexibilizer and amino-functional alkoxysilane, which provides flexibility, hardness and gloss to such compositions and that are useful as coatings, adhesives, sealants and composites. Also disclosed are cured compositions and substrates coated with such epoxy-based compositions.

Abstract: Silicone-polyether block copolymers are disclosed, having the average formula: R4R12Si(OR52Si)m{[R2O(CqH2qO)pR2R12Si(OR52Si)k]nR2O(CqH2qO)pR2R12Si)m}hOSiR12R4 wherein R1 is C1-C10 hydrocarbyl; R2 is C1-C10 hydrocarbylene; R3 is R1 or H; R4 is —R2—NR32 or —R2—NR3—R2—NR32; R5 is R1 or R4; h is 1 to 100; k is 2 to 500; m is 2 to 500; n is 0 to 30; p is 2 to 120; and q is 2 to 4. The silicone-polyether block copolymers comprise two terminal amine functionalities and may comprise varying degrees of pendent amine functionality. In a method for synthesizing linear silicone-polyether block copolymers of the above formula, a reaction mixture is formed by combining a polyether, an organosilicon component, an endblocking agent, and a catalyst. Thereupon, the reaction mixture is heated to produce a silicone-polyether block copolymer having at least one pendent amine functionality and a number-average molecular weight from 2000 to 500,000.

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.