Abstract: A thermosetting composition containing an aluminosiloxane and an epoxy silicone. The thermosetting composition of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

Abstract: Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.

Abstract: The invention relates to a copolymer which contains at least one polysiloxane group and the skeletal structure of which is an addition compound of at least one amine and at least one epoxide. The invention further relates to the use of said products as additives in coating agents, plastics, or homogeneous dispersions, e.g. as a dispersing agent for organic and inorganic pigments and fillers in oil-based compositions, or as a surface modifying agent.

Abstract: There is disclosed an adhesive composition comprising the following Components (A), (B) and (C), wherein a minimum melt viscosity of the composition is less than 500 Pa·s, a temperature which gives the minimum melt viscosity is less than 200° C., and, a melt viscosity at 200° C. of the composition is 500 Pa·s or more: (A) a polymer having a reactive functional group (B) a thermosetting resin (C) a compound having flux activity. As a result, there is provided an adhesive composition which can be suitably used for preparation of a semiconductor apparatus, particularly an adhesive composition which difficultly causes voids between bumps at the bonding, difficultly causes positional divergence of bumps, and difficultly causes voids after completion of solder bonding.

Abstract: A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups that react with the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity.

Abstract: Thermosetting compositions comprising (a) at least a first thermosetting resin, and (b) at least one silicone polyether, methods of making such thermosetting compositions, and thermoset products made from the compositions.

Abstract: To provide: a curable resin composition which can be continuously produced without gelling during production, and has excellent basic performances such as heat resistance and moisture resistance; an optical member which has excellent optical characteristics such as high transparency and exhibits excellent performances in a harsh use environment; and a method for controlling an optical material. A curable resin composition including an organic resin component and a metalloxane component, wherein the organic resin component includes a resin component having an Abbe number of 45 or more and the metalloxane component has a metalloxane bond; an optical material comprising the above-mentioned curable resin composition; an optical member produced by curing the optical material; and a method for controlling an Abbe number and/or a refractive index of an optical material.

Abstract: Composition comprising (A) 50-99.5 wt %, based on the total weight, of A, B and C of a reaction resin or reaction resin mixture that is processed into thermosetting materials, said resin or resin mixture being liquid at temperatures in the range of 15 to 100° C. and having an average molecular weight of 200 to 500,000 and with a sufficient number of suitable reactive groups for a curing process and (B) 0.5-50 wt %, relative to the total weight of A, B and C of one or more dispersed polyorganosiloxanes that are contained in the reaction resin or reaction resin mixture homogeneously in finely distributed form as polyorganosiloxane droplets with a diameter of 0.001 to 4 ?m, wherein the organopolysiloxane particle is a polymer of the general formula (R3SiO1/2)W(R2SiO2/2)X—(RSiO3/2)Y—(SiO4/2)Z, where w=0 to 20 Mol %, x=80 to 99.9 Mol %, y=0.5 to 10 Mol %, z=0 to 10 Mol %, (C) 0.

Abstract: A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of l and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)?1.0; and each of X and Y is a bivalent organic group.

Abstract: A non-curable coating composition which uses a modified silicone having a functional group and can effectively prevent or reduce adhesion of sticky contamination substances to the surface of a substrate is provided. The non-curable coating composition contains a carboxy-modified silicone having carboxy-containing groups at side chains, and an epoxy/oxyalkylene-modified silicone having an epoxy-containing group and an oxyethylene-containing group at side chains, in a weight ratio ranging from 1:2 to 1:30.

Abstract: There is disclosed a silphenylene skeleton-containing silicone type polymer comprising a repeating unit represented by the following general formula (1) and having a weight average molecular weight of 5,000 to 40,000. There can be a novel silphenylene skeleton-containing silicone type polymer which enables to satisfy both chemical resistance and adhesiveness to a substrate and can be used as a material for a thermosetting resin for forming coatings for protecting substrates, circuits, and interconnections; and a method for manufacturing the same.

Abstract: A process to physically deter fouling from a substrate in an aquatic fouling environment, which process comprises forming on the substrate, before exposure to the said environment, a coating composition comprising (i) a curable polyorganosiloxane polyoxyalkylene block copolymer having at least two reactive groups X situated on the copolymer chain and (ii) an organosilicon crosslinking agent and/or a catalyst.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: A transparent silicone epoxy composition is provided. The transparent silicone epoxy composition comprises (a) at least an epoxy modified siloxane, (b) at least a silanol-containing siloxane and (c) a catalyst. Each epoxy modified siloxane molecule comprises at least two cycloaliphatic epoxy groups and epoxy modified siloxane in the transparent silicone epoxy composition is about 10˜89 weight percentage. Silanol-containing siloxane can be cross-linked with epoxy modified siloxane. Silanol-containing siloxane comprises at least two hydroxyl groups. Silanol-containing siloxane in the transparent silicone epoxy composition is about 89˜10 weight percentage. The catalyst in the transparent silicone epoxy composition is about 0.01˜1 weight percentage.

Abstract: The present invention relates to a curing agent composition for epoxy resins comprising (A) a polyamine compound which is a reaction product of a compound having at least one glycidyl group in a molecule with a diamine having a specific structure, (B) a polyether-modified polysiloxane having a surface tension in the range of 19 dyne/cm to 25 dyne/cm and (C) an amino group-modified polysiloxane having a total amine value in the range of 150 mgKOH/g to 650 mgKOH/g which can provide excellent curing performances, excellent performances of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products, an epoxy resin composition comprising said curing agent composition for epoxy resins and an epoxy resin cured product obtained by curing said epoxy resin composition.

Abstract: A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

Abstract: A compound for filling small gaps in a semiconductor device and a composition comprising the compound are provided. The composition can completely fill holes having a diameter of 70 nm or less and an aspect ratio (i.e. height/diameter ratio) of 1 or more in a semiconductor substrate without any defects, e.g., air voids, by a general spin coating technique. In addition, the composition can be completely removed from holes at a controllable rate without leaving any residue by the treatment with a hydrofluoric acid solution after being cured by baking. Furthermore, the composition is highly stable during storage.

Abstract: A composition for producing an organic insulator is provided which comprises an organic-inorganic hybrid material (as defined). The hybrid material shows high solubility in organic solvents and monomers, and superior adhesion to substrates. In addition, the hybrid material displays a high dielectric constant and a high degree of crosslinking. Based on these advantages, the composition comprising the organic-inorganic hybrid material can be utilized during the fabrication of various electronic devices by a wet process. A method for producing the organic insulator while utilizing the composition also is provided, as well as the resulting organic insulator, and an organic thin film transistor which incorporates the resulting insulating layer.

Abstract: An organopolysiloxane is prepared by hydrolysis and polycondensation of an organosilicon compound in the presence of a liquid hydrolytic condensation catalyst which is separable. The organopolysiloxane contains a high proportion of cyclic polysiloxanes and has a sharp molecular weight distribution due to minimized monomer and polymer contents.

Abstract: The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.

Abstract: A heat conductive cured product which can be handled even in a single layer or thin film form, can be readily attached to a heat-generating component or heat-dissipating member, and exhibits an appropriate tack and heat conductivity in a thin film form is provided as well as a method for preparing the same. A heat conductive cured product is prepared by applying a heat conductive composition as a thin film to a substrate which has been treated to have a silicone pressure-sensitive adhesive releasable surface, and curing the composition, the composition comprising as essential components, (a) an organopolysiloxane having alkenyl radicals, (b) a heat conductive filler, the filler containing at least 30 vol % of aluminum powder based on its total volume, (c) an organohydrogenpolysiloxane, (d) a platinum group metal catalyst, (e) a reaction regulator, and (f) a silicone resin.

Abstract: A surface treatment process comprises (a) providing at least one substrate having at least one major surface; (b) combining (1) at least one curable oligomeric or polymeric polysilazane comprising at least one chemically reactive site, and (2) at least one fluorochemical compound comprising (i) at least one organofluorine or heteroorganofluorine moiety that comprises at least about six perfluorinated carbon atoms, and (ii) at least one functional group that is capable of reacting with the polysilazane through at least one of the chemically reactive sites; (c) allowing or inducing the polysilazane and the fluorochemical compound to react to form at least one curable organofluorine-modified polysilazane; (d) applying the curable organofluorine-modified polysilazane or its precursors to at least a portion of at least one major surface of the substrate; and (e) curing the curable organofluorine-modified polysilazane to form a surface treatment.

Abstract: A composition for preparing curable organofluorine-modified polysilazanes comprises (a) at least one curable oligomeric or polymeric polysilazane comprising at least one chemically reactive site; and (b) at least one fluorochemical compound comprising (1) at least one organofluorine or heteroorganofluorine moiety, and (2) at least one functional group that is capable of reacting with the curable oligomeric or polymeric polysilazane through at least one of the chemically reactive sites of the polysilazane. The curable organofluorine-modified polysilazanes can be prepared by combining the components of the composition and allowing or inducing the components to react.

Abstract: The present invention includes a method for preparing a nanoparticle filled nanocomposite material, the method including the steps of providing a plurality of nanoparticles. attaching a first layer of organic ligand to the nanoparticle via a phosphate or phosphonate linkage, covalently attaching a second layer of matrix compatible polymer to said first layer of organic ligand to produce modified nanoparticles, providing a polymer matrix and dispersing the modified nanoparticles in the polymer matrix, wherein the dispersement of the modified nanoparticles into the polymer matrix results in a nanocomposite material, and wherein the modified nanoparticles are modified such that the first layer is proximal to the nanoparticle and the second layer is distal to the nanoparticle. Also within the scope of the invention are modified nanoparticles, alternative nanocomposite materials and methods of making the same.

Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.

Abstract: A fluoropolyether base rubber composition comprising (a) a linear fluoropolyether compound containing at least two ester groups in a molecule and a divalent perfluoroalkyl ether structure in its backbone, and having a Mn of 3,000-100,000, and (b) a siloxane polymer containing at least three amino groups in a molecule cures at room temperature into a product having heat resistance, low-temperature performance, chemical resistance, solvent resistance and oil resistance.

Abstract: Alkoxysilyl-functional polyether-siloxanes and processes for preparing them by noble metal-catalysed SiC coupling of hydrogensiloxanes having SiH groups with unsaturated polyethers bearing alkoxysilyl groups or by alkoxylation of polyethersiloxanes or polysiloxanes by means of epoxy-functional alkoxysilanes in the presence of double metal cyanide catalysts.

Abstract: Use of one or more mixed curable hydroxyl-containing silyl polyethers as a constituent of compositions, as modifiers for surfaces, the silyl polyethers being prepared by DMC-catalysed alkoxylation of epoxy-functional alkoxysilanes.

Abstract: Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature.

Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.

Abstract: A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.

Abstract: A transparent silicone epoxy composition is provided. The transparent silicone epoxy composition comprises (a) at least an epoxy modified siloxane, (b) at least a silanol-containing siloxane and (c) a catalyst. Each epoxy modified siloxane molecule comprises at least two cycloaliphatic epoxy groups and epoxy modified siloxane in the transparent silicone epoxy composition is about 10˜89 weight percentage. Silanol-containing siloxane can be cross-linked with epoxy modified siloxane. Silanol-containing siloxane comprises at least two hydroxyl groups. Silanol-containing siloxane in the transparent silicone epoxy composition is about 89˜10 weight percentage. The catalyst in the transparent silicone epoxy composition is about 0.01˜1 weight percentage.

Abstract: An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.

Abstract: Provided is a resin composition superior in the adhesiveness to a metal and having high organic solvent resistance, particularly, a resin composition preferable as a sealant for an organic electrolyte battery, which shows superior adhesiveness to a terminal or a collector made of a highly heat resistant metal such as stainless steel and nickel, does not easily develop degradation even when contacted with an organic electrolytic solution at a high temperature, and does not easily influence an electrolytic solution, and a highly reliable organic electrolyte battery wherein leaching of an electrolytic solution from an electrolyte layer is prevented by the resin composition. A resin composition containing (A) an epoxy resin containing at least (E1) an epoxy resin having an aromatic ring and an alicyclic skeleton and (B) a latent curing agent.

Abstract: The present invention relates to a novel polymer, an adhesive composition including the same, and a rubber reinforcing material treated with the same, and more particularly to an organic polysiloxane including a certain repeating unit, an adhesive composition including the same, and a rubber reinforcing material treated with the same. Because the organic polysiloxane and the adhesive composition including the same is superior in reactivity to a hydroxyl group, an amide group, or an amine group, and has high thermal resistance and low stiffness, the composition is preferably used for surface-treating a rubber reinforcing material such as a tire cord and make it possible to provide a rubber reinforcing material such as a tire cord having good properties.

Abstract: Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2??(1) wherein R1 is monovalent hydrocarbon and a, b, and c are numbers such that: 0.8<=a<=1.5, 0<=b<=0.3, 0.001<=c<=0.5, and 0.801<=a+b+c<2; (B) white pigment; (C) an inorganic filler other than the white pigment; (D) condensation catalyst; (E) an epoxy resin derived from isocyanuric acid; (F) an organopolysiloxane comprising unit R2SiO and unit RSiO1.5, wherein R is hydroxyl, methyl, ethyl, propyl, cyclohexyl, phenyl, vinyl, or allyl; and (G) a linear diorganopolysiloxane of the formula wherein R5 and R6 are alkyl, cyclohexyl, vinyl, phenyl, or allyl and n is an integer from 800 to 1200.

Abstract: Disclosed are low temperature curable coating compositions, related coated substrates, methods for depositing a coating on a substrate and methods for refinishing the surface of an article, such as an automobile. The coating compositions include: (1) an aminofunctional silicon compound; (2) a polyether; and (3) a compound comprising functional groups reactive with the amino functionality of the aminofunctional silicon compound.

Abstract: The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle properties. According to the present invention, there is provided an epoxy resin composition for semiconductor encapsulation which comprises, as essential components, (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m2/g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin as a curing agent, and (F) a curing accelerator, in which said ultrafine silica is contained in an amount of 0.2-0.8% by weight based on the total weight of the resin composition, and said silicone compound is a polyorganosiloxane and is contained in an amount of 0.3-2.0% by weight based on the total weight of the resin composition.

Abstract: A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of 1 and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)?1.0; and each of X and Y is a bivalent organic group.

Abstract: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)d, (R1)f, and (R23SiO1/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1 is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Abstract: Disclosed are a composition including a silane-based organic/inorganic hybrid material having a multiple bond and one or more organic metal compounds and/or one or more organic polymers, an organic insulator including the composition, an organic thin film transistor (OTFT) including the organic insulator and an electronic device including the OTFT. The organic insulator including the composition for preparing an organic insulator has increased charge mobility and an increased on/off current ratio, thus exhibiting improved properties, and the organic thin film transistor manifests uniform properties due to the absence of hysteresis.

Abstract: Telechelic resins with reactive end groups (e.g., epoxy phosphate and epoxy ester) were synthesized using bisphenol-A (BPA) epoxide. The bisphenol-A based epoxide and the telechelic resins were all modified with tetraethylorthosilicate (TEOS) oligomers to produce epoxide/polysilicate (organic/inorganic) hybrid systems. The modified epoxides were thermally cured with a melamine-formaldehyde resin, cast on steel substrates and salt spray analysis revealed that the inorganically modified epoxides provided improvement over unmodified epoxide resins with respect to both corrosion resistance and adhesion to steel substrates.

Abstract: The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better -anti-yellowing performance.

Abstract: A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.

Abstract: A curable silicone composition comprising at least the following components: (A) an organopolysiloxane that contains epoxy groups and, preferably, has a branched molecular structure; (B) a phenolic-type curing agent such as an organosiloxane having in one molecule at least two phenolic hydroxyl groups; and (C) an acidic-anhydride type curing agent such as a methylhexahydrophthalic anhydride, as well as an arbitrary components such as (D) a curing accelerator, (E) a filler, or (F) an organic epoxy compound; is characterized by excellent handleability and reduced oil-bleeding during curing, and, when cured, forms a cured body of excellent flexibility and adhesion.

Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.

Abstract: The invention provides a process for preparing organically modified siloxanes by catalysed reaction of siloxanes having at least one SiH group with a compound having a double bond.

Abstract: The invention provides a silicone resin composition for solar cell modules including (A) an organopolysiloxane in a liquid state with a viscosity at 25° C. of 10,000 mPa·s or more or in a solid state, which is represented by the following formula (1): R1n(C6H5)mSiO[(4-n-m)/2]??(1); (B) an organohydrogenpolysiloxane containing, in each molecule, at least two hydrogen atoms bonded to a silicon atom, represented by Formula (2): R2aHbSiO[(4-a-b)/2]??(2); (C) a hydrosilylation reaction catalyst; (D) a (meth)acryloxyalkyl group-containing silicon compound; and (E) an epoxy group-containing silicon compound. There can be an addition-curable silicone resin composition that self-adheres to ETFE films, and has hardness and strength sufficiently high to withstand external shocks, and that can be suitably used as a sealing material, adhesive, or the like for a flexible solar cell module.

Abstract: It is an object of the present invention to provide a two-component curable composition whose component A is easy to be handled, and which shows excellent internal curability and good storage stability. This problem is solved using a two-component curable composition, comprising component A comprising 100 parts by weight of an organic polymer containing a reactive silicon group, (B) 0.1-300 parts by weight of an epoxy group-containing compound, and (C) 0.1-20 parts by weight of water, and component B comprising (D) 0.1-20 parts by weight of a curing catalyst, and (E) 0.1-200 parts by weight of an amine compound.