Abstract: A multifunctional thermochemically cured coating which provides noise reduction and weight reduction in combination with thermal insulating and corrosion resistant properties. The composition comprises an epoxy resin with a weight per epoxide of 175 to 950, a mixed methyl-phenyl hydroxyl functional silicone polymer, a catalyst, a silane, an anti-corrosive pigment, an inert film reinforcing pigment, calcium silicate fibers, a mixture of ground synthetic silicone rubber, silica, and fillers, and an organic solvent.

Abstract: An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.

Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.

Abstract: An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.

Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.

Abstract: Disclosed are a coating composition comprising a polymer dispersed in an aqueous medium, the polymer containing (a) a hydrolysate of an organosilane and/or a condensation product thereof and (b) a vinyl polymer containing a silyl group having a silicon atom bound to a hydrolytic group and/or a hydroxyl group, and further comprising (c) an oxazoline derivative as a crosslinking agent and a hardened film obtained therefrom. The above coating composition completes the hardening reaction of a coating film at low temperature for a short period of time, high in hardness immediately after hardening, and having water resistance, weather resistance, organic chemical resistance, acid resistance, alkali resistance, wear resistance and durable adhesion.

Abstract: Compositions are provided which contain (a) one or more polysiloxanes comprising at least one reactive functional group; a plurality of particles; and, optionally, one or more curing agents comprising at least one functional group that is reactive with any reactive functional group of polysiloxane (a). Additionally, a process for applying the multi-component composite coatings described above to a substrate and coated substrates are provided. A process for preparing the coating compositions also is provided. The multi-component composite coating compositions of the invention provide highly scratch resistant color-plus-clearcoatings capable of retaining scratch resistance after weathering.

Abstract: The invention relates to a coating material containing a binding agent and a cross-linking agent as well as a thixotropic agent based on ureas and/or ureas derivatives, whereby the coating material additionally contains a wetting agent that improves the wettability of the thixtropic agent.

Abstract: Functionalized organo-silicone compounds incorporate ultraviolet radiation screening or absorbing moieties. The novel materials of the invention are durable and provide uniform UV absorption properties when used in various applications, including coatings on substrates such as glass, in particular float glass. Methods for their preparation and use are also provided.

Abstract: A polymeric composition for making semiconductor device packaging includes at least one epoxy resin, at least one curing agent in an amount between 30 and 110 parts by weight per 100 parts by weight of the epoxy resin, at least one silica-based reinforcing filler in an amount between 300 and 2300 parts by weight per 100 parts of the epoxy resin, and at least one control agent for a rheology of the polymeric composition. The at least one control agent may be substantially free from polar groups and present in an amount between 0.1 and 50 parts by weight per 100 parts by weight of the epoxy resin. The invention also relates to a plastic packaging material for microelectronic applications which may be obtained from the above polymeric composition, and to a semiconductor electronic device including such packaging material.

Abstract: Compositions are provided which contain (a) one or more polysiloxanes comprising at least one reactive functional group; a plurality of particles; and, optionally, one or more curing agents comprising at least one functional group that is reactive with any reactive functional group of polysiloxane (a). Additionally, a process for applying the multi-component composite coatings described above to a substrate and coated substrates are provided. A process for preparing the coating compositions also is provided. The multi-component composite coating compositions of the invention provide highly scratch resistant color-plus-clearcoatings capable of retaining scratch resistance after weathering.

Abstract: A coating liquid for forming a silica-containing film with a low-dielectric constant, which enables the formation of a low-density film having a dielectric constant as low as 3 or less and having excellent resistance to oxygen plasma and process adaptation but also in the adhesion to a substrate and film strength, is provided. The coating liquid for forming a silica-containing film with a low-dielectric constant comprises a polymer composition mainly constituted by (i) a polysiloxane and (ii) a readily decomposable resin, said polysiloxane being a reaction product between fine particles of silica and a hydrolyzate of at least one alkoxysilane represented by the following formula (I): XnSi(OR)4−n  (I),  wherein X represents a hydrogen atom, a fluorine atom, an unfluorinated or fluorinated alkyl group of 1 to 8 carbon atoms, an aryl group or a vinyl group; R represents a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group or a vinyl group; and n is an integer of 0 to 3.

Abstract: Elastomer-modified Epoxy-polysiloxane compositions of this invention are prepared by combining a silicone intermediate, with an epoxy resin, an elastomeric resinous intermediate, a polyfunctional amine, an optional organometallic catalyst, and optional fillers, pigments, and processing agents. The composition is prepared using a sufficient amount of water to promote hydrolysis of the polysiloxane and the polycondensation of the silanols produced by such hydrolysis. In its cured form, the epoxy-polysiloxane composition exists as a uniformly dispersed arrangement of linear epoxy chain fragments that are cross-linked with a continuous polysiloxane polymer chain, wherein either or both of the epoxy and/or polysiloxane polymers are elastomer modified to provide coatings and floorings having significantly improved properties of impact resistance, flexibility, crack resistance, and abrasion resistance with compared to conventional epoxy systems.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.

Abstract: An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.

Abstract: The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.

Abstract: Coating compositions are provided which include a polysiloxane comprising at least one reactive functional group and at least one material comprising at least one reactive functional group. Also provided are multi-layer composite coatings formed from a basecoat deposited from a pigmented coating composition and a topcoat applied over the basecoat, the topcoat deposited from the aforementioned coating composition. A method for improving the scratch resistance of a coated substrate, as well as coated substrates also are provided. The compositions of the invention provide highly scratch resistant coatings, particularly highly scratch resistant color-plus-clearcoatings.

Abstract: Disclosed herein is a composition comprising: A) a moisture curable polymer selected from the group consisting of silylated polyurethanes, silylated polyethers, and mixtures thereof, and B) a silicone oligomer of the formula: [R3SiO1/2]m[O1/2Si(R)2O1/2]n[SiO3/2R]o[SiO4/2]p  (I) wherein: each R is independently selected from the group consisting of B, R1, —OR2, R3, and R4; B is an organosilyl functional group bridged to the Si atom of the siloxane oligomer backbone by a Si—C bond; each R1 is independently a saturated or aromatic hydrocarbon group of 1 to 16 carbon atoms; each R2 is independently a group as defined for R1 or an acyl group; each R3 is independently a monovalent organic group containing an aliphatic unsaturated hydrocarbon group; each R4 is a monovalent organic group linked to the Si atom of the siloxane oligomer backbone by a Si—C bond that does not include an aliphatic unsaturated hydrocarbon group and that has there

Abstract: Coating compositions are provided which are formed from components comprising (a) at least one polysiloxane comprising at least one reactive functional group; (b) at least one reactant comprising at least one functional group that is reactive with at least one functional group selected from the at least one reactive functional group of the at least one polysiloxane and at least one functional group of at least one reactant; and (c) a plurality of particles, wherein each component is different, and wherein the at least one reactive functional group of the at least one polysiloxane and the at least one functional group of the at least one reactant are substantially nonreactive with the particles. A multi-component composite coating composition formed from a basecoat and a topcoat deposited from the curable coating composition also is provided.

Abstract: By blending novel organosiloxane polymers of the invention with a crosslinking agent and a photoacid generator, photo-curable resin compositions are formulated which can be exposed to radiation in a broad wavelength range and readily form a thin film without oxygen attack. From the compositions, fine patterns having improved dry etching resistance can be formed. Cured coatings of the compositions having improved substrate adhesion, heat resistance, and electrical insulation are suitable as a protective film for electric and electronic parts.

Abstract: A pultrusion resin composition comprising about 75 wt % to about 85 wt % of a phenolic resin, about 9 wt % to about 20 wt % of the reaction product of a polyhydroxy compound and an epoxy-functional polysiloxane, about 6 wt % to about 15 wt %, of a phenolic epoxy, and about 0.2 wt % to about 1 wt % of a catalyst, based on total weight of the composition. Pultruded products are formed by drawing fibrous reinforcement through a bath of the pultrusion resin composition.

Abstract: A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.

Abstract: Disclosed is an epoxy resin modified with phosphorus and silicon having an synergistically improved flame retardant property, prepared by reacting an epoxy resin with phosphorus and silicon. The contents of phosphorus and silicon in the epoxy resin are 2.0 wt % to 3.2 wt % and 0.5 wt % to 2.2 wt %, respectively. The epoxy resin according to the present invention will be applicable to the preparation of electrical circuit boards.

Abstract: The present invention provides for a silicone epoxy resin, its preparation, and the use in corrosion-inhibiting, heat-stable coatings. The inventive resins are obtained by a process which comprises reacting: I) siloxanes of the general formula RaSi(OR′)bO(4−a−b)/2  in which OR′ is an alkoxy group with primary or secondary aliphatic alcohols, R is identical or different and is an alkyl group or an aromatic group, a is from 0.1 to 2.0, and b is from 0.1 to 1.0, with II) one or more low molecular mass polyhydric alcohols/polyols and III) one or more resins containing epoxide groups, containing at least two 1,2-epoxide groups per molecule, at temperatures in the range from about 100 to about 160° C. with removal of the alcohol HOR′ to a degree of conversion of from 20 to 80% and terminating the reaction by cooling to a temperature <about 100° C.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.

Abstract: The invention relates to self-adhesive addition-crosslinking silicone compositions which contain the components (A) diorganopolysiloxanes having aliphatic unsaturation, (B) organohydrogenpolysiloxanes bearing compatability decreasing substituents, (C) compounds having at least one aliphatically unsaturated radical and at least one &bgr;-diketone function or &bgr;-keto ester function and (D) a hydrosilylation catalyst. The compositions are cost effective, and exhibit excellent adhesion to both metallic and non-metallic substrates while maintaining other desirable physical properties.

Abstract: A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300° C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.

Abstract: A process for preparing silica-based organic-inorganic hybrid resin using sol-gel process. Phenol is used as catalyst to reduce the gel time of the sol-gel process and cyclosiloxane is used as modifier to increase the toughness of the resultant inorganic-organic hybrid resin.

Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.

Abstract: A gelcoat composition composed of a base resin having double bonds in a molecule and a modified silicone oil having double bonds in a molecule. The gelcoat composition is inexpensive and yet highly stainproof. It is suitable for application to bathroom waterproof panels, etc.

Abstract: A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an organic solvent, wherein if the sum of the epoxy resin and the curing agent is set to 100 parts by weight, the sum of the reactive silicone oil with an epoxy group and the triazinethiol is 2 to 30 parts by weight.

Abstract: A single-application polyimidosiloxane coating material comprising a uniformly mixed solution composition of a polyimidosiloxane with an epoxy resin-reactive group in the molecule, an epoxy resin and a fine inorganic filler in a solvent. The coating material has satisfactory storage stability and printing properties, and its cured films also have satisfactory properties and allow single-application printing.

Abstract: Disclosed is a continuous process for producing silicone copolymer using a series of at least one stirred-tank reactor the last of which feeds into at least one plug flow reactor, wherein the crude product stream exiting the last of said stirred-tank reactors is sufficiently homogeneous that the stream which undergoes further reaction in the plug flow reactor does not undergo phase separation.

Abstract: A suspension containing crosslinked silicone particles with a lower mean particle diameter and a better dispersion in certain organic resins is prepared by emulsifying a condensation crosslinkable silicone composition containing (A) an organopolysiloxane having at least two silanol groups per molecule and (B) a crosslinker, but no (C) condensation catalyst, in water using a surfactant. A tin (II) salt of an organic acid with no more than ten carbon atoms is then emulsified in water with a surfactant, and added as the component (C) to the emulsion of condensation crosslinkable silicone composition. This crosslinks the emulsion of condensation crosslinkable silicone composition.

Abstract: An efficient method is provided for producing water based coating compositions that are capable of forming highly scratch and abrasion resistant matte coatings in which crosslinked silicone particles are well dispersed. The method involves addition to a water based coating composition of a waterborne suspension of crosslinked silicone particles having an average diameter of 0.1-200 &mgr;m. The method is characterized in that the suspension is a waterborne crosslinked silicone particle suspension provided by effecting crosslinking of a condensation reaction crosslinkable silicone composition comprising (A) an organopolysiloxane containing at least two silanol groups in each molecule, (B) a crosslinker, and (C) a condensation reaction catalyst. The crosslinking is effected in the emulsified composition in an aqueous solution of an anionic surfactant.

Abstract: A curable composition having an epoxy component and an organosilane component. The epoxy component includes at least one epoxy compound having two or more epoxide functional groups. The organosilane component includes at least one organosilane compound having two or more silyl ether groups. An exemplary organosilane compound is a siloxane-modified polyol.

Abstract: A one-pack type curable resin composition having high adhesive strength to various substrates, good storage stability and excellent restoring properties is disclosed. The one-pack type curable resin composition contains an organic polymer (a) having at least one reactive silicon group per molecule, a compound (b) having reactive silicon group in its molecule, a non-phthalate plasticizer (c) having no phthalate structure in its molecule, and a stannous curing catalyst (d).

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of up to 1.7, an inorganic filler, a curing catalyst, a thermoplastic resin, and an optional phenolic resin and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. Owing to the thermoplastic resin added, the composition avoids the problem that when a semiconductor chip is sealed with an uncured film of the composition, the film will lose its original shape or entrapped voids will be formed near the chip.

Abstract: A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.

Abstract: The invention provides a silicone-modified epoxy resin obtained through condensation polymerization of a methoxy group silicone intermediate to a bisphenol-based epoxy resin, and its preparing method and a composition comprising the said silicone-modified epoxy resin. The silicone-modified epoxy resin is excellent in heat resistance and of value for use in coatings for hot appliances such as oven.

Abstract: The present invention pertains to an epoxy-functional organopolysiloxane resin, and an epoxy-functional organopolysiloxane coating composition comprising the epoxy-functional organopolysiloxane resin.

Abstract: The preparation of composites using epoxy-functional silicones as additives to phenolic resole resins.

Abstract: The present invention discloses an epoxy resin composition with a non-halogen, non-phosphorus flame retardant, which comprises (a) 100 parts by weight of an epoxy resin; (b) 40-60 parts by weight of a phenolic novolac hardener; and (c) 5-60 parts by weight of a silica-novolac hybrid resin solution as a flame retardant.

Abstract: Water resistant ink compositions comprising (I) a water-soluble dye compound and/or an organic pigment compound; (II) an organosilicon compound obtained by hydrolyzing a mixture of (A) a hydrolyzable silane obtained by reacting a specific aminated organic group-bearing hydrolyzable silane with an organic monoepoxy compound, or a partial hydrolyzate thereof, and (B) a specific hydrolyzable silane or a partial hydrolyzate thereof; and (III) water have excellent water resistance, good storage and shelf stability, good ink discharge stability, and outstanding color stability. These ink compositions are particularly suitable for use as ink-jet printer inks.

Abstract: The invention concerns the preparation of azlactone-derivatized polyamides which are obtained by reacting polyamides with a solution containing an azabicyclo compound and a vinyl azlactone derivative of formula (I), in which R1, R2 and R3, independently of one another, designate H or CH3; and R4 and R5, independently of each other, designate H or C1 to C3 alkyl. These azlactone-derivatized polyamides can be used to bond amino-group-containing compounds to a matrix. Examples of these polyamides include affinity carriers and immobilized enzymes.

Abstract: The invention provides a technique for improving the flexibility of a cured epoxy resin. An isocyanate terminated polydimethylsiloxane urethane as a modifier is grafted to an epoxy resin. The modified epoxy resin after being cured exhibits an improved flexibility.

Abstract: A resin composition comprising the following components (1) and (2): (1) a water-soluble resin having siloxane bonds, and (2) a siloxane compound represented by the formula (A1): SiOaXbYc  (A1)  wherein X is a hydrolyzable group, Y is a non-hydrolyzable group, 0≦a≦1.4, and b/(b+c)=0.01 to 1.0, provided 2a+b+c=4.

Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.