Abstract: There is disclosed methods and compositions for retarding the room temperature hardening of phenolic resole resins when such resins are mixed with lightburned magnesium oxide with or without an ester functional hardening agent. Compounds which act as retarders include azelaic acid, salicylamide, sulfanilic acid, glyoxal, salicylic acid, N-methylaniline, and 2,6-diethylaniline.

Abstract: A curing agent for a water borne epoxy resin composition wherein the curing agent is the reaction product of a chemical excess of a polyfunctional epoxide compound and a quaternary ammonium salt in which substantially all of the excess epoxide groups in the reaction product are subsequently consumed in a reaction with a polyamine. A process for preparing the curing agent and a hardenable film forming coating composition containing as essential components, the curing agent, at least one water dispersible epoxy resin and water is also disclosed.

Abstract: A polyurethane resin, rigid polyurethane foam and composite thereof prepared by using a polyol comprising a phenol resin base polyol mixed with an aminophenol base polyol or a polyphenylpolyxylylenepolyamine base polyol or a polymethylenepolyphenylpolyamine base polyol.

Abstract: The present invention is a fiber comprising cyanato group containing phenolic resin comprising repeating units of the formula: ##STR1## wherein p is 0 or an integer of one or more, q is O or an integer of 1 or more, X is a radical selected from the group consisting of: --CH.sub.2 --, --CO--, --SO.sub.2 --, ##STR2## and R is the same or different and is selected from the group consisting of hydrogen and methyl radicals. The fiber of the present invention can be made a phenolic triazine derived from the cyanato group containing phenolic resin.

Abstract: The invention is an epoxy resin composition. Diol initiators are reacted with alkylene oxide and 1 to 5 wt % epoxy resin. The epoxy resin is added internally, along the length of the diol chain to yield a modified polyol of molecular weight 2000 to 5000. The modified polyol is subjected to reductive amination to yield a polyamine. This polyamine is mixed with an epoxy base resin and cured to product epoxy resins demonstrating improved strength and adhesion.

Abstract: An epoxy resin curative composition that provides cured epoxy resins exhibiting improved properties is disclosed. The curative composition comprises a mixture of 1-isopropyl-2-aryl imidazole and 1-isopropyl-2-aryl imidazoline.

Abstract: There are disclosed methods and compositions for accelerating the hardening of phenolic resole resins having a pH of about 4.5 to 9.5 with lightburned magnesium oxide or magnesium hydroxide, with or without the addition of an ester functional hardening agent. Acceleration of hardening is achieved by incorporating into said compositions an effective quantity of a material which: increases the solubility of magnesium in the hardenable mixture; by certain amines; or by certain chelating agents. Accelerator compounds include those which provide chloride, sulfamate, nitrate, formate, and phosphite anions as well as selected tertiary amines.

Abstract: The hardening of a composition containing a phenolic resin solution and a magnesia aggregate is effected by mixing into such composition at a pH of at least 4.5: a compound which provides an acetate, adipate, 1,2,4-benzenetricarboxylate, formate, glycolate, lactate, nitrate, benzenesulfonate, naphthalenesulfonate, methanesulfonate, phenolsulfonate, succinate, sulfamate, or toluenesulfonate anion to the composition; or a mixture of said compounds.

Abstract: There is disclosed methods and compositions for retarding the room temperature hardening of phenolic resole resins when such resins are mixed with lightburned magnesium oxide with or without an ester functional hardening agent. Compounds which act as retarders include azelaic acid, salicylamide, sulfanilic acid, N-methylaniline, and 2,6-diethylaniline.

Abstract: The invention relates to a process for manufacturing fiber-reinforced boards for the electrical industry by the use of epoxy resins and latent curing agents based on imidazole/acrylic acid reaction products based on the general formula ##STR1## wherein R, R.sup.1 and R.sup.2 are, independently of one another, H or a short-chain alkyl group having from 1 to 3 carbon atoms, R.sup.3 is a group of the formula--O--(CH.sub.2)m--R.sub.4 (II)wherein m is an integer between 2 and 6, R.sup.4 is H, --OH or --O--, and n is equal to the valence of R.sup.3.

Abstract: The invention relates to new compounds of the general formulas ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.

Abstract: The invention relates to new compounds of the general formula ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.

Abstract: The present invention is directed to epoxy-based polymeric nonlinear optical materials in which a nonlinear optical active moiety or functionality forms the crosslink between polymer chains and a process for making the nonlinear optical (NLO) epoxy polymer including heating an epoxy resin and a curing agent such as a bi- or tri-functional aromatic amine containing an electron-withdrawing group, for example, diamino diphenylsulfone and poling the mixture under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical moieties in the polymer. The polymers have enhanced stability over polymers in which only one end of an NLO active moiety is attached to the polymer chain.

Abstract: Compounds containing at least one alkenyl group, at least one maleimide group and at least one rodlike mesogenic moiety are prepared by reacting one or more aminophenols containing one or more rodlike mesogenic moieties with a stoichiometric quantity of a maleic anhydride per amine group of said aminophenol and then alkenylating the resulting phenolic functional maleimide.

Abstract: Process for producing dimer-free phenolic polymers, particularly novolak polymers produced from cresol mixtures, and photoresist compositions containing such dimer-free novolak polymers. The process comprises reacting phenolic polymers containing phenolic dimers with a capping agent, such as a silylating agent, to cap all of the phenolic hydroxy groups. This reduces the distillation temperature of the capped dimers and renders the capped polymer stable at such distillation temperature. The capped dimers are distilled off, and finally the phenolic polymer is uncapped. Dimer-free novolaks produce scum-free developed photoresist images.

Abstract: A thermosetting resin composition useful for heat-resistant adhesive agents and cured shaped articles, comprising (A) a terminal imide oligomer having hydroxyl groups prepared, in an organic medium, from a biphenyltetracarboxylic acid ingredient, an aromatic diamine ingredient and a modifying monoamine ingredient having at least one hydroxy group, and exhibiting a logarithmic viscosity number of 0.01 to 1 at 30.degree. C., and (B) an organic compound having at least two epoxy groups, the imide oligomer optionally being in the state of a partial reaction product of the above-mentioned ingredients.

Abstract: Hardenable mixtures of materials, comprising(a) an epoxide resin,(b) a dithiol of the formula I or II ##STR1## in which the R.sub.1 s independently of one another are hydrogen or methyl, x is an integer from 2 to 50 and y is an integer from 1 to 30, and(c) a polyamine having at least two primary amino groups,give, after hardening, flexible and tough-lasting products. They are suitable, if appropriate in combination with further additives, for example for the production of sealing compositions, injection compositions, adhesives, moulding resins, matrix resins, casting resins or coating compositions.

Abstract: A fusible phenolic resin and a dialkyl-N, N-bis (hydroxyalkyl) aminoalkyl phosphonate are condensed to form a water-insoluble resin having fire retardant properties. Fire resistant materials are made by causing the condensation to occur in situ when a normally flammable material and the reactants are mixed and the mixture is heated at 250.degree. F. to 480.degree. F. Wooden articles such as molded hardboard roofing shingles of this invention do not lose their fire resistance after being soaked with rain repeatedly.

Abstract: The present invention is directed to a process of preparing a cyanato group containing phenolic resin by reacting the corresponding phenolic resin with a tertiary amine in a water immiscible, non-hydrogen bonding solvent at a temperature of preferably less than about 25.degree. C. to form the corresponding ammonium salt of the phenolic resin; and reacting the ammonium salt with a cyanogen halide at a temperature equal to or less than about 0.degree. C. in said solvent to form the cyanato containing phenolic resin.

Abstract: Certain polyether polyols are used in polyurethane-forming binders to improve the shakeout of molds and cores, made by cold-box and no-bake processes. Such molds and cores are used to make metal castings, particularly from low melting metals such as aluminum.

Abstract: Process for producing dimer-free phenolic polymers, particularly novolak polymers produced from cresol mixtures, and photoresist compositions containing such dimer-free novolak polymers. The process comprises reacting phenolic polymers containing phenolic dimers with a capping agent, such as a silylating agent, to cap all of the phenolic hydroxy groups. This reduces the distillation temperature of the capped dimers and renders the capped polymer stable at such distillation temperature. The capped dimers are distilled off, and finally the phenolic polymer is uncapped. Dimer-free novolaks produce scum-free developed photoresist images.

Abstract: The present invention is a cyanato group containing phenolic resin, and to phenolic triazine resins derived therefrom. The cyanato group containing phenolic resin of the present invention can be completely cured to form a phenolic triazine resin having a glass transition temperature equal to or greater than 250.degree. C.

Abstract: Broadly, the present invention is directed to an adhesive composition which comprises an epoxy resin, an effective amount of a mercapto curing agent or curative for said epoxy resin, and a compatibilizing amount of a polysulfide compound which has a performance improving fraction of its --SH groups rendered unreactive with the epoxy groups in said composition. Optionally, the adhesive composition can contain amine or amide curing agents in addition to the mercapto curative. Advantageously, at least about 5% of the number of reactive thiol groups of the polysulfide compound are rendered unreactive, advantageously at least about 25%, and preferably at least about 50%. Preferred polysulfide compatibilizing compounds are adducts of a polysulfide and a component which contains functionality reactive with a thiol group, but which contains no residual functionality reactive with epoxy groups in the composition once the polysulfide adduct is formed.

Abstract: A resin composition comprising an epoxy resin and an isocyanate group-containing fluorine compound is particularly suitable for covering a magnetic recording medium comprising a non-magnetic substrate and formed thereon a thin magnetic film so as to give excellent sliding durability.

Abstract: Blends of diaminoisopropylbenzene (DAIBP) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transition temperatures as compared with resins cured with either diamine alone.

Abstract: The present invention is a cyanato group containing phenolic resin, and to phenolic triazine resins derived therefrom. The resin of the present invention is stable and has a long shelf life. This is indicated by the gel time of greater than 3 minutes and by a shelf life equal to or greater than 3 days.

Abstract: Phenolic cyanate/phenolic triazine copolymers and cured resins prepared therefrom.

Abstract: The present invention is a cyanato group containing phenolic resin of the formula: ##STR1## wherein n is 0 or an integer of one or more, and R is the same or different and is selected from the group consisting of hydrogen and methyl radicals. The advancement over the art is that the resin of the present invention is stable and has a long shelf life. This is indicated by the gel time of greater than 1 minute, preferably greater than 2 minutes, more preferably greater than 10 minutes, and most preferably greater than 20 minutes at 155.degree. C. Alternately, the improved resin of the present invention can be characterized as having a thermal stability indicated by thermal decomposition temperature of at least 400.degree. C. and preferably of at least 450.degree. C. as measured by Thermal Gravimetric Analysis (TGA).

Abstract: A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.

Abstract: A fiber reinforced resin matrix composite material repair system is provided, which critically employs a resin comprising a catalyst of the formula I: ##STR1## with a multifunctional epoxy resin, the resin system being sealed in a water-proofed environment prior to being coated onto a fiber reinforcement. The coated fiber reinforcement is applied over the damaged area, the damaged portion having been removed, and the surrounding surface smoothed. An adhesive is applied to the remaining surface, prior to application of the patch. The resulting patch, which may further include thermoplastic toughening agents and an enhancer, can be directly cured at temperatures below 212.degree. F. to give physical properties similar to the original material.

Abstract: The present invention relates to a thermosetting resin having high thermal resistance, high strength, flame resistance, and good processability which can be obtained by reacting polycarbodiimide substantially produced form one or more kinds of organic polyisocyanate with crosslinking agents having two or more active hydrogen groups in their molecules, one or more kinds of compounds having epoxy groups in their molecules or compounds capable of accelerating the trimerization reaction of carbodiimide, and production methods thereof.

Abstract: A curable epoxy resin composition comprises (I) an epoxy resin and (II) a curing agent. It may comprise (III) another curing agent. It is preferable for it to comprise 25 to 95 wt.% of (I) and 5 to 45 wt.% of (II).1 an epoxy resin (I) represented by the general formula: ##STR1## wherein Z represents a group selected from among a hydrogen atom, a methyl group and an ethyl group, R represents a group selected from among a hydrogen atom and alkyl groups, and n represents a number of 0 to 1.6, and2 a curing agent comprising a polyamine reaction composition (II) obtained by reacting 1 mol of a phenol (II-1) having at least one unsubstituted reactive site in the aromatic nucleus with at least 1 mol of an aliphatic polyamine (II-2) and at least 1 mol of a carbonyl compound (II-3) having at least one carbonyl group in the molecule.

Abstract: Addition compounds which are suitable as dispersants for solids in organic media are obtained from polyepoxides based on novolaks having 3 to 11 nuclei and a mixture of aliphatic, aromatic and/or heterocyclic amines.

Abstract: This invention relates to ditertiary-butyl substituted bridged di(cyclohexylamines) where the tert-butyl substituent is alpha to the amine group and to polyepoxide formulations incorporating the di(cyclohexylamine). The formula of the diamine is: ##STR1## wherein R is tert-butyl. The di(tertiary butyl)methylene bridged cyclohexylamines have delayed reactivity when incorporated in epoxy resins and they also enhance physical properties in high resilience polyurethane foams.

Abstract: Epoxy resins are modified by reaction with an acidified polytertiary amine-containing compound. These modified epoxy resins when cured result in products having improved properties.

Abstract: Cationic paint binders based on the reaction products of epoxide compounds with substituted carbamic acid derivatives and the use thereof in the formulation of cathodically deposited paints are described. The carbamic acid derivatives are urethanes, ureas, allophanates, and biuret compounds. Crosslinking functionality and/or protonatable groups are introduced by a suitable selection of blocking agents for the isocyanate compounds utilized. The reaction between the epoxide compounds and carbamic acid derivatives takes place in the presence of basic groups under relatively mild conditions; and, even when several carbamic acid moieties are present in a molecule, a readily soluble product is obtained.

Abstract: Blends of diaminoisopropylbenzene (DAIPB) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transistion temperatures as compared with resins cured with either diamine alone.

Abstract: The present invention is flame resistant article and related method, made of phenolic triazine resin derived from a cyanato group containing phenolic resin of the formula: ##STR1## wherein: n is a positive whole number greater than or equal to 1;q and r are the same or different at each occurrence and are whole numbers from 0 to 3, with the proviso that the sum of q and r at each occurrence is equal to 3;Z is --CN, or hydrogen and --CN;o and p are the same or different at each occurrence and are whole numbers from 0 to 4 with the proviso that the sum of o and p at each occurrence is equal to 4;--X-- is a divalent organic radical; andR.sub.3 is the same or different at each occurrence and is a substituent other than hydrogen which is unreactive under conditions necessary to completely cure the copolymer.

Abstract: An aqueous electrophoretic coating material, which can be deposited at the cathode and contains(A) 90 to 50% by weight, based on the total portion of synthetic resin vehicle, of one or several polycondensation, polymerization and/or poly-addition resins, the resin or, in the event that several resins are present, their mixture(a) having a number average molecular weight (Mn) of 700 to 10,000(b) having 1.2.times.10.sup.23 to 21.7.times.10.sup.23 lateral or terminal double bonds per 1,000 g, corresponding to a hydrogenation iodine number of 5 to 90,(c) optionally containing primary and/or secondary hydroxyl groups, corresponding to a hydroxyl number of 0 to 450 mg KOH/g of resin, and(d) tertiary amino groups corresponding to an amine number of 30 to 450 mg KOH/g of resin.

Abstract: Disclosed is a novel, organic solvent-soluble novolak resin having a high molecular weight and an inherent viscosity of at least 0.1. This high-molecular-weight novolak resin can be prepared with a good reproducibility by reacting an aldehyde with a polyfunctional phenol at an aldehyde/polyfunctional phenol molar ratio of from 0.85 to 1.20 in the presence of an acid catalyst in a solution state. This high-molecular-weight novolak resin is valuable as the resin component of a radiation-sensitive resist.

Abstract: Curable compositions comprise(A) a polyglycidyl ether of a polyhydric phenol,(B) a polyglycidyl ether of a polyhydric alcohol,(C) a nitrogen-containing latent hardener for epoxide resins and(D) as cure accelerator dispersed as a powder in the composition, a solid solution of a polymeric phenol with an aliphatic polyamine having two or more amine groups, each of the amine groups being tertiary and at least two of the amine groups being dimethylamino groups.

Abstract: Epoxy resins are modified by reaction with a pyridine compound and a Bronsted acid. These modified epoxy resins when cured result in products having improved properties.

Abstract: A method for curing a 1,2-epoxy resin by mixing the resin with an effective amount of an amine curing agent under epoxy resin curing conditions and accelerating the cure with acetoacetoxyethyl methacrylate (AAEM).

Abstract: Use of polyamidoamines as curing agents for epoxy resins and curable mixtures containing these substances.The invention relates to the use of polyamidoamines (A) containing primary and/or secondary amino groups as curing agents for epoxy-containing compounds (B), wherein the polyamidoamines (A) used are those compounds which have been obtained by polycondensation of (a) compounds from the group of dicarboxylic acids containing oxyalkylene groups, or derivatives thereof (esters), with (b) polyamines containing at least two amino groups which are condensable with (a).The invention furthermore relates to curable mixtures containing the abovementioned components (A) and (B). The cured products obtainable according to the invention have advantages with regard to impact strength and shock resistance, to flexibility even at relatively low temperatures and crack-bridging properties.

Abstract: A synthetic resin which carries basic nitrogen groups and is water-dilutable by protonation with acid is obtainable by reacting(A) an epoxy resin having an average molecular weight M.sub.n of from 300 to 6,000 and on average from 1.5 to 3.0 epoxy groups per molecule with(B) a ketimine of a primary amine additionally containing one or more urethane groups and optionally also with(C) a diketimine of a diprimary amine containing no urethane groups and optionally also with(D) a secondary amine which may contain a tertiary amino group also, a ketimine of a primary monoamine and/or a ketimine of a primary/tertiary diamine.

Abstract: A synthetic resin which carries basic nitrogen groups and is water-dilutable by protonation with acid is obtainable by reacting(A) an epoxy resin having an average molecular weight M.sub.n of from 300 to 6,000 and on average from 1.5 to 3.0 epoxy groups per molecule with(B) a ketimine of a primary amine additionally containing one or more urethane groups and optionally also with(C) a diketimine of a diprimary amine containing no urethane groups and optionally also with(D) a secondary amine which may contain a tertiary amino group also, a ketimine of a primary monoamine and/or a ketimine of a primary/tertiary diamine.

Abstract: A reaction product of a .beta.-diketone and a polymer having groups that are reactive with the .beta.-diketone can be complexed with a metal. The reaction product having the complex metal can be activated to provide a substrate suitable for plating from an electroless metal plating bath.

Abstract: The present invention is a cyanato group containing phenolic resin of the formula: ##STR1## wherein n is 0 or an integer of one or more, and R is the same or different and is selected from the group consisting of hydrogen and methyl radicals. The advancement over the art is that the resin of the present invention is stable and has a long shelf life. This is indicated by the gel time of greater than 1 minute, preferably greater than 2 minutes, more preferably greater than 10 minutes, and most preferably greater than 20 minutes at 155.degree. C. Alternately, the improved resin of the present invention can be characterized as having a thermal stability indicated by thermal decomposition temperature of at least 400.degree. C. and preferably of at least 450.degree. C. as measured by Thermal Gravimetric Analysis (TGA).

Abstract: Compositions of phenolic resins, for example, phenol formaldehyde resins, containing an additive of triethanolamine borate or an amine/oxygen-containing boron derivative mixture, e.g., triethanolamine and boric anhydride, are particularly useful for the manufacture of prepeg mats.

Abstract: An epoxy resin composition for semiconductor sealing which comprises, as essential components,(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R.sub.1, R.sub.2 and R.sub.3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R.sub.1, R.sub.2 and R.sub.3 must not be hydrogen atom simultaneously,(B) a phenolic resin curing agent,(C) a silica filler, and(D) a curing accelerator.