Solid Polymer Or Specified Intermediate Condensation Product Derived From At Least One Phenolic Reactant And At Least One Aldehyde Or Aldehyde-type Reactant Or Polymer Therefrom Patents (Class 525/480)
  • Patent number: 9469777
    Abstract: There is provided a composition for forming a resist underlayer film which has high dry-etching resistance and wiggling resistance, and achieves excellent planarizing properties for a semiconductor substrate surface having level differences or irregular portions. A resist underlayer film-forming composition including a phenol novolac resin that is obtained by causing a compound that has at least three phenolic groups, in which each of the phenolic groups has a structure bonded to a tertiary carbon atom or has a structure bonded to a quaternary carbon atom to which a methyl group binds, to react with an aromatic aldehyde or an aromatic ketone in the presence of an acid catalyst.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: October 18, 2016
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Takafumi Endo, Tetsuya Shinjo, Keisuke Hashimoto, Yasunobu Someya, Hirokazu Nishimaki, Ryo Karasawa, Rikimaru Sakamoto
  • Patent number: 9354517
    Abstract: A resist composition includes: a solvent; and a resin in the solvent, the resin being prepared by the hydrolysis and condensation of an alkoxy group-containing compound that contains an alkoxy group bound to a silicon atom or a germanium atom in the presence of an acid or an alkali, wherein a portion of the resist composition irradiated with an energy radiation is insoluble in a developing solution.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: May 31, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Junichi Kon, Yoshihiro Nakata
  • Patent number: 9290605
    Abstract: Flexible polyurethane foams are made using certain hydrolysable silane compounds in the foam formulation. The hydrolysable silane compounds contain at least one isocyanate-reactive group and at least one hydrolysable silane group. The presence of the hydrolysable silane compound in the foam formulation leads to improved tensile, tear and elongation properties without an adverse effect on other important foam properties such as resiliency and hysteresis loss.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: March 22, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Parvinder S. Walia, Bernard E. Obi, Venkat S. Minnikanti, William A. Koonce, Kamesh R. Vyakaranam, Ling Zhang, Sabrina Fregni
  • Patent number: 9239517
    Abstract: The object is to provide a compound having high dissolvability in a safe solvent and high sensitivity, and also capable of obtaining a good resist pattern shape, a radiation-sensitive composition containing the same, and a resist pattern formation method using the composition. For this purpose, a compound (B) obtained by reaction between a polyphenol based cyclic compound (A) and a compound (C) having a particular structure, a radiation-sensitive composition containing the same, and a resist pattern formation method using the composition are provided.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: January 19, 2016
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventor: Masatoshi Echigo
  • Patent number: 9238708
    Abstract: An organosiloxane-modified novolak resin comprising structural units having formula (1) wherein R1 is an organosiloxy group having a monovalent C1-C10 hydrocarbon group bonded to silicon, and R2 is H or C1-C4 alkyl or alkoxy. The resin has high heat resistance and high strength inherent to novolak resins and low stress inherent to organosilicon compounds.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: January 19, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Patent number: 9163112
    Abstract: An oligomeric condensation product can be obtained from at least one (hydroxymethyl)phenol of general formula (I), in which R1 is hydrogen or —CH3, R2 is —CH2OH, and R3 is hydrogen or —CH3, at least one polyamine, and optionally at least one phenol compound having two centers reactive by means of a reaction with the methylol groups of the (hydroxymethyl)phenol.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 20, 2015
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Ulrich Gerber, Jürgen Finter
  • Publication number: 20150148497
    Abstract: Methods of synthesis and application thereof for peripherally aromatic silsesquioxanes featuring reactive functionality. A method, according to one embodiment of the invention, includes reacting a polyhedral oligomeric silsesquioxane with an anhydride. The polyhedral oligomeric silsesquioxane has an inorganic core, a phenyl moiety or an anlyine moiety covalently coupled to the at least one T-type silicon atom; and a metal-aniline group or a para-aniline group covalently coupled to the at least one D-type or M-type silicon atom.
    Type: Application
    Filed: February 2, 2015
    Publication date: May 28, 2015
    Applicant: Government of the United States as Represented by the Secretary of the Air Force
    Inventors: Timothy S. Haddad, Joseph M. Mabry, Gregory R. Yandek
  • Publication number: 20150126690
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Application
    Filed: January 14, 2015
    Publication date: May 7, 2015
    Inventor: Joseph Gan
  • Patent number: 9013049
    Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 21, 2015
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yugo Yamamoto, Jun Okabe, Setsuko Oike
  • Patent number: 8981014
    Abstract: The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: March 17, 2015
    Assignees: Meiwa Plastic Industries, Ltd., UFC Corporation
    Inventors: Masato Takenouchi, Tadatoshi Fujinaga, Erina Kimura, Yu-Chin Lee, Jen-Hai Liao, Sung-Chen Lo
  • Patent number: 8962712
    Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: February 24, 2015
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Nobuhito Ito, Kazuyoshi Yoneda, Masao Arima
  • Publication number: 20140378626
    Abstract: The introduction of environmentally-friendly organic phosphorus group can not only maintain the original excellent properties of epoxy resins, but also meet the high flame-retarding requirements, and have the ability to improve the vitrification temperature (Tg), heat resistance and other characteristics of the material so that the curing system can be successfully applied to the electronic materials field which are light, thin, small and precise, the present disclosure provides a flame-retarding phosphor-containing phenol-formaldehyde novolac and the preparation method thereof, the use of the compound to react with the epoxy group of an epoxy resin to obtain an environmentally-friendly and high performing halogen-free cured flame retarding epoxy resin, and the compound can also be used for curing epoxy resins and gives a high flame-retarding effect.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 25, 2014
    Inventors: Qi SHEN, Xu-Feng LI, Dong ZHAO
  • Patent number: 8906592
    Abstract: The invention relates to an antireflective coating composition comprising a crosslinkable polymer, where the crosslinkable polymer comprises at least one unit of fused aromatic moiety, at least one unit with a phenylene moiety in the backbone of the polymer, and at least one hydroxybiphenyl unit, furthermore where the polymer comprises a crosslinking moiety of structure (4), where R?3, R?3 and R??3 are independently hydrogen or a C1-C4alkyl. The invention further relates to a process for forming an image using the composition.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: December 9, 2014
    Assignee: AZ Electronic Materials (Luxembourg) S.A.R.L.
    Inventors: M. Dalil Rahman, Clement Anyadiegwu, Douglas McKenzie, JoonYeon Cho
  • Patent number: 8883883
    Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: November 11, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masahiro Wada
  • Patent number: 8877878
    Abstract: A sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). In the formula (1), R1 is an aralkyl group, R2 is a lower alkyl group, and R3 is a lower alkoxycarbonyl group. X is a halogen atom, and n is an integer of from 1 to 3.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: November 4, 2014
    Assignee: Dexerials Corporation
    Inventors: Yoshihisa Shinya, Jun Yamamoto, Ryota Aizaki, Naoki Hayashi, Misao Konishi, Yasuhiro Fujita
  • Patent number: 8871347
    Abstract: An aluminum chelate-based latent curing agent having excellent latency and thermal response includes a latent curing agent in which an aluminum chelating agent is retained in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound, and an enzyme-treated gelatin film coating such latent curing agent. This microcapsule-type latent curing agent can be produced by dissolving an aluminum chelating agent and a polyfunctional isocyanate compound in a volatile organic solvent, charging the obtained solution into a gelatin-containing aqueous phase, carrying out interfacial polymerization by heating and stirring, and subjecting the gelatin to an enzyme treatment by adding an enzyme to the obtained polymerization reaction mixture.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: October 28, 2014
    Assignee: Dexerials Corporation
    Inventor: Kazunobu Kamiya
  • Patent number: 8859673
    Abstract: Polymer formulations are disclosed and described herein that comprise: at least one polymer comprising at least one hydroxy functional group, at least one acid source, and at least one acid-activated crosslinker that reacts with the polymer. In contemplated embodiments, these polymer formulations are curable at relatively low temperatures, as compared to those polymer formulations not comprising contemplated crosslinkers. Transparent films formed from these contemplated formulations are also disclosed. Organic transparent film compositions are also disclosed that comprise: at least one at least one phenol-based polymer, at least one solvent; at least one acid-activated crosslinker; and at least one acid source. Methods of forming organic transparent films with improved transmittance by depositing on a substrate the formulations disclosed herein and curing the formulations or compositions at a temperature of less than about 200° C.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: October 14, 2014
    Assignee: Honeywell International, Inc.
    Inventors: Edward Rutter, Jr., Ahila Krishnamoorthy, Joseph Kennedy
  • Patent number: 8859185
    Abstract: A resist underlayer film-forming composition includes a polymer including a repeating unit shown by a formula (1), and having a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and a solvent. Each of R3 to R8 individually represent a group shown by the following formula (2) or the like. R1 represents a single bond or the like. R2 represents a hydrogen atom or the like.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: October 14, 2014
    Assignee: JSR Corporation
    Inventors: Shin-ya Minegishi, Yushi Matsumura, Shinya Nakafuji, Kazuhiko Komura, Takanori Nakano, Satoru Murakami, Kyoyu Yasuda, Makoto Sugiura
  • Publication number: 20140296452
    Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Dein-Run FUNG, Te-Chao LIAO, Chia-Cheng CHAO, Hao-Sheng CHEN
  • Publication number: 20140227520
    Abstract: A synthetic bead for use in mineral separation is described. The synthetic bead has a surface made of a synthetic material such as polymer and the synthetic material is functionalized with molecules having a functional group for attracting mineral particles to the surface in a separation process. The synthetic beads can be placed in flotation cell containing a mixture of water, valuable material and unwanted material or in a pipeline where the mixture is transported from one location to another. The enriched synthetic beads carrying the mineral particles are separated from the unwanted materials in the mixture. The mineral particles are then released from the synthetic beads by means of low pH treatment, ultrasonic agitation, thermal or electromagnetic treatment.
    Type: Application
    Filed: May 25, 2012
    Publication date: August 14, 2014
    Applicant: CiDRA Corporate Services Inc.
    Inventors: Paul J. Rothman, Mark R. Fernald, Francis K. Didden, Christian V. O'Keefe, Alan D. Kersey, Douglas H. Adamson
  • Patent number: 8802791
    Abstract: An abrasive product includes a plurality of abrasive particles and a resin cured with a polythiol group. A method of preparing the abrasive product includes contacting the plurality of abrasive particles with a curable composition that includes a resin and a polythiol group, and curing the curable composition to produce the abrasive product. A method of abrading a work surface includes applying an abrasive product to a work surface in an abrading motion to remove a portion of the work surface. A curable composition includes a formaldehyde resin and a polythiol group. A formaldehyde resin is crosslinked by a polythiol group. A method of crosslinking the formaldehyde resin includes reacting the polythiol group with the formaldehyde resin.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: August 12, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Anthony C. Gaeta, William C. Rice
  • Patent number: 8742033
    Abstract: A method of stabilizing a resorcinol-aldehyde resin comprises heating a resorcinol-aldehyde resin in the substantial absence of an acid or base catalyst at a temperature from about 130° C. to about 180° C. for a sufficient amount of time to render the resin stable in an aqueous solution, wherein the resorcinol-aldehyde resin prior to heating is a novolak resin. The stabilized resins have many useful applications. For example, they can be used to make aerogels and xerogels. They also can be used to make dipping solutions to improve the adhesion between rubber and tire cords in a tire, belt, or hose.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: June 3, 2014
    Assignee: Indspec Chemical Corporation
    Inventor: Theodore Harvey Dailey
  • Patent number: 8716376
    Abstract: The present invention provides a rubber composition capable of forming an inner tube and/or an outer cover having high adhesion to a brass-plated wire and having excellent heat resistance, and oil resistance in a hose using a brass-plated wire as a reinforcing layer. The rubber composition includes 100 parts by mass of a rubber component (A) that includes ethylene-(meth)acrylate copolymer rubber and/or hydrogenated acrylonitrile-diene copolymer rubber, 1 to 30 parts by mass of a phenol resin (B), 1 to 30 parts by mass of silica (C), 0.1 to 5 parts by mass of a triazine compound (D) represented by the following formula (I), and 1 to 15 parts by mass of an organic peroxide (E) (in the formula (I), R represents a mercapto group, alkoxy group, monoalkylamino group, dialkylamino group, monocycloalkylamino group, dicycloalkylamino group, or N-alkyl-N-arylamino group).
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: May 6, 2014
    Assignee: Bridgestone Corporation
    Inventor: Shinji Sakakura
  • Publication number: 20140093728
    Abstract: A carbon nanostructure that is free of a growth substrate can include a plurality of carbon nanotubes that are branched, crosslinked, and share common walls with one another. The carbon nanostructure can be released from a growth substrate in the form of a flake material. Optionally, the carbon nanotubes of the carbon nanostructure can be coated, such as with a polymer, or a filler material can be present within the porosity of the carbon nanostructure. Methods for forming a carbon nanostructure that is free of a growth substrate can include providing a carbon nanostructure adhered to a growth substrate, and removing the carbon nanostructure from the growth substrate to form a carbon nanostructure that is free of the growth substrate. Various techniques can be used to affect removal of the carbon nanostructure from the growth substrate. Isolation of the carbon nanostructure can further employ various wet and/or dry separation techniques.
    Type: Application
    Filed: September 24, 2013
    Publication date: April 3, 2014
    Applicant: Applied Nanostructured Solutions, LLC
    Inventors: Tushar K. SHAH, Harry Charles Malecki, Rajneeta Rachel Basantkumar, Han Liu, Corey Adam Fleischer, Joseph J. Sedlak, Jigar M. Patel, William Patrick Burgess, Jess Michael Goldfinger
  • Patent number: 8642709
    Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: February 4, 2014
    Assignees: Henkel AG & Co. KGaA, Henkel US IP LLC
    Inventors: Pablo Walter, Mustapha Benomar, Stefen Kreiling, Angelika Troll, Rainer Schoenfeld, Timothy Walsh
  • Patent number: 8623585
    Abstract: Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5?p); and s is an integer of 1 to (9?p).
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: January 7, 2014
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Takakazu Kage, Norifumi Imaizumi
  • Patent number: 8592134
    Abstract: A composition for forming an underlayer film for lithography for imparting excellent optical characteristics and etching resistance to an underlayer film for lithography, an underlayer film being formed of the composition and having a high refractive index (n) and a low extinction coefficient (k), being transparent, having high etching resistance, containing a significantly small amount of a sublimable component, and a method for forming a pattern using the underlayer film are provided. The composition for forming an underlayer film contains a naphthalene formaldehyde polymer having a specific unit obtained by reacting naphthalene and/or alkylnaphthalene with formaldehyde, and an organic solvent.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: November 26, 2013
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Dai Oguro, Go Higashihara, Seiji Kita, Mitsuharu Kitamura, Masashi Ogiwara
  • Publication number: 20130295341
    Abstract: A fluorescing dry toner particle comprises a polymeric binder phase comprising a non-fluorescing binder polymer and a polymeric fluorescing colorant dispersed within the non-fluorescing binder polymer. The polymeric fluorescing colorant comprises a fluorescing moiety that is covalently attached to a colorant polymer that is the same or different than the non-fluorescing binder polymer, but the polymeric fluorescing colorant is blendable with the non-fluorescing binder polymer to form a homogeneous polymeric binder matrix, and is present in an amount of at least 1 weight % and up to and including 40 weight %, based on the total fluorescing dry toner particle weight. These fluorescing dry toner particles can be used in various dry developers to provide fluorescing toner images with or without non-fluorescing color toner images.
    Type: Application
    Filed: May 2, 2012
    Publication date: November 7, 2013
    Inventors: Dinesh Tyagi, Louise Granica
  • Patent number: 8569430
    Abstract: Methods for producing spray-dried phenol-formaldehyde resole resins and products made therefrom. The method can include spray-drying an aerated liquid phenol-formaldehyde resole resin containing about 0.02 wt % or more of a surfactant, based on a combined weight of the liquid phenol-formaldehyde resole resin and the surfactant, to produce a spray-dried phenol-formaldehyde resole resin powder.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: October 29, 2013
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: James H. Knight, Paul S. Baxter, Robert M. Meacham, John D. Cothran
  • Patent number: 8523967
    Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: September 3, 2013
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs Technologie et Services S.A.S.
    Inventors: Alix Arnaud, Philippe Espiard, Sandrine Pozzolo
  • Publication number: 20130213550
    Abstract: The present disclosure provides an adhesive composition comprising derivatives of native lignin and an isocyanate-based binder such as methylene diphenyl diisocyanate. The present compositions may further comprise formaldehyde-based resins such as PF, UF, and MF. While not wishing to be bound by theory, it is believed that incorporating derivatives of native lignin in isocyanate compositions will reduce incidence of pre-curing.
    Type: Application
    Filed: August 13, 2012
    Publication date: August 22, 2013
    Inventor: Alex BERLIN
  • Patent number: 8513133
    Abstract: A resist underlayer film-forming composition includes (A) a polymer that includes a repeating unit shown by a formula (1), and has a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and (B) a solvent, wherein R3 to R8 individually represent a group shown by the following formula (2) or the like, —O—R1?R2??(2) wherein R1 represents a single bond or the like, and R2 represents a hydrogen atom or the like.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: August 20, 2013
    Assignee: JSR Corporation
    Inventors: Shin-ya Minegishi, Yushi Matsumura, Shinya Nakafuji, Kazuhiko Komura, Takanori Nakano, Satoru Murakami, Kyoyu Yasuda, Makoto Sugiura
  • Publication number: 20130186629
    Abstract: Reaction products of polymeric alkyl phenol formaldehyde resins are useful as additives to inhibit or prevent the deposition or precipitation of asphaltenes in hydrocarbon fluids, particularly crude oil produced from a subterranean formation. These reaction products are formed by reacting a polymeric alkyl phenol formaldehyde resin with a co-reactant having functional groups including, but not necessarily limited to, amines, esters, silanes, ketones, epoxides, alkoxides, aryloxides, halogens, alkali metals, alkali earth metals, acetamides, non-metal oxides, metal oxides, where the co-reactant optionally has a carbon chain length between 1 and 22 and the reaction is conducted in the presence of at least one of various solvents. In one non-limiting embodiment, the co-reactant is a silicon derivative.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 25, 2013
    Applicant: Baker Hughes Incorporated
    Inventors: Geoffrey C. Leonard, Gordon T. Rivers, Samuel Asomaning, Patrick J. Breen
  • Patent number: 8492459
    Abstract: There are provided an ink composition for imprint lithography and roll-printing, which is applied to the formation of a pattern using imprint lithography and roll-printing to play the role of a pattern support, can increase the accuracy of pattern formation by minimizing the occurrence of a swelling phenomenon caused by the ink composition, and can improve yield and the efficiency of the process by increasing the transfer rate of a pattern, and a method of forming a pattern of a display or semiconductor by using the same.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: July 23, 2013
    Assignee: LG Display Co., Ltd.
    Inventors: Jinwuk Kim, Kibeom Lee, Byonghoo Kim, Seunghyup Shin, Junyong Song, Myoungsoo Lee
  • Publication number: 20130184377
    Abstract: The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.
    Type: Application
    Filed: July 19, 2011
    Publication date: July 18, 2013
    Applicant: DIC CORPORATION
    Inventors: Ichirou Ogura, Yousuke Hirota, Yoshiyuki Takahashi, Norio Nagae, Nobuya Nakamura
  • Publication number: 20130122222
    Abstract: A polymer-bonded polycyclic aromatic hydrocarbon compound of general formula (1): (P—O)x-Q-(Y)w??(1) wherein P represents a polymeric moiety having at least three repeating units which comprise an optionally substituted phenyl ring; Q represents a perylene, quaterrylene or terrylene moiety; Y is selected from (i) halogen and (ii) optionally substituted N-heterocycloaliphatic groups having from 3 to about 8 ring members which are bonded to Q through an N atom, provided that at least one Y represents (ii); x represents an integer of from 1 to 4; w represents an integer of from 1 to 4. Also, are provided processes of producing the compounds, polymers, markings and articles, and methods of authenticating.
    Type: Application
    Filed: November 9, 2012
    Publication date: May 16, 2013
    Applicant: SICPA HOLDING SA
    Inventor: SICPA HOLDING SA
  • Patent number: 8431654
    Abstract: An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R1 is an aralkyl group, and R2 is a lower alkyl group, provided that when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: April 30, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yoshihisa Shinya, Jun Yamamoto, Ryota Aizaki, Naoki Hayashi, Misao Konishi
  • Patent number: 8399576
    Abstract: Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from —, —CH2—, —C(CH3)2—, —S—, —SO2—, —O—, —CO—, or —N?N—. Each X is independently selected from a hydrogen or phosphorous containing group, wherein the hydrogen and phosphorous containing group have a molar ratio of 1:0.1 to 0.1:1. Each R1 is independently selected from a hydrogen or C1-5 alkyl group. Each R2 is independently selected from a C1-5 alkyl group. m is an integer of 1 to 10, and n is 0 or 1.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: March 19, 2013
    Assignee: Grand Tek Advance Material Science Co., Ltd.
    Inventors: Shang-Wei Tang, Hsueh-Tso Lin, Kuan-Ching Chen, Dick Zhong
  • Publication number: 20130012668
    Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:
    Type: Application
    Filed: July 5, 2012
    Publication date: January 10, 2013
    Applicant: NATIONAL CHUNG HSING UNIVERSITY
    Inventors: CHING-HSUAN LIN, YU-WEI TIAN
  • Patent number: 8349989
    Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: January 8, 2013
    Assignee: Air Water Inc.
    Inventors: Kiyotaka Murata, Yoshihisa Sone
  • Publication number: 20120308832
    Abstract: A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.
    Type: Application
    Filed: January 19, 2011
    Publication date: December 6, 2012
    Applicant: DIC Corporation
    Inventors: Yutaka Satou, Kazuo Arita, Ichirou Ogura
  • Publication number: 20120296053
    Abstract: A photosensitive composition capable of forming a cured film having small internal stress; a cured film formed from the composition; and an electronic part including the cured film. The photosensitive composition includes: an alkali soluble resin (A), which includes at least 80% by mass of a novolak resin; a photosensitive compound (B); and a crosslinking agent (C), which includes at least a compound represented by the following formula (C1): wherein R1 is an alkyl group having 1 to 6 carbon atoms or the like; R2 is hydroxyl group or the like; R3 is a (a+1)valent hydrocarbon group or the like; R5 is a (c+1)valent hydrocarbon group or the like; R4 is a single bond or the like; a and c are each independently integers of 1 to 3, wherein the sum a+c is an integer of 3 to 6; and b is an integer of 0 or more.
    Type: Application
    Filed: April 18, 2012
    Publication date: November 22, 2012
    Applicant: JSR CORPORATION
    Inventors: Masaaki HANAMURA, Futoshi YAMATO, Akito HIRO, Akari SAKO, Jun MUKAWA
  • Patent number: 8309660
    Abstract: The present invention provides a perfluoroelastomer seal material in which adhesive strength, contamination, corrosion and color change of a contacted surface with a seal material are improved, and an amount of an uncrosslinked polymer component is at most 1% by weight, measured under specific conditions, and a process for preparing the same. The present invention relates to a perfluoroelastomer seal material, wherein a rate of weight decrease is at most 1% by weight when the seal material is immersed into perfluoro(tri-n-butyl) amine at 60° C. for 70 hours and is dried at 90° C. for 5 hours, 125° C. for 5 hours and 200° C. for 10 hours after taken out of the emersion. And, the present invention also relates to a process for preparing a perfluoroelastomer seal material comprising a step of treating with a solvent having at least 50% of a swelling rate based on said molded article, when said molded article is immersed at 60° C. for 70 hours.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: November 13, 2012
    Assignee: Daikin Industries, Ltd.
    Inventors: Hiroyuki Tanaka, Tsuyoshi Noguchi
  • Publication number: 20120252217
    Abstract: A resist underlayer film-forming composition includes (A) a polymer that includes a repeating unit shown by a formula (1), and has a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and (B) a solvent, wherein R3 to R8 individually represent a group shown by the following formula (2) or the like, —O—R1?R2 ??(2) wherein R1 represents a single bond or the like, and R2 represents a hydrogen atom or the like.
    Type: Application
    Filed: August 30, 2011
    Publication date: October 4, 2012
    Applicant: JSR Corporation
    Inventors: Shin-ya MINEGISHI, Yushi MATSUMURA, Shinya NAKAFUJI, Kazuhiko KOMURA, Takanori NAKANO, Satoru MURAKAMI, Kyoyu YASUDA, Makoto SUGIURA
  • Publication number: 20120184103
    Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.
    Type: Application
    Filed: December 7, 2011
    Publication date: July 19, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu OGIHARA, Daisuke KORI, Yusuke BIYAJIMA, Takeru WATANABE, Toshihiko FUJII, Takeshi KINSHO
  • Publication number: 20120172546
    Abstract: Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from—, —CH2—, —C(CH3)2—, —S—, —SO2—, —O—,—CO—, or —N?N—. Each X is independently selected from a hydrogen or phosphorous containing group, wherein the hydrogen and phosphorous containing group have a molar ratio of 1:0.1 to 0.1:1. Each R1 is independently selected from a hydrogen or C1-5 alkyl group. Each R2 is independently selected from a C1-5 alkyl group. m is an integer of 1 to 10, and n is 0 or 1.
    Type: Application
    Filed: February 4, 2011
    Publication date: July 5, 2012
    Inventors: Shang-Wei Tang, Hsueh-Tso Lin, Kuan-Ching Chen, Dick Zhong
  • Patent number: 8206808
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: June 26, 2012
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Subhotosh Khan, Halvar Young Loken
  • Publication number: 20120142193
    Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or general formula (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.
    Type: Application
    Filed: November 9, 2011
    Publication date: June 7, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu OGIHARA, Daisuke KORI, Yusuke BIYAJIMA, Takeru WATANABE, Toshihiko FUJII, Takeshi KINSHO
  • Publication number: 20120095156
    Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).
    Type: Application
    Filed: August 5, 2009
    Publication date: April 19, 2012
    Applicant: DIC Corporation
    Inventors: Koji Hayashi, Yoshiyuki Takahashi, Ichirou Ogura
  • Publication number: 20120046424
    Abstract: Compositions and methods for forming condensates and resin compositions are provided. In one embodiment, a condensate is formed from a reaction mixture including a triazine monomer, an arylhydroxy monomer, an aldehyde monomer and an acid catalyst having a pKa value of greater than 3.8. The condensates contain up to 28 wt. % of nitrogen and have a melt viscosity of 3,000 cps or less at 175° C. The condensates may have a solubility of at least 80 wt. % solids dissolved in an organic solvent for 120 hours or greater. Also disclosed are methods for the manufacture of the condensate as well as the condensate's use in fire-retardant epoxy resin compositions suitable for the manufacture of laminates for electronic applications. There is also disclosed a glycidylated triazine-arylhydroxy-aldehyde condensate of this invention.
    Type: Application
    Filed: August 17, 2010
    Publication date: February 23, 2012
    Inventors: Ganapathy S. Viswanathan, Raman C. Subrayan, Vinay Malhotra