Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Polymeric derivatives of indoles such as 1

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: 1

Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.

Abstract: A process of forming vias in a composition comprising (a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety and R2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator; (b) covering the layer with a mask having windows through which radiation can be transmitted; (c) exposing part of the composition to radiation to at least partially cure it in the exposed areas; (d) removing the non-cured portions of the composition; and (e) completing the cure of the resin compositions.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.

Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.

Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow encapsulation process. The composition contains a thermal curable resin system comprising an admixing of at least one epoxy resin and a phenol-containing compound such as phenol or phenolic resin, an imidazole-anhydride adduct as a catalyst, and a fluxing agent. Various additives, such as air release agents, flow additives, adhesion promoters and rheology modifiers may also be added as desired.

Abstract: Reactive diluents are formed by reaction of a compound having at least two glycidyl ester groups and a compound having at least one hydroxyl and/or carboxyl group. The diluents are useful in coating compositions together with crosslinking agents and optional other vehicle components.

Abstract: The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: wherein in the formula (2), R5 indicates (ChH2hO)iH and R6 indicates (CkH2kO)lH or (CkH2kO)lCkH2k+1, provided that h, i, k and l each are an integer of 1 or more. The present invention provides a reactive hot melt adhesive, in which a curing reaction progresses under application of actinic radiation.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: An object of the present invention is to prepare substances which are excellent in delivery and enable drugs to be retained in a body effectively over a long period and to construct a drug delivery system using the substances. When the delivering substance which is obtained by reacting polyalkylene glycol or a reactive derivative thereof, a phospholipid and a drug with each other to form covalent bonds is administered systemically or topically, the substance is retained at a target site in a body for a long period, thereby making it possible to sustain drug efficacy over a long period by a single administration.

Abstract: The invention relates to preparations with improved curing behavior, which are characterized in that they contain 0.0005 to 50 wt. % of soluble and/or fine-particle organic and/or inorganic alkaline earth and/or alkali metal compounds. The preparations according to the invention may be used for bonding, sealing, casting and coating substrates, also in medical dental and technical dental preparations, and for making impressions of articles and, more particularly, for making dental impressions.

Abstract: The present invention relates to a phosphorous-containing flame retarding epoxy resin and their composition comprising the nitrogen-containing flame retarding epoxy resin. More specifically, the present invention relates to a flame retarding epoxy resin having a pendent phosphorous-containing functional group and their composition comprising the nitrogen-containing flame retarding epoxy resin. The flame retarding phosphorous-containing epoxy resin and the epoxy resin composition containing the same of the present invention possess excellent flame retarding property and heat resistance without containing halogen and diantimony trioxide. Therefore they are useful as an encapsulating material in the semiconductor industry and the cured article prepared from the composition exhibits excellent molding ability and excellent reliance.

Abstract: A water based coating composition prepared by reacting an epoxy resin (A) having a bisphenol A skeletal structure and a carboxyl group-containing acrylic resin (B) in the presence of an amine compound to form an acrylic-modified epoxy resin (C), and neutralizing, and dispersing the acrylic-modified epoxy resin (C) into an aqueous medium, an amount of a quaternary ammonium salt in the acrylic-modified epoxy resin (C) being in the range of 3.0×10−4 mol or less per one gram of the resin.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A composition comprising (a) an epoxy resin having, on average, more than one 1,2-epoxy group per molecule, (b) a polyol as epoxy resin curing agent and (c) a solid microgel-amine adduct as accelerator has high latency, good storage stability and a wide processing window.

Abstract: A high voltage capable, insulating and resinous composition is disclosed. An epoxy-anhydride resin is prereacted with an antioxidant oligomer selected from the group consisting of organophosphorus compounds, sterically-hindered alkylated phenolics, alkyl and aryl thio-esters, alkyl and aryl thio-phosphites, thiazoles, lactones, hydroxylamines, and maleimides.

Abstract: The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.

Abstract: A controlled conversion resin having an epoxy functionality of greater than 2 and comprising moieties derived from epoxy resin, dihydric phenol, acid anhydride, or amine. The resin is prepared by reacting an epoxy resin with a dihydric phenol, an acid anhydride, or amine or other branching agent in the presence of a catalyst and terminating the reaction at a point such that the reaction product contains both epoxy and terminal hydroxyl groups.

Abstract: A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents: (a) an epoxy resin which is solid at room temperature, selected from (a1) polyglycidyl ethers based on novolaks; (a2) diglycidyl ethers based on bisphenols, and (a3) mixtures of more than one of components (a1) and (a2); (b) a crosslinking agent for component (a); (c) a suitable accelerator for the reaction of component (a) and component (b); (d) from 15 to 70 percent by weight, based on the overall weight of the composition, of filler selected from (d1) calcium carbonate, (d2) quartz flour, (d3) wollastonite whose particles have an average ratio of length

Abstract: In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may further include at least one additive selected from the group including curing agents, bonding enhancers, hardeners, flexibilizers, tackifiers, and mixtures thereof.

Abstract: The combination of powder coatings usable in a coating method comprising mixing two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogenous hue. A powder coating composition comprising two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogenous hue. A coating method comprising the steps of (a) applying to a substrate two or more powder coatings, of which each color is different; (b) heating to fuse with each other each of the two or more powder coatings applied in step (a); and (c) curing the resulting fused product in step (b), to give a coating film having a homogeneous hue.

Abstract: In accordance with the foregoing, the present invention comprises a polyester epoxy resin powder coating exhibiting improved impact resistance and flexibility, without the loss of other key properties and where the 1,3-PDO modified polyester has lower melt viscosity than polyesters made with 100% neopentyl glycol, which is formed by reacting: a) A carboxyl functional polyester resin formed by reacting one or more aliphatic glycols and one or more polycarboxylic acids and/or anhydrides, wherein 5 to 90% (on a molar basis) of the aliphatic glycol is 1,3-propanediol, in the presence of an esterification catalyst and then endcapping the polyester with an endcapping agent to ensure that the polyester has carboxyl chain ends; and b) An epoxy resin crosslinking agent.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: The present invention relates to multifunctional macromers, to a method for the manufacture thereof and to their use in unsaturated polyester resins as additives to improve mechanical properties of preparations manufactured thereof. The process for the manufacture of multifunctional macromers comprises the following steps: a) reacting a polycarboxylic acid with 2 to 4 carboxylic groups, preferably 3 to 4 carboxylic groups, with glycidyl (meth)acrylate or allyl glycidyl ether, the amount of glycidyl (meth)acrylate or allyl glycidyl ether being at least one mol of glycidyl (meth)acrylate or allyl glycidyl ether per free carboxylic group of formed macromer, and b) reacting the product from step a) with an unsaturated, aromatic or aliphatic anhydride in an amount sufficient to esterify part or all of the free hydroxyl groups of the product from step a).

Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

Abstract: A curable epoxy composition comprises an epoxy resin having at least 1.5 epoxy groups per molecule and an amine-terminated polyamide. The liquid amine-terminated polyamide is prepared by reacting a long-chain, C20-C60 dicarboxylic acid or derivative with an amine having a general formula of R1—NH—R2—NH—R3.

Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

Abstract: The present invention provides a cationic resin composition capable of forming a cationically electrodepositable coating film which is excellent in corrosion resistance, an aptitude for the cationic electrodepositable coating of a rust preventive steel plate and in adhesion to substrate, which cationic resin composition is characterized by comprising the following components: (A) an amino group-containing epoxy resin which is prepared by adding an amino group-containing compound to an epoxy resin having an epoxy equivalent of 400 to 3000, (B) a polyol-modified amino group-containing epoxy resin which is prepared by making an epoxy resin having an epoxy equivalent of 180 to 2500 react with an amino group-containing compound and with a polyol compound obtained by adding caprolactone to a compound having plural active hydrogen groups, and (C) a blocked polyisocyanate curing agent, component (A) being 40 to 70% by weight, component (B) being 4 to 40% by weight, and component (C) being 10 to 40% by weight, base

Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.

Abstract: The present invention provides a water borne two-component cross-linkable composition based on an aqueous dispersion of an at least partially neutralized amino-functional epoxy derived polymer and a compound comprising at least two acetoacetate groups or acetoacetamide groups or a combination of the two groups. This composition provides coatings with high gloss, good water and solvent borne resistance, and high hardness. This composition also provides adhesives with high adhesion power.

Abstract: Solid surface material is prepared from an extrudable composite material comprising a matrix of at least one acrylic resin and a filler dispersed in the matrix, said acrylic resin comprising an acrylic epoxy-ftmctional copolymer as a matrix resin crosslinked with a straight or branched chain aliphatic carboxylic acid or anhydride of such acid.

Abstract: The present invention relates to polyethyleneglycol/polylactide (or polyglycolide or polycaprolactone)/polyethyleneglycol triblock copolymers with an enhanced reactivity, and process for their preparation.

Abstract: The resin system comprises at least two components which can be stored separately and crosslinked with one another at room temperature, preferably without curing accelerators. The first component comprises at least one compound of the formula (I) where A is an unsubstituted or substituted aromatic radical. The second component comprises at least one cyclic anhydride of an organic acid.

Abstract: Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2) a dihydrazide compound and (F) a silicone resin gel, wherein at least one of components A and B is liquid at room temperature, component E1 is liquid at room temperature, and the weight ratio of component C to the total weight of the composition, the weight ratio of component A to component B, and the weight ratio of component E1, E2 or F to the total weight of the composition except component C each ranges a specific ratio.

Abstract: Disclosed is a novel amino-polyether-modified epoxy for an electrodeposition paint. The amin-polyether-modified epoxy compound is obtained by reacting amino polyether represented by a formula as follow: wherein m is an integer of 5 or more, R is hydrogen, methyl group or ethyl group, and n is 2 or 3, with polyglycidyl ether having a molecular weight of 1,000 to 7,000 and an epoxy equivalent of 500 to 3,500, wherein an equivalent ratio of a primary amino group of the amino polyether to an epoxy group of the polyglycidyl ether is controlled within the range of 0.52 to 1.0.

Abstract: Curable mixtures suitable for the manufacture of moldings, coatings and foams comprises a) an epoxy resin having more than one 1,2-epoxy group per molecule, b) as curing catalyst, an imidazole compound of formula I wherein R1, R2 and R3 are each independently of the others a hydrogen atom, a halogen atom, alkyl having from 1 to 20 carbon atoms, alkoxy having from 1 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms, or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, and R4 is alkyl having from 1 to 20 carbon atoms, alkenyl having from 2 to 20 carbon atoms, alkynyl having from 2 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms; and c) curing agent such as dicyadiami

Abstract: New polymers and anti-reflective or fill compositions including those polymers are provided. The polymer comprises recurring monomers according to the formula wherein R comprises a light attenuating compound. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process.

Abstract: In accordance with the present invention there are provided cycloaliphatic epoxy compounds and thermosetting resin compositions prepared therefrom. Inventive compounds are based on polycyclic hydrocarbon backbones, as illustrated by the following exemplary structure: wherein: each R is independently lower alkyl or halogen, n′″ is 1 up to about 8, and each x is independently 0, 1, or 2. Inventive compounds provide resins with desirable characteristics such as, for example, hydrophobicity, high Tg values, ionic purity, hydrolytic stability, and the like.

Abstract: Self-dispersing, hardenable epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: The present invention is directed to a water-soluble polyether glycol polymer having: a structural backbone of carbon atoms and oxygen atoms where there are at least two consecutive carbon atoms present between each oxygen atom; a moiety on the backbone of the polymer or a functionalized derivative on the polymer, that is cationic at physiological pH and permits complexation with phosphate or oxalate; and an average molecular weight from about 5,000 to about 750,000 Daltons. These polymers are formulated for oral dosage to reduce the phosphonate or oxalate levels in an animal. The process of preparing these polymers and the method of reducing gastrointestinal absorption of phosphate and oxalate are included.

Abstract: Aqueous coating composition, for example for use as a clear or pigmented top coat or a primer, comprising:

Abstract: A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.