Solid Polymer Contains More Than One 1,2-epoxy Group Or Is Derived From Reactant Containing At Least One 1,2-epoxy Group Patents (Class 525/523)
  • Patent number: 10752739
    Abstract: The invention relates to a particulate curing component for a thermosetting resin, the particulate curing component comprising particles of a solid resin, wherein a curative for the thermosetting resin is dispersed within the particles of solid resin. The invention also relates to methods of forming particulate curing components and compositions comprising particulate curing components.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: August 25, 2020
    Inventors: Mark Whiter, Thorsten Ganglberger, Michael Reisinger
  • Patent number: 10723875
    Abstract: The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: July 28, 2020
    Inventors: Xianping Zeng, Liexiang He
  • Patent number: 10538637
    Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: January 21, 2020
    Inventors: Toshiya Kamae, Shinji Kochi, Masayuki Miyoshi, Kenichi Yoshioka
  • Patent number: 10486406
    Abstract: The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: November 26, 2019
    Assignee: Zephyros, Inc.
    Inventors: Patrick Siboni, John Blancaneaux
  • Patent number: 10450416
    Abstract: A curable isocyanate free formulation for preparing a polyurethane foam. The formulation includes a compound A chosen from multifunctional cyclic carbonates of a formula (I) or a mixture thereof, a compound B chosen from multifunctional cyclic carbonates containing oxyalkylene groups —OR3- of a formula (II) or a mixture thereof, a compound C chosen from multifunctional amines of a formula (III) or a mixture thereof and a compound D chosen from non-reactive blowing agents, as well as a process for preparing a non-isocyanate polyurethane foam, a foam obtainable by this process, compound B, a mixture of compounds A and B, the use of compound B for enhancing the solubility of a non-reactive blowing agent in a compound A and a foamable system having a first part A containing compound A and compound B and a second part B containing compound C, wherein part A and part B are preferably physically separated.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: October 22, 2019
    Assignee: Faurecia Interieur Industrie
    Inventors: Marc Lauth, Rolf Mülhaupt, Hannes Blattmann
  • Patent number: 10329231
    Abstract: The present invention provides an epoxy compound which is 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene. Also, the present invention provides a method for producing [1,1?-binaphthalene]-2,2?,7,7?-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1?-binaphthalene]-2,2?,7,7?-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1?-binaphthalene]-2,2?,7,7?-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1?-binaphthalene]-2,2?,7,7?-tetraol or [1,1?-binaphthalene]-2,2?,7,7?-tetraol monohydrate with epihalohydrin.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 25, 2019
    Assignee: DIC Corporation
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita, Masamichi Hayashi
  • Patent number: 10301423
    Abstract: An amine of the formula (I) for use as hardener for epoxy resins, hardeners for epoxy resins containing the amine of the formula (I) and resultant epoxy resin compositions which more particularly can be used as low-emission room-temperature-curing epoxy-resin coatings with high hardness and surface quality. The amine of the formula (I) has little odor and is a very successful diluent for epoxy resin compositions. It is more particularly obtained by reductive alkylation from 1,2-propylenediamine and an aldehyde or ketone.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: May 28, 2019
    Inventors: Edis Kasemi, Andreas Kramer, Ursula Stadelmann, Urs Burckhardt
  • Patent number: 10214612
    Abstract: An epoxy resin composition including A) at least one epoxy compound, and B) a hardener composition including B1) from 0.1%-100% by weight of 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine, and B2) from 99.9%-0% by weight of at least one further diamine and/or polyamine, where the stoichiometric ratio of the epoxy groups of A) and the number of active hydrogen atoms of the functional groups of B) varies from 1:2 to 2:1.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: February 26, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Eike Langkabel, Martina Ortelt, Dirk Fuchsmann, Jaclyn Balthasar, Alexander Martin Rüfer, Anne Rittsteiger, Jörg-Joachim Nitz, Stephan Kohlstruk
  • Patent number: 10155841
    Abstract: A curing agent composition for curing an epoxy compound comprising a mixture of: (a) at least one natural oil phenol compound, (b) at least one phenolic resin compound, and (c) at least one amine curing agent; in particular, wherein the curing agent composition is adapted for providing a curable epoxy resin composition with a Shore D hardness build-up greater than 0 after within 2 hours at 23±2° C. and having an anti-blushing property such that 30 minutes after scratching a film cured on a glass panel, the film is at least 50 percent transparent; a curable composition including (I) at least one epoxy compound; and (II) the above curing agent composition, and a thermoset prepared from the above curable composition.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: December 18, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: CuiPing Chen, Yi Zhang
  • Patent number: 10134649
    Abstract: A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: November 20, 2018
    Inventors: Taryn J. Davis, Jonathan R. Fry, Tuhin Sinha
  • Patent number: 10100142
    Abstract: The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I) wherein A is: PPE are: Z are: Y are: Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03(1 GHz), dissipation factor is 0.0046(1 GHz) and no delamination longer than 60 minutes dipping in 288 soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: October 16, 2018
    Inventors: Cheng-Chung Lee, Yeong-Tong Hwang, Chen-Hua Wu, Jaou-Shain Yu
  • Patent number: 10047256
    Abstract: The present invention provides an epoxy resin composition including 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: August 14, 2018
    Assignee: DIC Corporation
    Inventors: Yasuyo Yoshimoto, Atsushi Oshio, Kunihiro Morinaga, Hiroshi Kinoshita, Daisuke Ito
  • Patent number: 9978898
    Abstract: Disclosed are multilayer structures comprising polyamide-ionomer compositions suitable for use in a backsheet in a photovoltaic module comprising a polymer component comprising a polyamide and an ionomer; 0 to 20 weight % of pigment; and 0 to 40 weight % of filler; preferably wherein the combination of pigment and filler comprises 8 to 50 weight % of the composition; and 0 to 5 weight % of weatherability additives.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: May 22, 2018
    Inventors: Timothy A Libert, Jingjing Xu, Barry Alan Morris, Benjamin Andrew Smillie, Richard T Chou
  • Patent number: 9944729
    Abstract: A material having a first non-zero elastic modulus capable of reversibly changing the first non-zero elastic modulus to a second non-zero elastic modulus in response to a redox reaction occurring in the material. A method of producing a material that is reversibly cyclable between a first non-zero elastic modulus and a second non-zero elastic modulus, comprising: preparing a polymer comprising both crosslinks that do not depend on metal binding and functional groups capable of having oxidation-state specific binding constants to a metal ion; and doping the polymer with a solution containing the metal ion.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: April 17, 2018
    Assignee: University of Pittsburgh—of the Commonwealth System of Higher Education
    Inventors: Tara Yvonne Meyer, William W. Clark, David Waldeck, Lisa Mauck Weiland, Percy Calvo-Marzal, Tianqi Pan, Rachel D. Harris, Haitao Liu
  • Patent number: 9896603
    Abstract: There is provided a highly versatile curing accelerator for an oxidative polymerization-type unsaturated resin. There are also provided a printing ink and a coating material that use the above curing accelerator. Specifically, the curing accelerator for an oxidative polymerization-type unsaturated resin that is used contains a fatty acid manganese salt (A) and a compound (B) represented by formula (1) below, (wherein R1 and R4 are each a hydrogen atom, a hydrocarbon group, a hydrocarbonoxy group, or an amino group, R2 and R5 are each a hydrogen atom, a hydrocarbon group, a hydrocarbonoxy group, a hydrocarbonoxycarbonyl group, a cyano group, a nitro group, or a halogen atom, R3 and R6 are each a hydrogen atom or a hydrocarbon group, and R7 is a divalent hydrocarbon group, and wherein R1 and R2 may form a ring, and R4 and R5 may form a ring).
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: February 20, 2018
    Assignee: DIC Corporation
    Inventors: Shigeki Matsunaga, Akinori Takahashi, Hitoshi Hayakawa
  • Patent number: 9879163
    Abstract: A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof; (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: January 30, 2018
    Assignee: General Electric Company
    Inventors: Weijun Yin, Gary William Yeager, Kevin Warner Flanagan, David Andrew Simon, Eugene Pauling Boden, Kathryn Amanda Misner
  • Patent number: 9862817
    Abstract: An at least two layer rotomolded article is described herein which may include a layer A and a layer B. Layer A can include an aliphatic polyester, a polyolefin, or a co- or ter-polymer that includes ethylene or styrene monomer, an unsaturated anhydride-containing monomer, epoxide-containing monomer, or carboxylic acid-containing monomer, and a (meth)acrylic ester monomer. Layer B can include a polyolefin and a polyester, or a co- or ter-polymer that includes an ethylene or a styrene monomer, an unsaturated anhydride-containing monomer, epoxide-containing monomer, or carboxylic acid-containing monomer, and a (meth)acrylic ester monomer.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: January 9, 2018
    Inventors: Michel Duc, Philippe Lodefier
  • Patent number: 9796810
    Abstract: An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220° C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: October 24, 2017
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Takayuki Chujo, Arata Endo
  • Patent number: 9745412
    Abstract: Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: August 29, 2017
    Inventor: Yutaka Tsujimura
  • Patent number: 9617448
    Abstract: Described is a clearcoat coating composition, its use, and a process for preparing the clearcoat coating composition. The clearcoat coating composition comprises (A) at least one polyester having an OH number of 80-250 mg KOH/g; (B) at least one butanol-etherified melamine-formaldehyde resin having a crosslinking onset temperature between 65° C.-100° C. lower than the crosslinking onset temperature of hexamethoxy-methylmelamine; (C) at least one butanol-etherified melamine-formaldehyde resin having a crosslinking onset temperature between 30° C.-60° C. lower than the crosslinking onset temperature of hexamethoxymethylmelamine; (D) at least one organic urea compound as rheological assistant; and (E) at least one acid catalyst.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: April 11, 2017
    Assignee: BASF Coatings GmbH
    Inventors: Christian Weiher, Günter Klein, Andreas Poppe, Ulrike Clausen-Meiring, Helmut Kleine Beckmann, Corinna Auβmann, Thomas Leitner
  • Patent number: 9611450
    Abstract: The present invention relates to a process for the removal of polymer thermosets from the substrates without damaging the substrates. The present invention relates to a process for the removal of polymer thermoset from the substrate retaining the physical and chemical properties of the substrates. The present invention more particularly relates to the use of bio molecules for cleaving polymer thermosets and the process to perform the cleaving.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: April 4, 2017
    Assignee: Council of Scientific and Industrial Research
    Inventor: Krishnamoorthy Kothandam
  • Patent number: 9611385
    Abstract: Disclosed are compositions comprising: (a) 10 to 40 percent by weight of the ultrafine particulate poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 9 microns or less; (b) 60 to 90 percent by weight of an epoxy resin; wherein the weight percents are based on the total weight of the composition. Also disclosed are processes for preparing such compositions as well as articles derived therefrom.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: April 4, 2017
    Assignee: SABIC Global Technologies B.V.
    Inventors: Edward Norman Peters, Scott Michael Fisher
  • Patent number: 9567481
    Abstract: The invention relates to a resin composition which is characterized by including: a reaction product that includes (A) a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups per molecule and (B) an epoxy compound having an average of 2 to 2.3 epoxy groups per molecule, wherein the reaction product is obtained by pre-reacting at least a part of hydroxyl groups on the polyphenylene ether (A) with epoxy groups on the epoxy compound (B) so that the concentration of terminal hydroxyl groups on the polyphenylene ether (A) becomes 700 ?mol/g or less; (C) a cyanate ester compound; and (D) an organometallic salt.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: February 14, 2017
    Inventors: Hirosuke Saito, Hiroaki Fujiwara, Yuki Kitai
  • Patent number: 9499653
    Abstract: The present invention relates to new mixtures containing cyanamide and a urea derivative, to liquid curing agents for curing polymer resins, in particular epoxy resins, and to epoxy resin compositions comprising liquid curing agents for producing fibre composite materials.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: November 22, 2016
    Assignee: ALZCHEM AG
    Inventors: Sylvia Strobel, Martin Ebner, Hans-Peter Krimmer, Michaela Huber
  • Patent number: 9487686
    Abstract: A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150° C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190° C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: November 8, 2016
    Assignee: Henkel AG & Co. KGaA
    Inventors: Ruediger Butterbach, Siegfried Kopannia, Carsten Schubert, Judith Siepenkothen
  • Patent number: 9464186
    Abstract: A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10?3 or less. [In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12 each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.].
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: October 11, 2016
    Inventors: Atsushi Kameyama, Takashi Suzuki, Ryuichi Ueno, Isao Ishikura
  • Patent number: 9441145
    Abstract: Curable material comprising silylated polymers containing urethane groups, and use thereof in sealants, adhesives, binders and/or surface modifiers.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: September 13, 2016
    Assignee: Evonik DeGussa GmbH
    Inventors: Frank Schubert, Wilfried Knott, Michael Ferenz, Stefan Silber
  • Patent number: 9422451
    Abstract: Low-density compositions and sealants prepared from sulfur-containing prepolymer compositions that exhibit enhanced fuel resistance are disclosed. The low density and enhanced fuel resistance is realized by using polyphenylene sulfide fillers.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: August 23, 2016
    Assignee: PRC-DeSoto International, Inc.
    Inventors: Chandra Rao, Marfi Ito, Renhe Lin
  • Patent number: 9414487
    Abstract: The present invention provides a metal paste composition which can obtain the calcined bodies having low volume resistivity in a wiring substrate after calcining. More specifically, the present invention provides a metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: August 9, 2016
    Inventors: Nobutaka Fujimoto, Tomoki Kawakita, Ryou Miyabara, Masami Nakamoto, Toshinobu Ohno, Mari Yamamoto, Yukiyasu Kashiwagi
  • Patent number: 9403952
    Abstract: A duromer, a method for producing the duromer, a use of the duromer as well as a flame retardant containing the duromer and plastics compositions thereof are disclosed. A phosphorous-containing polymer which is based on multi-functional esters of unsaturated carboxylic acids is three-dimensionally cross-linked and forms the claimed duromer as described. The duromer is suitable as a flame retardant and suitable for use in flame retardants for plastics.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: August 2, 2016
    Assignee: Chemische Fabrik Budenheim KG
    Inventors: Hendrik Wermter, Thomas Futterer, Robert Vogt, Manfred Doering, Michael Ciesielski
  • Patent number: 9394230
    Abstract: The invention relates to hardeners for epoxy resin containing secondary amino groups having dialkyl amino phenyl groups. The hardeners have a surprisingly low viscosity and harden surprisingly fast together with the epoxy resins, even in moist, cold conditions, and without blushing to form films with high hardness and stability. They are suitable, in particular, for low-emission coatings.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: July 19, 2016
    Inventors: Urs Burckhardt, Edis Kasemi
  • Patent number: 9381733
    Abstract: The invention relates to the technical field of fabricating a display device, and specifically, to a preparation method of a printing plate for alignment film. The method comprises the following steps of: mixing 40-70 parts by mass of a resin for a printing plate for alignment film, 10-20 parts by mass of an epoxy acrylic resin, 10-20 parts by mass of a photoinitiator, and 20-30 parts by mass of a peroxide initiator, and then coating on a surface of a substrate; exposing with an ultraviolet ray and developing; and subjecting the exposed and developed substrate to a thermal curing process.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: July 5, 2016
    Inventor: Hongpeng Li
  • Patent number: 9279050
    Abstract: Disclosed is a non-halogen flame retardant styrene resin composition which comprises (a) a styrene resin and (b) a phosphorous-modified epoxy resin and thus exhibits superior flame retardancy to external candle flame ignition.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: March 8, 2016
    Assignee: LG Chem, Ltd.
    Inventors: Jae Yong Sim, Ki Young Nam, Yong Yeon Hwang, Je Sun Yoo, Min Sul Jang
  • Patent number: 9265918
    Abstract: An expandable medical balloon including an inner layer formed of a poly(ether-block-amide) copolymer and an outer layer formed of a polyamide, the expandable medical balloon having a burst strength of greater than 50,000 psi, and to methods of making and using the same.
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: February 23, 2016
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: John J. Chen, Daniel J. Horn
  • Patent number: 9206287
    Abstract: Fluorene derivatives are described including those having optical properties which can make them suitable for use in optical systems such as cameras. Various derivatives can have high polarity, small molecular volume, low glass transition temperature, high transparency and/or excellent optical characteristics. In addition, a process for making the fluorene derivatives and products made from the fluorene derivatives are described.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: December 8, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Young Kim, Ichiro Ogura, Ick Chan Shim
  • Patent number: 9200159
    Abstract: A composition including a blend of: a) a polyethersulfone; b) a polyphenylene sulfide (PPS); and c) an epoxy, and optionally a polyetherimide, wherein the polyetherimide and epoxy are present in an amount effective to act as a compatibilizer for the polyethersulfone and polyphenylene sulfide (PPS). Methods of compatibilizing a blend of polyethersulfone and polyphenylene sulfide (PPS). The method can include melt mixing a polyethersulfone, and polyetherimide, a polyphenylene sulfide (PPS) and an epoxy under conditions of elevated temperature and simultaneous mixing.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: December 1, 2015
    Inventors: Hariharan Ramalingam, Kapil Sheth
  • Patent number: 9096719
    Abstract: Optical compensation films (positive C-plate) with mesogen anisotropic subunits (OASUs) that have high positive birefringence throughout the wavelength range 400 nm<?<800 nm are provided. The optical compensation films may be processed by solution casting to yield a polymer film with high birefringence without the need for stretching, photopolymerization, or other processes. Such optical compensation films are suitable for use as a positive C-plate in LCDs, particularly IPS-LCDs.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: August 4, 2015
    Inventors: Dong Zhang, Frank W. Harris, Xiaoliang Joe Zheng, Jiaokai Alexander Jing, Thauming Kuo, Brian Michael King, Ted Calvin Germroth, Qifeng Zhou
  • Patent number: 9074049
    Abstract: A thermosetting composition comprising (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a quaternary ammonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: July 7, 2015
    Assignee: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Patent number: 9051415
    Abstract: Epoxy resin compositions contain (i) a potyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or a mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: June 9, 2015
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Derek Scott Kincaid, Dong Le, David Lanham Johnson
  • Patent number: 9054313
    Abstract: The present invention relates to an etheramine mixture containing a monoether diamine and its method of production by alkyloxating an initiator with an alkylene oxide to produce a precursor polyol and reductively aminating the precursor polyol to form the etheramine mixture. The etheramine mixture may be used in variety of applications including as a curing agent for an epoxy resin or as a reactant in the production of polyurea materials.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: June 9, 2015
    Inventors: Howard P. Klein, Terry L. Renken, Martin J. Renner, Bruce L. Burton, Katty Darragas
  • Publication number: 20150148497
    Abstract: Methods of synthesis and application thereof for peripherally aromatic silsesquioxanes featuring reactive functionality. A method, according to one embodiment of the invention, includes reacting a polyhedral oligomeric silsesquioxane with an anhydride. The polyhedral oligomeric silsesquioxane has an inorganic core, a phenyl moiety or an anlyine moiety covalently coupled to the at least one T-type silicon atom; and a metal-aniline group or a para-aniline group covalently coupled to the at least one D-type or M-type silicon atom.
    Type: Application
    Filed: February 2, 2015
    Publication date: May 28, 2015
    Applicant: Government of the United States as Represented by the Secretary of the Air Force
    Inventors: Timothy S. Haddad, Joseph M. Mabry, Gregory R. Yandek
  • Patent number: 9034990
    Abstract: Injection molded articles and process of forming the same are described herein. The processes generally include providing a polyolefin including one or more propylene heterophasic copolymers, the polyolefin having an ethylene content of at least 10 wt. % based on the total weight of the polyolefin; contacting the polyolefin with a polylactic acid and a reactive modifier to form a compatiblized polymeric blend, wherein the reactive modifier is produced by contacting a polypropylene, a multifunctional acrylate comonomer, and an initiator under conditions suitable for the formation of a glycidyl methacrylate grafted polypropylene (PP-g-GMA) having a grafting yield in a range from 1 wt. % to 15 wt. %; and injection molding the compatibilized polymeric blend into an article.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: May 19, 2015
    Inventors: Fengkui Li, John Ashbaugh, Gabriel Desille, Caroline Schils
  • Patent number: 9034975
    Abstract: Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend of insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: May 19, 2015
    Assignees: Hexcel Corporation, Hexcel Composites Limited
    Inventors: Maureen Boyle, Dana Blair, Yi-Jui Wu, Yen-Seine Wang, Bryce Floryancic, Paul Mackenzie
  • Publication number: 20150132566
    Abstract: Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.
    Type: Application
    Filed: May 15, 2013
    Publication date: May 14, 2015
    Inventors: Thorsten Ganglberger, Birgit Wenidoppler, Herwig Englisch, Mark Whiter
  • Publication number: 20150116427
    Abstract: Provided is a sealant for use in ink jet recording heads, comprising a cationically polymerizable resin; a fluorine-containing compound that is liquid at a temperature in a range of 20° C.±15° C.; and a cationic polymerization initiator.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 30, 2015
    Inventors: Satoshi Tsutsui, Etsuko Sawada, Yohei Hamade
  • Patent number: 9018321
    Abstract: Resin compositions which contain a compound having at least two epoxy and/or thiirane groups in the molecule (ingredient (1)) and a specific ionic liquid (ingredient (2)), as combined, are practicable resin compositions which comprise constitutive elements of readily available materials and have well-balanced suitable curing capability and storage stability. Preferably, the ionic liquid (ingredient (2)) comprises a combination of an ammonium cation or phosphonium cation and a carboxylate anion.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: April 28, 2015
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hiroshi Amano, Shigeru Kawahara
  • Patent number: 9013049
    Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 21, 2015
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yugo Yamamoto, Jun Okabe, Setsuko Oike
  • Publication number: 20150105523
    Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.
    Type: Application
    Filed: December 17, 2014
    Publication date: April 16, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Joseph Gan, Carola Rosenthal, Matthieu M. Eckert, Bernhard Kainz, Emile C. Trottier
  • Patent number: 9005761
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Elite Material Co., Ltd.
    Inventor: Yu-Te Lin
  • Patent number: 9006311
    Abstract: Method of preparing a particle dispersion within a polymer is disclosed. The dispersion may include core shell rubber particles and the polymer may include epoxies. The particles are capable of being substantially dispersed within the polymer so as to substantially inhibit agglomeration of the particles. Mechanical properties, such as toughness are improved while glass transition temperature and viscosity are not substantially impaired by the presence of the particles.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: April 14, 2015
    Assignee: Cytec Engineered Materials Limited
    Inventors: Jonathan Edward Meegan, Olivia Smith