Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

Abstract: A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

Abstract: A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite.

Abstract: The present method comprises providing a flexible web substrate (e.g., polymeric flexible web substrates) that forms at least part of a component of a device, coating so as to wet-out on and cover all or a substantial portion of a major surface on one side or both sides of the flexible web substrate with flowable polymeric material, while the flexible web substrate is moving in a down-web direction, and solidifying the polymeric material so as to form one cleaning layer on the major surface of one side or both sides of the flexible web substrate. The present invention can be utilized in a continuous in-line manufacturing process. In applications of the present invention where the flexible web substrate will not form a component of a device, the present invention broadly provides a method for cleaning particles from a flexible web of indefinite length.

Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.

Abstract: The present invention relates to an epoxy resin composition (A) containing an epoxy resin represented by the following formula (1): and an epoxy resin represented by the following formula (2): wherein in formula (2), n represents an integer of from 0 to 2, wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight, and relates to an epoxy resin composition (B) containing a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A).

Abstract: Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

Abstract: The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.

Abstract: The present teachings contemplate relatively high glass transition temperature (Tg) polymers and/or other reaction products. A method may include reacting a diepoxide with a bisphenol in amounts and under conditions to produce a material that has a Tg as measured by differential scanning calorimetry according to ASTM E1358-08(2014) of at least about 90° C. at least about 100° C. (at least about 110° C., or at least about 120° C.

Abstract: A material with significant protection properties from galactic cosmic radiation and solar energetic particles. Hydrogen-rich benzoxazines which are particularly effective for shielding against such radiation. Benzoxazine resin meets the processing requirements for use with ultra-high molecular weight polyethylene fiber as a hydrogen-rich reinforcement: cure of the resin at 120° C. This highly reactive benzoxazine resin also exhibits low viscosity and adequate shelf life.

Abstract: This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Abstract: Chemically resistant sealant compositions include high equivalent weight sulfur-containing prepolymers. Upon exposure to chemicals the properties of sealants prepared using the prepolymers exhibit excellent fuel and phosphate ester resistance.

Abstract: A tube-shaped LED lighting device including: a substrate; a light emitting device mounted on the substrate; a heat sink having one surface on which the substrate is seated, and opposite side surfaces including a groove portion; a cover to receive the heat sink, the substrate, and the light emitting device therein, and including an overhang protruding from an inner wall of the cover to be inserted into the groove portion; and a base coupled to an end of the cover, in which the heat sink includes a substrate holding portion surrounding opposite sides of the substrate.

Abstract: A water soluble polymer or polymeric adduct has a backbone comprising a plurality of segments with amine functional groups and hydroxyl functional groups with a number average molecular weight of about 5.00 to 1,000,000 Daltons. The polymeric adduct may be formed as an addition product by reacting at least one multifunctional amine compound reacted with a one or more polyfunctional epoxy compounds and/or one or more monofunctional epoxy compounds, such that there are 1.3 to 3.8 reactive amine functional groups per reactive epoxy functional group. An aqueous solution of the polymer or polymeric adduct has a viscosity of about 100 centipoise to 100,000 centipoise and a pH value of about 8 to 12 when the solution comprises 70 wt. % of the polymer or polymeric adduct dissolved in water. The polymeric adducts are useful fast setting additives for emulsions due to excellent stability when blended with anionically stabilized latex.

Abstract: A semiconductor device includes a substrate and a semiconductor chip. The semiconductor chip includes a semiconductor element on a first surface thereof. The semiconductor chip is provided on the substrate such that a second surface thereof, which is opposite to the first surface, faces an upper surface of the substrate. A metal layer is provided between the second surface of the semiconductor chip and the upper surface of the substrate. A metal material, in which the range of ? rays is shorter than for single-crystal silicon, is used in the metal layer.

Abstract: The invention provides an aromatic polysulfone including an aromatic polysulfone having at least one highly polar functional group at its terminus, wherein in the aromatic polysulfone, an area of a signal attributed to the aromatic polysulfone having a highly polar functional group with respect to a total area of all signals attributed to the aromatic polysulfone in a chromatogram obtained by measurement through a gel permeation chromatography method under the following conditions is 0.1% or more and 11% or less, wherein the sample injection volume is 5 ?L, column is “Shodex KF-803” manufactured by Showa Denko K.K., column temperature is 40° C., eluent is N,N-dimethylformamide, eluent flow rate is 0.5 mL/min, detector is ultraviolet-visible spectrophotometer (UV), and detection wavelength is 277 nm.

Abstract: The invention provides an aromatic polysulfone including an aromatic polysulfone having at least one highly polar functional group at its terminus, wherein in the aromatic polysulfone, an area of a signal attributed to the aromatic polysulfone having a highly polar functional group with respect to a total area of all signals attributed to the aromatic polysulfone in a chromatogram obtained by measurement through a gel permeation chromatography method under the following conditions is 19% or more and 100% or less, wherein sample injection volume is 5 ?L, column is “Shodex KF-803” manufactured by Showa Denko K.K., column temperature is 40° C., eluent is N,N-dimethylformamide, eluent flow rate is 0.5 mL/min, and detector is ultraviolet-visible spectrophotometer (UV).

Abstract: An epoxy oligomerization catalyst can be employed to prepare an epoxy resin employing a method including admixing a first epoxy resin having a first epoxy equivalent weight of from about 100 to about 600 with a diphenolic compound, and a catalyst, thereby forming a second epoxy resin having a second epoxy equivalent weight of from about 200 to about 10,000; wherein the catalyst is a guanidinium catalyst. The second equivalent weight is greater than the first equivalent weight.

Abstract: A material having a first non-zero elastic modulus capable of reversibly changing the first non-zero elastic modulus to a second non-zero elastic modulus in response to a redox reaction occurring in the material. A method of producing a material that is reversibly cyclable between a first non-zero elastic modulus and a second non-zero elastic modulus, comprising: preparing a polymer comprising both crosslinks that do not depend on metal binding and functional groups capable of having oxidation-state specific binding constants to a metal ion; and doping the polymer with a solution containing the metal ion.

Abstract: A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition includes: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure and/or (b) a polyvalent amine-based curing agent (component b).

Abstract: The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and has excellent adhesion reliability.

Abstract: A photosensitive and via-forming circuit board comprising a laminate unit, a conductor unit, and a cover layer unit is provided. The laminate unit includes an insulating layer, a first conductive wiring layer and a second conductive wiring layer formed at two opposite sides of the insulating layer, respectively, and at least one through-hole surface defining a through hole extending from the upper surface of the first conductive wiring layer through the insulating layer to the lower surface of the second conductive wiring layer. The conductor unit is formed on the at least one through-hole surface. The cover layer unit is formed from a photosensitive composition comprising an epoxy group-containing compound and a photosensitive polyimide capable of reacting with the epoxy group of the epoxy group-containing compound, and includes a first cover layer formed on the first conductive wiring layer and extending into and filling the through hole.

Abstract: The invention relates to inorganic-organic hybrid materials comprising interpenetrated organic and inorganic components, wherein the organic component comprises polymer chains formed at least in part by ring-opening polymerization of a cyclic monomer, and processes for the production thereof.

Abstract: The invention relates to a particulate curing component for a thermosetting resin, the particulate curing component comprising particles of a solid resin, wherein a curative for the thermosetting resin is dispersed within the particles of solid resin. The invention also relates to methods of forming particulate curing components and compositions comprising particulate curing components.

Abstract: The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.

Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.

Abstract: The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.

Abstract: A curable isocyanate free formulation for preparing a polyurethane foam. The formulation includes a compound A chosen from multifunctional cyclic carbonates of a formula (I) or a mixture thereof, a compound B chosen from multifunctional cyclic carbonates containing oxyalkylene groups —OR3- of a formula (II) or a mixture thereof, a compound C chosen from multifunctional amines of a formula (III) or a mixture thereof and a compound D chosen from non-reactive blowing agents, as well as a process for preparing a non-isocyanate polyurethane foam, a foam obtainable by this process, compound B, a mixture of compounds A and B, the use of compound B for enhancing the solubility of a non-reactive blowing agent in a compound A and a foamable system having a first part A containing compound A and compound B and a second part B containing compound C, wherein part A and part B are preferably physically separated.

Abstract: The present invention provides an epoxy compound which is 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene. Also, the present invention provides a method for producing [1,1?-binaphthalene]-2,2?,7,7?-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1?-binaphthalene]-2,2?,7,7?-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1?-binaphthalene]-2,2?,7,7?-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1?-binaphthalene]-2,2?,7,7?-tetraol or [1,1?-binaphthalene]-2,2?,7,7?-tetraol monohydrate with epihalohydrin.

Abstract: An amine of the formula (I) for use as hardener for epoxy resins, hardeners for epoxy resins containing the amine of the formula (I) and resultant epoxy resin compositions which more particularly can be used as low-emission room-temperature-curing epoxy-resin coatings with high hardness and surface quality. The amine of the formula (I) has little odor and is a very successful diluent for epoxy resin compositions. It is more particularly obtained by reductive alkylation from 1,2-propylenediamine and an aldehyde or ketone.

Abstract: An epoxy resin composition including A) at least one epoxy compound, and B) a hardener composition including B1) from 0.1%-100% by weight of 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine, and B2) from 99.9%-0% by weight of at least one further diamine and/or polyamine, where the stoichiometric ratio of the epoxy groups of A) and the number of active hydrogen atoms of the functional groups of B) varies from 1:2 to 2:1.

Abstract: A curing agent composition for curing an epoxy compound comprising a mixture of: (a) at least one natural oil phenol compound, (b) at least one phenolic resin compound, and (c) at least one amine curing agent; in particular, wherein the curing agent composition is adapted for providing a curable epoxy resin composition with a Shore D hardness build-up greater than 0 after within 2 hours at 23±2° C. and having an anti-blushing property such that 30 minutes after scratching a film cured on a glass panel, the film is at least 50 percent transparent; a curable composition including (I) at least one epoxy compound; and (II) the above curing agent composition, and a thermoset prepared from the above curable composition.

Abstract: A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.

Abstract: The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I) wherein A is: PPE are: Z are: Y are: Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03(1 GHz), dissipation factor is 0.0046(1 GHz) and no delamination longer than 60 minutes dipping in 288 soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.

Abstract: The present invention provides an epoxy resin composition including 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.

Abstract: Disclosed are multilayer structures comprising polyamide-ionomer compositions suitable for use in a backsheet in a photovoltaic module comprising a polymer component comprising a polyamide and an ionomer; 0 to 20 weight % of pigment; and 0 to 40 weight % of filler; preferably wherein the combination of pigment and filler comprises 8 to 50 weight % of the composition; and 0 to 5 weight % of weatherability additives.

Abstract: A material having a first non-zero elastic modulus capable of reversibly changing the first non-zero elastic modulus to a second non-zero elastic modulus in response to a redox reaction occurring in the material. A method of producing a material that is reversibly cyclable between a first non-zero elastic modulus and a second non-zero elastic modulus, comprising: preparing a polymer comprising both crosslinks that do not depend on metal binding and functional groups capable of having oxidation-state specific binding constants to a metal ion; and doping the polymer with a solution containing the metal ion.

Abstract: There is provided a highly versatile curing accelerator for an oxidative polymerization-type unsaturated resin. There are also provided a printing ink and a coating material that use the above curing accelerator. Specifically, the curing accelerator for an oxidative polymerization-type unsaturated resin that is used contains a fatty acid manganese salt (A) and a compound (B) represented by formula (1) below, (wherein R1 and R4 are each a hydrogen atom, a hydrocarbon group, a hydrocarbonoxy group, or an amino group, R2 and R5 are each a hydrogen atom, a hydrocarbon group, a hydrocarbonoxy group, a hydrocarbonoxycarbonyl group, a cyano group, a nitro group, or a halogen atom, R3 and R6 are each a hydrogen atom or a hydrocarbon group, and R7 is a divalent hydrocarbon group, and wherein R1 and R2 may form a ring, and R4 and R5 may form a ring).

Abstract: A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof; (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented.

Abstract: An at least two layer rotomolded article is described herein which may include a layer A and a layer B. Layer A can include an aliphatic polyester, a polyolefin, or a co- or ter-polymer that includes ethylene or styrene monomer, an unsaturated anhydride-containing monomer, epoxide-containing monomer, or carboxylic acid-containing monomer, and a (meth)acrylic ester monomer. Layer B can include a polyolefin and a polyester, or a co- or ter-polymer that includes an ethylene or a styrene monomer, an unsaturated anhydride-containing monomer, epoxide-containing monomer, or carboxylic acid-containing monomer, and a (meth)acrylic ester monomer.

Abstract: An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220° C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.

Abstract: Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition.

Abstract: Described is a clearcoat coating composition, its use, and a process for preparing the clearcoat coating composition. The clearcoat coating composition comprises (A) at least one polyester having an OH number of 80-250 mg KOH/g; (B) at least one butanol-etherified melamine-formaldehyde resin having a crosslinking onset temperature between 65° C.-100° C. lower than the crosslinking onset temperature of hexamethoxy-methylmelamine; (C) at least one butanol-etherified melamine-formaldehyde resin having a crosslinking onset temperature between 30° C.-60° C. lower than the crosslinking onset temperature of hexamethoxymethylmelamine; (D) at least one organic urea compound as rheological assistant; and (E) at least one acid catalyst.

Abstract: The present invention relates to a process for the removal of polymer thermosets from the substrates without damaging the substrates. The present invention relates to a process for the removal of polymer thermoset from the substrate retaining the physical and chemical properties of the substrates. The present invention more particularly relates to the use of bio molecules for cleaving polymer thermosets and the process to perform the cleaving.

Abstract: Disclosed are compositions comprising: (a) 10 to 40 percent by weight of the ultrafine particulate poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 9 microns or less; (b) 60 to 90 percent by weight of an epoxy resin; wherein the weight percents are based on the total weight of the composition. Also disclosed are processes for preparing such compositions as well as articles derived therefrom.

Abstract: The invention relates to a resin composition which is characterized by including: a reaction product that includes (A) a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups per molecule and (B) an epoxy compound having an average of 2 to 2.3 epoxy groups per molecule, wherein the reaction product is obtained by pre-reacting at least a part of hydroxyl groups on the polyphenylene ether (A) with epoxy groups on the epoxy compound (B) so that the concentration of terminal hydroxyl groups on the polyphenylene ether (A) becomes 700 ?mol/g or less; (C) a cyanate ester compound; and (D) an organometallic salt.

Abstract: The present invention relates to new mixtures containing cyanamide and a urea derivative, to liquid curing agents for curing polymer resins, in particular epoxy resins, and to epoxy resin compositions comprising liquid curing agents for producing fibre composite materials.

Abstract: A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150° C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190° C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.

Abstract: A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10?3 or less. [In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12 each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.].

Abstract: Curable material comprising silylated polymers containing urethane groups, and use thereof in sealants, adhesives, binders and/or surface modifiers.