Abstract: Provided are filled polyimides that can be used in films and articles comprising the films. The films are useful in coverlay applications and have advantageous optical properties. Also provided are blends of polyimide precursor, polyacrylonitrile, and cellulosic polymer which can be used to obtain the filled polyimides.

Abstract: There is provided an organic electroluminescence display includes a lower electrode formed on a substrate, a device separation film formed on the lower electrode, an organic compound layer formed on the device separation film and including a light emission layer, and an upper electrode formed on the organic compound layer, wherein the device separation film is a polyimide film having an imidation ratio in a range of 65% or more to less than 90%. The display is expected to have longer operating life.

Abstract: Disclosed herein are second order nonlinear optic polyimide polymers comprising repeating units represented by the formula: wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed are the preparation processes of these polymers, chromophore-forming compounds for synthesis of these polymers, and the intermediate polymers thereof. The second order nonlinear optic polyimide polymers of formula (I) may be used in the manufacture of electro-optic (EO) devices, such as electro-optic waveguide devices.

Abstract: Disclosed herein are second order nonlinear optic polyimide polymers comprising repeating units represented by the formula: wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed are the preparation processes of these polymers, chromophore-forming compounds for synthesis of these polymers, and the intermediate polymers thereof. The second order nonlinear optic polyimide polymers of formula (I) may be used in the manufacture of electro-optic (EO) devices, such as electro-optic waveguide devices.

Abstract: A method of producing high molecular weight stereoregular head, tail-poly(alkylene D-glucaramides) is described. Amidoamino acids are esterified in cold alcohol and then polymerized in a protic solvent to form steroregular prepolymers. The prepolymers are then further polymerized by dissolving them in a solvent to form larger, purer postpolymers. Compositions of matter prepared using the subject method are also described.

Abstract: An alignment film for avoiding the degradation of the charge holding rate of a LCD, due to ionic impurity of the liquid crystal materials, and the LCD that is made of the same is disclosed herein. The alignment film 10 includes derivatives of polyimides or polyamides and low molecular thermosetting resins having a viscosity of 1–3000 Poise within the temperature of 25° C. Through the use of the alignment film 10 produced by the thermosetting resin monomers, the ionic impurity is prevented from contact with the pixel electrode 16. The performance of the LCD with the alignment film is improved during the test of reliability, even though a liquid crystal material with high dielectric anisotropy is used.

Abstract: A soluble polyimide for a photosensitive polyimide precursor and a photosensitive polyimide precursor composition including the soluble polyimide, wherein the soluble polyimide contains hydroxyl and acetyl moieties and at least one reactive end-cap group at one or both ends of the polymer chain. The photosensitive polyimide precursor composition comprises the soluble polyimide, a polyamic acid containing at least one reactive end-cap group at one or both ends of the polymer chain, a photo acid generator (PAG) and optionally a dissolution inhibitor. Since the polyimide film of the present invention exhibits excellent thermal, electric and mechanical properties, it can be used as insulating films or protective films for various electronic devices. A pattern with a high resolution may be formed even on the polyamide film having a thickness of above 10 ?m.

Abstract: In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Abstract: The present invention relates to a new sulfonated polyimides, more specifically to new methods for preparing the polyimides, and cation exchange membranes containing the polyimides. The sulfonated polyimides of the presented invention have excellent proton conductivity and low preparation cost. In particular, the sulfonated polyimides can be used as polymer electrolyte membrane in hydrogen or direct methanol fuel cell for electric vehicles and portable power sources operated with electric energy.

Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Abstract: A molding composition which is composed of at least 60% by weight of transparent polyamide, where the molding composition comprises an effective amount of one or more optical brighteners, and where the amount of the optical brightener has been judged in such a way that

Abstract: Polyimide polymers from 3,4,3',4'-biphenyltetracarboxylic dianhydride and 3,4,3',4'-benzophenonetetracarboxylic dianhydride and a diamine such as p-phenylenediamine exhibit a high glass transition temperature, high thermal oxidative stability and low moisture regain, useful for structural applications.

Abstract: A flame retardant resin composition comprising a thermoplastic resin/flame retardant mixture having fluororesin fibrils dispersed therein, wherein, when a breakage-exposed surface of a tensile force-broken piece of a test sample prepared from the flame retardant composition by injection molding so as to be used in a flame retardancy test by the Vertical Burning Method described in UL-Subject 94 is examined by means of a SEM with respect to a predetermined area of 7 .mu.m.times.7 .mu.m wherein the fibrils are dispersed in the entire region of the predetermined area, the dispersed fibrils exhibit a dispersion morphology in which the fibrils have a diameter of 0.

Abstract: The present invention relates to an optical fiber (1) comprising an optical core (2) for guiding the majority of the lightwaves transmitted by the fiber, and surrounded by optical cladding (3), itself surrounded by a protective covering (4) of a plastics material, characterized in that the plastics material (4) is a reversibly cross-linked material.

Abstract: A heat resistant polymer composition, an alignment layer formed using the same, and an LCD having the alignment layer are provided. The heat resistant polymer composition includes 10-25% by weight of a polyimide resin or polyamic acid, 0.1-1% by weight of an adhesive agent, and balance of a solvent. The adhesive agent improves thermal stability. Thus, the LCD having the alignment layer formed using the same can accomplish a desirable pre-tilt angle of liquid crystals and desirable alignment properties of liquid crystal molecules.

Abstract: New photosensitive polyamic acid precursors are disclosed which have the formula: ##STR1## where Z is a tetravalent organic radical which contains at least one aromatic ring, Z' is a divalent organic radical which contains at least one aromatic ring, and R* is a photo polymerizable group. Particularly preferred compounds include BPDA-PDA and BPDA-ODA polyamic acid precursors. The precursor compositions within the practice of this invention are i-line, g-line, and i-/g-line active and show good photoresolution. The films formed exhibit excellent self-adhesion and adhesion to glass ceramic and silicon wafer substrates have low internal stress, a very low degree of solvent swelling, high thermal stability, and excellent mechanical properties such as high modulus/tensile strength and high elongation at break.

Abstract: An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

Abstract: Described is an electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; (B) an electrically conductive filler, and a thermoset resin. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.

Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.

Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.

Abstract: A polymide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.

Abstract: New photosensitive polyamic acid precursors are disclosed which have the formula: ##STR1## where Z is a tetravalent organic radical which contains at least one aromatic ring, Z' is a divalent organic radical which contains at least one aromatic ring, and R* is a photosensitive group. Particularly preferred compounds include BPDA-PDA and BPDA-ODA polyamic acid precursors. The precursor compositions within the practice of this invention are i-line, g-line, and i-/g-line active and show good photoresolution. The films formed exhibit excellent self-adhesion and adhesion to glass ceramic and silicon wafer substrates have low internal stress, a very low degree of solvent swelling, high thermal stability, and excellent mechanical properties such as high modulus/tensile strength and high elongation at break.

Abstract: A thermosetting polyimide composition is provided with a sufficient heat resistance and excellent mechanical and electrical characteristics in toughness, flexibility and so on and under severe environmental conditions, by adding to a polyfunctional unsaturated imide a thermosetting resin selected from the group consisting of polyetherimide, polyarylate and polyamideimide which are in a miscibility region with the polyfunctional unsaturated imide and have an excellent glass transition point and a number-average molecular weight of more than 10,000.

Abstract: Unreinforced polyamide molding materials containA) from 60 to 100% by weight of a mixture consisting ofA.sub.1) from 97.5 to 99.85% by weight of one or more polyamides,A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide andA.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or amines of 2 to 40 carbon atomsand, based on the total weight of the polyamide molding material,B) from 0 to 40% by weight of a toughened polymer andC) from 0 to 10% by weight of conventional additives in effective amounts.

Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.

Abstract: The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength.

Abstract: The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength.

Abstract: Thermosetting resins for use in high performance fiber-reinforced composites are toughened without compromising their processability by the inclusion of micron-sized particles of thermoplastic material which are solid at ambient temperatures but solubilize in the resins at a temperature below the gel temperature of the thermosetting resin. By appropriate selection of the solubilization temperature (or temperature range) of the thermoplastic material, one achieves a composite product having intralaminar or interlaminar toughness emphasized or a combination of both. The invention is of particular utility when applied to bismaleimide resin systems.

Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer.

Abstract: Polyimides having a high thermal and oxidative stability are prepared by reacting a mixture of monomers comprising (a) a dialkyl, trialkyl, or teThis invention was made with Government support under F33615-88-C-5409 awarded by the Department of the Air force. The Government has certain rights in this invention.

Abstract: Soluble and/or fusible polyamidoimide-polyimide block copolymers with high heat stability, useful e.g. as molding powders for thermoplastic shaping films, fibers and laminates and process for their preparation are provided.

Abstract: Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and a terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.IC, of at least 1.0 MPam 1/2 and a glass transition temperature of at least 200.degree. C.

Abstract: Preparation of conductive polymers, particularly polyanilines having good solubility in organic solvents and high electrical conductivity, by providing a mixture of aniline, dianiline and a flexible diamine such as 1,3-bis (3-aminophenoxy)benzene or triethylene tetramine. The mixture is reacted in the presence of an oxidant such as ammonium persulfate and a protonic (Bronsted) acid, e.g. tosic acid, to polymerize the mixture and form a conductive polyaniline in which the conjugation is interrupted by an intermediate diamine group, and which renders the resulting polymer more flexible than polyaniline per se. The conductive polymer so produced also has terminal primary amino groups which aid solubility and which are further reactive. The conductive polyaniline product of the invention can be blended with non-conductive resins such as polyimides to provide cured conductive resin blends having good mechanical properties.

Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin composition of this invention comprises 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide has recurring units of the following formula: ##STR1## wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical.

Abstract: Disclosed are blends comprising from about 40 to 70 wt. % of a polyetherimide and the remainder one or more polyamides. The blends generally have a tensile strength which is greater than the tensile strength of polyetherimide-polyamide blends which do not contain from about 40 to 70% polyetherimide, while still retaining a good combination of other physical properties such as heat distortion characteristics and impact strength. In addition, the blends of the invention may have a flexural strength which is greater than that of other polyetherimide-polyamide blends which do not contain from about 40 to 70% polyetherimide.

Abstract: A method of producing an impact modified polymer comprises dissolving a high-temperature polyetherimide and a high-temperature fluorelastomer in a common solvent to form a single phase solution which is heated to a temperature that would normally vaporize the solvent. The solution is maintained at an elevated pressure to avoid vaporization of the solvent. After being heated at the elevated temperature, the solution is subjected to flash evaporation by introducing the solution into a zone of reduced pressure. This forms a blend of the polyetherimide into which the fluorelastomer is micro-dispersed. A composition of matter formed by the method advantageously includes a solid component having 90% by weight ULTEM 1000 polyetherimide and 10% by weight VITON A fluorelastomer. Dimethyl formamide is advantageously used as the common solvent.

Abstract: A copoly(imidine-imide) consisting of a copolymer of polyimidines and polyimides having, in the basic chain structure of the polymer, imidine structures represented by formula (I) and the imide structures represented by formula (II): ##STR1##

Abstract: Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.ic, of at least 1.0 MPam.sup.1/2 and a glass transition temperature of at least 200.degree. C.

Abstract: This invention provides a method for the preparation of an article from a blend of at least two molecularly compatible polymers by treating the blend with a solvent which is a solvent for one of the polymers and a non-solvent for the other. The solvent can be removed while the article is restrained from undergoing substantial shrinkage, in which case a microporous article is obtained. Alternatively, the solvent can be removed while the article is permitted to shrink. In this case high shrinkage force (also referred to as recovery force) results which can be utilized to apply the article to a substrate. The final and intermediate articles are novel. In a preferred embodiment, the invention provides a microporous article having an average pore size of about 0.005 microns to about 1 micron.

Abstract: This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following formula: ##STR1## wherein Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetravalent radical of aliphatic radical having at least 2 carbons, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, or noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function and from 5 to 100 parts by weight of fluororesin. The resin composition can provide molded products which are excellent in high-temperature stability, dimensional stability and mechanical strength and moreover have a low friction coefficient and good wear resistance. Therefore, the composition is useful as the material for electric and electronic devices, precision instrument parts etc.

Abstract: (1) Pyrrolidonyl acrylate block polymers having the formula ##STR1## wherein n has a value of 1 to 3; X and X' are dissimilar and each is hydrogen or methyl; y and z each have a value of from 1 to 40, except that at least one of y and z is greater than 1 and R is hydrogen or methyl;(2) preparation of said polymers and(3) uses of said polymers.

Abstract: A thermoplastic composition includes compatible blends of a mixed polycarbonate comprising units derived from a first dihydric phenol, which is a bis(hydroxyaryl) sulfone, a second dihydric phenol; and one or more thermoplastic condensation polymers containing hetero groups.

Abstract: Compositions that may be irradiated to form positive images useful in the manufacture of printing plates and printed circuits comprise(i) an organic solvent-soluble, radiation sensitive prepolymer which is a polyaddition or polycondensation product of a polyfunctional carbocyclic or heterocyclic compound containing at least 2 groups R capable of undergoing an addition or condensation reaction, and at least one polyfunctional carbocyclic or heterocyclic compound having at least 2 groups capable of adding to, or condensing with the groups R, this prepolymer having at least one group --COOR.sup.1 in the ortho- or peri- position to a group formed by reaction of a group R, where R.sup.1 is an organic radical with one or more double or triple bonds capable of being dimerized or polymerized by radiation-induction, and(ii) 1-25% by weight of an unsaturated mono- or di- carboxylic acid of formula ##STR1## where R.sup.2 is --H or --CH.sub.3 andR.sup.

Abstract: Electrical coating compositions comprise blended polyesterimides and from 1 to 20 percent by weight of total solids of an ester terminated amide imide. Such compositions provide insulation coatings on electrical conductors which have superior smoothness, even after high speed coating operations.

Abstract: Disclosed are blends of two or more polyetherimides. Such blends generally exhibit a high glass transition temperature, e.g., from about 125.degree. to about 210.degree. C., which makes the blends particularly suitable for automotive and appliance applications.

Abstract: Electrical coating compositions comprise blended polyesterimides and from 1 to 20 percent by weight of total solids of an ester terminated amide imide. Such compositions provide insulation coatings on electrical conductors which have superior smoothness, even after high speed coating operations.

Abstract: Blends of polyetherimides and block poly(esteramides) may contain about 99-1% by weight of the former and about 1-99% of the latter. Particularly useful are polyetherimides containing about 1-30% of the block poly(esteramide), which have improved impact strength and resistance to brittleness. The blends may also contain at least one poly(alkylene dicarboxylate) as a compatibility improver.

Abstract: Nylon molding powders are prepared by melt blending a nylon with a minor amount of a heat reactive polyimide resin. The mixture is cooled and ground and mixed with the desired filler. The heat reactive polyimide increases the melt viscosity of the nylon during subsequent melt forming of shapes so that the filler particles are not wet out or their interstices filled leaving them as discrete clusters of filler material held in pockets in the nylon/polyimide matrix. By these means, the filler material is more effective in contributing desired properties to a molded article.

Abstract: Thermosetting polycondensates containing amide and imide groups which are obtained by reacting 1,2,3,4-butanetetracarboxylic acid or its anhydride with one or more aliphatic, cycloaliphatic or aromatic diamines and one or more oxadicarboxylic acids or oxadicarboxylic acid esters of the general formulaROOC--CH.sub.2 --O--(CH.sub.2).sub.2 --O--.sub.n CH.sub.2 --COORwhere R is hydrogen or alkyl of 1 to 6 carbon atoms and n is 0 or an integer from 1 to 10, in a water-soluble organic solvent and/or water, at from 80.degree. to 200.degree. C. These polycondensates are useful as wire enamels, impregnating agents and adhesives.