Abstract: Disclosed is a coating solution including an oligomeric polyetherimide component, an oligomeric diamine component, a solvent system and optionally water which may be coated on a substrate and polymerized to form high quality polyetherimide coatings and a process for preparing the solution.

Abstract: The present invention relates to a heat resistant molding resin composition comprising 60-99.9% by weight of an aromatic polyamideimide resin, and 40-0.1% by weight of a thermoplastic resin which comprises at least one member selected from the group consisting of a polyphenylene sulfide resin, a polyamide resin, a polysulfone resin, an aromatic polyester resin, a polyphenylene-ether resin and a phenoxy resin. The thermoplastic resin must have a melt viscosity at 350.degree. C. of not more than 1.times.10.sup.5 poise and a decomposition temperature of not lower than 350.degree. C. The aromatic polyamideimide resin is improved in melt viscosity characteristics by being blended with the thermoplastic resin. Therefore, a resin composition is obtained which is excellent in moldability characteristics. This composition may optionally comprise various kinds of fillers.

Abstract: Described herein are molding compositions of blends of a poly(aryl ether) resin and a polyetherimide resin. These compositions have improved environmental stress crack resistance.

Abstract: Described herein are molding compositions of blends of a polyarylate derived from a dihydric phenol and an aromatic dicarboxylic acid, and a polyetherimide. These blends can additionally contain thermoplastic polymers which are compatible with the blend of polyarylate and polyetherimide.

Abstract: An improved substantially solvent-free process for preparing phthalate-moiety based polyesterimide resins, new resins prepared by the process, and substrates (e.g., electrical conductors) coated with compositions comprising the new resins are described.

Abstract: Novel polymer blends are disclosed comprising about 10 to 95 percent by weight of a copolyimide (A) prepared from benzophenone-3,3',4,4'-tetracarboxylic acid dianhydride and a mixture of 4,4'-methylenebis(phenyl isocyanate) and toluene diisocyanate (2,4- or 2,6-isomer or mixtures thereof) with the isocyanates used in a molar percent ratio from about 10/90 to 30/70 respectively; and from about 90 to 5 percent by weight of a copolyamideimide (B) prepared from 4,4'-methylenebis(phenyl isocyanate) and a mixture of trimellitic anhydride and isophthalic acid with the acid components used in a molar percent ratio from about 70/30 to 90/10 respectively.The novel blends may be used in the form of their dry blend or in solution and the films produced therefrom are characterized by improved elongation and tear strength values over those for the copolyimide (A) alone. Furthermore, the softening point of the blends is increased over the copolyamideimide alone.

Abstract: An aqueous coating composition containing in admixture a water soluble polyester, a water soluble orthoamic acid diamine and minor amounts of other water soluble polymeric coating materials. The water soluble orthoamic acid diamine is prepared by reacting in a suitable solvent for at least one reactant, an aromatic diamine and an aromatic dianhydride with the reactants in the molar ratio of m/(m-1) respectively, where m has a value between 2 and about 7. The diamine is dissolved in a solvent and the dianhydride is slowly added to the solution to form the orthoamic acid diamine. The reaction is carried out at a temperature below that at which imidization occurs. The reaction product may then be made water soluble by the addition of a volatile base such as ammonia or a volatile amine. Water solutions of polyester resins and the orthoamic acid diamine are utilized to produce coatings on substrates such as magnet wire.