Abstract: A thermoplastic resin composition can be obtained by adding about 0.1 to 20 parts by weight of a diene-series block copolymer (2) to 100 parts by weight of a resin composition containing a polycarbonate-series resin (1) as a basic component of which the proportion of terminal hydroxy groups relative to the whole of the terminals is 1 mole % or above (about 5 to 40 mole %). The polycarbonate-series resin base may further comprise a thermoplastic resin composition (3) such as a rubber-modified styrenic resin. The block copolymer component (2) includes an epoxy-modified block copolymer, etc. When added an organophosphorus compound as a flame retardant (4), or a fluorine-containing resin as a flame-retartant auxiliary (5), a halogen-free flame-retardant thermoplastic resin composition can be obtained. A thermoplastic resin with an improved flowability and impact strength can be obtained by modifying a polymer blend of the polycarbonate-series resin and the styrenic-series resin in quality.

Abstract: The present invention provides a primer composition comprising an aliphatic isocyanate-containing compound, a nonhalogenated hydrocarbon polymer containing organic functional groups, a halogenated hydrocarbon polymer optionally containing organic functional groups, and an organic solvent.

Abstract: There is disclosed an impact resistant polystyrene composition which comprises 5 to 98% by weight of an (a) styrenic polymer having a syndiotactic configuration and 2 to 95% by weight of a (b) styrene/diolefin diblock copolymer, styrene/diolefin/styrene triblock copolymer or styrene/diolefin random compolymer, each having a hydrogenation rate of 70 to 98 mol %, and optionally a (c) rubbery elastomer having an olefinic component or polyolefin, a (d) poly(phenylene ether), etc. The above composition is greatly enhanced in its impact resistance and elongation properties without deterioration of heat resistant stability of color tone, etc.

Abstract: A conductive polyester-based alloy sheet having three layers laminated together by co-extrusion, which comprises one substrate layer and two surface layers, wherein the surface layers are conductive and comprise polyester, acrylonitrile-butadiene-styrene (abbreviated as ABS) and/or polystyrene (abbreviated as PS), a compatibilizer, and a toughening agent, wherein the surface layers have a surface conductivity of not more than 10.sup.8 ohms. The melt flow index of the material for the conductive layers during the extrusion step is not less than 5.0 g/min (loading, 10 Kg; temperature, 250.degree. C.). The substrate layer is made from acrylonitrile-butadiene-styrene and/or polystyrene.

Abstract: An epoxy resin composition for powder coatings which comprises (a) 40 to 95 parts by weight of a solid epoxy resin having at least two epoxy groups in a molecule, an epoxy equivalent of 400 to 2500, and a softening point of 50.degree. C. to 150.degree. C., and (b) 5 to 60 parts by weight of an epoxidized polydiene polymer having a main structure of general Formula (I) in which aliphatic double bonds are partially epoxidized.

Abstract: An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.

Abstract: A process for curing epoxidized diene polymers for use in adhesives, sealants, and coatings which comprises contacting the polymer with an aromatic anhydride curing agent at an epoxy/anhydride molar ratio from 0.5/1 to 2.0/1.0, optionally, and from 0.1 to 10 phr of an accelerator at a temperature of from 100 to for a period of 10 minutes to six hours.

Abstract: The present invention provides an improved process for producing blends of tackifying resins and low molecular weight polyphenylene ether resins. This invention involves combining the resin solutions or redissolving one of the resins once isolated, in the other resin solution and isolation of the resin blend by devolatilization, precipitation, evaporation, spray drying, and/or stripping of the organic solvent.

Abstract: A process for curing epoxidized diene polymers for use in adhesives, sealants, and coatings which comprises contacting the polymer with an aromatic anhydride curing agent at an epoxy/anhydride molar ratio from 0.5/1 to 2.0/1.0, optionally, and from 0.1 to 10 phr of an accelerator at a temperature of from 100.degree. to 200.degree. C. for a period of 10 minutes to six hours.

Abstract: A process for incorporation of epoxidized polydienes into aromatic epoxy resins which comprises (a) blending the epoxidized polydiene into a curing agent in a ratio of 1:20 to 1:4, (b) reacting the epoxidized polydiene and a curing agent at a temperature of from 100.degree. to 150.degree. C. over a time from 10 to 100 minutes, (c) mixing the pre-reacted epoxidized polydiene and curing agent with the aromatic epoxy resin and accelerator, and (d) curing the aromatic epoxy resin by heating the full mixture of paragraph (c) to a temperature of from 110.degree. to 170.degree. C. for from 2 to 6 hours.

Abstract: Thermoplastic elastomers (TPEs) containing side chain crystalline (SCC) blocks. The SCC blocks my be hard (A) blocks or the soft (B) blocks (or both) in the TPE. Some of these TPEs are novel, e.g. those in which A blocks are SCC blocks, and the B blocks are polyethers, polyacrylates, polyamides, polyurethanes or polysiloxanes. The SCC-containing TPEs are particularly useful as matrix materials for other components which are dispersed therein, e.g. energetic solids and other thermally responsive materials.

Abstract: A polymeric resin for optical fiber strips is formed from a mixture comprising a first base polymer selected from an epoxy acrylate and a urethane acrylate and a copolymer in a proportion of between 0.5% and 20% by weight of said mixture which is compatible with said first polymer and carries polysiloxane chains.

Abstract: Hydroxy-terminated telechelic rubber polymers and block copolymers of flexible polymers with unsaturated polyester resins improve the elongation and flexural elongation of in-mold coating compositions for fiber reinforced plastics (FRP). An FRP in-mold coating composition based upon vinyl ester resin, ethylenically unsaturated monomers, and at least one of telechelic hydroxy terminated flexible polymers and the block copolymers of functionally terminated flexible polymers with unsaturated polyester polymers are described.

Abstract: The present invention provides a toughened cycloaliphatic epoxy resin composition useful as a coating comprising:(a) a curable cycloaliphatic epoxy resin,(b) an epoxidized low viscosity polydiene polymer wherein the polymer contains from 2.0 to 6.0 milliequivalents of epoxy per gram of polymer,(c) a curing agent,(d) an aromatic epoxy resin, and(e) a hydroxy functional material.

Abstract: The present invention provides a toughened epoxy resin composition comprising:(a) a curable aromatic epoxy resin,(b) an epoxidized low viscosity polydiene polymer wherein the polymer contains from 1.0 to 7.0 milliequivalents of epoxy per gram of polymer, and(c) a curing agent.

Abstract: The present invention provides a toughened epoxy resin composition comprising:(a) a curable aromatic epoxy resin,(b) a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation, and wherein the polymer contains from 0.5 to 7 milliequivalents of epoxy per gram of polymer, and(c) a curing agent.

Abstract: The present invention provides a toughened cycloaliphatic epoxy resin composition comprising:(a) a curable cycloaliphatic epoxy resin,(b) an epoxidized low viscosity polydiene polymer wherein the polymer contains from 2.0 to 6.0 milliequivalents of epoxy per gram of polymer, and(c) a curing agent.