Abstract: There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance.

Abstract: The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Abstract: Provided is a molded article comprising a resin, wherein the resin comprises a methacrylic resin comprising a structural unit derived from a methacrylic acid ester and a structural unit derived from a silica particle having an average primary particle diameter of 1 nm or more and 50 nm or less and comprising at least one polymerizable functional group, and the molded article has an absolute value of degree of orientation in the thickness direction of 0.02 or more and satisfies the requirement (I): (I) When the free induction decay curve (X) obtained by measuring the molded article by a solid echo method at 150° C. using a pulse nuclear magnetic resonance measurement apparatus is approximated by the least square method using the formula (F1), the sum (B+C) of the component fractions of two components having different spin-spin relaxation times in the free induction decay curve (X) is 4% or more.

Abstract: A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.

Abstract: The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.

Abstract: An tire replacement apparatus is disclosed that has an electric motor with a drive shaft and a first gear concentrically connected to the drive shaft. The first gear may connect to a symmetrical bolt locking gear array having several bolt locking gears arranged such that each bolt locking gear rotates in the same direction that the first gear rotates. Each bolt locking gear may have a cylindrical hole at its center. The cylindrical hole may be outlined with an inner spiral thread, which connects to a set of power bolts that are outlined in an outer spiral thread which interlocks with the inner spiral thread.

Abstract: The invention relates to a method for producing a polymer from a first component and a second component by means of a reactor (50), wherein reaction heat in the reactor (50) is discharged via an evaporative cooler (40), wherein gaseous exhaust vapour in the reactor (50) is supplied to the evaporative cooler (40), and condensed exhaust vapour is guided from the evaporative cooler (40) back into the reactor (50). In this way, the first component and/or second component are supplied at least partially via the evaporative cooler (40) and moved from the evaporative cooler (40) into the reactor (50). The invention also relates to a system for producing a polymer, comprising a reactor (50) and an evaporative cooler (40) for discharging reaction heat in the reactor (50). In addition, the evaporative cooler (40) has at least one filling opening (46) for filling in the first and/or second component.

Abstract: Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C): wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1<n?5.

Abstract: Provided are a methacrylic resin having high heat resistance, highly controlled birefringence, and excellent color tone and transparency, and a production method, a molded article, and an optical or automotive component of the methacrylic resin. The methacrylic resin includes N-substituted maleimide monomer-derived structural units (B) in a main chain thereof in a proportion of 5 mass % to 40 mass %. The N-substituted maleimide monomer-derived structural units (B) include a structural unit represented by formula (1). The methacrylic resin has a glass transition temperature of higher than 120° C. and not higher than 160° C. The content of components that exhibit light absorption at a wavelength of 400 nm in methanol-soluble content of the methacrylic resin is more than 0 mass % and not more than 2 mass % as calculated in terms of N-phenylmaleimide.

Abstract: An object of the present invention is to provide a bismaleimide (D-BMI) modified product in which an amino group of dimer diamine (DDA) is maleimidized, which has the good heat resistance, and has the sufficiently enhanced processability, and a method for producing the same. There are provided: <1> A bismaleimide (D-BMI) modified product in which an amino group of dimer diamine is maleimidized, the bismaleimide modified product having the following characteristics: 1) An acid value of the D-BMI modified product is 2 mg-KOH/g or less. 2) In 1H-NMR, when quantitative comparison is performed using an integrated value (A) of a peak corresponding to a proton of a methylene group directly bound to a nitrogen atom of a maleimide group and an integrated value (B) of a peak corresponding to a vinyl proton of a maleimide group, A/B is 1.25 or more and 2.00 or less.

Abstract: A composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing polymer ranges from about 2,000 to about 100,000 and a branching ratio (a) of the silicon-containing polymer calculated by Equation 1 ranges from about 0.25 to about 0.50. ?=k·Ma??[Equation 1] In Equation 1, ? is an intrinsic viscosity of a silicon-containing polymer, M is an absolute molecular weight of a silicon-containing polymer, a is a branching ratio, and k is an intrinsic constant.

Abstract: The present invention provides an a polyarylene sulfide (PAS) production device provided with a supply tube for loading corrosive materials such as a strong alkali into a reaction vessel, wherein prescribed amounts of various raw materials or the like can be accurately loaded into the reaction vessel without causing decreases in production efficiency due to the replacement of the supply tube or the repair of the reaction vessel in response to the corrosion of the supply tube or the like. The present invention is a production device, and a PAS production device, in particular, provided with a reaction vessel equipped with one or a plurality of supply tubes, at least one of the supply tubes having an insert pipe, which is preferably detachable, to be inserted into an outer supply tube; and a tip opening of the insert pipe being positioned further inward than an inside wall of the reaction vessel.

Abstract: A method for preparing a tetrapolymer includes preparing a suspension including an aromatic vinyl-based monomer, an unsaturated nitrile-based monomer, an N-substituted maleimide-based monomer, an ?-alkyl styrene-based monomer, and an inorganic dispersing agent, and polymerizing the suspension. The method for preparing a tetrapolymer can be useful in lowering a reaction temperature using suspension polymerization, and reducing a reaction time, thereby maximizing productivity. A tetrapolymer prepared by the method is also provided.

Abstract: A compound of the formula (I) wherein m and n are independently of one another a number from 1 to 50; the ratio of m/n is 1:10 to 10:1, the recurring units X can have the same definition or different definitions, the recurring units Y can have the same definition or different definitions and the recurring units X and Y can have a random, alternating or block distribution; the recurring unit X is a group of the formula (I-a) and the recurring unit Y is a group of the formula (I-b) the radicals R1 independently of one another are C1-C12alkyl or C3-C12cycloalkyl; the radicals R2 and R4 are independently of one another C12-C30alkyl; the radicals R3 are independently of one another hydrogen, C1-C12alkyl or C3-C12cycloalkyl.

Abstract: Provided are a resin composition for an optical film including an alkyl(meth)acrylate unit, a benzyl(meth)acrylate unit, a (meth)acrylic acid unit, and a unit expressed by Chemical Formula I, an optical film, a polarizing plate, and an image display device using the resin composition.

Abstract: Disclosed are a heat-resistant SAN resin, a method of preparing the same, and a heat-resistant ABS resin composition comprising the same. More particularly, a heat-resistant SAN resin comprising 60 to 75 wt % of ?-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound (except for ?-methylstyrene), the heat-resistant SAN resin having a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C., a method of preparing the same, and a heat-resistant ABS resin composition comprising the same are disclosed.

Abstract: A member for vehicle according to the present invention includes a resinous substrate, and a protective film being formed on a surface of the resinous substrate partially at least. The protective film is made by curing a curing-type coating-agent composition containing: Component (A) (e.g., an isocyanuric ring-containing urethane (meth)acrylate compound) in an amount of from 20 to 80 parts by mass; Component (B) (e.g., an isocyanuric ring-containing tri(meth)acrylate compound free from any urethane bond) in an amount of from 10 to 70 parts by mass; Component (C) (e.g., a reaction product) between a colloidal silica and an alkoxysilane compound having a maleimide group) in amount of from 1 to 35 parts by mass; a radical-polymerization initiator serving as Component (D) in an amount of from 0.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

Abstract: The use of Michael addition curing chemistries in compositions comprising sulfur-containing polymers such as polythioethers and polysulfides useful in aerospace sealant applications are disclosed. Sulfur-containing adducts comprising terminal Michael acceptor groups are also disclosed.

Abstract: A copolymer obtained by polymerizing two or more types of monomers, wherein among fractions obtained by dividing an eluate showing peaks relative to the copolymer, in an elution curve obtained by gel permeation chromatography (GPC), into eight fractions in order of fractionation, such that each fraction has the same volume, a difference between a monomer composition ratio of a copolymer contained in a first eluted fraction and a monomer composition ratio of all copolymers is ?3 mol % to +3 mol % in any of the constitutional units derived from the respective monomers.

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more. The thermally reversible adhesive comprises a functionalized aminopropyl methylsiloxane-dimethylsiloxane copolymer containing a plurality of dienophile functional groups bonded through an imide linkage, preferably maleimide groups, and a crosslinking agent containing a plurality of diene functional group, preferably furan groups. The reactive groups undergo a Diels Alder crosslinking reaction.

Abstract: A curable resin composition containing a specific vinyl compound obtained by vinylation of a terminal of a bifunctional phenylene ether oligomer having a polyphenylene ether structure in a molecule and a specific bismaleimide compound having at least two maleimide groups in a molecule, a curable film comprising the above composition, a cured product obtained by curing the above composition, and a film obtained by curing the curable film. The above resin composition is excellent in curability even in the presence of oxygen, is curable at a low temperature and is capable of giving a cured product having a low dielectric constant, a low dielectric loss tangent, high heat resistance, excellent mechanical properties, excellent chemical resistance and excellent flame retardancy.

Abstract: The present invention provides polyimide applied to the buffer coating of semiconductors and a photosensitive resin composition including the same. The polyimide is a polyimide polymer represented by Chemical Formula 1 below. Further, the present invention provides a photosensitive resin composition, including 1) BDA-series soluble polyimide having an i-ray permeability of 70% or more; 2) a polyamic acid having elongation of 40% or more; 3) a novolak resin, and 4) diazonaphthoquinone-series photosensitive substance and having a high resolution, high sensitivity, an excellent film characteristic, and mechanical physical properties which are the requirements of semiconductor buffer coating.

Abstract: The present invention provides a flow improver for oils and fats, by which a sufficient improvement in the flowability of oils and fats can be achieved, when oils and fats are used as fuels. This flow improver for oils and fats comprises a polymer including constitutional units (I), (II), and (III), and having a weight-average molecular weight in the range of 5,000 to 100,000. The molar fraction a of the constitutional unit (I) is in the range of 0.4 to 0.8, the molar fraction b of the constitutional unit (II) is in the range of 0.1 to 0.3, and the molar fraction c of the constitutional unit (III) is in the range of 0.1 to 0.3.

Abstract: There is provided a photosensitive resin composition for a microlens. A photosensitive resin composition for a microlens, comprising a component (A), a component (B) and a component (C), wherein the component (A) is a polymer having a maleimide structural unit of Formula (1), the component (B) is a cross-linking agent, and the component (C) is a photosensitizing agent.

Abstract: The invention provides a method for immobilization of biological molecules such as nucleic acids, peptides and proteins onto the surface of a glass or plastic solid support.

Abstract: A polymerizable monomer represented by the following formula (1) wherein at least one of Ar1 to Ar3 is substituted by a group represented by the following formula (2) and which is substituted by one or more groups comprising a polymerizable functional group. Ar1 to Ar3 are a substituted or unsubstituted aryl group having 6 to 40 ring carbon atoms, Ar6 is a substituted or unsubstituted aryl group having 6 to 40 ring carbon atoms and Ar4 and Ar5 are a substituted or unsubstituted arylene group having 6 to 40 ring carbon atoms.

Abstract: Disclosed are enamel varnish compositions for an enamel wire and an enamel wire using the same. The present invention relates to enamel varnish compositions for an enamel wire in which a polymeric resin component is included in an organic solvent, wherein the polymeric resin component includes a first polyamideimide resin; and a second resin having polyamideimide in which a triazine ring is introduced into a major chain. The enamel wire, in which such a coating pigment composition is applied to the innermost layer, has the increased adhesivity of the insulated coating layer to the conducting wire, as well as the excellent physical properties such as the wear resistance and flexibility, etc.

Abstract: Disclosed herein are various amine treated maleic anhydride containing polymers and compositions thereof, which are useful for forming self-imageable films. In some embodiments, such polymers encompass norbornene-type repeating units containing pendent silyl groups and maleic anhydride-type repeating units where at least some of such maleic anhydride-type repeating units are either ring-opened or have been transformed into maleimide repeat units. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: Disclosed herein are various amine treated maleic anhydride containing polymers and compositions thereof, which are useful for forming self-imageable films. In some embodiments, such polymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such maleic anhydride-type repeating units are either ring-opened or have been transformed into maleimide repeat units. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: The liquid crystal display of the present invention includes: a liquid crystal panel including vertical alignment liquid crystals encapsulated between a first substrate and a second substrate; a first compensation layer stacked on one side of the first layer; a first polarizing layer stacked on one side of the first compensation layer; a second compensation layer stacked on one side of the second substrate; and a second polarizing layer stacked on one side of the second compensation layer, wherein the first compensation layer is comprised of a polyimide copolymer, and the polyimide copolymer is a copolymer of a monomer mixture comprising maleimide compounds and aromatic vinyl compounds. The liquid crystal display provides significantly improved lateral viewing angle.

Abstract: The present invention relates to an acrylic copolymer resin containing: 1) an alkyl (meth)acrylate-based monomer; 2) a (meth)acrylate-based monomer containing an aliphatic ring and/or an aromatic ring; and 3) at least an imide-based monomer or a styrene-based monomer, to a resin composition containing said acrylic copolymer resin and a resin containing an aromatic ring and/or an aliphatic ring in the main chain thereof, to an optical film comprising said resin composition, and to a liquid crystal display device comprising said optical film. The optical film according to the present invention has excellent heat resistance, optical transparency, etc.

Abstract: The present invention relates to polymers, especially polymers useful as hydrogels, and to use of hydrogels for repair or restoration of tissue. In particular, the polymers and hydrogels of the present invention can be used for the repair or restoration of cartilage, especially articular cartilage. The polymers comprise at least a monomer for binding water, a monomer for imparting mechanical properties and a monomer for binding to an extracellular protein. The hydrogels comprise a polymer comprising at least a monomer for binding water and a monomer for binding to an extracellular protein. Crosslinking polymers by binding of said extra-cellular matrix protein forms hydrogels.

Abstract: An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.

Abstract: A disclosure provides a resin composition, a prepreg, and a substrate employing the same. According to an embodiment of the disclosure, the resin composition includes a polyphenylene ether compound, and a bismaleimide. The prepreg includes a cured product of the resin composition. The substrate includes a product fabricated by the resin composition or the prepreg.

Abstract: A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract: The present invention relates to a polymer having a novel structure and a photosensitive resin composition comprising the same. A photosensitive resin composition comprising a polymer according to the present invention has a high taper angle and excellent adhesion strength. Accordingly, the photosensitive resin composition comprising the polymer according to the present invention may be applied to various photosensitive materials, and particularly, may be preferably applied when a color filter pattern for LCD is manufactured.

Abstract: The present invention provides an acrylic thermoplastic resin containing 50 to 95% by mass of a repeating unit (X) derived from a methacrylate monomer represented by the following formula (1), 0.1 to 20% by mass of a repeating unit (Y1) derived from an N-substituted maleimide monomer (a) represented by the following formula (2), and 0.1 to 49.9% by mass of a repeating unit (Y2) derived from an N-substituted maleimide monomer (b) represented by the following formula (3), regarding the total amount of the repeating unit (X), the repeating unit (Y1), and the repeating unit (Y2) as 100% by mass: The absolute value of a photoelastic coefficient (C) of the acrylic thermoplastic resin is not greater than 3.0×10?12 Pa?1. The halogen atom content is less than 0.47% by mass with reference to the mass of the acrylic thermoplastic resin.

Abstract: Provided is a liquid crystal alignment layer of which a constituent member is a polymer represented by the general formula (I).

Abstract: A polymer for an optical film including: a repeating unit A including a repeating unit represented by the following Chemical Formula 1; and a repeating unit B derived from a monomer including an unsaturated bond copolymerizable with the repeating unit A: wherein, in Chemical Formula 1, the variables R1 to R9 are defined herein.

Abstract: The present application relates to a fluorine-based resin having a novel structure and a photosensitive resin composition including the same. The photosensitive resin composition including the fluorine-based resin according to an exemplary embodiment of the present application has excellent photosensitivity and developability and can increase a contact angle of a coating film to prevent a water stain. Accordingly, the photosensitive resin composition including the fluorine-based resin according to the exemplary embodiment of the present application may be applied to various photosensitive materials, and particularly, may be preferably applied when a color filter pattern for LCD is manufactured.

Abstract: The present inventions are directed to novel medical adhesives and their use, for example, in biomedical applications. These compositions and applications allow for improved adhesion with and between mammalian tissues.

Abstract: The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group.

Abstract: The present invention provides a polymer compound represented by the following Formula (1) and a method for production thereof, a pigment dispersant, a pigment dispersion composition, and a photocurable composition respectively using the polymer compound, and a color filter and a method for production thereof [R1: an organic linking group having a valency of (m+n); R2: a single bond or a divalent organic linking group; A1: a monovalent organic group containing at least one moiety selected from an organic dye structure, a heterocyclic structure, an acidic group, a group having a basic nitrogen atom, a urea group, a urethane group, a group having a coordinating oxygen atom, a hydrocarbon group having 4 or more carbon atoms, an alkoxysilyl group, an epoxy group, an isocyanate group, and a hydroxyl group; m=1 to 8, n=2 to 9 (m+n=3 to 10); and P1: polymer skeleton].

Abstract: The present discovery uses monomers which contain reversible photo-crosslinkable groups in addition to primary polymerizable groups. The mechanical properties of these materials and the reversibility of the photo-activated shape memory effect demonstrate the effectiveness of using photo-irradiation to effect change in modulus and shape memory effect. In the preferred embodiment the reaction mixture includes a photo-reactive monomer comprising a photo reactive group and a polymerizable group; a second monomer, which is more preferably a mixture of monomers, which are acrylate based; a multi-functional crosslinking agent, preferably 1,6 hexanediol diacrylate (HDODA); an initiator, preferably a free radical initiator; and a fifth, optional, component which is a modifying polymer. The mixture of the second monomer, crosslinking agent, and initiator comprise the base polymer matrix into which the photo-reactive monomer is incorporated.

Abstract: A resin composition of the present invention includes a maleimide derivative (A) represented by a general formula (1) and a bis-maleimide compound (B) represented by a general formula (2). In the general formula (1), R1 represents a straight chain or branched alkylene group having 1 or more carbon atoms, R2 represents a straight chain or branched alkyl group having 5 or more carbon atoms, and the sum of carbon atoms of R1 and R2 is 10 or less. In the general formula (2), X1 represents —O—, —COO—, or —OCOO—, R3 represents a straight chain or branched alkylene group having 1 to 5 carbon atoms, R4 represents a straight chain or branched alkylene group having 3 to 6 carbon atoms, and m is an integer of 1 or more and 50 or less.

Abstract: An adhesive composition includes an acrylic copolymer having at least one alkyl group, at least one hydroxyl group, and at least one furyl based group; and a curing agent.

Abstract: Conventional cross-linked cyclic olefin polymers do not have a sufficiently low linear expansion coefficient. A compound having a structure represented by the following formula (a).

Abstract: Provided is a liquid crystal alignment layer of which a constituent member is a compound represented by the general formula (I).

Abstract: Provided are a photoreactive polymer that includes a multi-cyclicmulticyclic compound at as its main chain and a method of preparing the same. The photoreactive polymer exhibits excellent thermal stability since it includes a multi-cyclicmulticyclic compound having a high glass transition temperature at as its main chain. In addition, the photoreactive polymer has a relatively large vacancy so that a photoreactive group can move relatively freely in the main chain therein. As a result, a slow photoreaction rate, which is a disadvantage of a conventional polymer material used to form an alignment layer for a liquid crystal display device, can be overcome.