Imide Monomer Patents (Class 526/262)
  • Patent number: 5143969
    Abstract: Heat-curable bismaleimide resins contain a bismaleimide, an aromatic dialkenyl compound as comonomer and also from 1 to 40% by weight of a monoalkenyl compound, preferably 2-hydroxy-3-allylbiphenyl, as reactive diluent.
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: September 1, 1992
    Assignee: BASF Aktiengesellschaft
    Inventors: Bernd Reck, Rita A. Laschober, Dale Gerth, Jack D. Boyd
  • Patent number: 5140083
    Abstract: A maleimide random copolymer contains an N-substituted compound structural unit, an unsaturated peroxycarbonate structural unit and optionally a vinyl monomer structural unit. In place of the unsaturated peroxycarbonate structural unit, an unsaturated peroxyester unit may be contained. A process for preparing a maleimide graft copolymer comprises polymerizing a mixture of an N-substituted maleimide compound and a vinyl monomer in the presence of a random vinyl copolymer containing peroxy groups with active oxygen content.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: August 18, 1992
    Assignee: Nippon Oil and Fats Co., Ltd.
    Inventors: Kenji Kato, Yasumi Koinuma, Kazunori Doiuchi, Seigo Kinoshita, Yukinori Haruta
  • Patent number: 5138001
    Abstract: Novel vinylphenyl compound which gives, as a copolymer with other vinyl compound copolymerizable therewith, a crosslinked polymer excellent in birefringence, transparency, heat resistance and moisture absorption resistance. The crosslinked polymer is advantageously useful as a disk substrate.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: August 11, 1992
    Assignee: Tokuyama Soda Kabushiki Kaisha
    Inventors: Masahide Ueda, Kanehiro Nakamura, Yoshifumi Matsumoto, Mari Kusaba
  • Patent number: 5138000
    Abstract: Curable compositions comprising(a) an aromatic bismaleimide of formula ##STR1## wherein R.sub.1 and R.sub.2 are identical or different and each is C.sub.1 -C.sub.4 alkyl, and R.sub.3 and R.sub.4 are each independently of the other a hydrogen or halogen atom, or a mixture of an aromatic bismaleimide of formula I and N,N'-4,4'-methylenebis(phenylmaleimide),(b) an alkenyl phenol, an alkenyl phenol ether or a mixture thereof, with the proviso that the alkenyl moiety contains at least 3 carbon atoms,are readily processable, well suited for the fabrication or prepregs or fibre-reinforced composites, and give mouldings having excellent ultimate strength.
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: August 11, 1992
    Assignee: Ciba-Geigy Corporation
    Inventor: Andreas Kramer
  • Patent number: 5137928
    Abstract: The invention relates to ultrasonic contrast agents composed of microparticles which contain a gas and polyamino-dicarboxylic acid-co-imide derivatives, to processes for their preparation and to their use as diagnostic and therapeutic agents.
    Type: Grant
    Filed: April 24, 1991
    Date of Patent: August 11, 1992
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Raimund Erbel, Rainer Zotz, Volker Krone, Michael Magerstadt, Axel Walch
  • Patent number: 5138028
    Abstract: Novel polyimide and polyisoimide oligomers and precursors thereof, end-capped with diaryl substituted acetylene.These novel end-capped polyimide or polyisoimides oligomers are useful for composites, molding compounds, adhesives, and electronic applications.
    Type: Grant
    Filed: January 21, 1992
    Date of Patent: August 11, 1992
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Charles W. Paul, Rose A. Schultz, Steven P. Fenelli
  • Patent number: 5134214
    Abstract: Copolymers comprising, in polymerized form, a 1,1-substituted arylethylene comonomer and at least one polymaleimide comonomer, are prepared using a system that provides a reduced onset of polymerization temperature thereby allowing removal of the copolymer from the mold after a preliminary curing period followed by transfer to an oven, a less expensive piece of equipment, for additional curing; thus making the mold, a more expensive piece of equipment, available for the next polymerization run.
    Type: Grant
    Filed: May 15, 1991
    Date of Patent: July 28, 1992
    Assignee: The Dow Chemical Company
    Inventors: Kenneth J. Bruza, Robert A. Kirchhoff
  • Patent number: 5134188
    Abstract: The present invention relates to aqueous solutions or dispersions of hydroxy-functional copolymers containing imide structural units corresponding to the formula ##STR1## The present invention also relates to a process for the production of these aqueous solutions or dispersions of hydroxy-functional copolymers containing imide structural units by reacting anhydride-functional and optionally carboxyl-functional copolymers corresponding to the hydroxy-functional copolymers with aminoalcohols and optionally aminocarboxylic acids. In a further embodiment of the process the hydroxy-functional copolymers may be reacted with lactones resulting in ring opening and the formation of ester groups.
    Type: Grant
    Filed: March 26, 1991
    Date of Patent: July 28, 1992
    Assignee: Bayer Aktiengesellschaft
    Inventors: Harald Blum, Volker Schneider, Peter Hohlein
  • Patent number: 5128428
    Abstract: Curable resin composition comprising a compound (A) having one or more maleimide groups within the molecule thereof, and vinlbenzyl compound (B) obtained by reacting amines with halomethylstyrene in the presence of alkali.The composition exhibits excellent low-temperature curability, heat resistance and mechanical strength.
    Type: Grant
    Filed: April 4, 1991
    Date of Patent: July 7, 1992
    Assignee: Showa Highpolymer Co., Ltd.
    Inventors: Norio Shinohara, Kazuo Ohtani, Toshiaki Hanyuda
  • Patent number: 5124386
    Abstract: Disclosed is a resin composition comprised of (A) 100 parts by weight of a polymer containing at least 10% by weight of methacrylimide units and (B) 0.5 to 20 parts by weight of a specific polyhydric alcohol compound and/or a specific compound having polyoxyethylene segments. This resin composition provides a shaped article having a good antistatic property and heat resistance.
    Type: Grant
    Filed: January 11, 1991
    Date of Patent: June 23, 1992
    Assignee: Mitsubishi Rayon Company Ltd.
    Inventors: Naoki Yamamoto, Hiroshi Mori, Masaharu Fujimoto, Hiroki Hatakeyama
  • Patent number: 5124419
    Abstract: Imido prepolymers and thermally stable imido polymers, well adapted for the production of a wide variety of useful molded or laminated shaped articles, or cellular materials, are prepared by reacting, at elevated temperatures, (a) at least one N,N'-bismaleimide, with (b) at least one aromatic di(meth)acrylate, in the presence of a catalytically effective amount of (c) an imidazole.
    Type: Grant
    Filed: May 7, 1991
    Date of Patent: June 23, 1992
    Assignee: Rhone-Poulenc Chimie
    Inventor: Rene Arpin
  • Patent number: 5120823
    Abstract: Toughened bismaleimide resin systems capable of preparing carbon fiber reinforced composites having compression after impact strengths of greater than 40 Ksi are prepared from bismaleimide matrix resin systems containing a member of a limited set of soluble thermoplastic polyimides in particulate form.
    Type: Grant
    Filed: April 3, 1991
    Date of Patent: June 9, 1992
    Assignee: BASF Aktiengesellschaft
    Inventor: Jack D. Boyd
  • Patent number: 5120857
    Abstract: Bisimides of the formula I ##STR1## in which, for example, R.sup.1 is hydrogen, x is 1, y is zero and R is bis-(1,4-phenylene)-methane are intermediates for the preparation of polymers having excellent physical properties, and are suitable for the production of mouldings, coatings and adhesive joints and, in particular, for the production of prepregs and heat-resistant composite materials.
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: June 9, 1992
    Assignee: Ciba-Geigy Corporation
    Inventors: Andreas Kramer, Sameer H. Eldin
  • Patent number: 5118771
    Abstract: An erasable optical disk having a grooved substrate which is made of a cured polymer product formed by radical polymerization of a composition comprising a specific type of (meth)acrylate compound alone or in combination with at least one compound selected from N-substituted maleimide compounds and epoxy-novolac (meth)acrylate compounds. The substrate has a good heat resistance, a good transparency, and can be produced at a high productivity.
    Type: Grant
    Filed: March 9, 1987
    Date of Patent: June 2, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Inoue, Takahiro Matsuo
  • Patent number: 5116935
    Abstract: A preferred class of polyimide oligomers include (1) linear, difunctional crosslinking oligomers prepared by condensing an imidophenylamine end cap with a lower alkylene diamine or a polyaryldiamine such as 3,3'-phenoxyphenylsulfone diamine and with a dianhydride, particularly 4,4'-phenoxyphenylsulfone dianhydride; and (2) multidimensional, crosslinking, polyimide oligomers having an aromatic hub and at least two radiating arms connected to the hub, each arm including a crosslinking imidophenylamine end cap at its distal end and at least two imide linkages.Blends, prepregs, and composites can be prepared from the oligomers.
    Type: Grant
    Filed: May 18, 1989
    Date of Patent: May 26, 1992
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5115060
    Abstract: Copolymers of olefinically unsaturated sulfonate salts such as sodium methallylsulfonate and .alpha.,62 -unsaturated dicarboxylic acid imide such as maleimide are produced by free radical polymerization. The copolymers and their derivatives are useful as water-soluble dispersants.
    Type: Grant
    Filed: November 21, 1990
    Date of Patent: May 19, 1992
    Assignee: Arco Chemical Technology, L.P.
    Inventor: Roger A. Grey
  • Patent number: 5115061
    Abstract: Novel compounds comprising N-propionitrile maleimides are formed by the reaction of an N-propionitrile maleamic acid and acetic anhydride. N-propionitrile maleamic acids are formed by the reaction of an aminopropionitrile with maleic anhydride. The novel maleimides may be homopolymerized or copolymerized with one or more comonomers.
    Type: Grant
    Filed: September 10, 1990
    Date of Patent: May 19, 1992
    Assignee: General Electric Company
    Inventor: Charles F. Parsons
  • Patent number: 5112507
    Abstract: Novel copolymers of unsaturated acidic reactants and high molecular weight olefins wherein at least 20 percent of the total high molecular weight olefin comprises the alkylvinylidene isomer are useful as dispersants in lubricating oils and fuels and also may be used to prepare polysuccinimides and other post-treated additives useful in lubricating oils and fuels.
    Type: Grant
    Filed: September 29, 1989
    Date of Patent: May 12, 1992
    Assignee: Chevron Research and Technology Company
    Inventor: James J. Harrison
  • Patent number: 5109087
    Abstract: A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.
    Type: Grant
    Filed: January 12, 1990
    Date of Patent: April 28, 1992
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Shigeki Naitoh, Yasuhisa Saito, Yasuhiro Hirano, Kazuo Takebe, Kunimasa Kamio, Youichi Ueda
  • Patent number: 5104967
    Abstract: The solvent-resistance and thermal stability of polyamideimides of the general formulae: ##STR1## is improved by capping the amideimides with a crosslinking functionality (Y) containing a residue selected from the group of: ##STR2## wherein R.sub.1 =lower alkyl, lower alkoxy, aryl, aryloxy, substituted alkyl, substituted aryl (either including hydroxyl or halo-substituents), halogen, or mixtures thereof;j=0, 1, or 2;G=--CH.sub.2 --, --O--, --S--, --SO.sub.2 --, --SO--, --CO--, --CHR--, or --CR.sub.2 --;R=hydrogen, lower alkyl, or phenyl;T=methallyl or allyl;Me=methyl;R.sub.2 =a trivalent organic radical; andR.sub.3 =a divalent organic radical.The amideimide oligomers may be linear or multidimensional, and can be processed into blends, prepregs, or composites. Methods of making these amideimides and intermediates useful in the syntheses are also described.
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: April 14, 1992
    Assignee: The Boeing Company
    Inventors: Clyde H. Sheppard, Hyman R. Lubowitz
  • Patent number: 5102972
    Abstract: A class of di-ortho-substituted bismaleimides undergo uncatalyzed Michael addition with polyhydric phenols to afford chain-extended bismaleimides having a significantly wider processing window than the non-extended parent. The fully cured resins show improved fracture toughness, generally have comparable or superior dielectric constant and dielectric loss, and show no degradation in other properties such as resistance to moisture, to methylene chloride, and coefficient of thermal expansion.
    Type: Grant
    Filed: July 25, 1990
    Date of Patent: April 7, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Raymond J. Swedo, Joseph J. Zupancic
  • Patent number: 5098971
    Abstract: A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF.sub.3, C.sub.2 F.sub.5 or C.sub.3 F.sub.7. The resin is excellent in moldability, thermal resistance and electric properties, has a low dielectric constant, is hence suitable as a molding material and can be used for molding materials, wiring boards, layer insulation films of LSI, etc.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: March 24, 1992
    Assignees: Hitachi, Ltd., Central Glass, Co.
    Inventors: Akira Nagai, Shin Nishimura, Akio Takahashi, Masamichi Maruta, Akihiro Fukui
  • Patent number: 5096603
    Abstract: A water soluble polymer which is characterized by the formula: ##STR1## wherein x is 50 mole percent or 662/3 mole percent or 75 mole percent and y+z is 50 mole percent, when x is 50 mole percent, y+z is 331/3 mole percent, when x is 662/3 mole percent, and y+z is 25 mole percent, when x is 75 mole percent, wherein the molar ratio of y to z is about 100:1 to 1:100, and M.sup.+ is hydrogen or a metal cation selected from the group consisting of lead, aluminum, iron and Groups IA, IIA, IB and IIB of the Periodic Table of Elements and the level of sulfonation based upon the styrene monomer is about 75 to about 100 mole percent, and R is an alkyl group having about 6 to about 22 carbon atoms.
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: March 17, 1992
    Assignee: Exxon Research and Engineering Company
    Inventors: Dennis G. Peiffer, Jan Bock, Julie Elward-Berry
  • Patent number: 5095074
    Abstract: A novel polyfunctional maleimide-based thermosettable resin composition comprising: (a) at least one polyfunctional maleimide compound selected from the group consisting of bismaleimide and polymaleimide, and (b) at least one ether derivative of an alkenylphenol.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: March 10, 1992
    Assignee: Hercules Incorporated
    Inventors: Sung G. Chu, Harold Jabloner, Tuyen T. Nguyen
  • Patent number: 5087681
    Abstract: A novel method for preparing a thermosetting imide resin composition which consists of chemically reacting a liquid mixture of a carboxy-(CTBN) or vinylidene-(VTBN) polybutadiene/acrylonitrile and a co-reactant comprisinga. at least one N,N'-bisimide of an unsaturated carboxylic acid of general formula I ##STR1## wherein B represents a divalent radical containing a carbon-carbon double bond and A represents a divalent radical having at least two carbon atoms, orb. the imide resin reaction product of an least one N,N'-bisimide of general formula I and at least one primary organic diamine or organic hydrazide, orc. the imide resin reaction product of at least one N,N'-bisimide of general formula I, at least one monoimide, and at least one organic hydrazide,to yield a thermosetting imide resin composition containing copolymerized CTBN or VTBN and co-reactant. A resin composition prepared by this method may be cured at a temperature between 100.degree. C. and 350.degree. C.
    Type: Grant
    Filed: August 8, 1989
    Date of Patent: February 11, 1992
    Assignee: Secretary of State for Defence in her Majesty's Government of United Kingdom
    Inventors: Anthony J. Kinloch, Stephen J. Shaw
  • Patent number: 5086139
    Abstract: A modified bisimide resin is prepared by copolymerizing a bisimide monomer and a reactive triene which contains a conjugated double bond capable of Diels-Alder reaction with the bisimide and an isolated double bond. The copolymerization of a bisimide with a reactive triene such as myrcene provides a modified bisimide having good fracture toughness.
    Type: Grant
    Filed: June 29, 1990
    Date of Patent: February 4, 1992
    Assignee: Shell Oil Company
    Inventor: Larry S. Corley
  • Patent number: 5081198
    Abstract: A tough, high performance polyimide is provided by reacting a triple bond conjugated with an aromatic ring in a bisethynyl compound with the active double bond in a compound containing a double bond activated toward the formation of a Diels-Adler type adduct, especially a bismaleimide, a biscitraconimide, or a benzoquinone, or mixtures thereof. Addition curing of this product produces a highly linear polymeric structure and heat treating the highly linear polymeric structure produces a thermally-stable aromatic addition-type thermoplastic polyimide, which finds utility in the preparation of molding compounds, adhesive compositions, and polymer matrix composites.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: January 14, 1992
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5079319
    Abstract: Vinyl unsaturated copolymers are described which are obtained in a two-step process and which consist of monomeric units A, B, C, D and E, copolymerized in a first step, and in a second step reacted with a reactive vinyl monomer M.sub.v, and in which A is a siloxane or fluorine containing vinyl monomer, 30-70% by weight; B is NN-dimethylacrylamide or N-vinylpyrrolidone, 30-70% by weight; C is an active hydrogen containing vinyl monomer, 0.5-25% by weight; D are other copolymerizable comonomers, 0-30% by weight, and E is a chain transfer agent, 0-10 mol percent. M.sub.v is a vinyl unsaturated isocyanate.These vinyl unsaturated polymers are useful, either by themselves or in combination with other copolymerizable vinyl monomers, as heat or UV-curable coatings or glass, plastic, wood, paper, textiles, metal or ceramics, said coatings possessing low surface energies and low refractive indices.
    Type: Grant
    Filed: February 13, 1991
    Date of Patent: January 7, 1992
    Assignee: Ciba-Geigy Corporation
    Inventor: Karl F. Mueller
  • Patent number: 5077380
    Abstract: Compounds containing at least one cyanate group, at least one maleimide group and at least one mesogenic or rodlike moiety are prepared by reacting one or more aminophenols containing one or more mesogenic or rodlike moieties with a stoichimetric quantity of a maleic anhydride per amine group of said aminophenol and then cyanating the resulting phenolic functional maleimide.
    Type: Grant
    Filed: October 11, 1990
    Date of Patent: December 31, 1991
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5077363
    Abstract: Heat-curable resins which are suitable for fabricating carbon fiber prepregs and fiber composites by winding and resin transfer molding contain a bismaleimide, an alkenylphenol and N-vinylpyrrolidone.
    Type: Grant
    Filed: April 6, 1990
    Date of Patent: December 31, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Philipp Eisenbarth, Roland Peter, Thomas Folda
  • Patent number: 5075398
    Abstract: Thermosetting compositions consist of a homogeneous mixture of an ethylenically unsaturated compound, a bismaleimide compound or a bismaleimide containing composition and an acid compound, with optionally further copolymerizable compounds and usual additives. The thermosetting composition are useful as a coating resin, a laminating resin or for the manufacture of shaped articles.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: December 24, 1991
    Assignee: DSM Resins B.V.
    Inventors: Adrianus J. de Koning, Jacobus Loontjens
  • Patent number: 5075456
    Abstract: Imides of the formula I ##STR1## In which R.sub.1, R.sub.2 and R.sub.4 independently of one another are hydrogen or methyl, R.sub.3 is a direct bond or a C.sub.2 -C.sub.20 aliphatic radical which can be interrupted by O atoms or a mononuclear or polynuclear C.sub.5 -C.sub.20 cycloaliphatic or C.sub.6 -C.sub.20 aromatic radical or is a group of the formula II ##STR2## in which T is methylene, isopropylidene, CO, O, S or SO.sub.2 and R.sub.5 is hydrogen or phenyl, can be crosslinked either photochemically or by heat and produce polymers having excellent properties, in particular a very high resistance to heat. They are particularly suitable for the production of heat-resistant photolithographs or as matrix resins for the production of composite materials.
    Type: Grant
    Filed: February 27, 1990
    Date of Patent: December 24, 1991
    Assignee: Ciba-Geigy Corporation
    Inventors: Alfred Renner, Christian Vonlanthen, Edward Irving, Christopher P. Banks
  • Patent number: 5073615
    Abstract: A high temperature heat resistant methacrylate-maleimide copolymer having at least 90% by weight methyl methacrylate monomer and up to about 10% by weight maleimide monomer to form a clear, weather-resistant copolymer having glass transition temperatures from about 105.degree. C. to about 131.degree. C. and a method of manufacture of the copolymers through an extremely high conversion bulk polymerization process.
    Type: Grant
    Filed: March 13, 1989
    Date of Patent: December 17, 1991
    Assignee: Continental Polymers, Inc.
    Inventor: Jyi-Sheng J. Shen
  • Patent number: 5071929
    Abstract: A thermoset resin composition comprises a compound (A) having one or more maleimido groups in its molecule and at least one vinylbenzyl ether compound (B) selected from the group consisting of compounds (B.sub.1) having at least two vinylbenzyl ether groups bonded to a naphthalene nucleus in its molecule and compounds (B.sub.2) having at least two vinylbenzyl ether groups bonded to a benzene nucleus having at least one substituent selected from the group consisting of hydroxyl groups, alkyl groups and alkoxy groups in its molecule.The composition exhibits excellent low-temperature curing properties, heat resistance and mechanical strength.
    Type: Grant
    Filed: September 26, 1989
    Date of Patent: December 10, 1991
    Assignee: Showa Highpolymer Co., Ltd.
    Inventors: Toshiaki Hanyuda, Kojiro Mori, Kazuo Ohtani, Norio Shinohara, Jouji Shibata
  • Patent number: 5066771
    Abstract: A method for producing an imide oligomer soluble in an organic solvent by reacting three components of an aromatic tetracarboxylic acid or its derivative, an aromatic diamine and an end-capping agent, wherein the aromatic diamine is a condensation product of o-ethylamiline with formaldehyde, and the end-capping agent is an ethynyl phthalic acid of the formula: ##STR1## wherein R is a hydrogen atom or a monovalent group selected from the group consisting of an aliphatic group, an alicyclic group and an aromatic group, or its derivative.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: November 19, 1991
    Assignee: Kozo Iizuka, Director-General of Agency of Industrial Science and Technology
    Inventors: Seiichi Hino, Shoichi Satou, Kouji Koura, Osamu Suzuki
  • Patent number: 5064919
    Abstract: A process for producing a molded article by introducing a reactive liquid mixture which comprises a cycloalkene containing dicyclopentadiene, a norbornene-type monomer containing at least one N-substituted 5-membered cyclic imide group and a metathesis polymerization catalyst system and which has moderated metathesis polymerizability into a mold in which the liquid mixture is metathesis polymerized, and a multi-part polymerizable composition for producing the molded article.
    Type: Grant
    Filed: November 24, 1989
    Date of Patent: November 12, 1991
    Assignee: Hercules Incorporated
    Inventors: Shigeyoshi Hara, Zen-ichiro Endo, Hiroshi Mera
  • Patent number: 5064921
    Abstract: The present invention relates to hydroxy functional polyacrylate copolymers having a molecular weight (M.sub.n) of about 2000 to 30,000 and containinga) about 1 to 70% by weight of structural units corresponding to the formula ##STR1## The present invention also relates to a process for the preparation of these hydroxy functional copolymers by reacting the corresponding anhydride functional copolymers with amino alcohols. Finally, the present invention also relates to the use of these hydroxy functional copolymers as binder components in combination with polyisocyanates for the production of polyurethane lacquers, coatings, sealants, adhesives or printing inks.
    Type: Grant
    Filed: May 25, 1990
    Date of Patent: November 12, 1991
    Assignee: Bayer Aktiengesellschaft
    Inventors: Harald Blum, Josef Pedain, Peter Hohlein, Christian Wamprecht
  • Patent number: 5064922
    Abstract: The present invention relates to copolymers having a weight average molecular weight (M.sub.w) of 1500 to 75,000, prepared from olefinically unsaturated compounds and containing 0.1 to 4.5% by weight of primary amino groups in the form of structural units corresponding to formula I ##STR1## wherein Q is a saturated aliphatic-cycloaliphatic hydrocarbon radical of the type obtained by removing the amino groups from an aliphatic-cycloaliphatic diprimary diamine containing an amino group attached to a primary carbon atom and an amino group attached to a secondary or tertiary carbon atom.The present invention also relates to a process for the production of these copolymers.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: November 12, 1991
    Assignee: Bayer Aktiengesellschaft
    Inventors: Christian Wamprecht, Josef Pedain, Harald Blum
  • Patent number: 5059657
    Abstract: A process for the polymerization of selected acrylic and maleimide monomers by contacting the monomers with a diazotate, cyanate or hyponitrite, and N-chlorosuccinimide, N-bromosuccinimide or a diazonium salt. The polymers produced can themselves initiate further polymerization. Block copolymers can be produced.
    Type: Grant
    Filed: August 6, 1990
    Date of Patent: October 22, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Joe D. Druliner, Michael Fryd
  • Patent number: 5059665
    Abstract: Heat-curable bismaleimide resins containing an aromatic alkenyl compound, preferably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated temperatures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.
    Type: Grant
    Filed: August 15, 1990
    Date of Patent: October 22, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Philipp Eisenbarth, Roland Peter, Thomas Folda
  • Patent number: 5057578
    Abstract: Copolymeric macromonomers containing alkyl acrylate and methacrylate units and units of polysiloxanylalkyl esters of acrylic and/or methacrylic acids and a terminal carbon-carbon double bond organo group are useful for copolymerizing with other acrylate or methacrylate esters to make improved polymer compositions such as for contact lenses.
    Type: Grant
    Filed: April 10, 1990
    Date of Patent: October 15, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Harry J. Spinelli
  • Patent number: 5049632
    Abstract: Polymers of N-cycloalkyl norbornene dicarboximides exhibit high glass transition temperature, low moisture pickup and low dielectric permittivity. Poly(N-cyclohexyl norbornene dicarboximide) has a Tg of 280.degree. C., dielectric constant of about 2.5 and boiling water equilibrated weight gain of only about 2%. Monomers have melting point less than 150.degree. C. and are advantageously prepared by melt polymerization with conventional metathesis ring-opening polymerization catalysts.
    Type: Grant
    Filed: December 19, 1990
    Date of Patent: September 17, 1991
    Assignee: Monsanto Company
    Inventor: Jawed Asrar
  • Patent number: 5047259
    Abstract: Copolymers of long-chain alkyl acrylates corresponding to the following formulaCH.sub.2 .dbd.CR.sup.1 --CO--OR.sup.2 (I)in which R.sup.1 is a hydrogen atom or a methyl group and R.sup.2 is the residue of a C.sub.16-34 fatty alcohol, with N-containing olefins containing acrylate or methacrylate functions can be used as flow control agents for powder coatings.
    Type: Grant
    Filed: August 25, 1989
    Date of Patent: September 10, 1991
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Doris Oberkobusch, Wolfgang Gress, Bernd Wegemund
  • Patent number: 5037923
    Abstract: Imido prepolymers and thermally stable imido polymers, well adapted for the production of a wide variety of useful molded or laminated shaped articles, or cellular materials, are prepared by reacting, at elevated temperatures, (a) at least one N,N'-bismaleimide, with (b) at least one aromatic di(meth)acrylate, in the presence of a catalytically effective amount of (c) an imidazole.
    Type: Grant
    Filed: June 26, 1990
    Date of Patent: August 6, 1991
    Assignee: Rhone-Poulenc Chimie
    Inventor: Rene Arpin
  • Patent number: 5032451
    Abstract: A class of benzocyclobutene/bisimide copolymers having superior toughness are disclosed. The copolymers are derived from bisbenzocyclobutene monomers by one of structures ##STR1## in which R is selected from unsubstituted and non-electrophilic substituted phenylene, naphthalenediyl and ##STR2## X is selected from oxygen, sulfur, nitrogen, --CH.sub.2 -- and --C(CH.sub.3).sub.2 --; and X' is selected from O, S, N and --CH.sub.2 --. Also disclosed is a method for preparing a bisbenzocyclobutene/bisimide copolymer having a Tg greater than 200.degree. C. and a Mode I fracture toughness greater than 2 MPa.m.sup.1/2.
    Type: Grant
    Filed: September 6, 1990
    Date of Patent: July 16, 1991
    Assignee: Shell Oil Company
    Inventor: Larry S. Corley
  • Patent number: 5021524
    Abstract: This invention relates to a polymerization process initiated by selected organo-silicon, -germanium and -tin compounds, and to "living" polymers therefrom.
    Type: Grant
    Filed: April 14, 1988
    Date of Patent: June 4, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Ira B. Dicker, Walter R. Hertler
  • Patent number: 5021519
    Abstract: A non-elastomeric epoxy having a mol wt less than about 10,000 and curing agent therefor ("epoxy-curing-agent"), both of which (epoxy/epoxy-curing-agent) are liquid while at curing temperatures, provide a continuous liquid phase in which a polyimide (PI) generally, and a bisimide (BI) in particular, may be homogeneously dispersed to form a fluidized dispersion. In one embodiment, the less viscous epoxy/epoxy-curing-agent is the dispersive medium (continuous phase) and the PI the dispersed or discontinuous phase. In the more preferred embodiment, the epoxy/epoxy-curing-agent and PI are miscible, forming a single liquid phase in which the PI is homogeneously dispersed. In each embodiment, the epoxy is essentially unreactive with the PI. Upon curing the epoxy in a first stage, to form a polymeric epoxy matrix (also referred to as "cured epoxy resin" herein) at a temperature below 150.degree. C.
    Type: Grant
    Filed: March 24, 1988
    Date of Patent: June 4, 1991
    Assignee: Aluminum Company of America
    Inventors: Uday M. Varde, Michael N. Tackie, Rakesh K. Gupta
  • Patent number: 5021487
    Abstract: The invention comprises a curable acrylic ester formulation which contains a maleimide thermal additive which is essentially miscible in conventional acrylic monomers. The formulation comprises a substantially solvent free adhesive formulation comprising:a) an acrylic functional maleimide compound of the formula: ##STR1## where the R.sub.1 groups are independently H or C.sub.1 -C.sub.3 alkyl, R.sup.2 is lower alkylene and R.sup.3 is defined as for R.sup.1 ;b) at least one acrylate or methacrylate monomer or prepolymer compound other than a compound as defined in a); and,c) an effective amount of an anaerobic or thermal free radical initiator.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: June 4, 1991
    Assignee: Loctite Corporation
    Inventor: Philip Klemarczyk
  • Patent number: 5019634
    Abstract: Group Transfer Polymerization (GTP) process for preparing a "living" polymer, the process comprising contacting under polymerizing conditions in a polymerization medium, at least one acrylic or maleimide monomer with an initiator which is a tetracoordinate organosilicon, organotin or organogermanium compound having at least one GTP initiating site and a catalyst which is or is a source of an anion selected from the group consisting of bifluoride, fluoride, cyanide, azide or a selected oxyanion, or a selected Lewis acid or Lewis base, the process further characterized in that the initiator or the anion or Lewis acid catalyst is chemically attached (grafted) to a solid support that is insoluble in the polymerization medium.
    Type: Grant
    Filed: October 6, 1989
    Date of Patent: May 28, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Fritz P. Boettcher, Ira B. Dicker, Richard C. Ebersole, Walter R. Hertler
  • Patent number: 5013804
    Abstract: Curable mixtures containing(a) an aromatic bismaleimide of formula ##STR1## wherein R.sub.1 and R.sub.2 are identical or different and each is C.sub.1 -C.sub.4 alkyl, and R.sub.3 and R.sub.4 are each independently of the other a hydrogen or halogen atom, and (a) a propenyl compound of formula II ##STR2## wherein m and n are each independently of the other 1 or 2, Z is a hydrogen atom or C.sub.1 -C.sub.4 alkoxy, and A is a radical of formula IIa, IIb or IIc ##STR3## wherein D is --SO.sub.2 -- or --CO-- or is a radical of formula ##STR4## wherein X and X.sub.1 are each independently of the other --CO--, --SO.sub.2 -- or --O--, and p is 0 or 1, E is phenylene or a radical of formula V ##STR5## wherein G is ##STR6## and q is 0 or 1, are readily processable, well suited for the preparation of prepregs or fibre-reinforced composites, and give mouldings having excellent fracture toughness.
    Type: Grant
    Filed: April 3, 1990
    Date of Patent: May 7, 1991
    Assignee: Ciba-Geigy Corporation
    Inventor: Andreas Kramer