Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.

Abstract: The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.

Abstract: A process for the production of PET foams includes the extrusion of a mixture of PET, epoxy resin, catalyst consisting of imidazole, derivatives of imidazole or mixtures thereof plus a blowing agent, wherein the homopolymerization reaction of the epoxy phase is performed in the extruder, upstream of the introduction of the blowing agent. Compared to the methods of the known art, a process according to the invention offers the advantage of providing a stable PET foam, in which the structure of the polymer chains is kept unaltered. The system therefore has viscoelasticity characteristics which allow the PET/epoxy homopolymer to receive the expanding action of the blowing agent, as far as the innermost and deepest layers of foam also even if they have a significant thickness.

Abstract: Various apparatuses, systems and methods involve high mobility materials. In accordance with one or more example embodiments, a material includes a conjugated molecule and a side chain bonded to the conjugated molecule. The side chain includes at least one of a siloxane-terminated unit and a derivative of a siloxane-terminated unit that enhance solubility of the conjugated molecule. Further, the side chain facilitates a ?-stacking distance between the conjugated molecules when stacked (e.g., in an organic semiconductor film), thereby facilitating carrier mobility between the conjugated molecules.

Abstract: An emulsifier for emulsion polymerization includes a compound represented by the following general: X=H, —(CH2)a—SO3M, —(CH2)b—COOM, —PO3M2, —P(B)O2M, or —CO—CH2—CH(SO3M)-COOM Y= Z=

Abstract: Thermoplastic molding compositions comprising A) from 29 to 97.5% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of melamine cyanurate, C) from 0.5 to 10% by weight of an organic phosphorus compound based on 9,10-dihydro-9-oxa-10-phosphaphenanthrene oxide (DOPO) as parent structure, D) from 1 to 50% by weight of a fibrous filler, the aspect ratio (L/D) of which is from 4 to 25, and the arithmetic average fiber length of which is from 40 to 250 ?m, and E) from 0 to 50% by weight of further additives, where the total of the percentages by weight of components A) to E) is 100%.

Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.

Abstract: A metal complex dye is disclosed, containing a dye as a ligand represented by the following formula (1). A color toner and a color filter containing the metal complex dye are also disclosed.

Abstract: The present invention provides compositions (small molecules, oligomers and polymers) that can be used to modify charge transport across a nanocrystal surface or within a nanocrystal-containing matrix, as well as methods for making and using the novel compositions.

Abstract: Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where the coating has the high Tg phenoxy-type material and a PHAE; or the article surface comprises a coating includes a PHAE; or the coating has the high Tg phenoxy-type material and a PHAE, and the article surface includes a coating layer of a PHAE.

Abstract: A luminescent polymer, suitable for use in an active layer of an organic light-emitting device, organic solid state lasers, a photovoltaic cell or an electrochromic display and exhibiting good stability and microstructure control, which has the structure wherein Ar1 and Ar2 are aromatic or heteroaromatic rings, such as phenyl, biphenyl, fluorene, thiophene, pyridyl, or their substituted aromatic or heteroaromatic rings with or without deuterium, and R1 and R2 are independently each selected from the group consisting of hydrogen, deuterium, substituted or unsubstituted alkyl, alkoxyl, aryl and heteroaryl, or halogen, wherein D represents deuterium and n is an integer greater than 3. Electronic devices and methods of making them which employ these luminescent polymers are also described.

Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: Gel formation is prevented in the reaction between a sulfonyl-chloride-containing resin and a polyamine by first forming an adduct between the resin with an aminophenol. The prevention of gel formation enables sulfonyl-chloride containing resin to be used in admixture with acrylates and epoxy resin to form a polyamine-curable adhesive composition having excellent adhesive properties and chemical resistance.

Abstract: Compositions comprising a blend of an inorganic base, an organic base, a monofunctional organic nucleophile or a multifunctional organic nucleophile and a thermoplastic hydroxy-functionalized polyetheramine can be formed into films and laminate structures by using conventional extrusion techniques. Containers and other molded parts can be fabricated from the films or laminate structures by using conventional fabricating techniques for thermoplastic polymers such as compression molding, injection molding, extrusion, thermoforming, blow molding and solvent casting.

Abstract: Phenol aralkyistion polymers can be prepared by reaction among a phenolic monomer, at least one styrenic monomer and an aryl diolefin. A phenolic monomer can be initially aralkylated in the presence of an acid catalyst with a first portion of at least one styrenic monomer to obtain an aralkylated phenol. The aralkylated phenol thereafter can be reacted with an aryl diolefin to obtain a phenol aralkylation polymer. Optionally, (though preferably) the phenol aralkylation polymer is further aralkylated with a second portion of at least one styrenic monomer. By employing specific catalyst concentrations, reactant concentrations, reaction temperatures, and reaction times, the formation of mono-functional and non-functional by-products is substantially reduced.

Abstract: Conjugated polymers and copolymers with strong luminescent properties and balanced charge transporting/injection properties are disclosed. Methods of manufacturing such polymers and copolymers and optoelectronic devices fabricated with such polymers and copolymers are disclosed. A conjugated luminescent polymer with tunable charge transport is prepared according to the following polymerization reaction: mM1+nM2→(M1)m(M2)n wherein M1 is a monomer having at least two reactive functional groups and at least one chemically bonded charge transporting chromophore group possessing electron-withdrawing character and M2 is a monomer having at least two reactive functional groups and at least one chemically bonded charge transporting chromophore group possessing electron-donating character, wherein m and n are stoichiometric quantities of the monomers M1 and M2, respectively, wherein m and n are varied to tune the charge transport property of the conjugated luminescent polymer.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: A thermosetting epoxy resin composition having a low environmental load and a high flame retardancy includes a compound represented by the following formula 1 and a novolac compound represented by the following formula 2 as essential components:X--R.sub.1 --X Formula 1X being a functional group, capable of reacting with a functional group Y of the formula 2; and R.sub.1 being a crystalline functional group having a phenyl group, ##STR1## Y being a functional group capable of reacting with the functional group X in the compound of the formula 1; R.sub.2 being a functional group capable of reacting with the functional group X, a hydrocarbon having 1 to 3 carbon atoms, or hydrogen; and n is an integer of 0 to 20.

Abstract: Mannich-derivatized polyphenolic compositions prepared by the reaction of a phenolic compound having at least two phenol rings with an aldehyde and an amphoteric compound having both a basic moiety and an acidic moiety are disclosed. Methods for utilizing such compositions in the control of stickie formation in papermaking are also disclosed.

Abstract: Provided is a curable composition comprising (A) a phenolic compound having a carbon-carbon double bond, (B) a compound having an SiH group, and (C) a foaming agent. The composition can be foamed and cured at room temperature or under heat at relatively low temperatures, and is poorly corrodable and poorly toxic.

Abstract: An epoxy resin composition for sealing a photo-semiconductor element, comprising(A) an epoxy resin,(B) a curing agent and(C) a polyether-modified silicone oil which is represented by the following general formula (1) ##STR1## wherein m, n and a are each independently a number of 1 or more, b is 0 or a positive number, and R is an alkyl group of 1 to 6 carbon atoms or H,and has a weight average molecular weight of 1,000 to 100,000, a silicone unit content {[(m+n+2)/(m+n+2+a+b+1)].times.100} of 10 to 60% and a polyether unit content {[(a+b+1)/(m+n+2+a+b+1)].times.100} of 40 to 90%and a photo-semiconductor device produced by sealing a photo-semiconductor element with the epoxy resin composition.

Abstract: A polymer including mers of the formulas: ##STR1## and copolymers or mixtures thereof.

Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which. shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

Abstract: For use in microelectronics applications, an improvement to an epoxy resin composition to reduce bleeding of the composition when it is applied to a silicon or metal substrate consists in the addition to the composition of a polyhydroxyl compound having two or three hydroxyl groups, or of a monohydroxyl compound that also contains one or more phenyl groups. The hydroxyl compound is present in the composition in a ratio by weight to the flexibilizing compound of from 1:3 to 1:10.

Abstract: The present invention relates to crosslinkable thermoplastic compositions comprising a plurality of crosslinkable moieties, capable of undergoing addition polymerization, incorporated by functionalization of the precursor poly(hydroxy ethers). The poly(hydroxy ethers) comprise recurring moieties derived from aromatic dihydroxy compounds. The crosslinkable polymeric compositions are crosslinked to obtain crosslinked thermoset polymeric compositions of the invention. The polymeric compositions of the inventions can be suitably used either as an active guiding layer, and/or as a NLO active upper and lower cladding layers in an electro-optic device. The polymeric compositions can also be used as non-NLO polymers for the upper and lower cladding layers, prior to orientation by the application of an electric field.

Abstract: Epoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

Abstract: Thermoplastic hydroxy ether polymers containing inertly substituted or unsubstituted stilbene and ether linkages in the backbone chain and pendant hydroxyl moieties are prepared by reacting (a) an inertly substituted or unsubstituted dihydroxy-stilbene with (b) a diglycidyl ether and, optionally, (c) a difunctional monomer under conditions sufficient to cause the hydroxyl moieties to react with the epoxy moieties to form ether linkages and pendant hydroxyl moieties. The polymers exhibit excellent oxygen barrier properties and are useful in packaging oxygen-sensitive materials.

Abstract: An epoxy resin composition contains an epoxy resin as a substratal resin and incorporates therein a polyallylphenol curing agent. The composition may also contain a polyphenol compound. The epoxy resin may have a naphthalene skeleton. The epoxy resin composition may also include a blend of two or more epoxy resins.

Abstract: An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) ##STR1## wherein each R.sub.1, independent of the other, represents hydrogen, a hologen atom, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups, and X represents ##STR2## and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product exhibiting low hygroscopicity and high adhesiveness.

Abstract: A polymeric fluorescent substance which is soluble, has a number-average molecular weight of 10.sup.3 -10.sup.7 and contains three different repeating units --Ar--CH.dbd.CH--, wherein Ar is a arylene group having 6-20 carbon atoms, a heterocyclic compound group having 4-20 carbon atoms or a divalent group --Ar.sub.1 --X.sub.1 --R--X.sub.2,--Ar.sub.2. At least one of the repeating units has at least one substituent selected from alkyl, alkoxy and alkylthio groups having 2-22 carbon atoms, aryl and aryloxy groups having 6-60 carbon atoms and heterocyclic compound groups having 4-60 carbon atoms. Ar.sub.1 and Ar.sub.2 are each an arylene group having 6-20 carbon atoms or a heterocyclic compound group having 4-20 carbon atoms and may contain at least one substituent selected from alkyl, alkoxyl and alkylthio groups having 2-22 carbon atoms, aryl and aryloxy groups having 6-60 carbon atoms and heterocyclic compound groups having 4-60 carbon atoms.

Abstract: Curable compositions containing (A) one or more epoxy resins, one (B) or more curing agents and (C) one or more cure controlling catalysts wherein at least one of components (A) or (B) or both components (A) and (B) contain a mesogenic moiety are prepared. These curable compositions permit processing at higher temperatures and improved properties. They are useful in the preparation of coatings, castings, electrical or laminates or composites and the like.

Abstract: The diglycidyl ether of 4,4'-dihydroxy-.alpha.-methylstilbene is prepared.

Abstract: Mesogen containing biaxially oriented films are prepared from curable mixtures containing an epoxy resin and a curing agent therefor. Certain of the mesogen containing biaxially oriented films possess unique properties, such as a metallic like, highly reflective appearance. These films are useful in adhesives, coatings, laminates or composites and the like.

Abstract: Laminates containing one or more plies of substrate material impregnated with a composition containing (A) one or more epoxy resins, (B) one or more curing agent and (C) about 0.00005 to about 0.1 mole per epoxide equivalent of cure controlling catalyst, wherein at least one of components (A) or (B) contain at least one mesogenic moiety, which, optionally, has been subjected to either (a) the application of an electric field, (b) the application of a magnetic field, (c) drawing or shear forces, or (d) any combination thereof, are prepared.

Abstract: A diamino-alpha-alkylstilbene useful as an epoxy resin curing agent is represented by the following Formula I: ##STR1## wherein R is independently hydrogen, a C.sub.1 -C.sub.10 hydrocarbyl(oxy) group or a halogen, nitro, nitrile, phenyl or --CO--R.sup.1 group wherein R.sup.1 is independently hydrogen or a C.sub.1 -C.sub.3 hydrocarbyl group; each R.sup.4 is independently hydrogen or a C.sub.1 -C.sub.10 hydrocarbyl group; and Y is a ##STR2## group wherein n=0 or 1.

Abstract: Adducts containing terminating nitro (nitroso) groups and one or more mesogenic moieties are prepared by reacting (A) at least one compound containing an average of more than one vicinal epoxide group per molecule with (B) at least one compound containing one or more nitro (nitroso) groups and an average of one reactive hydrogen atom per molecule; with the proviso that at least one member of components (A) and (B) contains a mesogenic moiety. Reduction of these adducts provides amines which are useful as curing agents for epoxy resins.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: An adduct is prepared by reacting (A) a compound containing at least one epoxy group per molecule, with (B) a compound containing at least one epoxide reactive group per molecule selected from the group consisting of phenolic, thiol, secondary amine and carboxyl; wherein (i) when compound (A) is a polyepoxide, compound (B) contains a single epoxide reactive group per molecule; (ii) when compound (A) is a monoepoxide it is a monoglycidyl ether and compound (B) contains at least two epoxide reactive groups per molecule; and (iii) at least one of components (A) and (B) contains a rodlike mesogenic moiety. These adducts are useful in the preparation of polyurethanes.

Abstract: A phenolic resin is represented by the formula (1) ##STR1## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2. A method for producing the phenolic resin involves reacting in the presence of an acid catalyst 3a,4,7,7a-tetrahydroindene and a phenol represented by the formula (2) ##STR2## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and n denotes 0, 1 or 2. An epoxy resin composition for encapsulation contains: (a) a curable epoxy resin, (b) the above phenolic resin, (c) a curing promotor, and (d) an inorganic filler.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Abstract: A curable resorcinol-based epoxy resin is disclosed having the general structural formula (I) ##STR1## wherein at least one of R.sub.1, R.sub.2, or R.sub.3 is selected from the group consisting of (a) the general structural formula (II) ##STR2## wherein R.sub.4 is selected from the group consisting of hydrogen and an alkyl group having 1 to about 4 carbon atoms, and (b) an allyl group.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: Phenoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: Advanced epoxy resins containing mesogenic moieties are prepared from epoxy resins which contain such moieties.

Abstract: Advanced epoxy resin compositions are prepared by reacting epoxy resins with active hydrogen-containing compounds which contain mesogenic moieties. Curable compositions containing these advanced epoxy resin compositions are useful in adhesives, coatings, laminates castings and the like.