From 1,2-epoxy-containing Phenolic Reactant Or With 1,2-epoxy-containing Reactant Patents (Class 528/87)
  • Patent number: 10189744
    Abstract: Described is the use of a hardening composition for epoxide-amine-based, multicomponent mortar compositions, particularly the use of one of these epoxide-amine-based, multicomponent mortar compositions for chemical fastening purposes. The multicomponent mortar composition contains (A) a resin component, which comprises as a curable compound at least an epoxide resin and optionally at least one reactive diluent, and (B) a hardener component, which comprises a hybrid hardener, wherein the resin component (A) and/or the hardener component (B) optionally comprises other ingredients selected from among inorganic and/or organic compounds. The hybrid hardener is a mixture of (a) at least one amine, selected from among aliphatic, alicyclic, or aromatic amines, as a hardener, and (b) a novolac resin as catalyst, wherein the novolac resin is contained in a quantity of 30 to 45 percent by weight, relative to the total weight of the hybrid hardener.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: January 29, 2019
    Assignee: Hilti Aktiengesellschaft
    Inventors: Alex Dureault, Stephen Jewitt, Christian Kloninger
  • Patent number: 10106630
    Abstract: An unsaturated deoxybenzoin compound has the structure (I) wherein R1, R2, R3, R4, R5, R6, R7, R8, and n are defined herein. A polymer including at least one group derived from a deoxybenzoin compound having structure (I), (II), or a combination thereof is also described, wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, and n are defined herein.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: October 23, 2018
    Assignee: THE UNIVERSITY OF MASSACHUSETTS
    Inventors: Todd Emrick, E. Bryan Coughlin, Megan Szyndler, Aabid A. Mir, Justin C. Timmons
  • Patent number: 9901904
    Abstract: Provided are a superabsorbent polymer and a preparation method thereof. The superabsorbent polymer according to the present invention has excellent gel bed permeability (GBP) and suction power, thereby being usefully applied to hygiene products such as diapers.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: February 27, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Tae Hwan Jang, Seong Beom Heo, Mi Young Kim, Min Gyu Kim
  • Patent number: 9765179
    Abstract: Disclosed is a method for producing a biphenyl-skeleton-containing epoxy resin represented by Formula (1) described below including a step of allowing polyvalent hydroxy biphenyl obtained by a production step including a regioselective cross-coupling reaction to react with epihalohydrin. (In the formula, k1 and l1 each represent an integer of 0 to 4, m and n each represent an integer of 1 to 5, R1 and R2 each independently represent a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent group, and R1 and R2 may be identical to each other or different from each other. (Provided that left and right phenyl structures of a biphenyl skeleton are different from each other.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: September 19, 2017
    Assignee: DIC CORPORATION
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita
  • Patent number: 9670310
    Abstract: Embodiments of the present disclosure are directed to heterogeneous advanced epoxy resins formed by reacting a mononuclear aromatic diglycidyl ether and a diphenol, more specifically, embodiments of the present disclosure are directed to heterogeneous advanced epoxy resins formed by reacting the mononuclear aromatic diglycidyl ether and the diphenol in a molar ratio of the mononuclear aromatic diglycidyl ether to the diphenol in a range from 1.5 to 1.0 to 5.0 to 1.0.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: June 6, 2017
    Assignee: BLUE CUBE IP LLC
    Inventors: Ray Drumright, Peter Margl
  • Patent number: 9550912
    Abstract: Compositions, methods, and coating composition using a curing agent are provided herein. In one embodiment, a curing agent for epoxy resins may be prepared using a formulation including: (a) an adduct of: (i) a diglycidyl ether of a bisphenol, and (ii) a first polyamine; (b) a second polyamine; and (c) water; wherein the composition has an amine hydrogen equivalent weight, based on solids, of less than or equal to 105.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: January 24, 2017
    Assignee: HEXION INC
    Inventors: David Flosser, Patricia Garcia, Larry Steven Corley, Bedri Erdem, Lucy Phan
  • Patent number: 9464161
    Abstract: The masterbatch-type latent curing agent for epoxy resin comprised of (A) glycidyl ether type epoxy resin, (B) a fine particle of mixture containing (B-1) 50 to 99 mass % of adduct-modified amine obtained by reacting the glycidyl ether type epoxy resin with a polyamine compound and (B-2) 50 to 1 mass % of a phenol compound, (C) an active hydrogen compound and (D) an isocyanate compound; and a one-component curable epoxy resin composition containing the masterbatch-type latent curing agent and epoxy resin.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: October 11, 2016
    Assignee: Adeka Corporation
    Inventor: Daisuke Sato
  • Patent number: 9416219
    Abstract: Provided is an RTM moldable chain curing resin composition which can be molded with less energy in a short time, and which makes it possible to obtain a cured product that is superior in mechanical strength. A chain curing resin composition of the present invention includes an alicyclic epoxy compound (A) having two cyclohexene oxides in a molecule and a specific modified bisphenol A-type epoxy resin (B), and the content of the alicyclic epoxy compound (A) is 25 to 90% by mass, when the total of the component (A) and the component (B) is taken as 100% by mass.
    Type: Grant
    Filed: October 4, 2010
    Date of Patent: August 16, 2016
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Atsushi Nohara, Manabu Kaneko, Noriya Hayashi
  • Patent number: 9062393
    Abstract: The present invention has an object of providing a novel multilayer composite fiber using polyacetal mainly derived from methanol, which is a petroleum-independent raw material, and having a low environmental load, and also providing a nonwoven fabric obtained by thermally bonding such fibers. According to the present invention, a multilayer composite fiber comprising a resin containing polylactic acid as a main component and a resin containing polyacetal as a main component, in which the components both form continuous layers in an axial direction of the fiber, and also a nonwoven fabric obtained by thermally bonding such fibers, can be provided.
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 23, 2015
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akira Ito, Satoshi Nagai
  • Patent number: 9024347
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: May 5, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Bae Moon, Jae Hun Jeong, Sang In Yoon
  • Patent number: 9018335
    Abstract: Bis-Phenol A (BPA) can now be replaced in industrial processes by BPA substitutes. The BPA substitutes can have structures that are derivatives of BPA. The BPA substitutes can be used in preparing epoxy composition, polycarbonate compositions, and polysulfonate compositions or for other uses in place of BPA.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: April 28, 2015
    Assignee: Empire Technology Development LLC
    Inventor: Masahiro Ueda
  • Publication number: 20150111991
    Abstract: There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.
    Type: Application
    Filed: May 17, 2013
    Publication date: April 23, 2015
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Mitsuharu Kitamura, Yutaka Matsuura, Hisayuki Kuwahara, Tomotaka Wada, Yuiga Asai
  • Publication number: 20150104651
    Abstract: The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.
    Type: Application
    Filed: March 19, 2013
    Publication date: April 16, 2015
    Inventors: Kazuo Arita, Hajime Watanabe
  • Publication number: 20150087749
    Abstract: A curable composition including (a) at least one divinylarene dioxide; (b) at least one phenol, wherein the phenol is unsubstituted at a 2-, 4-, or 6-phenolic ring position; and (c) at least one acid compound-related cure catalyst; and a cured product made from the above curable composition.
    Type: Application
    Filed: May 23, 2013
    Publication date: March 26, 2015
    Applicant: Dow Global Technologies LLC
    Inventor: Maurice J. Marks
  • Publication number: 20150080486
    Abstract: A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition.
    Type: Application
    Filed: May 19, 2012
    Publication date: March 19, 2015
    Inventor: Robert Valentine Kasowski
  • Publication number: 20150079793
    Abstract: Provided is an adhesion-promoting composition between a curable composition for imprints and a substrate, which excellent in adhesiveness and can control pattern failure. An adhesion-promoting composition used between a curable composition for imprints and a substrate, which comprises a compound having a molecular weight of 500 or larger and having a reactive group, and has a content of a compound, with a molecular weight of 200 or smaller, of more than 1% by mass and not more than 10% by mass of a total solid content.
    Type: Application
    Filed: November 21, 2014
    Publication date: March 19, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Akiko HATTORI, Hirotaka KITAGAWA, Yuichiro ENOMOTO
  • Publication number: 20150034928
    Abstract: The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G?(80)) of this optical-device surface-sealing composition, measured at 80° C. after said composition is heated from 40° C. to 80° C. at 5° C./min and then held at 80° C. for 30 minutes, is between 1.0×103 and 2.0×106 Pa.
    Type: Application
    Filed: February 21, 2013
    Publication date: February 5, 2015
    Inventors: Yugo Yamamoto, Setsuko Oike, Masatoshi Takagi
  • Publication number: 20150018456
    Abstract: Disclosed herein are polyglycidyl ethers of the formula: where R, m, Q, p and Z are as defined here. Also disclosed are methods of forming said polyglycidyl ethers and methods of using said polyglycidyl ethers to make epoxy resin oligomers and polymers, including powder coatings.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 15, 2015
    Inventors: Robert E. Hefner, JR., Erich J. Molitor
  • Patent number: 8933189
    Abstract: Disclosed are salt compositions of lysinol and dicarboxylic acids; and lysinol derived polymers including polyamide, polyimide, polyurea, cross-linked polyurea comprising urethane linkages, polyurea foams, cross-linked polyurea foams, and lysinol-epoxy thermoset.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 13, 2015
    Assignee: E I du Pont de Nemours and Company
    Inventors: Kenneth Gene Moloy, Mark A Scialdone
  • Publication number: 20150005458
    Abstract: The present invention relates to a matrix material for a carbon fiber-reinforced composite. The matrix material for the carbon fiber composite contains a matrix resin as a resin component. The matrix resin contains at least a first epoxy resin containing a polyfunctional glycidylamine-type epoxy resin having four epoxy groups in one molecule. The matrix resin may further contain at least one of a p-aminophenol-type epoxy resin having three epoxy groups in one molecule, and a tetramethylbiphenol-type solid epoxy resin having two epoxy groups in one molecule. The matrix resin has an average epoxy equivalency of 99 to 163.
    Type: Application
    Filed: June 17, 2014
    Publication date: January 1, 2015
    Inventor: Shuichiro Yoshida
  • Patent number: 8912294
    Abstract: Polyamines A1 of formula (I) or (II). They can be easily synthesized from readily available raw materials and have no primary amino groups or only a low content of primary amino groups and thus exhibit hardly any blushing. Their viscosity is relatively low, compared with polyamine/polyepoxide adducts of the polyamine on which polyamine A1 is based. Thus epoxy resin compositions can be formulated that are free of benzyl alcohol and free of blushing.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: December 16, 2014
    Assignee: Sika Technology AG
    Inventor: Pierre-Andre Butikofer
  • Publication number: 20140357829
    Abstract: The invention provides a novel platform for minimal- or non-flammable polymers, which is based purely on hydrocarbon systems and does not need additives of any kind A key feature is that the hydrocarbons disclosed herein are characterized by degradation mechanisms that produce few flammable volatiles. For example, 2,4,4?,6-tetrahydroxydeoxybenzoin is employed as a multifunctional cross-linker in conjunction with bis-epoxydeoxybenzoin, affording new resins that combine excellent physical and mechanical properties with low flammability.
    Type: Application
    Filed: May 19, 2014
    Publication date: December 4, 2014
    Inventors: Todd Emrick, Justin Timmons, Megan Warner Szyndler
  • Publication number: 20140336348
    Abstract: A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide with a high shear mixer to produce a first mixed feed; c) contacting the first mixed feed with a phase separator to form a first organic product comprising an epoxy resin and a first aqueous product; and d) recovering the first organic product, is disclosed.
    Type: Application
    Filed: December 6, 2012
    Publication date: November 13, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Jesus A. Atias, Philip J. Carlberg, Ravindra S. Dixit, Robert M. Drake, Dan Tirtowidjojo, David H. West, William G. Worley, Thomas C. Young
  • Patent number: 8853302
    Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: October 7, 2014
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen, Mark Bryant
  • Patent number: 8846856
    Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: September 30, 2014
    Assignee: Dow Global Technologies LLC
    Inventor: Maurice J. Marks
  • Patent number: 8816038
    Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: August 26, 2014
    Assignee: Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Publication number: 20140228481
    Abstract: A fiber sizing agent is described, which is capable of imparting sufficient sizing properties and fiber spreading properties to reinforced fiber bundles for producing fiber-reinforced composite materials. A fiber sizing agent composition (E) includes a sizing agent (A) having a viscosity of 50 to 3,000 Pa·s at 35° C., and has a thixotropic index of 3 to 15. The sizing agent (A) is preferably an epoxy resin, a polyester resin, a polyurethane resin, a polyether resin or a vinyl ester resin.
    Type: Application
    Filed: September 20, 2012
    Publication date: August 14, 2014
    Applicant: SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Masahito Inoue, Kazuki Aoki
  • Patent number: 8742055
    Abstract: Use a modified, amine-functionalized anion exchange resin as a catalyst to produce a bishalohydrin ether and then dehydrohalogenate the bishalohydrin ether with an aqueous inorganic hydroxide mixture to yield a liquid epoxy resin.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: June 3, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Philip J. Carlberg, H. Robert Goltz, Leming Gu, William I. Harris, David H. West, William G. Worley, Thomas C. Young
  • Patent number: 8735469
    Abstract: A resin material of high strength and high voltage equipment capable of improving the reliability by using the resin material, the resin material being a hardened product including fine particles and resin ingredients, in which the fine particles have hydrophobic groups on the surface and have a particle diameter of 200 nm or less, the resin ingredients have hydrophilic groups on the side chains, and the fine particles form a plurality of linear aggregates inside the resin, thereby forming a dendritic structure.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: May 27, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akihiro Sano, Atsushi Ohtake
  • Patent number: 8703277
    Abstract: Provided is a curable resin composition which can provide a cured article having a low dielectric constant and a low dielectric tangent, and can also provide a cured article having excellent moldability at ordinary press-molding temperatures, excellent heat resistance and excellent adhesion properties. The present invention provides a curable resin composition containing a polyphenylene ether, wherein the average number of phenolic hydroxy groups is 0.3 or more per molecule of the polyphenylene ether, the resin flow amount of the curable resin composition upon curing is 0.3 to 15% inclusive, and a cured article having a dielectric tangent of 0.005 or less at 1 GHz and a glass transition temperature of 170° C. or higher can be produced.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: April 22, 2014
    Assignee: Asahi Kasei E-Materials Corporation
    Inventors: Tetsuji Tokiwa, Takamitsu Utsumi, Masaaki Endo
  • Publication number: 20140107313
    Abstract: The present invention concerns a low-odor, low-viscosity hardener for epoxy resins comprising the amine of formula (I), as well as a method for thinning of hardeners for epoxy resins by adding the amine of formula (I). These hardeners harden with epoxy resins quickly and without blushing to form films of high hardness and little brittleness, even without non-incorporable thinners such as benzyl alcohol. They are especially suitable for low-emission coatings.
    Type: Application
    Filed: July 9, 2012
    Publication date: April 17, 2014
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Urs Burckhardt, Andreas Kramer, Ursula Stadelmann, Edis Kasemi
  • Publication number: 20140094562
    Abstract: Modified polyphenol binder compositions and methods for making and using same are provided. In at least one specific embodiment, the binder composition can include at least one unsaturated monomer and at least one polyphenolic compound. The polyphenolic compound can include a lignin, a tannin, a novolac resin, a modified phenol formaldehyde resin, bis-phenol A, humic acid, or any mixture thereof.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 3, 2014
    Applicant: Georgia-Pacific Chemicals LLC
    Inventors: Cornel Hagiopol, Derek L. Atkinson
  • Publication number: 20140051820
    Abstract: This invention relates generally to the field of quasicrystalline structures. In preferred embodiments, the stopgap structure is more spherically symmetric than periodic structures facilitating the formation of stopgaps in nearly all directions because of higher rotational symmetries. More particularly, the invention relates to the use of quasicrystalline structures for optical, mechanical, electrical and magnetic purposes. In some embodiments, the invention relates to manipulating, controlling, modulating and directing waves including electromagnetic, sound, spin, and surface waves, for pre-selected range of wavelengths propagating in multiple directions.
    Type: Application
    Filed: October 21, 2013
    Publication date: February 20, 2014
    Applicant: THE TRUSTEES OF PRINCETON UNIVERSITY
    Inventors: Paul Joseph Steinhardt, Paul Michael Chaikin, Weining Man
  • Patent number: 8618204
    Abstract: A two-part epoxy-based structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and an oil-displacing agent. The structural adhesive may optionally include reactive liquid modifiers, fillers, secondary curatives, reactive diluents, surfactants, metal salts, pigments and combinations thereof. The structural adhesive may be used to form bonded joints between adherends having clean surfaces, as well as those having surfaces contaminated with hydrocarbon-containing materials, such as oils, processing aids and lubricating agents.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: December 31, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Christopher J. Campbell, Alphonsus V. Pocius, Liya Gorodisher
  • Publication number: 20130330478
    Abstract: Provided is a method for producing a good epoxy resin composition for obtaining fiber-reinforced plastics. A production method for obtaining a fiber-reinforced composite material by impregnating a fiber assembly with an epoxy resin composition and then curing the epoxy resin composition, wherein the epoxy resin composition contains a component [A], a component [B] and a component [C] respectively satisfying the conditions described below. When the blending amount of the component [B] is set to b parts by mass and the blending amount of the component [C] is set to c parts by mass relative to 100 parts by mass of the component [A] contained in the epoxy resin composition, formula (2) is satisfied within the range of formula (1), formula (4) is satisfied within the range of formula (3), and formula (6) is satisfied within the range of formula (5).
    Type: Application
    Filed: February 16, 2012
    Publication date: December 12, 2013
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Hisaya Ushiyama, Yasuhiro Fukuhara, Kazuki Koga, Tomoo Sano, Kazutami Mitani
  • Publication number: 20130300020
    Abstract: Thermosetting resins and thermosetting composites comprising the thermosetting resins are hot-formable. The compositions result from contacting at least one thermosetting resin precursor with at least one hardener selected from acid anhydrides in the presence of at least one transesterification catalyst. The thermosetting resin precursor includes hydroxyl functions and/or epoxy groups, and optionally ester functions, and the total molar quantity of the transesterification catalyst is between 5 and 25% of the total molar quantity of hydroxyl and epoxy contained in the thermosetting resin precursor. Methods for manufacturing articles comprising the thermosetting resins and methods for recycling the thermosetting resins are also disclosed.
    Type: Application
    Filed: January 23, 2012
    Publication date: November 14, 2013
    Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Ludwik Leibler, Francois Tournilhac, Damien Montarnal, Mathieu Capelot
  • Patent number: 8546510
    Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: October 1, 2013
    Assignee: Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami, Kazuhiko Nakahara, Tomomi Fukunaga
  • Publication number: 20130178590
    Abstract: An epoxy resin composition of the following chemical structure (I), where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH3; each R1 is independently —H or a C1 to C6 alkylene radical (saturated divalent aliphatic hydrocarbon radical), Ar is a divalent aryl group or heteroarylene group; and X is a cycloalkylene group, including a substituted cycloalkylene group, where the substituent group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substituent group, for example, a halogen, a nitro, or a blocked isocyanate, an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.
    Type: Application
    Filed: September 14, 2011
    Publication date: July 11, 2013
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Xin Jin, Ray E. Drumright, Bernhard Kainz, Jerry W. White, Robert E. Hefner, JR.
  • Publication number: 20130172507
    Abstract: The method for detecting rotary speed includes: a step (I) for deeming the difference between input power (P) and loss power (A) to be a first order approximation value (PM1) of the mechanical output of an induction motor, and for obtaining a first approximation value (N1=NS(1?S1)) (NS is the synchronous speed) of the rotary speed from the functional relationship (PM1=?S1) of the output (PM) and slip (S) known for the induction motor; a step (II) for obtaining loss power (B1) based on the value (N1); and a step (III) for deeming a second order approximation value (PM2) of the motor output to be P?(A+B1), and for obtaining a second order approximation value (N2=NS(1?S2)) of the rotary speed from the functional relationship (PM2=?S2) (? is the motor constant) of the output (PM) and slip (S).
    Type: Application
    Filed: December 12, 2011
    Publication date: July 4, 2013
    Applicant: DIC CORPORATION
    Inventor: Shouei Ebisawa
  • Patent number: 8461286
    Abstract: A process for the production of liquid epoxy resins, including: contacting a polyhydric phenol and an epihalohydrin in the presence of an ionic catalyst to form a halohydrin intermediate reaction product; concurrently: reacting a portion of the halohydrin intermediate reaction product with an alkali hydroxide to form a solid salt suspended in a liquid mixture including a dehydrohalogenated product and unreacted halohydrin intermediate, wherein the alkali hydroxide is used at less than a stoichiometric amount; and removing water and epihalohydrin as a vapor from the reacting mixture; separating the solid salt from the liquid mixture; reacting at least a portion of the unreacted halohydrin intermediate with an alkali hydroxide in the presence of water to form an organic mixture including an epoxy resin and unreacted epihalohydrin and an aqueous solution including a salt; separating the aqueous mixture from the organic mixture; and separating the unreacted epihalohydrin from the liquid epoxy resin.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: June 11, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Thomas C. Young, Clinton J. Boriack, Elwin G. Collier, Robert M. Drake, Joachim Drewing, Edward J. Kronenberger, Shuji Maeda, Paulo Alfonso Dos Santos Pereira, Andreas Tigges, Roland Werner, Mark S. Burkinshaw
  • Patent number: 8399596
    Abstract: The preparation of epoxy resin compositions which comprise glycidyl ethers comprising cyclohexyl groups and have a low oligomer content is carried out by distillation of compositions which are obtainable by ring hydrogenation of compounds of the general formula (I) where —X— is —CR2—, —CO—, —O, —S—, —SO2—, the radicals R are each, independently of one another, H, C1-6-alkyl, C3-6-cycloalkyl, in which one or more H atoms can be replaced by halogen, the radicals R? are each, independently of one another, C1-4-alkyl, halogen, the indices n are each, independently of one another, 0, 1, 2 or 3, and subsequent reaction of the hydroxyl groups with epichlorohydrin, in thin film evaporators or short path evaporators at a temperature in the range from 150 to 270° C. and a pressure in the range from 0.001 to 1 mbar.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: March 19, 2013
    Assignee: BASF Aktiengesellschaft
    Inventors: Michael Henningsen, Lars Wittenbecher
  • Publication number: 20130052381
    Abstract: This disclosure relates to epoxides, polyepoxide compositions and epoxy resins whose degradation products exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed compositions and articles of manufacture comprising the disclosed compositions.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 28, 2013
    Inventors: Robert R. Gallucci, James A. Mahood, Jean Francois Morizur, Steve Dimond
  • Publication number: 20120269990
    Abstract: Provided are a phenoxy resin composition for transparent plastic substrate and a transparent plastic substrate using the phenoxy resin composition, capable of effectively substituting for a conventional glass substrate since having excellent thermal and chemical resistance, high adhesiveness, low water infiltration, and a small coefficient of linear thermal expansion. In one general aspect, there is provided a phenoxy resin composition for transparent plastic substrate, including: phenoxy resin having a chemical structure expressed as follows: wherein the n value is 35 to 400.
    Type: Application
    Filed: December 5, 2011
    Publication date: October 25, 2012
    Applicant: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon SIM, Yeun-Soo KIM, Ki-Jeong MOON
  • Publication number: 20120238709
    Abstract: An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.
    Type: Application
    Filed: November 10, 2010
    Publication date: September 20, 2012
    Inventors: Guillaume Metral, Johann-Wilhelm Frey, Bernd Hoevel, Robert E. Hefner, JR., Michael J. Mullins
  • Patent number: 8263714
    Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: September 11, 2012
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Kunihiro Morinaga, Yutaka Satou
  • Patent number: 8252512
    Abstract: An novel epoxy compound is represented by the general formula (I) and has a benzo- or naphtho-cycloalkane skeleton: X, Y, and Z each independently represent an alkyl group having 1-10 carbon atoms and optionally substituted with a halogen atom, an aryl group having 6-20 carbon atoms and optionally substituted with a halogen atom, an arylalkyl group having 7-20 carbon atoms and optionally substituted with a halogen atom, a heterocyclic group having 2-20 carbon atoms and optionally substituted with a halogen atom, or a halogen atom; k represents a number of 0-4; p represents a number of 0-8; r represents a number of 0-4; n represents 0-10; x represents a number of 0-4; y represents a number of 0-4; a sum of x and y is 2-4; and an optical isomer that exists when n is not 0 may be of any type.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: August 28, 2012
    Assignee: Adeka Corporation
    Inventors: Taiki Mihara, Kiyoshi Murata, Koichi Kimijima
  • Publication number: 20120172568
    Abstract: Bis-Phenol A (BPA) can now be replaced in industrial processes by BPA substitutes. The BPA substitutes can have structures that are derivatives of BPA. The BPA substitutes can be used in preparing epoxy composition, polycarbonate compositions, and polysulfonate compositions or for other uses in place of BPA.
    Type: Application
    Filed: December 29, 2010
    Publication date: July 5, 2012
    Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC
    Inventor: Masahiro Ueda
  • Publication number: 20120149863
    Abstract: Provided herein are isosorbide-based bisphenol polymer structural units and methods of making the same. These structural units may be polymerized with one or more other types of structural units to form polymers, such as polycarbonates.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 14, 2012
    Inventor: Jean Francois Morizur
  • Patent number: 8198342
    Abstract: An aluminum chelate latent curing agent includes an aluminum chelate curing agent, and a porous resin that holds the aluminum chelate curing agent and is obtained by subjecting a polyfunctional isocyanate compound to interfacial polymerization while simultaneously subjecting a polyfunctional radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator. In the aluminum chelate latent curing agent, a silanol compound of the formula (A) is further held in the porous resin. (Ar)mSi(OH)n??(A) In the formula, m is 2 or 3, and the sum of m and n is 4. Ar represents an optionally-substituted aryl group.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: June 12, 2012
    Assignee: Sony Chemical and Information Device Corporation
    Inventor: Kazunobu Kamiya
  • Patent number: 8110614
    Abstract: Adamantane derivatives are provided including a phenolic hydroxyl group-containing adamantane derivative, a glycidyloxy group-containing adamantane derivative, and an adamantyl group-containing epoxy modified acrylate, which exhibit excellent transparency, light resistance, and heat resistance properties. Also provided are resin compositions containing the adamantane derivatives. Further provided are corresponding methods for producing the adamantane derivatives, as well as the resin compositions containing the same.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: February 7, 2012
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Katsuki Ito, Yasunari Okada, Hideki Yamane, Akio Kojima