Abstract: A polymer compound including a repeating unit represented by Formula 1: wherein, in Formula 1, groups and variables are the same as described in the specification.

Abstract: A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or oligomer of an epoxy resin, a bismaleimide resin, and a bifunctional amine (calculated based on active hydrogen), and then performing an in-situ polymerization. The thermoplastic polymer-based composite material has excellent impregnation effect, excellent secondary processing performance, relatively high heat resistance, excellent flame retardancy, and mechanical properties, and excellent comprehensive performance.

Abstract: A laminar pre-preg of fibre-reinforced curable composite material. The pre-preg includes at least one layer of reinforcing fibres impregnated with a curable resin containing one or more curable thermosetting resin(s) and at least one liquid curative, wherein the curable resin exhibits a cure conversion of at least 95% when cured at a cure temperature in the range of from about 100° C. to about 160° C. and the cure cycle has a duration of no more than 10 minutes, and the glass transition temperature (Tg) of the curable resin when cured is in the range of from about 130° C. to about 165° C.

Abstract: A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.

Abstract: The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a high molecular weight polyester resin, an epoxy-terminated polyester, an additive, a curing agent, and a solvent, wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network.

Abstract: Provided is a polymer compound which is useful for production of a light emitting device excellent in light emission efficiency is provided. The polymer compound contains a constitutional unit represented by the formula (1) and a constitutional unit represented by the formula (Y) as follows: wherein R1 to R8 represent a hydrogen atom, an alkyl group, an aryl group or the like, and RA and RB represent an aryl group or a monovalent heterocyclic group, and ArY1??(Y) wherein ArY1 represents an arylene group or the like.

Abstract: Provided are a polymer for an organic electroluminescent element, which has improved luminous efficiency and is applicable to a wet process, and an organic electroluminescent element obtained therefrom. The polymer for an organic electroluminescent element has a repeating unit represented by [—(Z)l-(A)m-]n in repeating units constituting a main chain. In addition, the organic electroluminescent element includes, between an anode and a cathode laminated on a substrate, organic layers including a hole-transporting layer and a light-emitting layer, in which at least one of the organic layers contains the polymer for an organic electroluminescent element. In the repeating unit, Z represents an N-indolocarbazolyl group, A represents a repeating unit different from Z, l and m each represent an abundance molar ratio, and l is 5 to 100 mol % and m is 0 to 95 mol %, and n is 2 to 10,000.

Abstract: Provided is a two-part composition comprising A) An epoxy terminated polyester having the structure wherein R1— is G- is j is 0 to 5, —R2— is a divalent organic group, —R22— is a divalent alkyl group, and —R22— is a divalent alkyl group, and B) one or more epoxy curing agent, each molecule of which comprises two or more active hydrogen atoms that are each capable of reacting with an epoxy group.

Abstract: An epoxy terminated polyester having the structure wherein R1— is G— is j is 0 to 5, —R2— is a divalent organic group, —R22— is a divalent alkyl group, and —R22— is a divalent alkyl group.

Abstract: An epoxy terminated polyester having the structure wherein R1— is G- is -A- is a divalent alkyl group, —CA- is a divalent cycloalkyl group, and —R2— is a divalent organic group.

Abstract: Provided is a two-part composition. The first part is an epoxy terminated polyester having the structure wherein R1- is G- is -A- is a divalent alkyl group, -CA- is a divalent cycloalkyl group, and -R2- is a divalent organic group. The second part is an epoxy curing agent.

Abstract: A metal-clad phenolic resin laminate obtained by heating and pressing a lamination which comprises: (i) a central layered portion comprising one paper base prepreg which is made of a paper base impregnated with a first phenolic resin composition containing a resol-based resin, or a predetermined number of the paper base prepregs laid on each other; (ii) outer layered portions laid on an upper and a lower sides of the central layered portion, in which each of the outer layered portions comprises one glass fiber substrate prepreg which is made of a glass fiber substrate impregnated with a second phenolic resin composition containing a resol-based resin, or a predetermined number of the glass fiber substrate prepregs laid on each other; and (iii) a metal foil laid at least on one of the outer layered portions laid on the upper and lower sides of the central layered portion.

Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodephenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at last one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to- a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.

Abstract: The present invention relates to conjugated polymers comprising specific carbazole structural units. The materials according to the invention display steeper current-voltage curves and are therefore better suited to use in organic light-emitting diodes than are comparative polymers which do not contain these units.

Abstract: The present invention relates to conjugated polymers comprising specific carbazole structural units. The materials according to the invention display steeper current-voltage curves and are therefore better suited to use in organic light-emitting diodes than are comparative polymers which do not contain these units.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The present invention is directed to sulfonimide-containing polymers, specifically sulfonimide-containing poly(arylene ether)s and sulfonimide-containing poly(arylene ether sulfone)s, and processes for making the sulfonimide-containing poly(arylene ether)s and sulfonimide-containing poly(arylene ether sulfone)s, for use conductive membranes and fuel cells.

Abstract: A process for producing an aromatic polyether having a high molecular weight, small dispersion of the molecular weight, excellent in the heat resistance as well as the impact resistance and represented by the formula (1): wherein each of x1 and x2 independently represents a halogen, and n represents an integer of 1 or above is provided, which comprises polymerizing 4,4′-biphenol with a 4,4′-dihalogenodiphenyl sulfone represented by the formula (2): wherein x1 and x2 have the same meaning as above, in an amount exceeding 1 time by mole and not exceeding 1.05 time by mole based on said 4,4′-biphenol in diphenyl sulfone and in the presence of an alkali metal carbonate and/or an alkali metal bicarbonate at a temperature which is not lower than 240° C. and not higher than 270° C.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of abivalent phenol of the formula (2) and a monovalent phenol of the formula (3), H&Brketopenst;O—Y&Brketclosest;a&Parenopenst;O—X—O&Parenclosest;&Brketopenst;Y—O&Brketclosest;bH  (1) HO—X—OH  (2) Y—OH  (3) wherein —X— is represented by the formula (2′),  and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2′) and the formula (3′) being required not to be a hydrogen atom, and its use.

Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.

Abstract: A water-soluble branched polyhydroxyetheramine, wherein the branched polyhydroxyetheramine is prepared by reacting an amine having two reactive hydrogen atoms with a diepoxide to form a polyhydroxyetheramine and then reacting the polyhydroxyetheramine with an N-alkylating agent, an aqueous composition comprising the branched polyhydroxyetheramine and use of the branched polyhydroxyetheramine to modify the permeability to water of a subterranean formation are disclosed.

Abstract: A new brominated epoxy resin has been developed, which consists of following components: A. multifunctional phenol-benzaldehyde epoxy resin (formula 1) 10˜70 weight %; B. difunctional epoxy resin 0˜55 weight %; C. bromine-containing difunctional epoxy resin 0˜20 weight %; D. tetrabromobisphenol-A epoxy resin 15˜40 weight %; The synthesis is that (D) tetra bromo bisphenol-A reacts with at least one of (A), (B)and (C), then adding the rest of (A),(B) and (C) and mixing them uniformly, the new brominated epoxy resin produced, which can be applied to glass fiber laminate, and showing proper reactivity and a broad working window. The laminate possesses high Tg and good heat resistance, and applying to electron material with high performance.

Abstract: An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.

Abstract: A composition comprising a poly(hydroxy aminoether) and an effective amount of a propoxylated or ethoxylated phenol, process for preparing the same and articles prepared from the composition.

Abstract: The present invention concerns hydroxyaliphatic functional diglycidyl ethers of bisphenols (epoxy resins); curable (thermosettable) mixtures of at least one hydroxyaliphatic functional epoxy resin and at least one curing agent and/or catalyst therefor, as well as cured (thermoset) compositions prepared therefrom; and derivatives prepared therefrom. The bisphenol precursor to the diglycidyl ether contains a hydroxyaliphatic group linkage between the two aromatic rings of the bisphenol.

Abstract: An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: 1

Abstract: The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of a brominated bisphenol A epoxy resin optionally advanced with brominated bisphenol A by reaction of the epoxy groups with a C1-C8 alcohol such as methanol or butanol to the extent that the ratio of unmodified epoxy groups to alcohol-modified epoxy groups is from 2/1 to 1/2.

Abstract: A fluorine-containing curable composition comprises (A) a linear perfluoro compound having at least two secondary amino groups per molecule and a divalent perfluoroalkylene or divalent perfluoropolyether structure in the main chain, and (B) a crosslinkable fluorinated compound having at least three functional groups which are crosslinkable with the secondary amino groups of (A). This composition readily cures, with standing at room temperature or heating only, to a cured product having excellent solvent and chemical resistance.

Abstract: The present invention relates to an ablative fire resistant hydrophilic polyurea foam made from low molecular weight polyols capped with an isocyanate, with the polyol mixture including a fire retardant polyol that preferably includes carborane disilanol, with the fire retardant polyol containing the carborane disilanol imparting superior fire retardancy characteristics. The present invention also relates to a prepolymer for forming the polyurea foam and the present invention especially relates to the use of a carborane disilanol fire retardant polyol. The present invention also relates to a method for forming the polyurea foam and the prepolymer.

Abstract: Modified epoxy resin having an elevated softening point obtained from an epoxy resin having a low softening point without modifying the properties of the cured product and to improve the workability in the production of an epoxy resin composition. The modified epoxy resin is obtained by adding 4,4'-dihydroxybiphenyl to a specified phenol compound and epoxidizing the resultant mixture. Also disclosed is an epoxy resin composition containing the modified epoxy resin and the cured product thereof.

Abstract: The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface exposed to an elevated temperature sufficient to produce an advanced epoxy resin which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: To address the problem of difficulty of making compatible flame retarding property and electrical and mechanical characteristics in conventional printed interconnection substrates, the present invention employs, in a substrate for printed circuit board of which the insulating material comprises a thermosetting resin composition comprising an epoxy resin main component and a curing agent, an epoxy resin containing a brominated phenol novolac type epoxy resin having a biphenyl skeleton as the main component or a curing agent containing a brominated phenol novolac type curing resin. It provides a substrate for printed circuit board which has an extremely high flame retarding property and a superior heat resistance and humidity resistance, as well as a high insulating reliability and a superior high frequency characteristic.

Abstract: A laminate structure comprises one or more layers of an organic polymer and one or more layers of a hydroxy-functionalized polyetheramine, wherein the hydroxy-functionalized polyetheramine layer is adhered directly to a contiguous organic polymer layer without an adhesive layer therebetween. The hydroxy-functionalized polyetheramine is prepared by reacting (1) a difunctional amine with (2) a diglycidyl ether or a diepoxy-functionalized poly(alkylene oxide) under conditions sufficient to cause the amine moieties to react with the epoxy moieties to form a polymer backbone having amine linkages, ether linkages and pendant hydroxyl moieties and then treating the reaction product with a monofunctional nucleophile which is not a primary or secondary amine.

Abstract: Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

Abstract: "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.

Abstract: A fire-retardant compound including bromine indicated by general formula (1), wherein the end group X and Y are comprised by A or B shown in formula (2), and the said fire-retardant compound is a mixture of the composition including 15 to 30% of X=Y=A, the composition including 40 to 60% of X=A and Y=B and the composition including 20 to 35% of X=Y=B, and degree of polymerization n is indicated by an integral number from 0 to 30, and a flame-retarded thermoplastic resin including said fire-retardant compound.

Abstract: Described herein are polyesters and polyamides which contain repeat units derived from novel dicarboxylic acids comprising arylene groups having ortho ethers substituted thereon. Also disclosed are novel compounds from which these polymers can be made. The polymers are especially useful for molding resins and coatings.

Abstract: The invention provides for a process for the preparation of an advanced resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface exposed to an elevated temperature sufficient to produce an advanced epoxy resin which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant.

Abstract: Epoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: An epoxy resin composition characterized by comprising (A) an epoxy resin containing an oxazolidone ring, (B) a halogen-containing epoxy resin and (C) a curing agent as its ingredients, wherein the ratio by weight of ingredients (A) to (B) is 5-100:95-0, the hydrolizable chlorine content of ingredients (A) and (B) is no more than 500 ppm and the amount of .alpha.-glycol is no more than 100 m eq/kg has excellent properties and can be employed as the materials for electronic applications and as paints, adhesives, molding materials, composite materials, laminates and sealing materials.

Abstract: Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.

Abstract: A polyester polymer comprising repeating units (I), or repeating units (I) and (II), and having a reduced viscosity (.eta..sub.sp /c) of 0.2 to 10.0 dl/g, measured at 20.degree. C. as a 0.5 g/dl solution dissolved in methylene chloride is prepared by allowing a dihydric phenol (III), or dihydric phenols (III) and (IV), to react with a carbonate precursor or a dibasic acid. An electrophotographic photoreceptor which comprises an electroconductive substrate and a photosensitive layer disposed on the electroconductive substrate and containing the polyester polymer as a charge transporting material or a binder resin. ##STR1## wherein, W is --O-- or single bond, X is a divalent group which is derived from a dihydric phenol containing a hydrazine structure, each of R.sup.25 and R.sup.26 is a halogen atom, an alkyl group, a cycloalkyl group or an aryl group, each of m and n is an integer of 0 to 4, Y is single bond, --O--, --S--, --SO--, --SO.sub.2 --, --CR.sup.27 R.sup.28 --, a 1,1-cycloalkylene group or an .alpha.

Abstract: N-Alkyl-N'-aryl-p-phenylenediamines, when added at 2.5 to 12.5% by weight, based on the total weight of the epoxy resin and hardener, cause the epoxy resin after curing to exhibit substantial increases in physical properties, such as strength, stiffness, toughness and hot/wet properties, compared to the properties of the cured, but unmodified epoxy resin.

Abstract: An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).

Abstract: Novel polymers of general formula: ##STR1## wherein R is an alkyl or aryl group that contains an active hydrogen atom (as determined by the Zerewitinoff test); A is a spacing group having at least one carbon atom; B is a spacing group having at least two carbon atoms; and R and R' are alkyl or aryl groups. The polymer is synthesized via the Mannich pathway, involving formation of an imine intermediate.

Abstract: Polyaminoethers prepared by reacting (1) a primary amine or bis(secondary) diamine with (2) a diglyeidyl ether and (3) an amine- or epoxy-functionalized poly(alkylene oxide) exhibit a combination of low glass transition temperature (Tg of 14.degree. C. to 73.degree. C.) and low oxygen transmission rate (OTR of 0.53 to 19.0 cc-mil/100-in.sup.2 -atm-day).

Abstract: A diamino-alpha-alkylstilbene useful as an epoxy resin curing agent is represented by the following Formula I: ##STR1## wherein R is independently hydrogen, a C.sub.1 -C.sub.10 hydrocarbyl(oxy) group or a halogen, nitro, nitrile, phenyl or --CO--R.sup.1 group wherein R.sup.1 is independently hydrogen or a C.sub.1 -C.sub.3 hydrocarbyl group; each R.sup.4 is independently hydrogen or a C.sub.1 -C.sub.10 hydrocarbyl group; and Y is a ##STR2## group wherein n=0 or 1.

Abstract: The invention provides a compound of general formula I ##STR1## in which X represents a direct bond or a ##STR2## group.