Abstract: The present disclosure relates to highly reflective coating formulations that produce coatings having an average infrared reflectivity ranging from about 75% to about 90% at wavelengths ranging from about 0.5 ?m to about 1000 ?m, methods for making the coatings and coating mixtures, and substrates comprising such coatings.

Abstract: The present invention addresses the problem of providing a resin having a high Abbe number and a small difference in hygroscopic expansion coefficient with respect to a polycarbonate resin having a low Abbe number and a high refractive index. The above problem can be solved by a polycarbonate resin including structural units represented by general formula (1). In general formula (1), R represents H, CH3, or C2H5.

Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components: wherein each of j and k is 1 or 2, and at least one of j and k is 2; wherein each of l, m and n is 1 or 2, and at least one of l, m, and n is 2.

Abstract: Provided herein are compositions useful as ink or coatings which contain novel dispersants that are capable of dispersing pigments which are traditionally difficult to disperse while maintaining acceptable levels of viscosity. Use of dispersants as taught herein enables the preparation of a wide variety of inks and coatings having high pigment loading and existing within a conventionally-useful viscosity range.

Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.

Abstract: Polyamines A1 of formula (I) or (II). They can be easily synthesized from readily available raw materials and have no primary amino groups or only a low content of primary amino groups and thus exhibit hardly any blushing. Their viscosity is relatively low, compared with polyamine/polyepoxide adducts of the polyamine on which polyamine A1 is based. Thus epoxy resin compositions can be formulated that are free of benzyl alcohol and free of blushing.

Abstract: Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.

Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.

Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least 2.5 times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature at which the polymer is transformable between a first shape and a second shape. The second crosslinking agent is crystallizable within the polymer and thereby has a melting temperature that is detectable within the polymer.

Abstract: The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the symmetric or saturated cyclic alphatic molecular structure with low “molecular dipole moment” characteristics; making a printed circuit board for high frequency signal transformation applications needs a proper copper clad laminate which processes the properties of a low dielectric constant and of a low dissipation factor; a copper clad laminate can meet above requirements by using the inventive resin as a laminate binder. The inventive resin is prepared by the following steps: 1. Reacting a 2,6-disubstituted mono-phenol compound (A) with an aldehyde or a cyclic diene compound (B), so as to obtain a bisphenol compound (C) having a high symmetry or saturated aliphatic heterocyclic structure; 2.

Abstract: The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated methylene-di-(cyclohexylamine) compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: Disclosed herein are a phenol novolac resin which is used as a raw material for thermosetting resin, a phenol novolac epoxy resin which is obtained therefrom, an epoxy resin composition which utilizes the phenol novolac resin as a curing agent or contains the phenol novolac epoxy resin as a base resin.

Abstract: A novel polymeric initiator is disclosed comprising a dendritic polymer core with at least one initiating functional group as an end group. The dendritic polymeric core is preferably a hyperbranched polymer. The polymeric initiators are useful in radiation curable compositions such as varnishes, lacquers and printing inks and are especially useful in radiation curable inkjet inks.

Abstract: A laser-decomposable resin composition, includes: (A) a polymer compound containing a structure represented by formula (0) as a repeating unit in a main chain of the polymer compound: wherein R1 represents H or a hydrocarbyl group which may have a substituent; and (B) a photo-latent or heat-latent catalyst, and a pattern-forming material, includes: a layer containing the laser-decomposable resin composition.

Abstract: Condensation products of dihydroxyaromatics A, alone or in mixture with mono- or polyhydroxyaromatics C, with diepoxides or polyepoxides B which have been alkylolated by reaction with aldehydes D and whose alkylol groups may have been etherified with alcohols, a process for preparing them, and a method of use thereof in particular as compositions for coating the inside of foodstuff and beverage packaging forms made from metals.

Abstract: The present invention discloses a clay/amine complex which is an excellent surfactant and a good reinforcing agent of polymers. The complex of the present invention can be produced by modifying layered inorganic silicate clay such as montomorillonite, with an intercalating agent, AMO (amine terminal-mannich oligomer). The AMO can be obtained by polymerizing polyoxyalkylene amine having molecular weight over 1000, p-cresol and formaldehyde. The present invention further discloses a nanosilica plate, which can be obtained by extracting the above complex with a hydroxide or a chloride of alkali metal or alkaline-earth metal, and consequently, the AMO intercalating agent can be recycled for reusing.

Abstract: Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines. A poiyol mixture is then selected. The first component is combined with the polyol mixture to form a hardener. The hardener is combined with epoxy resin and is cured. A method for selecting a hardener to yield an epoxy-hardener system with good properties after curing at a specified temperature and time includes selecting components for the hardener so the glass transition temperature of the cured epoxy-hardener system is not significantly lower than 45° C. above the cure temperature. The method includes steps for adjusting and controlling the ultimate glass transition temperature to maximize the mechanical properties of the epoxy-hardener system. The method regularly produces hardened epoxy systems having about 90% or more epoxy groups reactect.

Abstract: A water-soluble composition including a water soluble polyamine adduct which is a reaction product of: (a) an alkoxy group modified polyepoxide resin containing an average of at least 1.5 epoxide groups per molecule; and (b) a Mannich base polyamine. The Mannich base polyamine is a reaction product of a polyamine containing at least two amino groups with a N-Mannich condensate prepared from a reaction of a phenolic compound, an aldehyde, and a secondary amine wherein the secondary amine of the N-Mannich condensate is replaced by one of the at least two amino groups of the polyamine, and wherein the ratio of the Mannich base polyamine to the alkoxy group modified polyepoxide resin contains an excess of an active amine hydrogen relative to epoxide groups so that the water soluble polyamine adduct has an amine hydrogen equivalent weight of at most 1000 based on solids content.

Abstract: A process for preparing an epoxy resin involves the reaction of a polyhydric phenol with an epihalohydrin in a water-soluble solvent in the presence of an alkali reactive catalyst wherein a continuous distillation of the reaction product is conducted to (1) isolate a first recovered fraction containing unreacted epihalohydnn, water-soluble solvent and at most 0.01 part by weight of the by-product glycidol per one part by weight of unreacted epihalohydrin; (2) isolate a second recovered fraction containing unreacted epihalohydrin, the by-product glycidol and at most 0.01 part by weight of water-soluble organic solvent per one part by weight of unreacted epihalohydrin; (3) recover the epihalohydrin from the second recovered fraction by washing with water to remove the water-soluble organic solvent and glycidol; and (4) reuse the first recovered fraction and the recovered epihalohydrin from the second recovered fraction as a raw material of the reaction.

Abstract: The present invention provides a cationic coating composition capable of forming a coating film which is excellent in an electrodepositablly coating property and an adhesive property toward a rust preventive steel plate, a corrosion resistance and a low temperature curability. The cationic coating composition described above comprises as a vehicle component, a xylene-formaldehyde resin-modified, amino group-containing epoxy resin obtained by reacting an epoxy resin (A) having an epoxy equivalent of 180 to 2500 with a xylene-formaldehyde resin (B) and an amino group-containing compound (C).

Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a melaminic amino resin and a phenolic resin composition, wherein the phenolic resin composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a stable phenolic resin composition as well as wood based products obtained by the method or through the use of the adhesive system.

Abstract: The present invention relates to resins obtained by reacting a compound of formula 1 with an aldehyde and alkoxylating, in any order: wherein X is —OH, Y is ortho-, meta- or para- to X and is a radical of formula 4, wherein R5 is a C1-C30-alkyl, C2-C30-alkenyl, C6-C18-aryl, or C7-C30-alkylaryl. The resin has a molecular mass from 250 to 100,000 and is useful in methods of breaking oil-water emulsions.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: The present invention relates to a compound according to formula (1) wherein n is 0, 2, 4 or 6 and a, b and c are, independently of one another, 1 or 0. R1-1a, R1-1b and R1-1c are hydrogen, a hydrocarbyl containing 1 to 10 carbon atoms which are alkyl, aryl, alkylene, arylalkyl or alkylaryl or a hydrocarbyl containing 1 to 10 carbon atoms and at least one heteroatom which can be oxygen, sulfur or nitrogen. R2-1a, R3-1a, R4-1a, R5-1a, R2-1b, R3-1b, R4-1b, R5-1b, R2-1c, R3-1c, R4-1c and R5-1c hydrogen or C1-C4alkyl. R6-1a, R7-1a, R6-1b, R7-1b, R6-1c and R7-1c are C1-C4akyl. A is an aromatic or alicyclic ring having 5 to 7 carbon atoms. The present invention further relates to a Mannich base reaction product obtained by combining an extract from cashew nutshell liquid with at least one aromatic or alicylic polyamine and at least one aldehyde compound, epoxy resin compositions and curable formulations containing the same, and methods for using such compositions.

Abstract: The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation as well as polyphenolic products and epoxidized derivatives and compositions thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80° C. to about 100° C. with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature below about 170° C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol. Water is distilled stepwise or continuously from the reaction mixture.

Abstract: The specification discloses epoxidized products and compositions of a polyphenol of a phenol and glyoxal wherein the polyphenol prior to epoxidation has an ultraviolet (UV) absorbance of at lest 0.260 at 365 nanometers (nm) and/or at least 0.400 at 350 nm.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation as well as polyphenolic products and epoxidized derivatives and compositions thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80.degree. C. to about 100.degree. C. with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature below about 170.degree. C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol. Water is distilled stepwise or continuously from the reaction mixture.

Abstract: The invention relates to a process for the preparation of pigment paste resins for cathodically depositable coating compositions, wherein diepoxide compounds which contain polyoxyalkylene structures and alkyl and/or alkylene and/or hydroxyalkyl radicals having more than 3 carbon atoms are first reacted to form epoxy resin/amine adducts and final products with oxazolidine structures are obtained by a partial or complete reaction of secondary amino groups with formaldehyde.

Abstract: Novel polymers of general formula: ##STR1## wherein where n is a whole number from 2 to 10; R is a spacing group comprising (a) at least one of m methylene units where m is a whole number from 1 to 20, m' methine units where m' is a whole number from 0 to 20, a mixture of m methylene units and m' methine units where m+m'.ltoreq.20, and units of formula --(CH.sub.2 -CHX-O).sub.m" --, where m" is a whole number from 0 to 200 and X is H, CH.sub.3 or C.sub.2 H.sub.5, or (b) an aromatic ring having one, two or three members; R' is H, an alkyl group having no more than 20 carbon atoms, an aryl group having no more than three rings, or a combination thereof; R" is a group containing at least two active hydrogen atoms and having at least two but no more than 20 carbon atoms; and R'" is a group containing at least two active hydrogen atoms and is selected from the group consisting of alkyl, aryl and mixed alkyl-aryl species having from 1 to 200 carbon atoms; polyalkylene oxides; and urea formaldehyde resin.

Abstract: A polyhydroxystyrene having a 2,4-diamino-s-triazinyl group substituted for 1-50 mol % of its hydroxyl group and a weight average molecular weight of 3,000-50,000 is provided. A negative radiation-sensitive resist composition comprising the polymer, preferably along with a photo-acid generator and a crosslinking agent has high resolution and developability, affords a resist pattern of rectangular profile, and is shelf stable. The composition is thus very useful as resist material for LSI manufacture.

Abstract: Cyclic acetal derivative of a resole includes the reaction product of an ortho resole compound with a carbonyl compound or a carbonyl compound derivative. The cyclic acetal derivatives of phenolic resole compounds exhibit enhanced storage stability and can be readily activated at elevated temperatures to prepare phenolic based adhesives and coatings.

Abstract: Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.

Abstract: A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.

Abstract: Novel polymers of general formula: ##STR1## wherein R is an alkyl or aryl group that contains an active hydrogen atom (as determined by the Zerewitinoff test); A is a spacing group having at least one carbon atom; B is a spacing group having at least two carbon atoms; and R and R' are alkyl or aryl groups. The polymer is synthesized via the Mannich pathway, involving formation of an imine intermediate.

Abstract: There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet-or a prepreg, whereby the printed circuit board can be produced easily and cheaply.

Abstract: The present invention discloses oriented optical epoxy compositions comprising a reaction product of arylhydrazones with a monomer copolymerizable therewith and to oriented crosslinked polymeric composition comprising the reaction product of an epoxy arylhydrazone or the epoxy composition of the invention with a curing agent. The present invention also discloses processes for making the said compositions.

Abstract: Cross-linked epoxy resins having nonlinear optical properties may be used in nonlinear optical media. These cross-linked epoxy resins may have the following structure: ##STR1## Z.sup.1 and Z.sup.2 being NLO-chromophores.

Abstract: Anhydride compounds which contain at least one rodlike mesogenic moiety and at least two anhydride groups per molecule, wherein each of said aromatic anhydride groups is linked to the mesogen via an ester linkage are prepared. These anhydride compounds are useful in curing epoxy resins to provide the cured products with one or more improved properties.

Abstract: Oil-soluble, phenolic resin-modified natural resinic acid esters, which are able to form self-gelling mineral oil solutions and in the form of gel varnishes can advantageously be used as binder resins in printing inks for offset printing and letterpress printing, and also processes for their preparation from natural resins, phenols, aldehydes, condensation catalyst, esterifying agents and modifiers by reaction of the components at temperatures in the range from 80.degree. to 300.degree. C., individual components preferably being initially introduced and the other components being metered in, the combined use of a magnesium compound as condensation catalyst and the continuous removal of the water of reaction during the condensation reaction by azeotropic distillation with co-use of an inert organic solvent as distillative entraining agent being necessary and decisive for the self-gelling property of the process product.

Abstract: An acrylated epoxy resin based on bisphenol-S having a formula as follows ##STR1## wherein ph is phenylene or halophenylene; R.sub.1 is C.sub.2 -C.sub.4 alkylene;R.sub.2 is --CH.sub.2 CH(OH)CH.sub.2 --;R.sub.3 is acryloyl or methacryloyl;m is 0-4 integer, n is 0-4 integer and k is 0-5 integer.

Abstract: Synthetic resins are based on products which are obtainable by reactingA) epoxy-carrying resins based ona.sub.1) polyhydric phenols anda.sub.2) at least one compound selected from the group consisting of.alpha..sub.1) polyoxyalkylenepolyols,.alpha..sub.2) polyoxyalkylenepolyepoxides,.alpha..sub.3) polyoxyalkylenepolyamines and.alpha..sub.4) polyhydric aliphatic alcohols and,if desired,a.sub.3) phenolic compounds which react monofunctionally toward epoxides,B) monocarboxylic acids of 5 to 30 carbon atoms,C) amines which contain at least one primary and one tertiary amino group andD) formaldehyde-donating compounds.

Abstract: An epoxy resin composition useful in an electrical laminate, which composition comprises:(A) an epoxy resin prepared by reacting (A-1) an epoxy resin having an average of more than one, but less than three epoxy groups per molecule and (A-2) a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule at a ratio to provide an epoxy to phenolic equivalent ratio of 1:x;(B) y equivalent of a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule; and(C) at least one catalyst for catalyzing a reaction of Component (A) and Component (B);wherein x and y satisfy the following equations:x.gtoreq.0.01y.gtoreq.0.010.02.ltoreq.x+y<1.00.The disclosed epoxy resin composition, exhibits low viscosity when dissolved in an organic solvent and good heat resistance when cured.

Abstract: There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.

Abstract: Liquid coating agent based on a polymer containing acetoacetate groups and a polyamine in the form of the corresponding aldimine or ketimine, the polymer containing acetoacetate groups being obtained by reaction of a polyepoxide with water, an amine or a hydroxycarboxylic acid and subsequent esterification or transesterification with acetoacetic acid. These liquid coating agents are particularly suitable as binders in two-component automobile repair fillers or as two-component primers.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: A liquid coating composition based on a polymer containing acetoacetate groups and a polyamine in the form of the corresponding aldimine or ketimine, the polymer containing acetoacetate groups being obtained by reacting a polyepoxide containing hydroxyl groups, or a polyepoxide which is partially or completely reacted with monocarboxylic acids, with acetoacetic acid derivatives. These liquid coating compositions are suitable in particular as binders in two-component fillers for automotive refinishing or as two-component primers.

Abstract: Compositions containing an aryl phosphite and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.