Non-1,2-epoxy, Or Nonphenolic Reactant Is A Phosphorus-containing Material Patents (Class 528/108)
  • Patent number: 11492484
    Abstract: This invention relates to a polymer composition comprising: (A) at least one polymer comprising at least one diol residue, and (B) a stabilizer composition comprising: (1) at least one primary antioxidant comprising at least one phenolic antioxidant; and (2) at least one secondary antioxidant comprising at least one phosphite, and (3) at least one chain extending agent; wherein the b* value for said polymer composition is less than 10 according to the L*, a* and b* color system of the CIE (International Commission on Illumination) after being heated for at least three hours at 200° C. or 24 hours at 175° C.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: November 8, 2022
    Assignee: Eastman Chemical Company
    Inventors: Robert Erik Young, Mark Allen Peters
  • Patent number: 10947454
    Abstract: A flame retardant levulinic acid-based compound, a process for forming a levulinic acid-based flame retardant polymer, and an article of manufacture comprising a material that contains a flame retardant levulinic acid-based polymer are disclosed. The flame retardant levulinic acid-based compound has variable moieties, which include phenyl-substituted and/or R functionalized flame retardant groups. The process for forming the flame retardant polymer includes forming a phosphorus-based flame retardant molecule, forming a levulinic acid derivative, chemically reacting the phosphorus-based flame retardant molecule and the levulinic acid derivative to form a flame retardant levulinic acid-based compound, and incorporating the levulinic acid-based flame retardant compound into a polymer to form the flame retardant polymer.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: March 16, 2021
    Assignee: International Business Machines Corporation
    Inventors: Jason T. Wertz, Joseph Kuczynski, Brandon M. Kobilka, Scott B. King
  • Patent number: 10683386
    Abstract: Provided is a powder coating latent curing agent; and an epoxy powder coating composition having the same, and more specifically, to a powder coating latent curing agent, which is prepared by hot blending of a product of an addition reaction of imidazole, an amino alcohol and an epoxy resin with a phenolic curing agent resin, is capable of securing latency by inhibiting the reactivity of a phenolic curing agent, is capable of providing an improved coating film appearance and bending resistance when applied as a curing agent to a powder coating, and is capable of improving the workability of a coating preparation; and an epoxy powder coating composition having the same.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: June 16, 2020
    Assignee: KCC CORPORATION
    Inventors: Sang Hun Han, Seung Yeob Choi, Woo Ram Kim, Jee Hye Ann, Byung Soo Moon, Jun Tae Kang
  • Patent number: 8999510
    Abstract: A metal-clad phenolic resin laminate obtained by heating and pressing a lamination which comprises: (i) a central layered portion comprising one paper base prepreg which is made of a paper base impregnated with a first phenolic resin composition containing a resol-based resin, or a predetermined number of the paper base prepregs laid on each other; (ii) outer layered portions laid on an upper and a lower sides of the central layered portion, in which each of the outer layered portions comprises one glass fiber substrate prepreg which is made of a glass fiber substrate impregnated with a second phenolic resin composition containing a resol-based resin, or a predetermined number of the glass fiber substrate prepregs laid on each other; and (iii) a metal foil laid at least on one of the outer layered portions laid on the upper and lower sides of the central layered portion.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: April 7, 2015
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventor: Masao Uesaka
  • Patent number: 8772424
    Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: July 8, 2014
    Assignee: ICL-IP America Inc.
    Inventors: Sergei V. Levchik, Andrew Mieczyslaw Piotrowski, Joseph Zilberman, Stephen J. Chaterpaul
  • Patent number: 8702943
    Abstract: An aqueous electrodeposition coating composition comprising a cathodically electrodepositable binder, the binder comprising a phosphorylated resin and a carboxyl group separated by from 2 to 4 carbons from an ester group, provides corrosion protection equivalent to that obtained by the conventional phosphate pretreatment-electrodeposition coating process.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: April 22, 2014
    Assignee: BASF Coatings GmbH
    Inventors: Timothy S December, Abdellatif Chouai, Cynthia A Stants
  • Patent number: 8486303
    Abstract: An object of the present invention is to provide a granule mass containing an antioxidant as a main component, which is excellent in flowability, produces little dust from an additive, and can be prepared by a simple facility when an additive such as an antioxidant is added to a plastic such as polyolefin, and affords a plastic having thermal stability which is hardly ununiformized, and a process for producing the same. There is provided a granule mass comprising a granule containing a phenol-based antioxidant represented by the following formula (1) and a sulfur-based antioxidant represented by the following formula (2), wherein a content of the sulfur-based antioxidant (2) relative to a total of 100 parts by weight of phenol-based antioxidant (1) and the sulfur-based antioxidant (2) is 3 to 70 parts by weight.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: July 16, 2013
    Assignee: Sumitomo Chemical Company Limited
    Inventors: Kenji Kimura, Hitoshi Hara, Yoshiyuki Endo
  • Publication number: 20130123457
    Abstract: Disclosed is a method for making a low-k, flame-retardant, bi-functional benzoxazine. The method includes the steps of dissolving phosphoric diamine with various functional groups, phenolic adamantane and paraformaldehyde in a solvent at 72° C. to 88° C. for 7 to 9 hours, and cooling and introducing the solution in n-hexane to separate the low-k, flame-retardant, phosphoric, bi-functional benzoxazine.
    Type: Application
    Filed: February 15, 2012
    Publication date: May 16, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Wen-Chiung Su, Ching-Hsuan Lin, Hung-Tse Lin, Feng-Jen Wang
  • Patent number: 8058362
    Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: November 15, 2011
    Assignee: National Chung Hsing University
    Inventors: Ching-Hsuan Lin, Yu Ming Hu, Hong Tze Lin
  • Patent number: 8057902
    Abstract: A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material for an electrically insulating coating.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: November 15, 2011
    Assignee: Nippon Steel Chemicals Co., Ltd.
    Inventors: Naoki Yokoyama, Kazuo Ishihara, Tetsuya Nakanishi
  • Patent number: 8008405
    Abstract: The present invention is directed to a passivating material suitable for passivating a metal surface. The passivating material comprises a polymer which comprises (a) at least one nitro group, and/or pyridine group, and/or phenolic hydroxyl group; and (b) at least one group selected from a phosphorous-containing group and/or a carboxylic acid group, wherein the at least one phosphorous-containing group is selected from a phosphate, a phosphite, or a non-nitrogen substituted phosphonate.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: August 30, 2011
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Cathy A. Taylor, Daniel Rardon, Paul Lamers, Kapiappa G. Ragunathan, Shanti Swarup, Michael Hart
  • Patent number: 7494716
    Abstract: Process for the anodic electro-dipcoating of conducting surfaces by dipping in an aqueous anodic electro-dipcoating bath and connecting up as the anode, in which an aqueous anodic electro-dipcoating bath is used that contains 1 to 15 wt. %, referred to the binder solids of the electro-dipcoating bath, of one or more phosphoric acid epoxy esters and/or phosphonic acid epoxy esters that have been produced in the presence of alcohols.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: February 24, 2009
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Eduard Ehmann, Manfred Evers, Andreas Fieberg, Konstadinos Markou, Bettina Vogt-Birnbrich
  • Patent number: 7476444
    Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: January 13, 2009
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Michael J. Pawlik, Dennis W. Jones, Ralph C. Gray, Richard M Nugent, Jr., Yves Le Disert, Laurent Deronne
  • Patent number: 7271225
    Abstract: A phosphorus-containing epoxy resin has a structural unit derived from a secondary phosphine derivative represented by the following formula: wherein R1 represents an alkylene group that may have a substituent, R2 represents a cycloalkylene or arylene group that may have a substituent, and X represents an oxygen or sulfur atom.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: September 18, 2007
    Assignee: Nippon Chemical Industrial Co., Ltd.
    Inventors: Ken Tamura, Yoshifusa Hara
  • Patent number: 7217779
    Abstract: A phosphoric ester demulsifier composition prepared by reacting one or more alkylphenol-formaldehyde resin alkoxylates or one or more polyalkylene glycols, or a mixture thereof, with about 0.001 to about 1.0 molar equivalents of one or more phosphorous compounds selected from phosphorous oxychloride, phosphorous pentoxide and phosphoric acid and a method of using the demulsifier composition to resolve water-in-oil emulsions.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: May 15, 2007
    Assignee: Nalco Company
    Inventor: Frank T. Lang
  • Patent number: 6911490
    Abstract: Aqueous curing agents for epoxy resin dispersions comprising mixtures, adducts and/or salts of partly esterified organic phosphoric acids A1 or partly esterified phosphonic acids A2 with organic amines B selected from the group consisting of epoxide-amine adducts B1, Mannich bases B2, polyaminoamides B3, and condensation products B4 of diamines or polyamines B42 with di- or polyhydroxyaromatics B41, their preparation and a method of use comprising mixing thereof with aqueous epoxy resin dispersions in particular for coating metals as corrosion protection
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: June 28, 2005
    Assignee: Solutia Austria GmbH
    Inventors: Roland Feola, Willibald Paar, Johann Gmoser
  • Patent number: 6830825
    Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: December 14, 2004
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takafumi Sumiyoshi, Ayako Mizushima, Ken Oota, Yoshio Fujieda, Hiroki Nikaido, Takashi Aihara
  • Patent number: 6645631
    Abstract: A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of: (1) a non-halogenated, non-phosphorus element-containing epoxy resin, and (2) a phosphorus element-containing compound; or (C) the reaction product of: (1) a non-halogenated epoxy resin; and (2) a phosphorus element-containing compound; or (D) a combination of two or more of components (A) to (C); and (II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: November 11, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Joseph Gan, Alan Goodson
  • Patent number: 6617028
    Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: wherein R2 represents a hydrogen atom or a group represented by the following formula: wherein n is an integer of from 0 to 20, and R represents phenylene, naphthylene or a group represented by the following formula: wherein A represents —O—, —S—, —SO2—, —CO—, —CH2—, —C(CH3)2— or a group represented by the following formula: provided that at least one R2 is not a hydrogen atom; and R1 represents NHR2, C1-6alkyl or phenyl; in the above groups represented by R and A, the aromatic group can be substituted by one or more substituents selected from the group consisting of hydroxy, amino, carboxy and C1-6alkyl. The present invention also discloses a flame retarding composition containing said hardener.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: September 9, 2003
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, Hong Hsing Chen, An Pang Tu
  • Publication number: 20030162935
    Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.
    Type: Application
    Filed: February 6, 2003
    Publication date: August 28, 2003
    Inventors: Takashi Sagara, Toshiharu Takata, Kiyoaki Ihara, Hidetaka Kakiuchi, Kazuo Ishihara, Chiaki Asano, Masao Gunji, Hiroshi Sato
  • Patent number: 6551714
    Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: April 22, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Akihiko Tobisawa
  • Publication number: 20030073781
    Abstract: A phosphorus-containing resin and a flame retardant resin composition containing the same are proposed. The flame retardant resin composition includes a phosphorus-containing resin, a nitrogen-containing resin hardener and a hardening promoter. Since the flame retardant resin composition has an excellent flame retardant property and heat resistance with no halogens contained and no additional flame retardant additives added therein, it can be used for producing prepregs, composite materials, laminates, printed circuit boards, copper foil adhesives, and packaging materials for semiconductors.
    Type: Application
    Filed: August 14, 2001
    Publication date: April 17, 2003
    Applicant: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen-Yuan Hwang, Hong-Hsing Chen, An-Pang Tu
  • Patent number: 6548627
    Abstract: The present invention relates to novel flame-retardant phosphorus-containing epoxy resins with an epoxy value of from 0.05 to 1.0 moll 100 g containing structural units which derive from (A) polyepoxy compounds having at least two epoxy groups per molecule, and (B) organic phosphinic acids. The invention further relates to a process for their preparation, and to their use. Besides their flame retardancy, the novel flame-retardant phosphorus-containing epoxy resins have especially good storage stability.
    Type: Grant
    Filed: April 19, 2000
    Date of Patent: April 15, 2003
    Assignee: Clariant GmbH
    Inventor: Sebastian Hörold
  • Publication number: 20030013836
    Abstract: According to the present invention, a resin composition having a high refractive index and low dispersion characteristics is provided. THE resin composition comprises a carbonate residue, a phosphonic acid residue represented by the following structural formula (1), and a dihydric phenol residue represented by the following structural formula (2), wherein the mol fractions of the phosphonic acid residue and the carbonate residue satisfy equation (3).
    Type: Application
    Filed: May 20, 2002
    Publication date: January 16, 2003
    Inventors: Keijiro Takanishi, Takuya Kumagai, Ryouichi Ishinabe
  • Patent number: 6476101
    Abstract: To provide a method for producing a pigment dispersing resin varnish for cationic electrodeposition paint, wherein the flow properties and appearance of the resulting electrodeposition coating film are not compromised when using as a solvent a compound that is not volatilized into the atmosphere but remains in the electrodeposition coating film during the onium conversion of a pigment dispersing resin, as well as a cationic electrodeposition resin composition allowing HAPs to be eliminated and volatile organic carbon compounds to be reduced (VOC reduction). A method for producing a pigment dispersing resin varnish for use with cationic electrodeposition paint, wherein a solvent comprising a polyalkylene oxide compound represented by the following formula is used to produce a resin varnish which has been obtained from a cationic epoxy resin composition having amino groups, phosphonium groups, or sulfonium groups.
    Type: Grant
    Filed: November 30, 2000
    Date of Patent: November 5, 2002
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Masahiro Takegawa, Makoto Ando, Keisuke Tsutsui, Shinsuke Shirakawa, Mitsuo Yamada
  • Patent number: 6441064
    Abstract: A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, dicyandiamide latent heat activated curing agent and an accelerator for the dicyandiamide curing agent characterized in that an imidazole phosphate salt is the accelerator.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: August 27, 2002
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Dilipkumar Nandlal Shah, William Edward Starner
  • Patent number: 6432539
    Abstract: A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohydrin, and the polymer may further act as the hardener.
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: August 13, 2002
    Assignee: Chang Chun Plastics Co. Ltd.
    Inventors: Kuen-Yuan Hwang, Hong-Hsing Chen, An-Pang Tu, Ying-Ling Liu
  • Patent number: 6353080
    Abstract: A flame retardant epoxy resin composition containing not more than 10% by wgt. of halogen, comprising an epoxy resin, stated concentrations of phosphoric acid ester, nitrogen—containing cross-linking agent having an amine functionality of at least 2 and a catalyst capable of promoting the reaction of the phosphoric acid ester with the epoxy resin and promoting the curing of the epoxy resin with the cross-linker, and optionally a Lewis acid in a stated amount.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: March 5, 2002
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, Alan Goodson, Raymond A. Koenig, John P. Everett
  • Publication number: 20010044518
    Abstract: The invention relates to low-dust granules of plastics additives, comprising
    Type: Application
    Filed: June 12, 2001
    Publication date: November 22, 2001
    Inventors: Kurt Hoffmann, Heinz Herbst, Rudolf Pfaendner
  • Patent number: 6284869
    Abstract: The invention pertains to an adduct comprising epoxy groups obtainable by condensation of an epoxy compound and at least a monocyclic phosphite according to Formula 1: wherein R1 and R2 may be the same or different and represent H or C1-4 alkyl and m is 1, optionally, in admixture with a bicyclic phosphite according to Formula 1 wherein R1 and R2 are absent, m is 2, and wherein R3-R6 may be the same or different and represent H or C1-4 alkyl.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: September 4, 2001
    Assignee: Akzo Nobel N.V.
    Inventors: Antonius Johannes Wilhelmus Buser, Jan André Jozef Schutyser
  • Patent number: 6087417
    Abstract: The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of epoxy resin, acid, and tertiary amine; (B) reactive diluent, and, optionally, (C) curing agent. The compositions are useful for forming cured coated substrates, that are especially suitable for food and beverage packaging.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: July 11, 2000
    Assignee: The Valspar Corporation
    Inventors: Thomas A. Stevenson, Larry Brandenburger, William McCarty, John Mazza, Jeffrey Niederst
  • Patent number: 5959043
    Abstract: The invention relates to a flame-resistant epoxy resin mixture comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprises a phosphorus-containing compound of the formula I or II ##STR1## in which R1 and R2 are identical or different and are a straight-chain or branched alkyl radical of 1 to 8 carbon atoms, a cyclohexyl, cyclopentyl or aryl radical or an alkyl- or alkoxy-substituted alkyl radical of 1 to 18 carbon atoms, it also being possible for R1 and R2, together with the P atom, to form a ring, and m and n are 0 or 1, to a process for their preparation and to their use.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: September 28, 1999
    Assignee: Clariant GmbH
    Inventors: Sebastian Horold, Hans-Jerg Kleiner
  • Patent number: 5900469
    Abstract: The present invention relates to a storage-stable, phosphorus-modified epoxy resin having an epoxide value of 0.05 to 0.6 mol/100 g and comprising 5 to 25% by weight of an ester-anhydride formed from a phosphonic acid diester, phosphinic acid ester or mixture of these esters and phosphorus pentoxide, and to a process for its preparation by reaction of 95 to 75 parts by weight of an epoxy resin (A) having an epoxide value of 0.1 to 0.8 mol/100 g and 5 to 25 parts by weight of the ester-anhydride in the presence or absence of a solvent at -20 to 150.degree. C.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: May 4, 1999
    Assignee: Aventis Research & Technologies GmbH
    Inventors: Hans-Jerg Kleiner, Sebastian Horold, Guido Scholz
  • Patent number: 5880247
    Abstract: The invention relates to a phosphorus-modified epoxy resin having an epoxide value of from 0.05 to 0.6 mol/100 g comprising structural units derived from(A) polyepoxide compounds having at least two epoxide groups per molecule and(B) phosphorus-containing dicarboxylic acids or phosphorus-containing carboxylic anhydrides,to a process for their preparation and to their use.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: March 9, 1999
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Sebastian Horold, Hans-Jerg Kleiner
  • Patent number: 5854371
    Abstract: The invention relates to a flame-resistant epoxy resin mixture comprising epoxy resins, phosphorus-containing compounds and a curing agent, wherein the epoxy resin mixture comprises phosphorus-containing structural units of the formula I ##STR1## in which R1 is an alkyl or aryl group having from 1 to 10 carbon atoms, R2 is hydrogen or an alkyl group having from 1 to 4 carbon atoms and R is an alkylene, cycloalkylene or arylene group having from 2 to 20 carbon atoms.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: December 29, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventor: Sebastian Horold
  • Patent number: 5854361
    Abstract: The invention relates to a process for preparing soluble and/or meltable phosphorus-modified epoxy resins, which comprises reacting a polyepoxide compound having at least 2 epoxide groups per molecule with carboxyl-containing phosphinic or phosphonic acids.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: December 29, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Sebastian Horold, Hans-Peter Schmitz
  • Patent number: 5830973
    Abstract: The invention relates to a phosphorus-modified epoxy resin having an epoxide value of from 0 to 1.0 mol/100 g, comprising structural units derived from(A) polyepoxide compounds having at least two epoxide groups per molecule and(B) diphosphinic acids,to a process for their preparation and to their use.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: November 3, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Sebastian Horold, Hans-Peter Schmitz
  • Patent number: 5817736
    Abstract: Epoxy resin mixtures to produce prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides or phosphonic acid half-esters;dicyandiamide and/or an aminobenzoic acid derivative as the hardener;an amino hardening accelerator.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: October 6, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang von Gentzkow, Jurgen Huber
  • Patent number: 5811188
    Abstract: The present invention relates to phosphorus-modified epoxy resins of the formulae (I) and/or (II) ##STR1## The invention furthermore relates to a process for the preparation of these phosphorus-modified epoxy resins and to their use for the production of shaped articles, coatings or laminates.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: September 22, 1998
    Assignees: Siemens Aktiengesellschaft, Aventis Research & Technologies GmbH & Co. KG
    Inventors: Jurgen Huber, Heinrich Kapitza, Hans-Jerg Kleiner, Wolfgang Rogler
  • Patent number: 5811486
    Abstract: For better flame-retardant finishing and better workability of an epoxy-anhydride reaction resin system, it is proposed to supplement the reaction resin system with phosphonic semi-ester as additional reactive constituents. These are produced by conversion of phosphonic acid anhydride with single-valent or multi-valent alcohols. As a result of the selection of the alcohol constituent, property features of the molding material modified therewith that are already advantageous can be designationally set without thereby negatively influencing the hardening characteristic. Even with slight parts of phosphonic acid semi-ester, shaped members manufactured therefrom exhibit an adequate flame-retardant behavior given an otherwise unmodified property profile.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: September 22, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ernst Wipfelder, Windfried Plundrich
  • Patent number: 5773533
    Abstract: The invention relates to flame-resistant epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprise a phosphorus-containing compound of the formula I or II ##STR1## in which R is a linear or branched alkyl, cycloalkyl, aryl or alkylaryl group having 1 to 18 carbon atoms or is hydrogen, and R' is a linear or branched alkylene, cycloalkylene, arylene or alkylarylene group having 1 to 18 carbon atoms, to a process for their preparation and to their use.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: June 30, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventor: Sebastian Horold
  • Patent number: 5759691
    Abstract: The invention relates to an expandable, halogen-free, flame-retardant coating composition comprising epoxy resins, polyphosphoric/polyphosphonic esters and a curing agent, which composition comprises from 75 to 95 parts by weight of epoxy resin and from 5 to 25 parts by weight of polyphosphoric/polyphosphonic ester and wherein the overall weight ratio of epoxy resin and polyphosphoric/polyphosphonic ester to curing agent is (1.1 to 10) to 1. The invention likewise relates to a process for preparing such coating compositions and to their use.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: June 2, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Guido Scholz, Sebastian Horold, Wolf-Dieter Pirig
  • Patent number: 5759692
    Abstract: The invention relates to expandable, halogen-free, flame-retardant coating compositions comprising epoxy resins, polyphosphoric esters and a curing agent, which composition comprises from 75 to 95 parts by weight of epoxy resin and from 5 to 25 parts by weight of polyphosphoric ester and wherein the overall weight ratio of epoxy resin and polyphosphoric ester to curing agent is (1.1 to 10) to 1. The invention likewise relates to a process for preparing such expandable, halogen-free coating flame-retardant, compositions comprising epoxy resins and polyphosphoric esters and a curing agent, and to their use, in particular as an intumescent coating.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: June 2, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Guido Scholz, Sebastian Harold, Wolf-Dieter Pirig
  • Patent number: 5759690
    Abstract: Epoxy resin mixtures for the production of prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule, and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;an amine-substituted aromatic sulfonic acid amide or hydrazide as a hardener;an amino hardening accelerator.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: June 2, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang von Gentzkow, Jurgen Huber, Heinrich Kapitza, Wolfgang Rogler
  • Patent number: 5756638
    Abstract: The present invention relates to phosphorus-modified epoxy resins having an epoxy number from 0 to 1 mol/100 g, comprising structural units which are derived from(A) polyepoxy compounds having at least two epoxy groups per molecule, and(B) phosphinic and/or phosphonic anhydrides.The invention further provides a process for preparing these phosphorus-modified epoxy resins and provides for the use of the resins in producing moldings, coatings or laminates.
    Type: Grant
    Filed: October 27, 1995
    Date of Patent: May 26, 1998
    Assignee: Hoechst AG
    Inventors: Wolfgang von Gentzkow, Jurgen Huber, Heinrich Kapitza, Wolfgang Rogler, Hans-Jerg Kleiner, Uwe Schonamsgruber
  • Patent number: 5756596
    Abstract: An increase in the molecular weight of a polyamide or recycled polyamide, essentially without crosslinking, can be achieved by blending said polyamide with a polyfunctional epoxy resin and a sterically hindered hydroxyphenylalkylphosphonic acid ester or half-ester and heating the blend to above the melting point (or the glass transition temperature) of the polyamide, in the absence of a catalyst of the type used in the polymerization of polyamides.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: May 26, 1998
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Rudolf Pfaendner, Heinz Herbst, Kurt Hoffmann
  • Patent number: 5728468
    Abstract: The invention relates to an organic phosphorus compound-containing which comprises an interpenetrating polymer network (IPN) produced by polymerizing free-radically polymerizable monomers comprising at least an allyl group-containing monomer and an epoxy resin.
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: March 17, 1998
    Assignee: Akzo Nobel N.V.
    Inventors: Jan Andre Jozef Schutyser, Antonius Johannes Wilhelmus Buser, Andre Steenbergen
  • Patent number: 5648171
    Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, andan aromatic polyamine as the hardener.
    Type: Grant
    Filed: September 14, 1995
    Date of Patent: July 15, 1997
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang von Gentzkow, Jurgen Huber, Heinrich Kapitza, Wolfgang Rogler, Hans-Jerg Kleiner
  • Patent number: 5624979
    Abstract: The present invention relates to phosphorus-modified epoxy resins having an epoxide value of 0 to about 1 mol/100 g containing structural units which are derived from(A) polyepoxide compounds having at least two epoxide groups per molecule and(B) phosphinic and/or phosphonic acid anhydrides, wherein at least one phenolic antioxidant is admixed to them. The phosphorus-modified epoxy resins stabilized in this way are distinguished by an increased storage stability, in particular at higher temperatures.The invention furthermore relates to the use of these stabilized, phosphorus-modified epoxy resins for the production of shaped articles, coatings or laminates.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: April 29, 1997
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Hans-Jerg Kleiner, Dieter Regnat
  • Patent number: 5587243
    Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, andan aromatic polyamine as the hardener.
    Type: Grant
    Filed: September 14, 1995
    Date of Patent: December 24, 1996
    Assignees: Siemens Aktiengesellschaft, Hoechst Aktiengesellschaft
    Inventors: Wolfgang von Gentzkow, J urgen Huber, Heinrich Kapitza, Wolfgang Rogler, Hans-Jerg Kleiner, Dieter Wilhelm