Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.

Abstract: An aliphatic epoxy resin precursor composition containing an epoxy component and, optionally, a reactive component, the composition containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component. A cured aliphatic epoxy resin containing a precursor composition and a curing component, the precursor composition including an epoxy component and, optionally, a reactive component, and the cured resin containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component.

Abstract: An aliphatic epoxy-terminated polysulfide polymer has the formula R?—CHOH—CH2-S—R—(Sy-R)t-S—CH2-CHOH—R? and is formed by a process, where each R is independently chosen from branched alkanediyl or branched arenediyl groups and groups with the structure —(CH2)a-O—(CH2)b-O—(CH2)c- and about 0 to about 20% of the number of R-groups are branched alkanediyl or branched arenediyl groups and about 80 to about 100% of the number of R-groups have the structure —(CH2)a-O—(CH2)b-O—(CH2)c-, where t is from about 1 to about 60, y is an average value of from about 1.0 to about 2.5, b is an integer value of from about 1 to about 8, and a and c are independently integers from about 1 to about 10, and where each R? is independently a particular radical where, m, n, o, p, q and r independently have a value of from about 1 to about 10.

Abstract: A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

Abstract: Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.

Abstract: Described is a quantum dot film article comprising a quantum dot of a cured thiol-epoxy matrix. The matrix formulations resist ingress from water and/or oxygen, while also providing acceptable color stability upon aging.

Abstract: Disclosed herein are crosslinked polycarbonates, composition thereof and methods thereof. The crosslinked polycarbonates can be prepared from allyl or epoxy polycarbonates. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: A potting material for membrane modules which is formed of an epoxy resin composition, in which the mass change ratio of a cured product of the epoxy resin composition after being immersed in diethylene glycol methyl ethyl ether at 40° C. for one week is ±10% or less, and the mass change ratio thereof after being immersed in tetrahydrofurfuryl acrylate at 40° C. for one week is ±5% or less, and a hollow fiber membrane module which uses the potting material for membrane modules.

Abstract: A resin composition containing (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent is provided. The compound of the (B) component has a content of 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 50 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.

Abstract: A polysulfide coating composition includes an aliphatic, aromatic or cycloaliphatic material with at least 2 thiol groups; an aliphatic, aromatic or cycloaliphatic, acryl, polyester or polysiloxane-based material with at least two epoxy groups; and a catalyst. The coating provides a durable cavitation- and erosion-resistant coating for the rudders of ships, and is also suitable for sound-damping applications.

Abstract: The present invention provides a gel time controllable epoxy adhesive, which includes a first part comprising an epoxy resin containing two or more epoxy groups in one molecule, and a second part comprising a thiol curing agent, wherein a peroxide is comprised in part A, part B and/or a third separate part C.

Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.

Abstract: An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

Abstract: To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30° C. or less, and (B1) thiol compound having two or more thiol groups in one molecule.

Abstract: The present invention relates to epoxy resin coating composition which comprises, at least, epoxy resin, a thiol-type curing agent and a curing assistant, being composed of two liquids of liquid (A) containing epoxy resin and a thiol-type curing agent and liquid (B) containing a curing assistant, which liquids are mixed just before using, wherein the thiol-type curing agent contains a branched compound containing a thiol group (P), which compound is an ester of polyhydric alcohol with thiol group-containing carboxylic acid represented by formula (1) HOCO(CH2)nCR1R2SH??(1) (in the formula, R1 represents a hydrogen atom or a linear or branched alkyl group having 1 to 10 carbon atoms, R2 represents a linear or branched alkyl group having 1 to 10 carbon atoms, and n represents an integer of 1 to 4), which exhibits a suitable pot life, excellent curability particularly at low and ordinary temperature and low toxicity.

Abstract: A polymer of formula (I): where: n is an integer from 10 to 5,000; m is an integer from 10 to 5,000; Ar1 and Ar3 are the same or different and are residues derived from a tetra-hydroxy aromatic monomer, the tetra-hydroxy aromatic monomer being wherein R is the same or different and is H or a C1-C8 alkyl, C2-C8 alkenyl or C3-C8 cycloalkyl group; and, Ar2 and Ar4 are the same or different and are residues derived from a tetra-halogenated aromatic monomer, the tetra-halogenated aromatic monomer being wherein X is F, Cl or Br, and R1 and R2 are the same or different and are wherein y is an integer from 1 to 8; with the proviso that when Ar1 is the same as Ar3 and Ar2 is the same as Ar4, R1 and R2 are not both —CN is useful as a material for gas separation, vapor separation, adsorbents or catalysis.

Abstract: A composition comprising a reaction product of reactants comprising (a) a compound comprising (i) a polysulfide moiety and (ii) an oxygen atom in a ?-position to a sulfur link having the formula: where each R is independently selected from H or a C1 to C20 organyl group, R? is independently selected from a C1 to C20 organyl group, R?? is independently selected from H or a C1 to C20 organyl group, and x has an average of greater than 2, (b) a compound comprising a nucleophilic moiety; and (c) a compound comprising a moiety reactive to active hydrogen.

Abstract: The present invention relates to an aminimide compound having a structure represented by the following general formula (I) in the molecule thereof, relates to a curable composition using the aminimide compound and relates to a method for curing the composition; in which R0 represents a hydrogen atom, an alkyl group which may have an optional substituent, an aryl group which may have an optional substituent, or a heterocyclic residue which may have an optional substituent. R1, R2 and R3 each independently represent a hydrogen atom, or an optional substituent. However, at least two of R1, R2 and R3 may bond to each other to form a cyclic structure.

Abstract: A composition comprising a reaction product of reactants comprising (a) a compound comprising (i) a polysulfide moiety and (ii) an oxygen atom in a ?-position to a sulfur link having the formula: where each R is independently selected from H or a C1 to C20 organyl group, R? is independently selected from a C1 to C20 organyl group, R?? is independently selected from H or a C1 to C20 organyl group, and x has an average of greater than 2, (b) a compound comprising a nucleophilic moiety; and (c) a compound comprising a moiety reactive to active hydrogen.

Abstract: A novel polymeric initiator is disclosed comprising a dendritic polymer core with at least one initiating functional group as an end group. The dendritic polymeric core is preferably a hyperbranched polymer. The polymeric initiators are useful in radiation curable compositions such as varnishes, lacquers and printing inks and are especially useful in radiation curable inkjet inks.

Abstract: The present invention relates to adhesion-improved, curable compositions comprising a cyclic ether, a cyclic thiocarbonate, an amine and a carboxylic acid. A method of making such compositions and their use in adhesives, sealants and coatings are also provided.

Abstract: An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein R1 may be the same with or different from each other and is a substituted or unsubstituted C1-4 alkyl group, and R2 is a substituted or unsubstituted C1-9 monovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).

Abstract: A method for treating extremely small particles of plastic comprises providing a quantity of plastic particles having an average mean particle size ranging from about 0.0005 inch to about 0.05 inch in diameter, heating the plastic particles to a temperature sufficient to cause at least a portion of the plastic particles to adhere to one another, and forming the adhered plastic particles into pellets, said pellets having substantially the same average surface-to-volume ratio as the bulk, un-adhered plastic particles.

Abstract: The present invention provides a comb-shaped epoxy resin represented by the following formula (1): in the formula (1), X1 and X2 represent a divalent group having a residue selected from xanthene residue, biphenylene residue, hydrogenated bisphenol residue, alkylene residue and polyoxyalkylene residue, each may having a methyl group or a ethyl group as a substituent, and at least one of them is an aromatic residue, Y represents a polymer chain such as linear polymer chain, a number average polymerization degree being 5 to 2000, and n (number average polymerization degree) represents an integer within a range of 3 to 200, and to a method for preparing the comb-shaped epoxy resin.

Abstract: The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.

Abstract: The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.

Abstract: The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.

Abstract: Ion-Exchange polymers for a polymer electrolyte membrane include a moiety of formula (I), and/or a moiety of formula (II), and/or a moiety of formula (III) wherein at least some of the units I, II and/or III are sulphonated; wherein the phenyl moieties in units I, II, and III are independently optionally substituted and optionally cross-linked; and wherein m, r, s, t, v, w and z independently represent zero or a positive integer, E and E? independently represent an oxygen or a sulphur atom or a direct link, G represents an oxygen or sulphur atom, a direct link or a —O—Ph—O— moiety where Ph represents a phenyl group and Ar is selected from one of the above moieties (i) to (x) which is bonded via one or more of its phenyl moieties to adjacent moieties

Abstract: A sealant composition for a plastic liquid crystal display cell is composed of a two-component epoxy resin composition of a base resin liquid and a curing agent liquid, wherein the base resin is a liquid epoxy resin having from 1.7 to 6 in weight average of epoxy groups in one molecule and an ionic conductivity of 2 mS/m or less; and the curing agent has an ionic conductivity of 0.6 mS/m or less. The sealant composition facilitates the fabrication of plastic liquid crystal displays having enhanced durability and sealant properties, particularly in high temperature and high humidity environments.

Abstract: The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor.

Abstract: The invention relates to epoxy resin hardener compositions containing at least one mercaptan hardener and at least one metal salt of C8-24 carboxylic acids. These hardeners are distinguished in particular by the fact that catalyzed resins containing epoxy resins and the hardener compositions according to the invention give high-gloss molding compounds, more particularly coatings, after hardening by crosslinking.

Abstract: The present invention relates to an epoxy resin composition for fiber reinforced composite material comprising the following components (1)-(3) as essential components, their mixing ratios meeting the following conditions (I)-(IV), and component (3) being dissolved homogeneously:

Abstract: An episulfide compound useful as a starting material for optical materials that have a high refractive index and a high Abbe's number is provided. A method for producing the same and an optical product made with the same are also provided. The episulfide compound may be represented by the general formula (1): wherein EP represents and n is an integer of from 0 to 2. A method for producing the episulfide compound represented by the general formula (1) may involve reacting a mercapto group-containing episulfide compound with 2,4,6-trimethylene-1,3,5-trithiane.

Abstract: A water-soluble branched polyhydroxyetheramine, wherein the branched polyhydroxyetheramine is prepared by reacting an amine having two reactive hydrogen atoms with a diepoxide to form a polyhydroxyetheramine and then reacting the polyhydroxyetheramine with an N-alkylating agent, an aqueous composition comprising the branched polyhydroxyetheramine and use of the branched polyhydroxyetheramine to modify the permeability to water of a subterranean formation are disclosed.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: To provide a method for producing a pigment dispersing resin varnish for cationic electrodeposition paint, wherein the flow properties and appearance of the resulting electrodeposition coating film are not compromised when using as a solvent a compound that is not volatilized into the atmosphere but remains in the electrodeposition coating film during the onium conversion of a pigment dispersing resin, as well as a cationic electrodeposition resin composition allowing HAPs to be eliminated and volatile organic carbon compounds to be reduced (VOC reduction). A method for producing a pigment dispersing resin varnish for use with cationic electrodeposition paint, wherein a solvent comprising a polyalkylene oxide compound represented by the following formula is used to produce a resin varnish which has been obtained from a cationic epoxy resin composition having amino groups, phosphonium groups, or sulfonium groups.

Abstract: A composition comprising a poly(hydroxy aminoether) and an effective amount of a propoxylated or ethoxylated phenol, process for preparing the same and articles prepared from the composition.

Abstract: Metal compounds of pseudohalogenides and their use as curing agents for epoxy compounds which curing agents can be produced by mixing the reactants in aqueous solution and are distinguished by a long processibility time at temperatures up to 100° C. as well as by very short curing times at temperatures in the range of 120 to 160° C.

Abstract: A sulfur-containing (thio)ether (co)polymer comprising repetitive structural units represented by general formulas 1 and 2, and an optical element using the (co)polymer: where A and B are bivalent organic group; R1 and R2 are hydrogen or alkyl; X1 to X4 are oxygen or sulfur; Y1 and Y2 are halogen, hydroxy, —OR3 or —SR4, in which R3 is sulfur-containing alkyl, aryl, heterocycle or acyl optionally having a substituent other than SH; and R4 is alkyl, aryl, heterocycle or acyl; provided that —OR3 and/or —SR4 constitute 10 to 100% of the total of Y1+Y2. The (co)polymer exhibits good optical, mechanical and thermal properties and a higher refractive index, and may be prepared in a good productivity. The sulfur-containing (thio)ether (co)polymer is useful for manufacturing a variety of optical elements.

Abstract: Polyfunctional mercaptoalkyl-substituted aryl compounds, one and two-part adhesive compositions including the compounds, and methods of making and using the compounds are disclosed. The compounds include one or more aromatic rings, wherein at least one, and in one embodiment, only one aromatic ring is substituted with at least one alkylthio group and at least one oxyalkylthio group, and preferably do not include hydrolyzable linkages. The aromatic nucleus can provide the cured products with higher glass transition temperatures (Tg's) than are available from most commercially available polymercaptans. The adhesive systems include an epoxy resin or other compounds such as terminal olefins which are known to react with thiols (polymerizable material). Preferably, the compounds are used in combination with amine curatives as a two-component curing system for epoxy resins.

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bonds.

Abstract: The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of epoxy resin, acid, and tertiary amine; (B) reactive diluent, and, optionally, (C) curing agent. The compositions are useful for forming cured coated substrates, that are especially suitable for food and beverage packaging.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Abstract: A laminate structure comprises one or more layers of an organic polymer and one or more layers of a hydroxy-functionalized polyetheramine, wherein the hydroxy-functionalized polyetheramine layer is adhered directly to a contiguous organic polymer layer without an adhesive layer therebetween. The hydroxy-functionalized polyetheramine is prepared by reacting (1) a difunctional amine with (2) a diglycidyl ether or a diepoxy-functionalized poly(alkylene oxide) under conditions sufficient to cause the amine moieties to react with the epoxy moieties to form a polymer backbone having amine linkages, ether linkages and pendant hydroxyl moieties and then treating the reaction product with a monofunctional nucleophile which is not a primary or secondary amine.

Abstract: A composition for polysulfide-based resin comprising a polythiol having 4 or more functional groups and a compound having a reactive unsaturated bond(s) and/or b epoxy group(s) and/or c iso(thio)cyanato group(s) in one molecule (however, a+b+c.gtoreq.2, and a and b are not simultaneously 0). A polysulfide-based resin obtained by curing the composition, an optical material comprising the resin, a lens consisting of the optical material and a method for producing the polysulfide-based resin are also set forth.

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.

Abstract: In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted at a temperature of .ltoreq.0.degree. C. with a mixed dianhydride of a dicarboxylic acid and a sulfonic acid with the following structure:E--SO.sub.2 --O--CO--R*--CO--O--SO.sub.2 --Ewhere E is an (optionally substituted) methyl, phenyl, or naphthyl group and R* is the parent body of the dicarboxylic acid.

Abstract: A method for the preparation of a diaminobisimide compound of the formula (I) substantially free of oligomers: ##STR1## wherein Ar.sup.1 is an optionally substituted aromatic residue which provides for good conjugation between the nitrogen containing groups; andAr is an optionally substituted aromatic residue characterized in that at least two molar proportions of an aromatic diamine of the formula (II)H.sub.2 N--Ar.sup.1 --NH.sub.2 (II)wherein Ar.sup.1 is as defined above,are heated with one molar proportion of an aromatic tetracarboxylic acid of the formula (III) or the corresponding dianhydride,(HOOC).sub.2 Ar(COOH).sub.2 (III)wherein Ar is as defined above,optionally in the presence of a polar solvent and optionally including 0.1 to 2 molar proportions of a tertiary amine.The compounds of formula (I) are useful curing agents in epoxy resin formulations.

Abstract: A method of preparing epoxy parts wherein the interval of low viscosity of an amine-hardened epoxy system can be extended without sacrifice of cure time. Suitable catalysts for the epoxy-amine hardener reaction are generated in situ. As an advantage, more epoxy articles may be prepared with a given mold capacity having improved wet-out of fiber reinforcement attributed to a larger interval of low viscosity.