Abstract: The present invention aims to provide a resin composition which can form a cured product having a high adhesive property and a high thermal conductivity. A resin composition containing an epoxy compound (A), an amine curing agent (B) and a thermally conductive filler (C), wherein the epoxy compound (A) is in a liquid form and wherein the amine curing agent (B) contains a benzoxazole skeleton.

Abstract: In the manufacture of articles in slabs or blocks according to so-called Bretonstone technology, a polyester resin is employed, free of reactive solvents, formed by the reaction between an epoxidized triglyceride and at least one carboxylic anhydride.

Abstract: The present invention provides an epoxy-vinyl copolymerization type liquid resin composition and a cured product of the same. The resin composition contains: an epoxy resin having an epoxy resin equivalent of not more than 200 g/eq; an acid anhydride having an unsaturated double bond that is liquid at normal temperature or the acid anhydride having an unsaturated double bond that is liquid at normal temperature and maleic anhydride; a polyfunctional monomer which is liquid at normal temperature; an epoxy resin curing catalyst which accelerates a curing reaction of the epoxy resin with the acid anhydride or with the acid anhydride and maleic anhydride; and a radical polymerization catalyst which accelerates a curing reaction of the polyfunctional monomer. This makes it possible to reduce varnish viscosity and to enhance heat resistance of the cured product.

Abstract: A method for producing particles, including: bringing a compressive fluid into contact with a pressure plastic material, so as to plasticize the pressure plastic material; applying a shear force to the compressive fluid and the plasticized pressure plastic material, between which an interface exists, in the presence of a surfactant to granulate the pressure plastic material in the compressive fluid, so as to produce particles.

Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.

Abstract: A resin composed of a particular polymer, the particular polymer including a repeating unit containing a structure derived from a dehydroabietic acid, a specific structural unit, and a specific aromatic ring-containing structural unit in the main chain.

Abstract: A method for producing particles, including: bringing a compressive fluid into contact with a pressure plastic material, so as to plasticize the pressure plastic material; applying a shear force to the compressive fluid and the plasticized pressure plastic material, between which an interface exists, in the presence of a surfactant to granulate the pressure plastic material in the compressive fluid, so as to produce particles.

Abstract: There is provided an anti-reflective coating forming composition for lithography comprising a polymer having an ethylenedicarbonyl structure and a solvent; an anti-reflective coating formed from the composition; and a method for forming photoresist pattern by use of the composition. The anti-reflective coating obtained from the composition can be used in lithography process for manufacturing a semiconductor device, has a high preventive effect for reflected light, causes no intermixing with photoresists, and has a higher etching rate than photoresists.

Abstract: Aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC. Resins ABC are an adduct mixture of: adducts formed by the reaction of polyethylene glycol-modified epoxy resins A with olefinically unsaturated acids C, and adducts formed by the reaction of epoxy resins B, that are free from polyethylene glycol derived groups, with olefinically unsaturated acids C. A process for preparing aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC, and a process of coating a substrate with aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC.

Abstract: The present invention provides a cyclic olefin addition copolymer which has a reactive silyl group having a specific structure, excels in optical transparency, heat resistance, and adhesion, and is capable of producing a crosslinked product having improved dimensional stability, solvent resistance, and chemical resistance. The present invention also provides a process for producing the cyclic olefin addition copolymer, a crosslinking composition, a crosslinked product and a process for producing the same, and an optically transparent material (transparent resin film) comprising the cyclic olefin addition copolymer. The optically transparent material excels in optical transparency and heat resistance, exhibits improved dimensional stability, adhesion, solvent resistance, and chemical resistance, and is capable of improving fragility and preventing occurrence of cracks in the film.

Abstract: The present invention provides a cyclic olefin addition copolymer which has a reactive silyl group having a specific structure, excels in optical transparency, heat resistance, and adhesion, and is capable of producing a crosslinked product having improved dimensional stability, solvent resistance, and chemical resistance. The present invention also provides a process for producing the cyclic olefin addition copolymer, a crosslinking composition, a crosslinked product and a process for producing the same, and an optically transparent material (transparent resin film) comprising the cyclic olefin addition copolymer. The optically transparent material excels in optical transparency and heat resistance, exhibits improved dimensional stability, adhesion, solvent resistance, and chemical resistance, and is capable of improving fragility and preventing occurrence of cracks in the film.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclo[2.2.2]oct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent. The composition is adherent to the surface of silicon chips, and especially to polyimide resins and nitride films and has high thermal shock resistance. A semiconductor device sealed with the cured epoxy resin composition remains reliable.

Abstract: A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.

Abstract: The object of the present invention is to provide resin compositions conferring cured materials (a coating or the like) with excellent appearance, excellent mechanical properties, or the like. The present invention provides resin compositions containing a vinyl copolymer with an epoxy group and a branched glutaric acid.

Abstract: In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted at a temperature of .ltoreq.0.degree. C. with a mixed dianhydride of a dicarboxylic acid and a sulfonic acid with the following structure:E--SO.sub.2 --O--CO--R*--CO--O--SO.sub.2 --Ewhere E is an (optionally substituted) methyl, phenyl, or naphthyl group and R* is the parent body of the dicarboxylic acid.

Abstract: In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted with a dicarboxylic acid derivative of the following structure: ##STR1## with D=O, S, or NH and where R* is the parent body of the dicarboxylic acid and the groups R.sup.1 through R.sup.4 are H, F, CH.sub.3, or CF.sub.3 (with a maximum of two CH.sub.3 or CF.sub.3 groups).

Abstract: There is disclosed a photo-imaging resist ink containing (A) an unsaturated group-containing polycarboxylic acid resin which is a reaction product of (c) succinic anhydride with an additive reaction product of (a) an epoxy resin with (b) an unsaturated group-containing monocarboxylic acid, wherein (a) the epoxy resin is represented by the following formula (1): ##STR1## wherein M stands for ##STR2## n is at least 1 on the average; and m is 1 to n on the average. The resist ink is excellent in developability and photosensitivity, while the cured product thereof is excellent in flex resistance and folding resistance, and well satisfactory in adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, etc.

Abstract: A curing agent for a composition useful for the production of matt epoxy resin and hybrid powder coatings, comprising a mixture ofa) salts of phthalic acid, isophthalic acid and terephthalic acid with the following amines ##STR1## in which R.sub.1, R.sub.2 and R.sub.3 are identical or different aliphatic, cycloaliphatic, araliphatic or aromatic hydrocarbon radicals having 1-20 carbon atoms and in which one or more CH.sub.2 groups in the carbon chain may be replaced by 0 atoms, by NR.sub.4 groups where R.sub.4 =C.sub.1-6 -alkyl, CH--OH groups, and/or one or more terminal methyl groups may be replaced by dialkyl-substituted amino groups having 1 to 6 carbon atoms, and R.sub.1 and R.sub.2 may form a joint ring in which one CH.sub.2 group may be replaced by an O atom or by an NR.sub.4 group, and R.sub.1 =R.sub.2 =R.sub.3 --CH.sub.2 --CH.sub.2 -- attached via a common nitrogen atom, and n=3-11, and 0.5-2 mol of amine A)-C) per mole of acid, andb) pyromellitic acid and/or trimellitic acid, 0.

Abstract: The invention relates to salts of pyromellitic acid which comprise 1 mol of pyromellitic acid and 0.5 to 2 mol of a guanidine of the following composition: ##STR1## in which R, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are identical or different radicals from the group consisting of hydrogen, alkyl, cycloalkyl and aromatic hydrocarbon residues having 1 to 8 carbon atoms, and R.sup.1 and R.sup.2 and R.sup.3 and R.sup.4 may form a joint ring which may contain an oxygen atom as heteroatom. Also claimed are the preparation of the salts and their use for matt epoxide and hybrid powder coatings.

Abstract: Epoxy interpenetrating polymer networks having chemical bonds between the interpenetrating networks are prepared from a first and a second polymer network, at least one of which contains an EPRXE resin; a resin having two epoxide functionalities represented by E and a reactive pendant nonepoxide functionality X. The two resin networks are sequentially crosslinked followed by activation of the pendant functionality of the EPRXE resin to form internetwork chemical bonds between the two resin networks affording an epoxy resin with both increased strength and toughness. The invention is also directed to the process of making interpenetrating polymer networks.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: An epoxy resin composition containing an anhydride-functional cyclobutene which can be represented by the formula ##STR1## in which each R is independently selected from hydrogen, C.sub.1-10 alkyl, aryl, halide and C.sub.1-10 heteroatomic.

Abstract: Compounds are described having the formula: ##STR1## Z represents a cyanuric ring nucleus or the residue of a polyol, L.sub.1, L.sub.2, and L.sub.3 each independently represents a divalent linking group or a covalent bond, andR.sub.1, R.sub.2, and R.sub.3 each independently represents H, alkyl, cycloalkyl, or aryl.These compounds are useful as crosslinking agents for curable compositions such as coating compositions.

Abstract: A method of preparing an unsaturated ester resin having improved storage stability is disclosed. An epoxy compound and polymerizable unsaturated monocarboxylic acid are reacted in the presence of a trivalent organic phosphorous catalyst. The catalyst is subsequently deactivated by oxidation. The resin may then be reacted with an acid anhydride.

Abstract: The present invention is directed to a method of imparting moisture resistance to epoxies. Moisture resistant epoxy compositions are formed from epoxies and alkenylsuccinic anhydride (ASA) such as tripropenylsuccinic anhydride (TSA). The epoxy compositions, following cure, show surprisingly improved moisture resistance and retention of properties when exposed to warm, humid environments.

Abstract: Polyester resins are prepared by reacting a lower alkyl ester of an aromatic dicarboxylic acid with an aliphatic diol to form an aromatic polyester, and which includes (i) subjecting to transesterification reaction conditions in the presence of a titanium compound catalyst a transesterification reaction system having the lower alkyl ester of the aromatic dicarboxylic acid, the aliphatic and between 0.02 to 5.0 mole percent, based on the amount of the lower alkyl ester of the aromatic dicarboxylic acid, of an aromatic sulfonic acid compound represented by the following general formula (I):OH--R--O--Ar--SO.sub.3 M (I)wherein Ar is a p-substituted benzene group or a 2,6-substituted naphthalene group, R is a divalent group selected from among --CH.sub.2 CH(CH.sub.3)--, --CH(CH.sub.3)CH.sub.2 --, --CH.sub.2 CH(CH.sub.3)-- and --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 --, and M is an alkali metal selected from the group consisting of lithium, sodium and potassium.

Abstract: Phenoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.

Abstract: The amount of solvent-extractable materials present in organosiloxane gels cured by a platinum-catalyzed hydrosilylation reaction can be reduced without sacrificing other desirable properties the gels when the curable composition used to prepare the gel comprise a first polydiorganosiloxane with vinyl or other ethylenically unsaturated hydrocarbon radicals only at the terminal positions, a second polydiorganosiloxane with silicon bonded hydrogen atoms only at the terminal positions and a crosslinking reactant containing at least three alkenyl radicals or silicon-bonded hydrogen atoms per molecule. The number of silicon-bonded hydrogen atoms or alkenyl radicals in excess of 2 per molecule of crosslinking reactant constitute from 10 to 30 percent of these reactive groups present in the curable composition.

Abstract: Disclosed herein is a viscoelastic resin composition for vibration-damping material which comprises (A) at least one amorphous polyester resin of low specific gravity in which more than 40 mol % of the dibasic acid moiety is of aromatic type, (B) at least one amorphous polyester resin of high specific gravity in which more than 80 mol % of the dibasic acid moiety is of aromatic type, and (C) at least one hardener selected from the group consisting of polyisocyanate compounds, epoxy group-containing compounds, and acid anhydrides, said consitutents (A) and (B) being in the ratio of from 90:10 to 30:70 by weight and differing from each other in specific gravity (at 30.degree. C.) by 0.06 to 0.15 and also in molecular weight by more than 10000, with that of either of them being higher than 5000. This resin composition gives a vibration-damping material which exhibits improved vibration-damping properties, adhesive strength, formability, and heat resistance after forming.

Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.

Abstract: Thermosettable polyol resins for coating compositions are prepared by reacting a polyglycidyl ester of an aliphatic polycarboxylic acid and a di- to hexa-hydric aliphatic alcohol with an adduct of a di- to hexa-hydric aliphatic alcohol and a glycidyl ester of a branched aliphatic monocarboxylic acid with 5 to 15 C-atoms, said adduct having an epoxy group content of less than 0.2 meq/g.

Abstract: An epoxy-based coating formulation includes a curing agent comprising oligomeric adducts of trimellitic anhydride and the glycidyl ester of pivalic acid. Such curing agents having a melting point of from 80 to 110.degree. C., making the epoxy-based formulation suitable for powder coating applications.

Abstract: A solvented polyurethane adhesive composition comprising 20 to 40% by weight of diphenylmethane diisocyanate, 0.5 to 4.0% by weight of a caprolactone triol, 40 to 75% by weight of a neopentyl adipate ester diol, 0 to 10% by weight of at least one polypropylene oxide diol, and a functionally effective amount of a catalyst therefor.

Abstract: An epoxy resin comprising an active hydrogen compound having at least three active hydrogen atoms capable of reacting with an epoxy group in its molecule or butadine or isoprene as a main monomer is modified with an oligomer having on average at least 1.5 equivalents of active hydrogen capable of reacting with an epoxy group in its molecule. An epoxy resin modified with a bisphenol and a compound having active hydrogen or acid anhydride groups capable of reacting with an epoxy group is also provided. A toner containing the epoxy resin as a binder is useful in electrostatography.

Abstract: Fluoroepoxy resins for use in computer composite circuit boards. A "glass state" curing agent containing a fluorinated monoanhydride, a fluorinated dianhydride and a catalyst is compounded at a temperature of about 210.degree. C. The curing agent is blended with di- and tri-functional epoxy resins at 100.degree. C. or higher to give homogeneous fast-curing syrups. Fluoroepoxy resins inherently have low dielectric constants. This method produces a fluoroepoxy resin with higher crosslink densities and higher glass transition temperatures.

Abstract: A thermosetting liquid moulding composition comprising:(a) a polyepoxide containing at least two epoxide groups per molecule;(b) a tricarboxylic acid definable by the general formula: ##STR1## where: R.sup.1, R.sup.2 and R.sup.3 have the meaning given in the description; and(c) a diacarboxylic acid anhydride.This composition can be transformed by liquid moulding into manufactured articles particularly useful in the electrical sector.

Abstract: A curable composition comprising (a) an epoxy resin, (b) a hardener if necessary, (c) an anthraquinone of formula I ##STR1## wherein R.sup.1 is --COOH or a radical of formula II ##STR2## wherein n is 0 or a number from 1 to 12, R.sup.2 is H, C.sub.1 -C.sub.12 -alkyl or --CN and R.sup.3 is H, --CN or the radical --C.sub.m H.sub.2m X, where m is 0 or a number from 1 to 12 and X is --COOH or --CN, and (d) an amino alcohol. The cured compositions are photosensitive and are suitable for the preparation of metallic coatings and images by electroless metal deposition.

Abstract: The invention relates to polymers of formula (I) ##STR1## in which R.sup.1 and R.sup.2 represent optionally substituted alkylene, cycloalkylene or phenylene radicals, A represents hydrogen or carboxyl groups, B represents hydrogen or groups derived from carboxylic acids or isocyanates. The invention also relates to aqueous epoxy resin dispersions containing one or more polymers of general formula (I) in addition to bases, acid, one or more emulsifiers and, optionally, other active substances and auxiliaries typically used in epoxy resin dispersions and also water.The invention also relates to a process for the production of such aqueous epoxy resin dispersions and to the use of such resins in processes for the autophoretic coating of metallic surfaces.

Abstract: An epoxy resin system is disclosed which is especially adapted for use in the pultrusion process. Such resin system comprises tris (hydroxyphenyl) methane-based epoxy resin and a combination of the cross-linking agents (methyl)-bicyclo(2,2,1) heptane-2,3-dicarboxylic anhydride and poly sebacic poly anhydride, the ratio of the dicarboxylic anhydride to the total amount of cross-linking agents ranging from 0.65 to 0.80 and the ratio of the poly anhydride to the total amount of cross-linking agents ranging from 0.35 to 0.20. The amount of total cross-linking agents to epoxy resin ranges from about 60 to about 80 parts total cross-linking agents, per 100 parts resin, by weight. A small amount of an imidazole accelerator, preferably 2-ethyl-4 methyl imidazole, is included.

Abstract: An epoxy resin composition consisting essentially of an epoxy resin having an epoxy equivalent of 200 or lower, a mixture of polybasic carboxylic acid anhydride and aromatic ester as a curing agent, and inorganic powder as a filler.

Abstract: This invention relates to a stable acid anhydride paste mixture useful as a crosslinking agent for epoxy resins and a dual catalyst system therefor. In particular, the anhydride mixture comprises high melting point acid anhydride, a liquid acid anhydride, and a low melting point acid anhydride. The dual catalyst system comprises tertiary amine catalysts with boron trihalide amine complex catalysts.

Abstract: Methods and compositions are disclosed for absorbing moisture when moisture constraints are present. The moisture absorbing compositions include a curable epoxy resin, a curing agent, and an anhydride of a carboxylic acid. In one embodiment, the anhydride component is present in an amount sufficient both to cure the resin and to absorb the moisture. In other embodiments, a separate curing agent is included. Methods employing such compositions as adhesives or coatings, particularly in electronic device packaging, also are disclosed.

Abstract: Resinous materials are produced in the substantial absence of a solvent by feeding to an extruder operated at a temperature sufficient to cause a reaction between the reactants (A) at least one material having an average of more than one vicinal epoxy group per molecule, (B) at least one material having an average of more than one group reactive with component (A) such as hydroxyl, thiol, carboxyl, isocyanate, thioisocyanate or secondary amine groups or a combination of such groups per molecule or a material having only one primary amine group per molecule, (C) at least one catalyst for promoting a reaction between components (A) and (B) if a catalyst is required to effect the reaction between components (A) and (B), and (D) optionally one or more chain terminators and thereafter recovering a resinous material resulting from the reaction between components (A) and (B) from said extruder.This process is useful in preparing advanced epoxy resins and phenoxy thermoplastic resins.

Abstract: Novel epoxy-polyester graft copolymer and novel, solvent-based thermosetting coating composition comprising said copolymer and blocked polyisocyanate crosslinking agent. Coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, composition may be formulated as a high solids composition sprayable with conventional spraying equipment. Epoxy-polyester graft copolymer is prepared by polymerization of lactone monomers in presence of hydroxy functional epoxy ester resin precursor. Precursor resin is formed by reaction of diepoxide, previously chain extended with dicarboxylic acid, with hydroxy functional secondary amine in chain terminating reaction.

Abstract: Novel epoxy-polyester graft copolymer and novel, solvent-based thermosetting coating composition comprising said copolymer and blocked polyisocyanate crosslinking agent. Coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as a chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, composition may be formulated as a high solids composition sprayable with conventional spraying equipment. Epoxy-polyester monomers in presence of hydroxy functional epoxy ester resin precursor. Precursor resin is formed by reaction of diepoxide, chain extended with diphenol and dicarboxylic acid, with hydroxy functional secondary amine in chain terminating reaction.

Abstract: Novel solvent-based thermosetting composition comprising (a) hydroxy functional epoxy ester resin of number average molecular weight (Mn) between about 1,000 and about 5,000, comprising the reaction product of diepoxide with diphenol, dicarboxylic acid and acid component comprising hydroxy functional acid and optionally further comprising fatty acid; and (b) polyfunctional, hydroxy-reactive crosslinking agent, for example, aminoplast crosslinking agent or blocked polyisocyanate crosslinking agent comprising isocyanate groups blocked by reaction with an active hydrogen bearing blocking agent. Coating composition may be formulated as primer sprayable with conventional spraying equipment.

Abstract: Novel solvent-based thermosetting composition comprising (a) hydroxy functional epoxy ester resin of number average molecular weight (Mn) between about 1,000 and about 5,000, comprising the reaction product of diepoxide with dicarboxylic acid and acid component comprising hydroxy functional acid and optionally further comprising fatty acid; and (b) polyfunctional, hydroxy-reactive crosslinking agent, for example, aminoplast crosslinking agent or blocked polyisocyanate crosslinking agent comprising isocyanate groups blocked by reaction with an active hydrogen bearing blocking agent. Coating composition may be formulated as primer sprayable with conventional spraying equipment.

Abstract: The invention provides a low-dusting anhydride curing agent blend for epoxy resins comprising a solid acid anhydride (trimellitic anhydride) and a normally liquid acid anhydride (methyl hexahydrophthalic anhydride. The invention further provides processes for preparing the anhydride blends and to curable epoxy compositions thereof.

Abstract: A heat-curable epoxy resin composition comprising (A) an epoxy resin and (B) an acid anhydride curing agent liquid at 20.degree. C. composed of, based on acid anhydride equivalents, of 10 to 70% of a tetrabasic acid anhydride represented by the following formula ##STR1## wherein R.sub.1 represents hydrogen or a methyl group, andR.sub.2 represents hydrogen or a lower alkyl group,and 30 to 90% of a liquid alicyclic dibasic acid anhydride.