Phenolic Reactant Contains At Least Two Ring Moieties (includes Fused Or Bridged Ring System) Patents (Class 528/153)
  • Patent number: 9598599
    Abstract: The use of a colloidal silica having a specific surface area greater than 300 m2/g in a gas barrier coating additionally comprising polyvinyl alcohol and/or ethylene vinyl alcohol copolymer and/or a silylated derivative thereof improves wet bond strength.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: March 21, 2017
    Assignee: SUN CHEMICAL, B.V.
    Inventors: Derek Ronald Illsley, Graham Trevor Street
  • Patent number: 9376587
    Abstract: A pigment dispersion and a method for preparing the same are provided. The pigment dispersion comprises the following components in the following mass percentage: 10%˜20% pigment, 1.5%˜12% dispersant, 0.75%˜7.5% binder resin, 58.5%˜87.3% solvent and 0.45%˜2% nonionic surfactant, based on the total mass of the pigment dispersion. The pigment dispersion is improved in stability, and is applicable to a colored filter.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: June 28, 2016
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xuelan Wang, Chen Liu, Jisheng Zhao, Wenwen Sun
  • Publication number: 20150090691
    Abstract: Material for forming an underlayer film for lithography, which has a high carbon concentration, a low oxygen concentration, a relatively high heat resistance and also a relatively high solvent solubility, and which can be applied to a wet process is disclosed. Material for forming an underlayer film for lithography contains a compound represented by general formula (1).
    Type: Application
    Filed: August 9, 2012
    Publication date: April 2, 2015
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masatoshi Echigo, Go Higashihara, Naoya Uchiyama
  • Publication number: 20140363958
    Abstract: In lithography, a composition comprising a novolak resin comprising recurring units derived from a naphtholphthalein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.
    Type: Application
    Filed: June 4, 2014
    Publication date: December 11, 2014
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Jun Hatakeyama, Daisuke Kori, Tsutomu Ogihara
  • Publication number: 20140363957
    Abstract: In lithography, a composition comprising a novolak resin comprising recurring units of fluorescein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.
    Type: Application
    Filed: June 4, 2014
    Publication date: December 11, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Daisuke Kori, Tsutomu Ogihara
  • Publication number: 20140363956
    Abstract: In lithography, a composition comprising a novolak resin comprising recurring units of hydroxycoumarin is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.
    Type: Application
    Filed: June 4, 2014
    Publication date: December 11, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Daisuke Kori, Tsutomu Ogihara
  • Publication number: 20140363955
    Abstract: In lithography, a composition comprising a novolak resin comprising recurring units derived from a phenolphthalein, Phenol Red, Cresolphthalein, Cresol Red, or Thymolphthalein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.
    Type: Application
    Filed: June 4, 2014
    Publication date: December 11, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Daisuke Kori, Tsutomu Ogihara
  • Patent number: 8906592
    Abstract: The invention relates to an antireflective coating composition comprising a crosslinkable polymer, where the crosslinkable polymer comprises at least one unit of fused aromatic moiety, at least one unit with a phenylene moiety in the backbone of the polymer, and at least one hydroxybiphenyl unit, furthermore where the polymer comprises a crosslinking moiety of structure (4), where R?3, R?3 and R??3 are independently hydrogen or a C1-C4alkyl. The invention further relates to a process for forming an image using the composition.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: December 9, 2014
    Assignee: AZ Electronic Materials (Luxembourg) S.A.R.L.
    Inventors: M. Dalil Rahman, Clement Anyadiegwu, Douglas McKenzie, JoonYeon Cho
  • Patent number: 8791214
    Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: July 29, 2014
    Assignee: DIC Corporation
    Inventors: Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga, Kazuo Arita
  • Patent number: 8695752
    Abstract: Deep-drawn membranes formed of polyester or polycarbonate films, comprising units of Formula (I) and (II), useful for acoustic signal converters as microphones and speakers. The film can be produced by thermoplastic processes or solvent cast processes.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: April 15, 2014
    Assignee: tesa SE
    Inventors: Kerstin Metzler, Bernhard Müssig, Frank Virus
  • Patent number: 8652757
    Abstract: A method for forming a resist underlayer film of a multilayer resist film having at least three layers used in a lithography, includes a step of coating a composition for resist underlayer film containing a novolak resin represented by the following general formula (1) obtained by treating a compound having a bisnaphthol group on a substrate; and a step of curing the coated composition for the resist underlayer film by a heat treatment at a temperature above 300° C. and 600° C. or lower for 10 to 600 seconds. A method for forming a resist underlayer film, and a patterning process using the method to form a resist underlayer film in a multilayer resist film having at least three layers used in a lithography, gives a resist underlayer film having a lowered reflectance, a high etching resistance, and a high heat and solvent resistances, especially without wiggling during substrate etching.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: February 18, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Jun Hatakeyama, Toshihiko Fujii, Tsutomu Ogihara
  • Patent number: 8642714
    Abstract: The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: February 4, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Haruaki Sue, Kuniaki Satou, Osamu Matsuzaka
  • Publication number: 20130337649
    Abstract: The invention provides a compound for forming an organic film having a partial structure represented by the following formula (i) or (ii), wherein the ring structures Ar1, Ar2 and Ar3 each represent a substituted or unsubstituted benzene ring or naphthalene ring; e is 0 or 1; R0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; L0 represents a linear, branched or cyclic divalent organic group having 1 to 32 carbon atoms; and the methylene group constituting L0 may be substituted by an oxygen atom or a carbonyl group. There can be provided an organic film composition for forming an organic film having high dry etching resistance as well as advanced filling/planarizing characteristics.
    Type: Application
    Filed: June 12, 2013
    Publication date: December 19, 2013
    Inventors: Seiichiro TACHIBANA, Daisuke KORI, Tsutomu OGIHARA, Takeru WATANABE, Kazumi NODA, Toshiharu YANO
  • Patent number: 8470930
    Abstract: The present invention relates to novolak resins prepared with, inter alia, one or more alkylphenols. The invention further relates to compositions comprising the novolak resins, such as vulcanizable rubber compositions, and to products obtained therewith.
    Type: Grant
    Filed: September 10, 2008
    Date of Patent: June 25, 2013
    Assignee: SI Group, Inc.
    Inventors: L. Scott Howard, Todd M. Aube, Timothy Edward Banach, James J. Lamb
  • Publication number: 20130131215
    Abstract: There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility. A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin.
    Type: Application
    Filed: July 19, 2011
    Publication date: May 23, 2013
    Applicant: DIC CORPORATION
    Inventor: Yutaka Satou
  • Patent number: 8445187
    Abstract: A hardmask composition includes an organic solvent and one or more aromatic ring-containing polymers represented by Formulae 1, 2 and 3:
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: May 21, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Kyong Ho Yoon, Jong Seob Kim, Dong Seon Uh, Hwan Sung Cheon, Chang Il Oh, Min Soo Kim, Jin Kuk Lee
  • Patent number: 8399576
    Abstract: Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from —, —CH2—, —C(CH3)2—, —S—, —SO2—, —O—, —CO—, or —N?N—. Each X is independently selected from a hydrogen or phosphorous containing group, wherein the hydrogen and phosphorous containing group have a molar ratio of 1:0.1 to 0.1:1. Each R1 is independently selected from a hydrogen or C1-5 alkyl group. Each R2 is independently selected from a C1-5 alkyl group. m is an integer of 1 to 10, and n is 0 or 1.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: March 19, 2013
    Assignee: Grand Tek Advance Material Science Co., Ltd.
    Inventors: Shang-Wei Tang, Hsueh-Tso Lin, Kuan-Ching Chen, Dick Zhong
  • Patent number: 8394911
    Abstract: A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: March 12, 2013
    Assignee: DIC Corporation
    Inventors: Yutaka Satou, Kazuo Arita, Ichirou Ogura
  • Patent number: 8349989
    Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: January 8, 2013
    Assignee: Air Water Inc.
    Inventors: Kiyotaka Murata, Yoshihisa Sone
  • Patent number: 8288003
    Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: October 16, 2012
    Assignee: DIC Corporation
    Inventors: Koji Hayashi, Yoshiyuki Takahashi, Ichirou Ogura
  • Publication number: 20120184103
    Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.
    Type: Application
    Filed: December 7, 2011
    Publication date: July 19, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu OGIHARA, Daisuke KORI, Yusuke BIYAJIMA, Takeru WATANABE, Toshihiko FUJII, Takeshi KINSHO
  • Publication number: 20120172546
    Abstract: Disclosed is a phosphorous containing phenol novolac resin, having a structure as below: In the above formula, Z is selected from — or —CH2—. Each Y is independently selected from—, —CH2—, —C(CH3)2—, —S—, —SO2—, —O—,—CO—, or —N?N—. Each X is independently selected from a hydrogen or phosphorous containing group, wherein the hydrogen and phosphorous containing group have a molar ratio of 1:0.1 to 0.1:1. Each R1 is independently selected from a hydrogen or C1-5 alkyl group. Each R2 is independently selected from a C1-5 alkyl group. m is an integer of 1 to 10, and n is 0 or 1.
    Type: Application
    Filed: February 4, 2011
    Publication date: July 5, 2012
    Inventors: Shang-Wei Tang, Hsueh-Tso Lin, Kuan-Ching Chen, Dick Zhong
  • Publication number: 20120142193
    Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or general formula (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.
    Type: Application
    Filed: November 9, 2011
    Publication date: June 7, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu OGIHARA, Daisuke KORI, Yusuke BIYAJIMA, Takeru WATANABE, Toshihiko FUJII, Takeshi KINSHO
  • Publication number: 20120095170
    Abstract: This invention relates to a novel phosphorus-containing phenol novolac resin, use of the phosphorus-containing phenol novolac resin as a halogen-free flame retardant epoxy hardener, and an epoxy resin composition having high phosphorus content because it includes the phosphorus-containing phenol novolac resin, thereby exhibiting superior flame retardancy and heat resistance.
    Type: Application
    Filed: March 30, 2010
    Publication date: April 19, 2012
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Ji Woong Kong, Sang Min Lee, Ick Kyung Sung
  • Patent number: 8153349
    Abstract: A polymer composition includes an aromatic ring-containing polymer represented by Formula 1: wherein m and n satisfy the relations 1?m<190, 0?n<190, and 1?m+n<190.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: April 10, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Hwan Sung Cheon, Jong Seob Kim, Kyong Ho Yoon, Min Soo Kim, Jin Kuk Lee, Jee Yun Song
  • Publication number: 20120022211
    Abstract: The invention relates to a hydroxy-aromatic resin, prepared by bringing together and reacting a hydroxy-aromatic compound and glyoxylic acid. The invention further relates to use of the resin in adhesives, laminates, and coatings.
    Type: Application
    Filed: September 29, 2011
    Publication date: January 26, 2012
    Applicant: DSM IP Assets B.V.
    Inventors: Jozef Johannes Catherina Jacobus BOONEN, Wilhelmus Hubertus Joseph Boesten, Renier Henricus Maria Kierkels, Mark Martinus Maria Janssen, Rudolfus Antonius Theodorus Maria Van Benthem
  • Publication number: 20110306735
    Abstract: The invention relates to a hydroxy-aromatic resin, prepared by bringing together and letting react a hydroxy-aromatic compound of formula (I) and an alkanol hemiacetal compound of formula (II). Formula (I) is: wherein R1, R2, R3, R4 and R5 may be the same or may be different and are H, OH, a C1-C20 alkyl group, or an oligomeric or polymeric system, whereby at least one of the set consisting of R1, R3, and R5 is H, Formula (II) is: wherein R6 is a C1-C12 alkyl group, aryl group, aralkyl group or cycloalkyl group and wherein R12 is H, a C1-C12 alkyl group, aryl group, aralkyl group or cycloalkyl group. The invention further relates to use of the resin in adhesives, laminates, and coatings.
    Type: Application
    Filed: August 24, 2011
    Publication date: December 15, 2011
    Applicant: DSM IP Assets B.V.
    Inventor: Rudolfus Antonius Theodorus Maria VAN BENTHEM
  • Publication number: 20110288260
    Abstract: Disclosed are benzoxazine compositions where oxazine rings are part of the polymer main-chain. The benzoxazine oligomers are prepared by the reaction of a bisphenol and an aldehyde, such as formaldehyde or paraformaldehyde, with one or more diamines or polyamines, and optionally with one or more monofunctional amines or monofunctional phenols. Also disclosed are benzoxazine monomers prepared from a bisphenol, an aldehyde, such as formaldehyde or paraformaldehyde, and a monofunctional amine, which benzoxazine monomers may be optionally used as reactive diluents. Further disclosed are benzoxazine monomers are prepared from a diamine, and aldehyde, such as formaldehyde or paraformaldehyde, and a monofunctional phenol, which benzoxazine monomers may also be optionally used as reactive diluents.
    Type: Application
    Filed: March 17, 2011
    Publication date: November 24, 2011
    Inventors: Hatsuo Ishida, Tarek Agag
  • Patent number: 8026335
    Abstract: The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that contains a main chain-type aromatic benzoxazine structure, wherein the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm. The present invention also provides a method of producing a baked resin product, comprising baking a resin composition that contains a main chain-type aromatic benzoxazine structure at 270° C. to 350° C. The present invention further provides an electronic device that incorporates this baked resin product.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: September 27, 2011
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Yoshinori Chiku, Yuji Eguchi, Kazuo Doyama
  • Patent number: 7994271
    Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: August 9, 2011
    Assignee: Air Water Inc.
    Inventors: Kiyotaka Murata, Yoshihisa Sone
  • Patent number: 7994270
    Abstract: The present invention provides a method for producing a thermosetting resin having a benzoxazine ring, comprising the step of: reacting a bifunctional phenol compound, a diamine compound, and an aldehyde compound in a mixed solvent of an aromatic nonpolar solvent and an alcohol.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: August 9, 2011
    Assignee: Sekisui Chemical Co., Ltd
    Inventors: Tomoaki Katagiri, Yuji Eguchi
  • Publication number: 20110178252
    Abstract: Disclosed herein are a phenol novolac resin which is used as a raw material for thermosetting resin, a phenol novolac epoxy resin which is obtained therefrom, an epoxy resin composition which utilizes the phenol novolac resin as a curing agent or contains the phenol novolac epoxy resin as a base resin.
    Type: Application
    Filed: August 31, 2009
    Publication date: July 21, 2011
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Ick Kyung Sung, Sang Min Llee, Sang Youb Seong, Jung Ha Chung
  • Patent number: 7981594
    Abstract: A hardmask composition includes an organic solvent and one or more aromatic ring-containing polymers represented by Formula 1, 2 and 3:
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: July 19, 2011
    Assignee: Cheil Industries, Inc.
    Inventors: Kyong Ho Yoon, Jong Seob Kim, Dong Seon Uh, Hwan Sung Cheon, Chang Il Oh, Min Soo Kim, Jin Kuk Lee
  • Patent number: 7834099
    Abstract: An imide-naphthoxazine copolymer comprising a repeating unit represented by General Formula (1) below: (wherein X and Y independently represent a single bond, an oxygen atom, a carbonyl group, or an organic group which may be substituted by a heteroatom; R represents CH3 or H, n represents an integer from 1 to 10; and m represents an integer from 1 to 20).
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: November 16, 2010
    Assignees: Sekisui Chemical Co., Ltd., Case Western Reserve University
    Inventors: Hatsuo Ishida, Masanori Nakamura
  • Patent number: 7795357
    Abstract: Multiblock copolymers are described and contain the structural unit of formula I -A-O—R1—O—CO—(R2—CO—)m—X-D-X—(CO—R2)m—CO—X—??(I), where A is a radical derived from a homo- or copolyoxymethylene, R1 is an alkylene radical-having at least two carbon atoms or a cycloalkylene radical, R2 is a direct carbon-carbon bond, or an alkylene, cycloalkylene, arylene, or aralkylene radical, X is selected from —O—, —S—, or —NH—, D is a divalent radical B which is a radical of a hydroxy-terminated, mercaptan-terminated, or amino-terminated polymer which derives from polyalkylene glycols, polyvinyl ethers, polyvinyl ether-alkene copolymers, polyvinyl esters, polyvinyl ester-alkene copolymers, polyvinyl alcohols, polyvinyl alcohol-alkene copolymers, polyvinylaromatics, polyacrylates, polymethacrylates, polyacetals, polycarbonates, polyesters, polyamides, polyimines, polyetherester elastomers, polyetheramide elastomers, polyalkadienes, polyurethanes, polyureas, polysiloxanes, or a triblock copolymer radical -PAO-B-PAO-, wh
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: September 14, 2010
    Assignee: Ticona GmbH
    Inventors: Dirk Zierer, Klaus Kurz, Jens Schiebisch, Karl-Friedrich Mück, Holger Schmalz
  • Patent number: 7662902
    Abstract: A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an alkaline catalyst at a temperature of from 0° C. to 100° C., neutralizing with an acid, adding an acid to adjust the pH to from 0 to 6, heating to a temperature of from 50° C. to 200° C, and vacuuming to recover the phenolic resin.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: February 16, 2010
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, An Pang Tu, Chun Hsiung Kao, Fang Shian Su
  • Patent number: 7659051
    Abstract: A naphthalene-backbone polymer represented by Formula 1: wherein n and m are independently at least 1 and less than about 190, R1 is a hydrogen, a hydroxyl, a hydrocarbon group of about 10 carbons or less, or a halogen, R2 is methylene or includes an aryl linking group, R3 is a conjugated diene group, and R4 is an unsaturated dienophile group.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: February 9, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Kyong Ho Yoon, Jong Seob Kim, Dong Seon Uh, Chang Il Oh, Kyung Hee Hyung, Min Soo Kim, Jin Kuk Lee
  • Publication number: 20090318658
    Abstract: The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that contains a main chain-type aromatic benzoxazine structure, wherein the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm. The present invention also provides a method of producing a baked resin product, comprising baking a resin composition that contains a main chain-type aromatic benzoxazine structure at 270° C. to 350° C. The present invention further provides an electronic device that incorporates this baked resin product.
    Type: Application
    Filed: May 1, 2007
    Publication date: December 24, 2009
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yoshinori Chiku, Yuji Eguchi, Kazuo Doyama
  • Patent number: 7632624
    Abstract: A material comprising a specific bisphenol compound of formula (1) is useful in forming a photoresist undercoat wherein R1 and R2 are H, alkyl, aryl or alkenyl, R3 and R4 are H, alkyl, alkenyl, aryl, acetal, acyl or glycidyl, R5 and R6 are alkyl having a ring structure, or R5 and R6 bond together to form a ring. The undercoat-forming material has an extinction coefficient sufficient to provide an antireflective effect at a thickness of at least 200 nm, and a high etching resistance as demonstrated by slow etching rates with CF4/CHF3 and Cl2/BCl3 gases for substrate processing.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: December 15, 2009
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Jun Hatakeyama, Toshihiko Fujii, Takeru Watanabe, Katshiro Kobayashi
  • Publication number: 20090137725
    Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.
    Type: Application
    Filed: October 16, 2006
    Publication date: May 28, 2009
    Applicant: AIR WATER, INC.
    Inventors: Kiyotaka Murata, Yoshihisa Sone
  • Patent number: 7425602
    Abstract: The present invention relates to novolak resins prepared with, inter alia, one or more alkylphenols. The invention further relates to compositions comprising the novolak resins, such as vulcanizable rubber compositions, and to products obtained therewith.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: September 16, 2008
    Assignee: SI Group, Inc.
    Inventors: L. Scott Howard, Todd M. Aube, Timothy Edward Banach, James J. Lamb
  • Publication number: 20080112876
    Abstract: A method of stabilizing a resorcinol-aldehyde resin comprises heating a resorcinol-aldehyde resin in the substantial absence of an acid or base catalyst at a temperature from about 130° C. to about 180° C. for a sufficient amount of time to render the resin stable in an aqueous solution, wherein the resorcinol-aldehyde resin prior to heating is a novolak resin. The stabilized resins have many useful applications. For example, they can be used to make aerogels and xerogels. They also can be used to make dipping solutions to improve the adhesion between rubber and tire cords in a tire, belt, or hose.
    Type: Application
    Filed: October 17, 2007
    Publication date: May 15, 2008
    Applicant: INDSPEC CHEMICAL CORPORATION
    Inventor: Theodore Harvey Dailey
  • Patent number: 7074861
    Abstract: A modified resorcinol resin is prepared by reacting a phenolic compound (e.g., resorcinol) with an olefinically unsaturated compound (e.g., styrene) and two types of aldehyde: a formaldehyde and an alkyl aldehyde (e.g., butyraldehyde). The reaction is typically carried out in the presence of an acid catalyst. The resulting resin has a lower softening point and can be used as a methylene acceptor compound in a vulcanizable rubber composition.
    Type: Grant
    Filed: February 18, 2003
    Date of Patent: July 11, 2006
    Assignee: INDSPEC Chemical Corporation
    Inventors: Raj Durairaj, Mark A. Lawrence
  • Patent number: 6723801
    Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 20, 2004
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
  • Patent number: 6521359
    Abstract: Provided is a polymeric fluorescent substance which emits a fluorescence in a solid state, which comprises the following repeating unit in an amount of 20 mol % or more based on the total amount of all repeating units, in the formula, X1 represents a group selected from the group consisting of —CR3═CR4—, —C≡C—, —SiR5R6—, —NR7—, —CO—, —CO—O—, —O—CO—, —SO2—, a carbon-carbon single bond, —O— and —S—. The polymeric fluorescent substance has strong fluorescence, and can be suitably used as a polymer LED and a dye for laser.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: February 18, 2003
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takanobu Noguchi, Shuji Doi, Makoto Kitano, Fumi Yamaguchi
  • Patent number: 6465599
    Abstract: A curing or bridging composition is useful for effecting the crosslinking of phenolic resoles and the formation of novolaks. The composition comprises from 1% to 99% by weight of partially or totally sulfonated calixarenes and from 99% to 1% of partially or totally sulfonated linear phenolic oligomers, optionally together with partially or totally sulfonated phenol. To the contrary of conventional catalysts for the crosslinking of resoles and the formation of novolaks, the composition is chemically incorporated into the molecular structure of the final products; especially the sulfonated calixarenes confer new, surprisingly improved properties to phenolic resins and novolaks and sensibly accelerate the condensation reactions.
    Type: Grant
    Filed: July 2, 1999
    Date of Patent: October 15, 2002
    Assignee: Transdiffusia S.A.
    Inventors: Roger Lamartine, Philippe Choquard
  • Patent number: 6417317
    Abstract: A novolak resin precursor is composed of bonded phenolic moieties, one of the hydrogen atoms in the o- or p-positions relative to the hydroxy group of each phenolic moiety is substituted with an alkyl or alkenyl group having 1 to 3 carbon atoms, and the other two hydrogen atoms are bonded through methylene bonds. The content of ortho-ortho bonding is 30 to 70% relative to the number of total methylene bonds and the weight average molecular weight of the precursor is 300 to 10,000. A novolak resin is obtained from this precursor, and a positive photoresist composition comprises this novolak resin. The invention provides a positive photoresist composition that comprises less binuclear compounds, suppresses scum formation, is excellent in terms of definition and coating performance and provides a resist pattern having satisfactory heat resistance.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: July 9, 2002
    Assignee: Togyo Ohka Kogyo Co., Ltd.
    Inventors: Ken Miyagi, Kousuke Doi, Ryuusaku Takahashi, Hidekatsu Kohara, Toshimasa Nakayama
  • Patent number: 6326454
    Abstract: There is provided a polymer scale deposition preventive agent, comprising an alkaline solution of a condensation product having a molecular weight of 500 to 1,000,000 obtained by condensing a dimer compound of 2,3-dihydroxynaphthalene with formaldehyde. By polymerizing vinyl chloride or a monomer mixture containing vinyl chloride in a polymerization vessel wherein a coating film made of said polymer scale deposition preventive agent has been formed on the inner wall surface and the like, polymer scale is effectively prevented from depositing not only on an agitation apparatus but also on areas near the interface between a gas phase and a liquid phase, which prevention of the polymer scale deposition is conventionally difficult. Thus, a vinyl chloride polymer can be obtained which contains colored foreign matters, fish eyes, etc. in small amounts and is small in initial discoloration and is good in quality.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: December 4, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshihide Shimizu, Tatsuya Fujimoto, Seiji Fukuda
  • Patent number: 6291600
    Abstract: In a novel method of homo- or copolymerization of vinyl chloride, a specified coating agent is applied on the surfaces of the portions which will become into contact with the vinyl chloride monomer during the polymerization process. The coating agent is in a form of an aqueous solution of a modified condensation product of phenol and aldehyde, the pH of the solution being adjusted in a range that the product is dissolved at an ambient temperature upon coating of the solution and separates out of the solution upon being heated on the surfaces. The wall surface of the polymerization tank and the like is then coated with a thin film of the coating agent having a uniform thickness and being strongly adhered to the wall surface, thereby providing an excellent effect of preventing adhesion of the product polymer to the wall surface.
    Type: Grant
    Filed: April 9, 1993
    Date of Patent: September 18, 2001
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Seiichi Masuko, Ichisaburo Nakamura, Yoshimatsu Naka, Keiichi Fukuda, Akira Yamamoto, Yasuyuki Hatakeyama, Akihiro Yamaguchi, Keizaburo Yamaguchi
  • Patent number: 6207788
    Abstract: A novolak resin precursor is composed of bonded phenolic moieties, one of the hydrogen atoms in the o- or p-positions relative to the hydroxy group of each phenolic moiety is substituted with an alkyl or alkenyl group having 1 to 3 carbon atoms, and the other two hydrogen atoms are bonded through methylene bonds. The content of ortho—ortho bonding is 30 to 70% relative to the number of total methylene bonds and the weight average molecular weight of the precursor is 300 to 10,000. A novolak resin is obtained from this precursor, and a positive photoresist composition comprises this novolak resin. The invention provides a positive photoresist composition that comprises less binuclear compounds, suppresses scum formation, is excellent in terms of definition and coating performance and provides a resist pattern having satisfactory heat resistance.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: March 27, 2001
    Assignee: Tokyo Ohka Kogya Co., Ltd.
    Inventors: Ken Miyagi, Kousuke Doi, Ryuusaku Takahashi, Hidekatsu Kohara, Toshimasa Nakayama