Carboxylic Acid Or Derivative Is A Reactant Patents (Class 528/173)
  • Patent number: 5144000
    Abstract: Polyetherimide oligomers having crosslinking end cap moieties which provide improved solvent-resistance to cured composites are generally represented by the formula: ##STR1## wherein X=--O-- or --S--; ##STR2## n=1 or 2; ##STR3## E=allyl or methallyl; R=a trivalent C.sub.(6-13) aromatic organic radical;R.sub.1 =any of lower alkyl, lower alkoxy, aryl, or substituted aryl;R'=a divalent C.sub.(6-30) aromatic organic radical;j=0, 1, or 2; andG=--CH.sub.2 --, --O--, --S--, or --SO.sub.2 --The crosslinkable oligomers are made by reacting substituted phthalic anhydrides with hydroxyaryl amines and suitable crosslinking end cap reactants, or by self-condensation of phthalimide salts followed by capping the polymers.
    Type: Grant
    Filed: July 9, 1990
    Date of Patent: September 1, 1992
    Assignee: The Boeing Company
    Inventors: Clyde H. Sheppard, Hyman R. Lubowitz
  • Patent number: 5120826
    Abstract: The present invention provides for a novel heat stable class of polyamide-imide polymers having excellent flow properties and hydrolytic stability which are prepared by forming the polycondensation product of one or more aromatic or aliphatic diamines and a comonomer comprising a tri- or hexafluoro-substituted tricarboxylic acid anhydride (or acid derivative thereof) having the structure: ##STR1## wherein R is CF.sub.3 or a phenyl radical. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, good resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as good thermal properties, including resistance to thermooxidative degradation.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: June 9, 1992
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
  • Patent number: 5120825
    Abstract: The present invention provides for hybrid polybenzimidazole and polybenzimidazolone polymers which are characterized as containing both imidazole and imidazolone structural units in the polymer chain. These polymers are characterized as containing at least one recurring monomer unit containing the structure of the formula: ##STR1## wherein Ar is a tetravalent aromatic moiety derived from an aromatic tetraamine and Ar.sub.1 is a trivalent aromatic moiety derived from a trifunctional acid, an acid anhydride or amine-reactive derivatives thereof, said polymers further characterized by an inherent viscosity of at least about 0.01 dl/g measured as a 0.5% solution in N-methyl pyrrolidone at 25.degree. C.The polymers of this invention exhibit many of the advantageous properties of both polybenzimidazole and polybenzimidazolone polymers. They are characterized as being extremely resistant to chemical attack such as by solvents, acids and bases.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: June 9, 1992
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
  • Patent number: 5118782
    Abstract: A thermotropic aromatic polyester comprising (a) an aromatic dicarbonyl ingredient comprising recurring aromatic units of the formulae (I) and/or (II): ##STR1## and, optionally, other recurring aromatic dicarbonyl units, (b) an aromatic dioxy ingredient comprising recurring aromatic units of the formula (III) ##STR2## wherein R.dbd.--H, C.sub.
    Type: Grant
    Filed: September 10, 1990
    Date of Patent: June 2, 1992
    Assignee: Ube Industries, Ltd.
    Inventors: Akinori Shiotani, Michinori Suzuki, Fumio Matsuo
  • Patent number: 5116935
    Abstract: A preferred class of polyimide oligomers include (1) linear, difunctional crosslinking oligomers prepared by condensing an imidophenylamine end cap with a lower alkylene diamine or a polyaryldiamine such as 3,3'-phenoxyphenylsulfone diamine and with a dianhydride, particularly 4,4'-phenoxyphenylsulfone dianhydride; and (2) multidimensional, crosslinking, polyimide oligomers having an aromatic hub and at least two radiating arms connected to the hub, each arm including a crosslinking imidophenylamine end cap at its distal end and at least two imide linkages.Blends, prepregs, and composites can be prepared from the oligomers.
    Type: Grant
    Filed: May 18, 1989
    Date of Patent: May 26, 1992
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5112942
    Abstract: Copolyimides and their precursors are disclosed comprising units represented by the formula ##STR1## where R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are hydrogen or C.sub.1 to C.sub.6 linear or branched alkyl, with the proviso that R.sub.1, R.sub.2, R.sub.3 and R.sub.4 cannot simultaneously be hydrogen and where Z is a chemical bond, ##STR2## Ar is the tetravalent residue of a tetracarboxylic acid or acid dianhydride or di- or tetraester thereof, where x and y are integers from about 100 to about 1,000, and the ratio of x to y is from about 1:99 to about 49:51, and z is 0-5.These copolymers have improved resistance to stress cracking. They may also be used in applications such as coatings, or adhesives.
    Type: Grant
    Filed: September 26, 1990
    Date of Patent: May 12, 1992
    Assignee: Ethyl Corporation
    Inventor: Wesley C. Blocker
  • Patent number: 5109107
    Abstract: The present invention provides for a novel heat stable class of polyamide-imide polymers having excellent flow properties and hydrolytic stability which are prepared by forming the polycondensation product of one or more aromatic or aliphatic diamines, one or more additional comonomers selected from the group consisting of a tetrafunctional aromatic dianhydride, an aromatic or aliphatic dicarboxylic acid (or acid derivative thereof) and mixtures thereof, and a comonomer comprising a tri- or hexafluoro-substituted tricarboxylic acid anhydride (or acid derivative thereof) having the structure: ##STR1## wherein Z is CF.sub.3 or a phenyl radical.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: April 28, 1992
    Assignee: Hoecht Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
  • Patent number: 5109105
    Abstract: Polyamide advanced composites are formed by the condensation of diacid halides (or dicarboxylic acids) and diamines in a linear or multidimensional morphology with crosslinkable end caps that provide improved solvent-resistance. The diamines and diacid halides generally include "sulfone" linkages in aryl chains to impart the desired combination of physical properties to the oligomers, prepregs, and composites. Linear oligomers have mono- or difunctional crosslinking end caps at the ends of polyarylamide chains. Multidimensional oligomers have a hub and three or more radiating amide arms, each arm having a mono- or difunctional crosslinking end cap at its distal end.
    Type: Grant
    Filed: June 7, 1989
    Date of Patent: April 28, 1992
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5104946
    Abstract: Disclosed is a solution in butyrolactone of a diglyme-insoluble polyimidesiloxane. The polyimidesiloxane is the reaction product of a dianhydride selected from the group consisting of 3,3',4,4'-benzophenone tetracarboxylic acid dianhydride, 3,3',4,4'-oxydiphthalic anhydride, and mixtures thereof, with a mixture of a non-siloxane diamine and a siloxane diamine in a molar ratio of about 0.1 to about 16, where said non-siloxane diamine is selected from the group consisting of 2,4-diaminotoluene, 3,5-diamino-tert-butylbenzene, 2,5-diamino-trifluoromethyl benzene, 2,6-diamino-4-trifluoromethyl pyridine, and mixtures thereof.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: April 14, 1992
    Assignee: Occidental Chemical Corporation
    Inventor: Chung J. Lee
  • Patent number: 5104967
    Abstract: The solvent-resistance and thermal stability of polyamideimides of the general formulae: ##STR1## is improved by capping the amideimides with a crosslinking functionality (Y) containing a residue selected from the group of: ##STR2## wherein R.sub.1 =lower alkyl, lower alkoxy, aryl, aryloxy, substituted alkyl, substituted aryl (either including hydroxyl or halo-substituents), halogen, or mixtures thereof;j=0, 1, or 2;G=--CH.sub.2 --, --O--, --S--, --SO.sub.2 --, --SO--, --CO--, --CHR--, or --CR.sub.2 --;R=hydrogen, lower alkyl, or phenyl;T=methallyl or allyl;Me=methyl;R.sub.2 =a trivalent organic radical; andR.sub.3 =a divalent organic radical.The amideimide oligomers may be linear or multidimensional, and can be processed into blends, prepregs, or composites. Methods of making these amideimides and intermediates useful in the syntheses are also described.
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: April 14, 1992
    Assignee: The Boeing Company
    Inventors: Clyde H. Sheppard, Hyman R. Lubowitz
  • Patent number: 5104966
    Abstract: Novel polyimide based films are disclosed that are resistant to arc tracking and that include aromatic dianhydrides together with aromatic diamines and aliphatic diamines. The compositions contain from 5 to 20 percent by weight of the aliphatic diamine. These compositions maximize the thermal aging capability of the polyimide. The compositions are useful as films and laminates for wire and cable.
    Type: Grant
    Filed: June 13, 1989
    Date of Patent: April 14, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Harris B. David
  • Patent number: 5102971
    Abstract: Process for the preparation of polyaromatic compounds in which an aromatic dichloro compound, optionally in the presence of an anhydrous aprotic solvent, is reacted with metallic zinc, manganese or magnesium in the presence of a catalyst system of(1) from 0.1 to 25 mol-% (based on the dihalogen compound) of a nickel salt, nickel complex salt or nickel complex,(2) from 2 to 100 mol per mol of nickel in (1) of a triarylphosphine and optionally(3) from 0.1 to 10 mol per mol of nickel (1) of a halide, sulphate or phosphate of an alkali metal, alkaline earth metal, zinc, magnesium or manganese.
    Type: Grant
    Filed: September 14, 1990
    Date of Patent: April 7, 1992
    Assignee: Bayer Aktiengesellschaft
    Inventors: Thomas Himmler, Rudolf Braden, Joachim Genz, Karsten-Josef Idel, Ralf Pakull
  • Patent number: 5101006
    Abstract: Novel halogenated polyimides and co-polyimides comprise recurring imide structural units of the formula ##STR1## where X is F, Cl, Br or I; Y is H, F, Cl, Br or I; and R is a divalent organic radical.
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: March 31, 1992
    Assignee: Occidental Chemical Corporation
    Inventors: Jeffrey S. Stults, Willis T. Schwartz
  • Patent number: 5098989
    Abstract: Flame-resistant thermoplastic branched polycarbonates of high molecular weight are prepared from:(1) a carbonate precursor;(2) at least one dihydroxyaromatic compound of formula: ##STR1## where: R is a single bond, or a substituted or non-substituted linear or branched C.sub.1 -C.sub.5 alkylene radical, or a group chosen from O, S, SO.sub.2 and CO;X and Y, which may be the same or different, are H or CH.sub.3 ;m and n, which may be the same or different, are whole numbers from 1 to 4;(3) at last one halogenated pyrimidine compound of formula: ##STR2## where: R.sub.2, R.sub.3, R.sub.4, which may be the same or different, are chlorine or bromine or hydrogen, on condition that at least one is chlorine or bromine;R.sub.1 is chlorine or bromine, or a radical of formula: ##STR3## where Z is NH or S or O; (4) at least one polyfunctional organic compound as branching agent, characterized by possessing at least three equal or different groups chosen from the groups OH, COOH, COCl and SO.sub.2 Cl.
    Type: Grant
    Filed: November 30, 1989
    Date of Patent: March 24, 1992
    Assignee: Enichem Tecnoresine S.p.A.
    Inventor: Alberto Petri
  • Patent number: 5096995
    Abstract: A transparent polyester-ester amide having a permanently antistatic property is obtained by copolymerizing (a) an aminocarboxylic acid, a lactam, or a salt derived from a diamine and a dicarboxylic acid; (b) a diol of the formula: ##STR1## wherein R.sup.1 and R.sup.2 are an ethylene oxide or propylene oxide group, Y is covalent bond, alkylene, alkylidene, cycloalkylidene, arylalkylidene, O, SO, SO.sub.2, CO, S, CF.sub.2, C(CF.sub.3).sub.2 or NH, X is H, alkyl, halogen, sulfonic acid or salt thereof, l is 0 or an integer of 1-4, and m and n an integer of 1-15; (c) a poly(alkylene oxide)glycol or a diol of the formula:HO--R.sup.3 --OH (IV)wherein R.sup.3 is alkylene, alkylidene, cycloalkylidene or arylalkylidene; and (d) a dicarboxylic acid; wherein the content of the polyether-ester units is 10 to 90 wt. %.
    Type: Grant
    Filed: August 9, 1988
    Date of Patent: March 17, 1992
    Assignee: Toray Industries, Inc.
    Inventors: Tadao Fukumoto, Kazuhisa Yano, Masatoshi Iwamoto
  • Patent number: 5097000
    Abstract: Disclosed are rigid fluorinated monomers, their preparation, and polymers derived therefrom based on two novel tricyclic xanthene core systems, 9,9-bis-(perfluoroalkyl)xanthene (I) and 9-phenyl-9-perfluoroalkylxanthene (II). The monomers have utility in the preparation of advanced high-performance polymers, particularly polyimides.
    Type: Grant
    Filed: June 21, 1991
    Date of Patent: March 17, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Swiatoslaw Trofimenko
  • Patent number: 5096997
    Abstract: Described herein are novel polyarylates derived from mixtures of terephthalic and isophthalic acids, hydroquinone and 4,4'-dihydroxydiphenyl sulfone. The instant polyarylates exhibit excellent stress-crack resistance in a wide variety of solvents. Moreover, the materials display very good mechanical and thermal properties.
    Type: Grant
    Filed: August 10, 1987
    Date of Patent: March 17, 1992
    Assignee: Amoco Corporation
    Inventors: James H. Kawakami, Lloyd M. Robeson, Robert J. Cotter
  • Patent number: 5093453
    Abstract: A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.
    Type: Grant
    Filed: December 12, 1989
    Date of Patent: March 3, 1992
    Assignee: Administrator of the National Aeronautics and Space Administration
    Inventors: Anne K. St. Clair, Terry L. St. Clair, J. Richard Pratt
  • Patent number: 5084547
    Abstract: The thermotropic, fully aromatic polycondensates according to the invention, which contain compounds capable of complex formation, are distinguished by improved resistance to hydrolysis and may be used for the production of moulded articles, fibres, filaments, sheet products and films.
    Type: Grant
    Filed: September 11, 1990
    Date of Patent: January 28, 1992
    Assignee: Bayer Aktiengesellschaft
    Inventors: Harald Pielartzik, Hermann Brinkmeyer, Rolf-Volker Meyer, Bernd Willenberg
  • Patent number: 5080698
    Abstract: The disclosed invention is directed to polycyanoarylether membranes. These membranes are formed by reacting an aromatic diol with a dihalobenzonitrile or dinitrobenzonitrile in the presence of a base and a polar, aprotic solvent. These membranes can be provided as either homopolymers or copolymers.
    Type: Grant
    Filed: April 25, 1991
    Date of Patent: January 14, 1992
    Assignees: E. I. du Pont de Nemours and Company, L'Air Liquide S.A.
    Inventor: Timothy D. Krizan
  • Patent number: 5071997
    Abstract: A new class of polyimides and copolyimides made from substituted benzidines and aromatic dianhydrides and other aromatic diamines. The polyimides obtained with said diamines are distinguished by excellent thermal, excellent solubility, excellent electrical properties such as very low dielectric constants, excellent clarity and mechanical properties making the polyimides ideally suited as coating materials for microelectronic apparatii, as membranes for selective molecular or gas separation, as fibers in molecular composites, as high tensile strength, high compression strength fibers, as film castable coatings, or as fabric components.
    Type: Grant
    Filed: July 20, 1989
    Date of Patent: December 10, 1991
    Assignee: University of Akron
    Inventor: Frank W. Harris
  • Patent number: 5070181
    Abstract: Disclosed is a film of polyimide having repeating units of formula (1) and a birefringence (.DELTA.n) of at least 0.13: ##STR1## wherein R.sup.1 is an aromatic group having a valency of 4, at carbon atoms constituting the aromatic ring, and R.sup.2 is an aromatic group having a valency of 2, at carbon atoms constituting the aromatic ring. This polyimide film exhibits good thermal dimensional stability.
    Type: Grant
    Filed: August 7, 1989
    Date of Patent: December 3, 1991
    Assignee: Kanegafuchi Chemical Ind. Co., Ltd.
    Inventors: Hideki Kawai, Kiyokazu Akahori, Hirosaku Nagano
  • Patent number: 5068307
    Abstract: A polyamideimide having an inherent viscosity of above 0.48 which comprises a unit of the following formula (II) ##STR1## and a unit of the following formula (IV) ##STR2## as main units forming the molecular chains of the polyamideimide, and an intimate mixture of the polyamideimide and a plasticising material for the polyamideimide.
    Type: Grant
    Filed: November 8, 1989
    Date of Patent: November 26, 1991
    Assignee: Teijin Limited
    Inventors: Shigeyoshi Hara, Hiroo Inata, Shunichi Matsumura
  • Patent number: 5066409
    Abstract: Disclosed is an aryl ether sulfone of the following formula: ##STR1## wherein R.sup.1 is independently in each occurrence hydrogen, alkyl, alkoxy, aryl, aryloxy, polyhaloaryl, polyhaloaryloxy, polyhaloalkylaryl, or polyhaloalkylaryloxy, R.sup.2 is independently in each occurrence hydrogen, alkyl, alkoxy, aryl, aryloxy, polyhaloaryl, polyhaloaryloxy, polyhaloalkylaryl, or polyhaloalkylaryloxy, and n is a whole number from 1 to 5. Also disclosed is a lubricant composition which comprises a lubricating fluid and an aryl ether sulfone as shown above, wherein the aryl ether sulfone is present in an amount sufficient to increase the lubricity of the lubricating fluid component.
    Type: Grant
    Filed: September 12, 1990
    Date of Patent: November 19, 1991
    Assignee: The Dow Chemical Company
    Inventor: Bassam S. Nader
  • Patent number: 5061780
    Abstract: Novel poly(etherimide) polymers and a method for the production thereof, which polymers are characterized by moieties of a dioxyaryl-substituted 1,6-diaza [4,4] spirodilactam, alternating with moieties of a bis(imide) and, optionally, with moietis of a di(oxyphenyl) compound. The polymers are thermoplastic polymers of relatively high glass transition temperature.
    Type: Grant
    Filed: August 9, 1990
    Date of Patent: October 29, 1991
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 5061783
    Abstract: The process of the present invention includes first treating a polyamide-acid (such as LARC-TPI polyamide-acid) in an amide-containing solvent (such as N-methylpyrrolidone) with an aprotic organic base (such as triethylamine), followed by dehydrating with an organic dehydrating agent (such as acetic anhydride). The level of crystallinity in the linear aromatic polyimide so produced is maximized without any degradation in the molecular weight thereof.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: October 29, 1991
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Terry L. St. Clair
  • Patent number: 5055550
    Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.
    Type: Grant
    Filed: March 21, 1990
    Date of Patent: October 8, 1991
    Assignee: Hoechst Celanese Corp.
    Inventors: Werner H. Mueller, Dinesh N. Khanna, Rohitkumar H. Vora, Ruediger J. Erckel
  • Patent number: 5053480
    Abstract: A polyimide resin composed essentially of repeating units represented by the general formula: ##STR1## where R is a divalent aromatic hydrocarbon radical.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: October 1, 1991
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Noriaki Koto, Toyohiko Abe, Hideo Suzuki, Kanji Otsuka
  • Patent number: 5053478
    Abstract: Production of polyenaminonitriles including those which can be cyclized to very stable poly(aminoquinolines) without the evolution of any small molecules and thus in a manner free of volatiles. The polyenaminonitriles are polymers which have desirable dielectric properties, and include those which can be cyclized to poly(aminoquinolines) without the evolution of volatiles to make defect-free films and composites of similar dielectric properties because of this characteristic.
    Type: Grant
    Filed: August 2, 1990
    Date of Patent: October 1, 1991
    Inventors: James A. Moore, Douglas Robello
  • Patent number: 5037949
    Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(amino(halo)phenoxyphenyl)hexafluoroisopropyl]diphenyl ether.
    Type: Grant
    Filed: March 6, 1990
    Date of Patent: August 6, 1991
    Assignee: Hoechst Celanese Corp.
    Inventors: Werner H. Mueller, Dinesh N. Khanna, Rohitkumar H. Vora, Ruediger J. Erckel
  • Patent number: 5036150
    Abstract: This invention relates to moldable polyarylates and in particular to moldable polyarylate compositions which have repeating units derived from bis-(3,5-dimethyl-4-hydroxyphenyl) sulfone (TMBS), optionally a dihydric phenol such as 2,2-bis-(4-hydroxyphenyl)-propane (Bisphenol A) and a mixture of isophthalic acid and terephthalic acid or derivatives thereof. Such polyarylates exhibit improved hydrolytic stability.
    Type: Grant
    Filed: April 20, 1990
    Date of Patent: July 30, 1991
    Assignee: Amoco Corporation
    Inventors: James H. Kawakami, James E. Harris, Louis M. Maresca, Lloyd M. Robeson
  • Patent number: 5034540
    Abstract: Liquid crystalline polyesteretherimides are prepared by a transesterification reaction involving hydroquinone, 4,4'-biphenol or 2,6-dihydroxynaphthalene and esters of certain bisimidodicarboxylic acids, or from the free bisimidodicarboxylic acids and esters of the dihydroxyaromatic compounds. In addition to being liquid crystalline, the polyesteretherimides are crystalline in the solid state and have relatively high glass transition temperatures.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: July 23, 1991
    Assignee: General Electric Company
    Inventors: Deborah A. Haitko, David N. Schissel
  • Patent number: 5032667
    Abstract: Described herein are amide and/or imide containing polymers based on novel monomers that contain isoalkylidene bridges. These polymers have excellent toughness combined with high temperature stability, low water absorption, and good melt-fabricability.
    Type: Grant
    Filed: December 20, 1989
    Date of Patent: July 16, 1991
    Assignee: Amoco Corporation
    Inventors: James E. Harris, Abe Berger, Vilas M. Chopdekar, Markus Matzner, James Spanswick
  • Patent number: 5032668
    Abstract: In one embodiment this invention provides novel thermosetting aromatic polyimide prepolymers which have superior solubility and flow properties, and which can be thermally cured to heat and oxidation resistant thermoset adhesives, films and molded products.Illustrative of a prepolymer is the dimaleimide of 2,2-bis[p,p'-(m-aminophenoxy)phenylsulfonyl(p-phenyleneoxy)-phenyl]propane .
    Type: Grant
    Filed: February 21, 1989
    Date of Patent: July 16, 1991
    Assignee: Hoechst Celanese Corp.
    Inventor: Eui W. Choe
  • Patent number: 5013816
    Abstract: Particulate polymers of aromatic diols I and aromatic dihalogen compound II are prepared by(A) producing a plurality of liquid jets from a solution of the polymer by means of a nozzle,(B) causing the liquid jet to divide into particles of equal size,(C) precipitating the drops by introduction into a precipitation bath and(D) removing solvent residues and other impurities.
    Type: Grant
    Filed: December 16, 1987
    Date of Patent: May 7, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Hendrikus Bobbink, Hermann Fischer, Gerhard Heinz, Klaus Matthias, Joachim Seibring, Wolfgang Stegmaier
  • Patent number: 5004775
    Abstract: A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl oxide.
    Type: Grant
    Filed: September 28, 1989
    Date of Patent: April 2, 1991
    Assignee: Allied-Signal Inc.
    Inventors: Larry D. Olson, Jeffrey R. Kamla
  • Patent number: 5003039
    Abstract: High temperature polymeric materials, which are easily process into void-free components, are needed for use in composites for advanced aerospace applications. These materials could bridge the gap between currently-used polymeric materials and ceramics or metal. Phthalonitrile resins can be used as high temperature polymeric material and 1,3-bis(3-aminophenoxy)benzene can be used as a curing agent to reduce voids and benzene can be used as a curing agent to reduce voids and blisters formed from volatiles during polymerization.
    Type: Grant
    Filed: November 18, 1988
    Date of Patent: March 26, 1991
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Teddy M. Keller
  • Patent number: 5003031
    Abstract: Novel polyimides and co-polyimides are prepared by the condensation polymerization of an aryl diamine with dioxydiphthalic anhydride or a mixture thereof with oxydiphthalic anhydride. The polyimides and co-polyimides prepared exhibit a low moisture absorption and improved dielectric properties and can be tailored to provide a composition having desirable mechanical properties, specifically, rigidity.
    Type: Grant
    Filed: May 15, 1989
    Date of Patent: March 26, 1991
    Assignee: Occidental Chemical Corporation
    Inventors: Willis T. Schwartz, Jeffrey S. Stults
  • Patent number: 4999416
    Abstract: Provided is a wholly aromatic polyester superior in melt processability and tenacity which consists essentially of the following structural units (A), (B) and (C) and wherein 0.2 to 40 mole % of the total of said units are of ortho configuration; ##STR1## where Ar.sup.1 and Ar.sup.2 each represent a divalent aromatic hydrocarbon group having 6 to 20 carbon atoms, the hydrogen atoms of said aromatic hydrocarbon group may be substituted with a halogen atom, an alkyl or alkoxy group having 1 to 4 carbon atoms, or phenyl; Z is ##STR2## --O--, or --SO.sub.2 --; m is 0 or 1, at least 60 mole % of Ar.sup.1 being constituted by a group selected from 1,4-phenylene, substituted 1,4-phenylenes, naphthyl and 4,4'-biphenyl.
    Type: Grant
    Filed: January 19, 1990
    Date of Patent: March 12, 1991
    Assignee: Nippon Oil Company, Limited
    Inventors: Tadahiro Kaminade, Shigeki Iida, Tomohiro Toya, Hajime Hara
  • Patent number: 4997902
    Abstract: Polyaryl ethers which are stable at high temperatures essentially consist of(A) from 60 to 97 mol % of repeating units of the general formula I ##STR1## where l and m are each 1 or 2, or their C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl, chlorine or fluorine derivatives which are substituted in the nucleus,(B) from 3 to 40 mol % of repeating units of the general formula II ##STR2## where n is 1 or 2, or their C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl, chlorine or fluorine derivatives which are substituted in the nucleus, and furthermore(C) from 0 to 15 mol % of repeating units of the general formulae III and/or IV ##STR3## where Ar is ##STR4## or a C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, chlorine or fluorine derivative thereof, r is 0 or 1 and p, q and s are each 1 or 2, or their C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl, chlorine or fluorine derivatives which are substituted in the nucleus.
    Type: Grant
    Filed: February 10, 1989
    Date of Patent: March 5, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Juergen Koch, Robert R. Lieder, Gerhard Heinz
  • Patent number: 4988792
    Abstract: Liquid crystalline polyesteretherimides are prepared by a transesterification reaction involving terephthalic acid and acylated derivatives of 4-hydroxybenzoic acid and of certain bisimidodiphenols, or from the free bisimidodiphenol and aryl esters of the acids. In addition to being liquid crystalline, the polyesteretherimides are crystalline in the solid state and have relatively high glass transition temperatures.
    Type: Grant
    Filed: January 19, 1990
    Date of Patent: January 29, 1991
    Assignee: General Electric Company
    Inventors: David N. Schissel, Deborah A. Haitko
  • Patent number: 4987197
    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: January 22, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 4978739
    Abstract: An improved diester process is provided for preparing a polyarylate polymer which process comprises reacting at least one aromatic dicarboxylic acid and a diester derivative of a dihydric phenol and an ester-forming agent having no hydrogens alpha to a carbonyl group of the ester-forming agent. Polyarylates produced by the improved process of this invention have a low degree of coloration, melt stability and a low level of haze.
    Type: Grant
    Filed: August 3, 1989
    Date of Patent: December 18, 1990
    Assignee: Amoco Corporation
    Inventors: Michael J. Amone, Barry D. Dean
  • Patent number: 4966955
    Abstract: The structure of the aromatic copolyether amide which can be processed as a thermoplastic comprises recurring units of the formulae --CO--Ar.sup.1 --CO-- (A), --NH--Ar.sup.1 --O--Ar.sup.1 --X--Ar.sup.1 --O--Ar.sup.1 --NH (B) and --NH--Ar.sup.2 --NH-- (C) in which Ar.sup.1 denotes a divalent, unsubstituted or substituted aromatic radical having 6 carbon atoms which is linked in the p-position, X represents a 2,2-propylidene link and Ar.sup.2 is identical with Ar.sup.1 or is Ar.sup.1 which is linked in the m-position, or is the --Ar.sup.1 --Z--Ar.sup.1 -- group in which Z is a direct bond or is a radical --CH.sub.2 --, --C(CH.sub.3).sub.2 --, --SO.sub.2 --, --CO--, --O--, --CH.dbd.CH--, --CO--NH-- or --O--Ar.sup.1 --O-- or the radical ##STR1## in which R represents hydrogen or a branched or unbranched alkyl radical having 1-4 carbon atoms. The proportion of units (A) and of the sum of units (B) and (C) is each 100 mol-%, the proportion of units (C) being up to 50 mol-% and, if Z represents --SO.sub.
    Type: Grant
    Filed: May 26, 1989
    Date of Patent: October 30, 1990
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Harald Cherdron, Hellmuth Deckers, Friedrich Herold, Reiner Hess
  • Patent number: 4966954
    Abstract: Production of polyenaminonitriles including those which can be cyclized to very stable poly(aminoquinolines) without the evolution of any small molecules and thus in a manner free of volatiles. The polyenaminonitriles are polymers which have desirable dielectric properties, and include those which can be cyclized to poly(aminoquinolines) without the evolution of volatiles to make defect-free films and composites of similar dielectric properties because of this characteristic.
    Type: Grant
    Filed: May 23, 1988
    Date of Patent: October 30, 1990
    Assignee: Rensselaer Polytechnic Institute
    Inventors: James A. Moore, Douglas Robello
  • Patent number: 4963641
    Abstract: Polyester resins usefurl for forming containers having improved resistance to gas permeability comprising the reaction product of(A) a dicarboxylic acid corresponding to the structure ##STR1## wherein X is hydrogen or unstubstituted alkyl containing 1-5 carbons and n is an integer in the range of 4 to 10, and(B) a diol selected from the group consisting of ethylene glycol, 1,4-butanediol and 1,4-cyclohexanedimethanol.
    Type: Grant
    Filed: May 30, 1989
    Date of Patent: October 16, 1990
    Assignee: Eastman Kodak Company
    Inventor: Burns Davis, deceased
  • Patent number: 4963647
    Abstract: The present invention provides novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines and one or more trifunctional acid anhydride monomers, wherein at least one of said diamine monomers is a 12F-Diamine or 12F-Oxydiamine containing at least two CF.sub.3 ##STR1## R groups linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degredation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: October 16, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr., Jeffrey S. Devolve
  • Patent number: 4958003
    Abstract: A class of amide group-containing aromatic dihalide compounds are sulfidized together with a class of aromatic dihalide compounds to provide a novel class of aromatic sulfideamide polymers increased in crystalline melting point (T.sub.m). The polymers exhibit excellent resistance to high temperatures, resistance to solvents, flame-retardant properties and improved mechanical properties.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: September 18, 1990
    Assignee: Tosoh Corporation
    Inventors: Satoshi Tomagou, Toshikazu Kato, Hiroshi Inoue, Kensuke Ogawara
  • Patent number: 4954610
    Abstract: The present invention provides novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines and one or more trifunctional acid anhydride monomers, at least one of said diamine monomers containing the group ##STR1## linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degradation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: September 4, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Paul N. Chen, Sr., Rohitkumar H. Vora
  • Patent number: 4954611
    Abstract: The present invention provides for shaped articles made from novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines, one or more trifunctional acid anhydride monomers, and one or more tetrafunctional aromatic dianhydrides, at least one of said monomers containing the groups ##STR1## linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attach by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degradation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: September 4, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Paul N. Chen, Sr., Rohitkumar H. Vora