Carboxylic Acid Or Derivative Is A Reactant Patents (Class 528/173)
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Patent number: 6127509Abstract: Polyimide polymers from 3,4,3',4'-biphenyltetracarboxylic dianhydride and 3,4,3',4'-benzophenonetetracarboxylic dianhydride and a diamine such as p-phenylenediamine exhibit a high glass transition temperature, high thermal oxidative stability and low moisture regain, useful for structural applications.Type: GrantFiled: June 1, 1999Date of Patent: October 3, 2000Assignees: E. I. du Pont de Nemours and Company, Fiberite Inc.Inventors: James F. Pratte, Murty S. Tanikella
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Patent number: 6121408Abstract: The powder coating for use in a coating method which includes the steps of mixing and applying two or more powder coatings to a substrate, the powder coating comprising a resin not having thermosetting properties at a temperature of 160.degree. C. or less by itself, and being heat-cured at a temperature of 160.degree. C. or less when used in combination with other powder coatings. The powder coating composition comprising two or more powder coatings, wherein each of the powder coatings comprises a resin not having thermosetting properties at a temperature of 160.degree. C. or less by itself, and being heat-cured at a temperature of 160.degree. C. or less to form a coating film when used in combination with other powder coatings.Type: GrantFiled: April 7, 1998Date of Patent: September 19, 2000Assignee: Kao CorporationInventors: Katsutoshi Aoki, Masayuki Maruta, Yukiya Sato, Hisakazu Tajima, Takehiko Tohjo, Yasunori Inagaki, Shingo Tanaka
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Patent number: 6114494Abstract: A fully imidized cresylic acid soluble polymer comprising 4,4'- oxydiphthalic anhydride (ODPA), 3,4,3',4',-biphenyltetracarboxylic dianhydride (BPDA), 3,4'-oxydianiline (ODA), and 4,4'-oxydianiline (DAPE) that can be used as a coating material such as a wire coated enamel. The polyimide has relatively low viscosity and high percent solids by substituting some of the 3,4'oxydianiline with 4,4'oxydianiline. Substitution with the 4,4'oxydianiline can be accomplished up to 25% on the molar basis without losing the fully imidized, cresol solubility characteristics.Type: GrantFiled: December 3, 1998Date of Patent: September 5, 2000Assignee: Ranbar Electrical Materials, Inc.Inventors: Edward W. Kifer, James R. Kwiecinski
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Patent number: 6111058Abstract: Biodegradable polyesteramides as defined in the specification obtained by reacting a mixture consisting essentially of(a1) from 95 to 99.9% by weight of a polyesteramide,(a2) from 0.1 to 5% by weight of a divinyl ether, and(a3) from 0 to 5 mol % of compound D as defined in the specification, and other biodegradable polymers and thermoplastic molding compositions, processes for the preparation thereof, the use thereof for producing biodegradable moldings, and adhesives, biodegradable moldings obtained from the polymers and molding compositions according to the invention.Type: GrantFiled: July 3, 1997Date of Patent: August 29, 2000Assignee: BASF AktiengesellschaftInventors: Volker Warzelhan, Matthias Kroner, Jurgen Hofmann, Ursula Seeliger, Motonori Yamamoto, Peter Bauer
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Patent number: 6111059Abstract: A diaminobenzene derivative represented by formula (1), and a polyimide obtained by reacting a diamine containing at least 1 mol % of said diaminobenzene derivative, with a tetracarboxylic acid and its derivatives to obtain a polyimide precursor and ring-closing it, having a repeating unit represented by formula (2), and a liquid crystal alignment film containing said polyimide. ##STR1## P is a single bond or --O--, --COO--, or --CONH--, Q is a cyclic substituent selected from an aromatic ring, an aliphatic ring, a hetero ring and their substitution products, R.sup.1 is an aliphatic ring, and R.sup.2 is C.sub.1-22 straight chain alkyl group, A is a tetravalent organic group constituting a tetracarboxylic acid, B is a bivalent organic group constituting a diamine.Type: GrantFiled: August 12, 1998Date of Patent: August 29, 2000Assignee: Nissan Chemical Industries, Ltd.Inventors: Takayasu Nihira, Hideyuki Nawata, Hiroyoshi Fukuro
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Patent number: 6107439Abstract: A conductive composition including a mixture of a reaction product ofa hole transporting hydroxy functionalized aryl amine,a hydroxy functionalized arylamine that is different from the hole transporting hydroxy functionalized aryl amine,a cross linkable polyamide, andand an acid capable of simultaneously cross linking the polyamide and oxidizing a portion of the hydroxy functionalized arylamine,the mixture of a reaction product includinga hole transporting hydroxy functionalized aryl amine andan oxidized hydroxy functionalized aryl amine in aa crosslinked polyamide matrix.Other embodiments including processes for applying the aforementioned composition and processes for using devices containing the compositions in high speed laser printing and related printing systems are also disclosed.Type: GrantFiled: December 22, 1998Date of Patent: August 22, 2000Assignee: Xerox CorporationInventors: John F. Yanus, Damodar M. Pai, Timothy J. Fuller, Paul J. DeFeo, Markus R. Silvestri, Dale S. Renfer, William W. Limburg
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Patent number: 6103864Abstract: The polyimides are derived from solutions of at least one low-boiling organic solvent, e.g. isopropanol containing a mixture of polyimide-forming monomers. The monomeric solutions have an extended shelf life at ambient (room) temperatures as high as 80.degree. C. and consist essentially of a mixture of monoalkyl ester-acids, alkyl diester-diacids and aromatic polyamines wherein the alkyl radicals of the ester-acids are derived from lower molecular weight aliphatic secondary alcohols having 3 to 5 carbon atoms per molecule such as isopropanol, secondary butanol, 2-methyl-3-butanol, 2 pentanol or 3-pentanol. The solutions of the polyimide-forming monomers have a substantially improved shelf-life and are particularly useful in the aerospace and aeronautical industry for the preparation of polyimide reinforced fiber composites such as the polyimide cured carbon composites used in jet engines, missiles, and for other high temperature applications.Type: GrantFiled: January 14, 1999Date of Patent: August 15, 2000Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: William B. Alston, Gloria S. Gahn
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Patent number: 6100365Abstract: The present invention provides a novel soluble polyimide resin which is superior in solubility in solvents and transparency, which is useful particularly in electronics and optronics fields, and which has good processability; a process for production of the resin; and a solution composition of the resin. A soluble polyimide resin containing, as part or the whole of the diamine units, a 2,5(or 6)-bis(aminomethyl)bicyclo[2.2.1]heptane and having a light transmittance of 60% or more in a range of wavelength larger than 400 nm in an ultraviolet-visible light spectrum measured for a film of 10-.mu.m thickness; a process for production of the resin; and a solution composition of the resin.Type: GrantFiled: April 12, 1999Date of Patent: August 8, 2000Inventors: Toshihiko Matsumoto, Toshikazu Kurosaki, Shin Irie, Masaaki Kudo, Yoshiharu Ito, Masao Kaneko
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Patent number: 6100371Abstract: A polyimide for optical communications has a monomer, represented by the formula (1), as a repeating unit: ##STR1## wherein X.sub.1 and X.sub.2 are independently selected from the group consisting of halogen atom, halogenated alkyl group, halogenated aromatic ring group, --NO.sub.2, --OR.sup.1 and --SR.sup.1 (where R.sup.1 is selected from the group consisting of halogenated alkyl and halogenated aromatic ring groups); and Z is selected from the group consisting of divalent halogenated aliphatic hydrocarbon, divalent halogenated aliphatic cyclic hydrocarbon and divalent halogenated aromatic hydrocarbon. Thus, light absorption loss at a near infrared light wavelength range can be minimized by using the polyimide, so that the polyimide is very useful as an optical material in the optical communications field using light of a near infrared light region.Type: GrantFiled: September 18, 1998Date of Patent: August 8, 2000Assignee: SamSung Electronics Co., Ltd.Inventors: Dong-Hack Suh, Eun-Young Chung, Tae-Hyung Rhee
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Patent number: 6096850Abstract: Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a 4,4'-(hexafluoroisopropylidene)diphthalic acid dianhydride, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.Type: GrantFiled: February 26, 1999Date of Patent: August 1, 2000Assignee: Nippon Mektron LimitedInventors: Lin-chiu Chiang, Jenq-Tain Lin, Nobuyuki Sensui
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Patent number: 6093790Abstract: The present invention provides polyimides and co-polyimides that are organosoluble. The polyimides and co-polyimides are prepared from an aromatic diamine having tert-butyl group, i.e., 1,4-bis(4-aminophenoxy)-2-tert-butyl-benzene, or its mixture with other diamines, and a mixture of dianhydrides that containing DSDA or 6FDA or other diether-dianhydrides.Type: GrantFiled: August 18, 1998Date of Patent: July 25, 2000Assignee: National Science CouncilInventors: Chin-Ping Yang, Huei-Wen Yang
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Patent number: 6087470Abstract: The new diamine, "3,3',5,5'-tetramethyl-2,2-bis[4-(4-amino-phenoxy)phenyl]propane" was synthesized and used to prepare high performance soluble engineering plastics by polycondensation. The polymer can be polyamides, polyimides or poly(amide-imide)s. These polymers exhibit excellent solubility, processability, heat resistance and mechanical performance.Type: GrantFiled: June 30, 1998Date of Patent: July 11, 2000Assignee: National Science Council of Republic of ChinaInventors: Der-Jang Liaw, Been-Yang Liaw
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Patent number: 6084058Abstract: A composition for a polyimide type liquid crystal aligning film characterized in that a diamino compound constituting polyimide contains one, two or more diamine selected from 4,4'-diaminodiphenyl methane, 3,3'-dimethyl-4,4'-diaminodiphenyl methane, 2,2'-dimethyl-4,4'-diaminodiphenyl methane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenyl methane and 4,4'-ethylene di-meta-toluidine.Type: GrantFiled: September 11, 1998Date of Patent: July 4, 2000Assignee: Chisso CorporationInventors: Shizuo Murata, Toshiya Sawai, Satoshi Tanioka, Haruo Kato
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Patent number: 6084053Abstract: Electronic parts and a process for manufacturing the electronic parts are provided. The electronic parts comprise an electric insulating material exhibiting a high heat resistance and low dielectric constant as a structural component. The electric insulating material is formed of a polyimide containing a recurring unit represented by the following general formula (1).Type: GrantFiled: April 15, 1998Date of Patent: July 4, 2000Assignee: JSR CorporationInventors: Minoru Matsubara, Yasutake Inoue, Mayumi Kakuta, Igor Rozhanskii, Kohei Goto
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Patent number: 6080832Abstract: A diamine-containing polyamic acid alignment layer material provided by the polymerization of aromatic diamine and dianhydride, and having an excellent coating, adhesion and stability. After the polyamic acid alignment layer material is coated and cured at a high temperature, a polyamic acid alignment layer having a pretilt angle of below 2 degrees is formed due to a close ring reaction. The polyamic acid alignment layer with a low pretilt angle can be used in a TN (twisted nematic) type liquid crystal display.Type: GrantFiled: September 10, 1998Date of Patent: June 27, 2000Assignee: Industrial Technology Research InstituteInventors: Fu-Lung Chen, Ted Hong Shinn, Wen Hishin Wang, Chein-Dhau Lee
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Patent number: 6077924Abstract: Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.Type: GrantFiled: February 26, 1999Date of Patent: June 20, 2000Assignee: Nipopon Mektron LimitedInventors: Lin-chiu Chiang, Jenq-Tain Lin, Nobuyuki Sensui
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Patent number: 6069278Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a relatively high glass transition temperature and improved mechanical properties at useful temperature ranges.Type: GrantFiled: November 23, 1999Date of Patent: May 30, 2000Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Chun-Hua K. Chuang
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Patent number: 6066710Abstract: Disclosed is a method of making an imide-containing polymer by bulk or melt polymerizing monomers. A mixture is formed of (1) a cyclic compound that contains an anhydride group and a second group which is an anhydride, a carboxylic acid, or an ester and (2) a diamine in an amount stoichiometric .+-.5 mole % of stoichiometric with the amount of cyclic compound. An end capper may also be included in the mixture to control the molecular weight but no solvent is used. A polyimidesiloxane can be made by using a siloxane-containing diamine. The mixture is heated to a temperature above the T.sub.g or T.sub.m of the polymer but below its degradation temperature.Type: GrantFiled: October 29, 1998Date of Patent: May 23, 2000Assignee: Occidental Chemical CorporationInventors: Kevin H. Becker, Jerold C. Rosenfeld
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Patent number: 6060581Abstract: An optical alignment composition including self-photosensitive polyimide having a benzophenone moiety and an active hydrogen moiety, and an LCD having the alignment layer formed of the optical alignment composition are provided. Since the alignment layer with excellent thermal stability and improved pretilt angle is obtained, the LCD having excellent performance can be manufactured.Type: GrantFiled: December 10, 1997Date of Patent: May 9, 2000Assignee: Samsung Display Devices Co., Ltd.Inventors: Han-sung Yu, Yong-kyu Jang
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Patent number: 6060575Abstract: The present invention provides a series of easily processable poly(ether-imide)s that are organic-soluble and can afford colorless films, their organic solutions and their manufacturing process. The poly(ether-imide) is prepared from a dianhydride and a diamine, wherein the dianhydride is a bis(ether anhydride) having tert-butyl group, i. e. 1,4-bis(3,4-dicarboxyphenoxy)-2-tert-butylbenzene dianhydride.Type: GrantFiled: April 27, 1999Date of Patent: May 9, 2000Assignee: National Science CouncilInventors: Chin-Ping Yang, Sheng-Huei Hsiao
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Patent number: 6054554Abstract: The invention herein relates to a novel soluble polyimide resin comprising polyalicyclic structures and the process of preparation of the same, wherein aromatic tetracarboxylic dianhydride and novel aromatic diamine having an polyalicyclic group with various structures are used to yield a novel form of a polyimide resin, which has superior heat-resistance, solubility, and transparency.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance and solubility, which is prepared by means of reacting diamine monomers having a novel chemical structure with various types of aromatic carboxilic dianhydrides, in stead of aromatic diamine used for the preparation of the conventional polyimide resin. As a result, the polymers so obtained had the glass transition temperature of 260.degree. C..about.410.degree. C. and showed a increase in solubility in proportion to the increase in a number of the aromatic rings between two phenyl groups.Type: GrantFiled: May 7, 1999Date of Patent: April 25, 2000Assignee: Korea Research Institute of Chemical TechnologyInventors: Kil Yeong Choi, Mi Hie Yi, Wenxi Huang
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Patent number: 6048959Abstract: Tough, soluble, aromatic, thermoplastic copolyimides were prepared by reacting 4,4'-oxydiphthalic anhydride, 3,4,3',4'-biphenyltetracarboxylic dianhydride and 3,4'-oxydianiline. Alternatively, these copolyimides may be prepared by reacting 4,4'-oxydiphthalic anhydride with 3,4,3',4'-biphenyltetracarboxylic dianhydride and 3,4'-oxydiisocyanate. Also, the copolyimide may be prepared by reacting the corresponding tetra acid and ester precursors of 4,4'-oxydiphthalic anhydride and 3,4,3',4'-biphenyltetracarboxylic dianhydride with 3,4'-oxydianiline. These copolyimides were found to be soluble in common amide solvents such as N,N'-dimethyl acetamide, N-methylpyrrolidinone, and dimethylformamide allowing them to be applied as the fully imidized copolymer and to be used to prepare a wide range of articles.Type: GrantFiled: January 22, 1999Date of Patent: April 11, 2000Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Robert G. Bryant
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Patent number: 6046303Abstract: The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the manufacturing method thereof, wherein a mixture of aliphatic tetracarboxylic acid dianhydrides and aromatic diamine having aliphatic side chains are used to yield a soluble polyimide resin which has superior heat-resistance, solubility, surface hardness, transparency and liquid crystal alignment capacity.The soluble polyimide resin having alkoxy substituents, for a liquid crystal layer, according to the present invention, is manufactured by adding a mixture of dioxotetrahydrofuran 3-methylcyclohexene-1,2-dicarboxylic dianhydride, which is an aliphatic tetracarboxylic acid dianhydride and aromatic tetracarboxylic acid dianhydride to a mixture of aromatic diamine, and said dioxotetrahydrofuran 3-methylcyclohexene- 1,2-dicarboxylic dianhydride is used in the amount of 50 to 99 mol % to the total amount of anhydrides.Type: GrantFiled: September 11, 1998Date of Patent: April 4, 2000Assignee: Korea Research Institute of Chemical TechnologyInventors: Kil-Yeong Choi, Mi-Hie Yi, Moon-Young Jin, Jin-Tae Jung, Jeong-Ghi Koo, Jae-Eun Cho
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Patent number: 6040418Abstract: Fluorinated polymides comprising units of 2,2',5,5',6,6'-hexafluorobiphenyl-3,3',4,4'-tetracarboxylic dianhydride and aromatic diamines.Type: GrantFiled: August 4, 1998Date of Patent: March 21, 2000Assignee: Ube Industries, Ltd.Inventors: Tomohiko Yamamoto, Tatsuo Tsumiyama, Kouji Sugimoto
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Patent number: 6037499Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a realatively high glass transition temperature and improved mechanical properties at useful temperature ranges.Type: GrantFiled: December 24, 1998Date of Patent: March 14, 2000Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Chun-Hua K. Chuang
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Patent number: 6031068Abstract: The object of the present invention is to provide polyimide composition having such excellent property as low water absorption and low hygroscopic swelling, and a base tape for a TAB carrier tape and a FPC.The another object of the present invention is to provide polyimide composition comprising polyimide consisting of a repeating unit of the general formula (1): ##STR1## The further object of the present invention is to provide a base tape for a TAB carrier tape containing polyimide film made from said polyimide composition as a base film and a FPC containing polyimide film made from said polyimide composition as an insulating material.Type: GrantFiled: October 23, 1998Date of Patent: February 29, 2000Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventor: Kohji Okada
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Patent number: 6031067Abstract: The invention herein relates to a soluble polyimide resin and the process of preparation of the same, wherein aromatic tetracarboxylic dianhydride and aromatic diamine having an alicyclic group with various structures of substituted alkyl groups are used to yield a novel form of a polyimide resin, which has superior heat-resistance, solubility and transparency.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance and solubility, which is prepared by means of reacting aromatic diamine monomers having a novel chemical structure with various types of aromatic tetracarboxilic acid dianhydrides, in stead of aromatic diamine used for the preparation of the conventional polyimide resin. As a result, the polymers so obtained had the glass transition temperature of 250.degree. C..about.400.degree. C. and showed a increase in solubility in proportion to the increase in volume of the alkyl group.Type: GrantFiled: May 29, 1998Date of Patent: February 29, 2000Assignee: Korea Research Institute of Chemical TechnologyInventors: Kil-Yeong Choi, Mi-Hie Yi, Wenxi Huang
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Patent number: 6028158Abstract: This invention relates to a novel freeze-stable allophanate modified toluene diisocyanurates, and to a process for producing these freeze-stable allophanate-modified toluene diisocyanurates which requires a catalyst which is capable of forming both trimer and allophanate groups, or a catalyst system comprising at least one catalyst capable of forming trimer groups and at least one catalyst capable of forming allophanate groups. This invention also relates to novel freeze-stable blends of the allophanate-modified toluene diisocyanurates with di- and/or polyisocyanates of the diphenylmethane series; and to freeze-stable urethane prepolymers of the allophanate-modified toluene diisocyanurates, or the blends of these with an isocyanate of the diphenylmethane series.Type: GrantFiled: December 31, 1997Date of Patent: February 22, 2000Assignee: Bayer CorporationInventors: William E. Slack, Hersel T. Kemp, II
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Patent number: 6028159Abstract: A polyamideimide for optical communications, having a minimum light absorption loss in a near infrared light wavelength range, high thermal stability and excellent film processibility, and a method for preparing the same are provided. The polyamideimide has a higher refractive index than the conventional fluorinated polyamideimide. Thus, when using such polyamideimide as a material for a core of an optical fiber, the selection range on the material for cladding becomes wide. Also the coating property and adhesiveness to a substrate are improved, thereby providing a good film processibility and heat resistance.Type: GrantFiled: December 31, 1998Date of Patent: February 22, 2000Assignees: SamSung Electronics Co., Ltd., Korea Research Institute of Chemical TechnologyInventors: Dong-hack Suh, Eun-young Chung, Tae-hyung Rhee
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Patent number: 6025461Abstract: A photosensitive polyimide, which comprises a copolymer of (A) three diamine compounds mixture consisting of a diaminopolysiloxane, a hydroxyl group-containing diamine or carboxyl group-containing diamine and 1,4-bis[2-(3-aminobenzoyl)ethenyl]benzene with (B) an aromatic tetrocarboxylic acid dianhydride or a dicarboxylic anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, is soluble in all-purpose low boiling organic solvents, typically methyl ethyl ketone and provides a negative type photosensitive polyimide, which is developable with an aqueous alkaline solution.Type: GrantFiled: August 5, 1998Date of Patent: February 15, 2000Assignee: Nippon Mektron, LimitedInventors: Lin-Chiu Chiang, Jeng-Tain Lin
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Patent number: 6025460Abstract: The service life of fiber-reinforced polyimide composites in a high temperature oxidative environment is extended by coating with a polyimide coating precursor solution that is synthesized by reacting an aromatic dianhydride with an aromatic diamine in a non-reactive solvent. The reactive solution is heated to a temperature sufficent to reduce its viscosity prior to its use as a coating. Preferably, a mixture of meta-phenylenediamine and para-phenylenediamine is reacted with biphenyldianhydride in n-methyl pyrrolidinone solvent and thereafter heated to between about 50.degree. C. (122.degree. F.) and 150.degree. C. (302.degree. F.) under nitrogen while stirring for a time sufficient to obtain a polyamic acid polyimide precursor coating solution having a Brookfield viscosity of from about 500 to about 5000 cP and a solids content of from about 5 to about 35 weight percent.Type: GrantFiled: November 4, 1997Date of Patent: February 15, 2000Assignee: Ohio Aerospace InstituteInventors: Anthony M. Mazany, Stanley G. Prybyla
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Patent number: 6013760Abstract: The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the process of preparation of the same, wherein aliphatic tetracarboxylic dianhydride and aromatic diamine having the amide group are used to yield a novel form of a polyimide resin having superior heat-resistance, solubility, transparency, and liquid crystal alignment capacity.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance, solubility, liquid crystal alignment property, and high pretilt angle, which is prepared by means of jointly using the aromatic diamine, used for the preparation of the conventional polyimide resin, and the aromatic diamine having a long alkyl chain with a substituted amide group, and reacting the same with various types of carboxylic dianhydride.Type: GrantFiled: May 29, 1998Date of Patent: January 11, 2000Assignee: Korea Research Institute of Chemical TechnologyInventors: Kil-Yeong Choi, Mi-Hie Yi, Moon-Young Jin, Dae-Woo Ihm, Jae-Min Oh
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Patent number: 6013759Abstract: A polyamideimide for optical communications, having a minimum optical loss in a near infrared light wavelength range, high thermal resistance and good film processibility, and a method for preparing the same are provided. The polyamideimide is very useful as an optical material in the optical communications field adopting the light of near infrared light wavelength.Type: GrantFiled: December 7, 1998Date of Patent: January 11, 2000Assignee: SamSung Electronics Co., Ltd.Inventors: Dong-hack Suh, Eun-young Chung, Tae-hyung Rhee
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Patent number: 6001942Abstract: The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.Type: GrantFiled: December 21, 1998Date of Patent: December 14, 1999Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Masaaki Amako, Haruhiko Furukawa, Yoshitsugu Morita, Hiroshi Ueki
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Patent number: 6001958Abstract: The invention relates to a crosslinkable polymer for use in optics and non-linear optics, which comprises at least one chromophore, characterized in that it has, on at least two of its ends, at least one reactive end group of a different chemical type from the group predominantly used in polymerization and the preparation of a polymer skeleton. Said reactive end group comprises at least one CC, CN, CS, SS or NS double bond and/or triple bond, and/or an epoxy group and/or a thiol group or a derivative of said groups, and the polymerization groups are selected from at least one of the following groups: urethane, ester, amide, imide, ether, carbon-carbon, sulfide, silane and siloxane, urethane and ester groups being particularly preferred. Application in optical and opto-electronic materials and devices.Type: GrantFiled: October 28, 1996Date of Patent: December 14, 1999Assignee: Flamel TechnologiesInventors: Gilles Hugues Tapolsky, You Ping Chan, Remi Meyrueix, Jean-Pierre Lecomte, Michael Dickens
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Patent number: 5998572Abstract: Methods and devices for controlling the oxidation of a hydrocarbon to an acid by regulating the temperature hold-up time, and conversion in consecutive reaction zones. The temperature in the consecutive reaction zones progressively decreases, while the hold-up time increases. Preferably, the conversion also increases. One of the major advantages of the methods and devices of the present invention is that an outstanding balance between productivity and selectivity/yield of the desired acid may be achieved. In this respect high yields and selectivities may be obtained without sacrificing productivity.Type: GrantFiled: May 12, 1998Date of Patent: December 7, 1999Assignee: RPC Inc.Inventors: Ader M. Rostami, Mark W. Dassel, Eustathios Vassiliou, David C. DeCoster
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Patent number: 5986036Abstract: A new holographic substrate utilizing flexible, optically transparent fluorinated polyimides. Said substrates have extremely low birefringence which results in a high signal to noise ratio in subsequent holograms. Specific examples of said fluorinated polyimides include 6FDA+APB and 6FDA+4BDAF.Type: GrantFiled: June 27, 1997Date of Patent: November 16, 1999Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Paul A. Gierow, William R. Clayton, Anne K. St. Clair
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Colorless organic-soluble aromatic poly(ether-imide)s, the organic solutions and preparation thereof
Patent number: 5977289Abstract: The present invention provides a series of easily processable poly(ether-imide)s that are organic-soluble and can afford colorless films, their organic solutions and their manufacturing process. The poly(ether-imide) is prepared from a dianhydride and a diamine, wherein the dianhydride is a bis(ether anhydride) having tert-butyl group, i.e. 1,4-bis(3,4-dicarboxyphenoxy)-2-tert-butylbenzene dianhydride. The present invention is also directed to synthesis of this special dianhydride.Type: GrantFiled: August 18, 1998Date of Patent: November 2, 1999Assignee: National Science CouncilInventors: Chin-Ping Yang, Sheng-Huei Hsiao -
Patent number: 5969087Abstract: A novel polyimide having a repeating structure unit expressed by the following general formula (1), a method for manufacturing the same, a gas separation membrane using the novel polyimide and the method for manufacturing the same. The gas separation membrane using this polyimide is excellent in gas permeable performance and separation selectivity for gas, for example, carbon dioxide, methane, etc.General Formula (1) ##STR1## where R denotes a quadrivalent organic group.Type: GrantFiled: March 31, 1998Date of Patent: October 19, 1999Assignee: Nitto Denko CorporationInventor: Masatoshi Maeda
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Patent number: 5969088Abstract: An angularity enhancement layer in a liquid crystal display, which display comprises a liquid crystal cell, wherein the angularity enhancement layer includes a negative birefringent polyimide layer comprising a plurality of structural units having pendant fluorene groups, said angularity enhancement layer being disposed on at least one surface of said liquid crystal cell. A liquid crystal display can comprise an angularity enhancement construction of the invention which comprises a polyimide layer.Type: GrantFiled: May 5, 1998Date of Patent: October 19, 1999Assignee: 3M Innovative Properties CompanyInventors: Stephen A. Ezzell, Hassan Sahouani, Ernest L. Thurber
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Patent number: 5969080Abstract: A film excellent in flatness, and not degraded in flatness by curling, etc. even at high temperature during processing and use as a product.The film of the present invention is made of an aromatic polyamide and/or aromatic polyimide, and satisfies the following:(Pmax-Pmin)/Pavr.ltoreq.1.0where Pmax is the maximum value of the orientation degree obtained from the Raman spectrum in the section direction of the film; Pmin is the minimum value and Pavr is the average value.Type: GrantFiled: December 30, 1997Date of Patent: October 19, 1999Assignee: Toray Industries, Inc.Inventors: Toshiya Ieki, Akimitsu Tsukuda, Toshihiro Tsuzuki
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Patent number: 5969079Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## R.sub.R =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --,--S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.theta.=--C.tbd.N, --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.Type: GrantFiled: October 21, 1994Date of Patent: October 19, 1999Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5965691Abstract: A process for aligning liquid crystals adjacent to a surface of an optical alignment layer comprising: exposing at least one optical alignment layer, comprising anisotropically absorbing molecules, to polarized light; the polarized light having a wavelength within the absorption band of said anisotropically absorbing molecules; wherein the exposed anisotropically absorbing molecules induce alignment of a liquid crystal medium at an angle + and - with respect to the direction of the polarization of the incident light beam and along the surface of the optical alignment layer; and applying a liquid crystal medium to said optical alignment layer; wherein said anisotropically absorbing molecules consist essentially of diaryl ketones, is described.Type: GrantFiled: July 1, 1997Date of Patent: October 12, 1999Assignee: Elsicon, Inc.Inventors: Wayne M. Gibbons, Paul J. Shannon, Shao-Tang Sun
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Patent number: 5955566Abstract: Thermosetting polymers with high temperature capability for composite and adhesive applications are disclosed. Inhibitors for improving pot life, gel time and storage stability are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.Type: GrantFiled: November 13, 1996Date of Patent: September 21, 1999Assignee: Cytec Technology CorporationInventors: Jean Lee, Jack Douglas Boyd, Albert Kuo
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Patent number: 5952453Abstract: Methylenedianiline-free, PMR-type, curable compositions based on m-phenylenediamine or mixtures of m-phenylenediamine and p-phenylenediamine are described.Type: GrantFiled: May 8, 1996Date of Patent: September 14, 1999Assignee: Cytec Technology Corp.Inventors: Patrick T. McGrail, Paul Eustace, William S. Dewar
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Patent number: 5952448Abstract: This invention relates to a poly (imide amic ester) random copolymer, a precursor thereof, and a process for preparing the same. Specifically this invention relates to a novel precursor of polyimide, poly(imide amic ester) which is chemically stable and has excellent workability in either liquid or solid state, a polyimide obtained therefrom and a process for preparing the same.Type: GrantFiled: December 30, 1997Date of Patent: September 14, 1999Assignee: Korea Research Institute of Chemical TechnologyInventors: Myung-Hun Lee, Seo-Bong Lee, Chang-Jin Lee, Eun-Kyoung Kim, Mi-Seon Ryoo
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Patent number: 5939521Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a realatively high glass transition temperature and improved mechanical properties at useful temperature ranges.Type: GrantFiled: January 23, 1998Date of Patent: August 17, 1999Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Chun-Hua K. Chuang
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Patent number: 5939520Abstract: Regiospecific polyamide-imides are cast to form membranes which exhibit superior gas separation properties when compared to polyamide-imide membranes formed from random copolymers. The regiospecific polyamide-imides are synthesized by reacting specific aromatic diimide dicarboxylic acids with select aromatic diamines.Type: GrantFiled: September 5, 1997Date of Patent: August 17, 1999Assignee: Air Products and Chemicals, Inc.Inventor: Michael Langsam
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Patent number: 5929201Abstract: The present invention relates to amine compositions and the preparation of polyimides. The polyimides can be used for inducing alignment of a liquid crystal medium with polarized light and liquid crystal display elements.Type: GrantFiled: May 20, 1997Date of Patent: July 27, 1999Assignee: Elsicon, Inc.Inventors: Wayne M. Gibbons, Paul J. Shannon, Shao-Tang Sun
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Patent number: 5916996Abstract: A process for the preparation of polyester-imide resin of the formula ##STR1## wherein n represents the number of segments present and is a number of from about 10 to about 10,000; R' is alkyl or alkylene; and R is independently an oxyalkylene or a polyoxyalkylene by the reaction of trimellitic acid, or a trimellitic anhydride, a glycol and a diamine of the formula ##STR2## wherein R represents a hydrogen or alkyl group; and n represents the number of monomer segments, and is a number of from about 1 to about 10, and which reaction is accomplished by heating the aforementioned components.Type: GrantFiled: June 23, 1994Date of Patent: June 29, 1999Assignee: Xerox CorporationInventors: Guerino G. Sacripante, Melvin D. Croucher, Stephan V. Drappel