Abstract: Disclosed herein are polymer compounds and a method for preparing thereof. More specifically, provided are polymer compounds with well-connected, narrow size distribution free-volume element and a method for preparing the polymer compounds by thermal rearrangement for aromatic polyimides containing ortho-positioned functional groups in the solid state.

Abstract: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

Abstract: A fusible polyimide showing a fusion endothermic peak in a differential scanning calorimeter has a recurring unit of the following formula (1): in which Ar1 is a mixture of residues of tetracarboxylic dianhydrides composed of 12-25 mol. & of a residue of pyromellitic dianhydride, 5-15 mol. % of a residue of 3,3′4,4′-benzophenonetetracarboxylic dianhydride, and a remaining mol. % of a residue of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and Ar2 is an aromatic diamine residue composed of 1,3-bis(4-aminophenoxy)benzene.

Abstract: A flexible printed substrate is constituted of metallic foil and provided thereon a polyimide layer which is produced by forming a film of a polyamic acid varnish on the metallic foil, followed by imidating. The polyimide layer has a linear expansion coefficient of 10×10−6 to 30×10−6 (1/K) and a softening point not more than the imidation temperature.

Abstract: The present invention provides a process for preparing an optical alignment layer for aligning liquid crystals and liquid crystal displays comprising exposing polyimide layers with polarized light. The invention further describes optical alignment layers, liquid crystal displays incorporating optical alignment layers and novel polymer compositions within the class of polyimide, polyamic acids and esters thereof.

Abstract: Polymerisable resins which comprise a porphyrinogenic ring system obtained by the reaction of: (a) one or more compounds selected from the group consisting of pyrrole and N-(lower)alkyl pyrroles, any of which may be optionally substituted, and (b) a C4-C6 saturated alicyclic ketone which is capable of reacting with the 2 or 5 position of the pyrrole ring. Resin coating systems comprising the said resins.

Abstract: A thermoplastic resin composition containing a polyetherimide resin, a siloxane-polyetherimide copolymer and a branched polycarbonate resin exhibits exhibit high heat distortion temperature, improved room temperature impact properties and improved impact strength and ductility at low temperatures.

Abstract: A thermoplastic resin composition containing a polyetherimide resin, a siloxane-polyetherimide copolymer and a branched polycarbonate resin exhibits exhibit high heat distortion temperature, improved room temperature impact properties and improved impact strength and ductility at low temperatures.

Abstract: A polyimide copolymer containing a block polyimide polymer component composed of a rigid aromatic diamine compound and an aromatic tetracarboxylic acid compound and a random polyimide copolymer component composed of a flexible aromatic diamine compound and at least two types of aromatic tetracarboxylic acid compounds is prepared by a two-stage polymerization process. Resin molded products prepared from the polyimide copolymer have high modulus, low thermal expansion and low water absorption and can be used as TAB base films that require higher processability and precision.

Abstract: Disclosed are polymers and copolymers containing at least one repeating unit of the formula ##STR1## in which X is O or NH; R is a single bond or a hydrocarbon chain; R' is a hydrocarbon chain containing one or two carbon atoms, and P is the residue of an oligomer HX--P--XH whose solution viscosity determined in meta-cresol at 30.degree. C. at concentrations of 0.5 g/dl is lower than 0.50 dl/g.sup.-1. Also disclosed is a process for obtaining the polymers and copolymers.

Abstract: The present invention provides novel thermoset copolymers, and methods for preparing same, having both the strength and the thermo-oxidative stability required for high performance, high temperature applications. The copolymers comprise (a) a thermoplastic resin having unreacted phenolic OH groups, and (b) bis-oxazoline monomers which have been modified to have at least one substituent on the oxazoline ring selected from the group consisting of a methyl group, a group having at least a substituent capable of undergoing addition polymerization, and a cyclic group capable of undergoing ring opening polymerization.

Abstract: The yield of fully substituted, multidimensional aromatic hubs in the condensation of hydroxyl and acid halide functionalities is improved by adding a thallium catalyst, such as thallium ethoxide (T1-OC.sub.2 H.sub.5), in the solvent.

Abstract: An alternating copolymer comprising a repeating unit of the formula:--Z--(X-Y).sub.n -- (I)wherein n is at least 2, X is O, S, Se or Te, and Y and Z are independently an aromatic or substituted aromatic group, and at least one other repeating unit, which is useful as a photosensitive material used in a spatial light modulator.

Abstract: This invention relates to a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is ##STR2## and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.

Abstract: A readily melt processable polyimide obtained by reacting diamine represented by the formula: 4,4' ##STR1## wherein n is an integer of 1 or 2, with 3,3'4,4' -diphenylethertetracarboxylic dianhydride and/or 4,4' -(p-phenylenedioxy)diphthalic dianhydride or a mixture of these tetracarboxylic acid dianhydrides and pyromellitic dianhydride in the presence of phthalic anhydride.

Abstract: A readily melt-processable polyimide obtained by reacting diamino-diphenyl ether with 3,3',4,4'-biphenyltetracarboxylic dianhydride in the presence of phthalic anhydride and thermally or chemically imidizing the resultant polyamic acid.

Abstract: A polyamic acid having a three-dimensional network molecular structure produced by a gel forming ring-opening polyaddition reaction in an organic solvent of the reaction components comprising:(A) an acid component consisting of at least one tetracarboxylic acid dianhydride selected from the group consisting of a tetracarboxy benzene dianhydride, a tetracarboxy dianhydride of a compound having 2 to 5 condensed benzene rings, and compounds represented by formula (III), and substituted compounds thereof: ##STR1## wherein R.sub.1 represents --O--, --CO--, --SO.sub.2 --, --SO--, an alkylene group, an alkylene bicarbonyloxy group, an alkylene bioxycarbonyl group, a phenylene group, a phenylene alkylene group, or a phenylene dialkylene group, n.sub.4 is 0 or 1, n.sub.5 is 0 or 1; and n.sub.6 is 1 or 2, provided that the sum of n.sub.5 and n.sub.

Abstract: The solvent-resistance and thermal stability of polyamideimides of the general formulae: ##STR1## is improved by capping the amideimides with a crosslinking functionality (Y) containing a residue selected from the group of: ##STR2## wherein R.sub.1 =lower alkyl, lower alkoxy, aryl, aryloxy, substituted alkyl, substituted aryl (either including hydroxyl or halo-substituents), halogen, or mixtures thereof;j= 0, 1, or 2;G=--CH.sub.2 --, --O--, --S--, --SO.sub.2 --, --SO--, --CO--, --CHR--, or --CR.sub.2 --;R=hydrogen, lower alkyl, or phenyl;T=methallyl or allyl;Me=methyl;R.sub.2 =a trivalent organic radical; andR.sub.3 =a divalent organic radical.The amideimide oligomers may be linear or multidimensional, and can be processed into blends, prepregs, or composites. Methods of making these amideimides and intermediates useful in the syntheses are also described.

Abstract: The solvent-resistance and thermal stability of polyamideimides of the general formulae: ##STR1## is improved by capping the amideimides with a crosslinking functionality (Y) containing a residue selected from the group of: ##STR2## wherein R.sub.1 =lower alkyl, lower alkoxy, aryl, aryloxy, substituted alkyl, substituted aryl (either including hydroxyl or halo-substituents), halogen, or mixtures thereof;j=0, 1, or 2;G=--CH.sub.2 --, --O--, --S--, --SO.sub.2 --, --SO--, --CO--, --CHR--, or --CR.sub.2 --;R=hydrogen, lower alkyl, or phenyl;T=methallyl or allyl;Me=methyl;R.sub.2 =a trivalent organic radical; andR.sub.3 =a divalent organic radical.The amideimide oligomers may be linear or multidimensional, and can be processed into blends, prepregs, or composites. Methods of making these amideimides and intermediates useful in the syntheses are also described.

Abstract: The present invention provides diamino compounds and liquid crystal aligning films comprising polyimides which are obtained from the said diamino compounds represented by the general formula: ##STR1## wherein R.sub.1 indicates an alkyl group having 3 to 22 carbon atoms, R.sub.2 indicates a hydrogen atom or an alkyl group having 1 to 22 carbon atoms, and R.sub.3 -R.sub.10 indicate a hydrogen atom or a methyl group, respectively.The liquid crystal aligning films are useful for STN mode display cells in realizing a high pretilt angle.

Abstract: This invention relates to a method for preparing a polyimide having good heat-stability and excellent flowability in a molten state.The polymide is prepared by reacting aromatic diamines such as 4,4'-bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine: tetracarboxylic dianhydride: dicarboxylic anhydride is 1:(0.9 to 1.0):(0.001 to 1.0).The invention also relates to polyimide composite materials which are excellent in mechanical strengths and processability.

Abstract: The invention relates to processes for preparing a polyimide, a polyimide composition prepared by the processes and polyimide composite materials containing the same.

Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.

Abstract: A polyimide copolymer having a repeating unit of formula (I): ##STR1## wherein each of R.sub.1 and R.sub.2 is independently ##STR2## and R.sub.1 and R.sub.2 are different from each other, R.sub.0 is an aromatic group having a valency of 4, and m is a positive integer. The polyimide copolymer is excellent in heat resistance, mechanical properties (e.g., tensile elongation) and thermal dimensional stability.

Abstract: A colorless transparent polyimide shaped article having as a main component at least one recurring unit selected from the recurring units of the formulae (I) to (IX). It is useful, for example, as an oriented film in liquid crystal display devices. The polyimide shaped article is produced by a process which comprises preparing a solution of a polyamide acid having as a main component at least one recurring unit selected from the recurring units of the formulae (V) to (VIII) in an amide-type organic polar solvent, forming a shaped article of the polyamide acid from the solution, and imidizing the resulting shaped article of the polyamide acid.

Abstract: This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting 2,6-bis(3-aminophenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.

Abstract: This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).

Abstract: Disclosed is an aromatic polyamic acid solution composition comprising an aromatic polyamic acid dissolved in an amount of 5 to 40% by weight in an organic polar solvent. The aromatic polyamic acid is prepared by polymerizing substantially equimolar amounts of an aromatic tetracarboxylic acid component comprising 15 to 85 mole % of a biphenyltetracarboxylic acid or its functional derivative and 15 to 85 mole % of a pyromellitic acid or its functional derivative and an aromatic diamine component comprising 30 to 100 mole % of a phenylenediamine and 0 to 70 mole % of a diaminodiphenyl ether. The aromatic polyamic acid solution composition is formed into an aromatic polyimide film having a relatively small thermal expansion coefficient, high mechanical strength and good flexibility.

Abstract: A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula ##STR1## wherein, each of X, X.sub.1, X.sub.2, X.sub.3 and X.sub.4 is a tetravalent carbocyclic or heterocyclic residue, each of Y.sub.1, Y.sub.2, and Y.sub.3 is a divalent carbocylic or heterocyclic residue, at least one of Z.sub.1 and Z.sub.2 is a residue having a reactive carbon-carbon double bond, and each of l, m, and n is an integer from 0 to 20, preferably from 0 to 10. The polyimide may include (a) polyacrylate compounds (b) bis-imide compounds (c) photosensitive polyimide precursors (d) oxime initiators (e) a 3 component sensitizer of a phenone compound, a mercapto compound, and an arylamine-alkanol, or mixtures of a,b,c,d, and e.

Abstract: A transparent aromatic polyimide produced by polymerization and imidation of an aromatic tetracarboxylic acid containing as a principal component biphenyltetracarboxylic acid and an aromatic diamine containing as a principal component bis(aminophenoxy-phenyl)sulfone of the formula (I) or bis(aminophenoxy-phenyl)propane of the formula (II): ##STR1##

Abstract: Methods of making modified polyimide adhesives and laminating compositions. These adhesives are also particularly useful as the matrix material in high strength fiber reinforced composites. The adhesive compositions are prepared by initially reacting an oxoimine with one or more tetracarboxylic acid dianhydrides, which is primarily 1, 2, 3, 4-butanetetracarboxylic acid dianhydride. The resulting bisimide is dissolved in a non-reactive solvent and a suitable diamine is added to react with the bisimide, producing a liquid resin solution which is essentially a polyamide resin solution. This solution is useful as an adhesive or a fiber composite matrix which can be cured to a polyimide at moderate processing temperatures. The final adhesive bond or matrix is found to be flexible, strong and very resistant to flame, high temperatures, oils and solvents.

Abstract: An organic solvent-soluble photosensitive polyimide resin having excellent heat resistance and electrical and mechanical properties, comprising a copolycondensation product of a biphenyltetracarboxylic acid component with an aromatic diamine component consisting of 40 to 90 molar % of a diamine compound of the formula (I) and 10 to 60 molar % of a diaminodiphenylether compound of the formula (II), ##STR1## wherein X=--CO--O-- or --CH.sub.2 --O--, R.sub.1 and R.sub.2 =an organic residue having an ethylenically unsaturated radical, and R.sub.3 =H or --NHCOR.sub.2.

Abstract: Method of forming 4,4',4",4'"-tetraamino phthalocyanines by reducing 4,4',4",4'"-tetranitro phthalocyanines, polymerization of the metal tetraamino phthalocyanines with a tetracarboxylic dianhydride (preferably aromatic) or copolymerization with a tetracarboxylic dianhydride and a diamine (preferably also aromatic) to produce amic acids which are then dehydrocyclized to imides. Thermally and oxidatively stable polymers result which form tough, flexible films, etc.

Abstract: Cationic heat-hardenable binders comprising polymers containing amine groups and a crosslinking component which is film-forming with the amine group containing polymer through transesterification at elevated temperatures are described. The binders which are water-dilutable upon protonization of the amine groups comprise(a) 60 to 95% by weight of a polymer having a hydroxyl value of from 40 to 450 mg KOH/g and an amine value of from 20 to 150 mg KOH/g, water-soluble or water-dilutable upon protonation of the basic groups, and(b) 5 to 40% by weight of a cross-linking component of the general formula ##STR1## n having a value of from 1 through 5, R.sub.1 being the moiety of a monoalcohol having from 1 to 8 C-atoms or of a polyol or of a polyamine or of a polyepoxy compound or of a polyisocyanate remaining after reaction with one or more carboxylic acid groups, andR.sub.2 being a straight chain or branched alkyl radical with from 1 to 8 C-atoms.

Abstract: Polymerizable compositions comprise(a) a compound containing both(i) at least one acryloyloxy or methacryloyloxy group,(ii) at least one allyl, methallyl, or 1-propenyl group attached directly to a carbon atom which forms part of an aromatic nucleus or to an oxygen atom or an oxycarbonyl group which are in turn directly attached to such a carbon atom,the total of the said groups (i) and (ii) being at least three, and(b) a compound containing at least two mercaptan groups directly attached to aliphatic carbon atoms, in a proportion as to supply at least 0.8 such mercaptan group per allyl, methallyl or 1-propenyl group in (a) but less than 1.0 such mercaptan group in (a) per acryloyl, methacryloyl, allyl, methallyl, or 1-propenyl group.

Abstract: A class of polyamides comprising recurring units having substituted-quaterphenylene radicals is disclosed. The polymers comprise recurring units of the formula ##STR1## wherein each of A and B is a divalent radical, except that B can represent a single bond; R and R.sup.1 are each hydrogen, alkyl, aryl, alkaryl or aralkyl; and c is zero or one; and wherein, when c is one, at least one of A and B is a substituted-quaterphenylene radical having the formula ##STR2## where each U is a substituent other than hydrogen, each W is hydrogen or a substituent other than hydrogen, each p is an integer from 1 to 3, each X is hydrogen or a substituent other than hydrogen and each r is an integer from 1 to 4, the U, W.sub.p and X.sub.r substitution being sufficient to provide the radical with a non-coplanar molecular configuration; and wherein, when c is zero, A is a substituted-quaterphenylene radical as aforedescribed.

Abstract: A class of polyamides comprising recurring units having certain substituted-biphenylene or substituted-stilbene radicals is disclosed. The substituted radicals include substituents so as to confer a non-coplanar molecular configuration and a substantially cylindrical distribution of electron density about the long axis of the recurring units and the chain-extended polymers including such radicals.Molecularly oriented polymers of the invention exhibit optically uniaxial properties. The highly birefringent polymers are suited to application in optical filter and other devices where a refractive and birefringent material is desired.

Abstract: Copolymers of etherimides and amides have been found to be useful in the coating and molding arts.

Abstract: Copolymers of etherimides and amideimides have been found to be useful in the coating and molding arts.

Abstract: The products of the invention are partial acetylene end-capped oligomers which have the structure as shown in FIG. 3 in which terminal R" group is derived from a mixture consisting of about 14-40 mol % of an aromatic monoamine and the balance an acetylene substituted aromatic monoamine. The products are prepared from either of two (2) precursors. The first precursor has the structure shown in FIG. 2. The second precursor is a complex amine salt having the structure shown in FIG. 5.

Abstract: The products of the invention are end-capped polyimide oligomers prepared from a dianhydride of an aromatic tetracarboxylic acid such as 3,3'4',4'-benzophenonetetracarboxylic acid, an aromatic diamine, and a 1-(aminoaryl)-3-hydroxy-3-methyl-1-butyne. The structure of the polyimide oligomers is shown in FIG. 3.

Abstract: The products of the invention are acetylene end-capped polyimide oligomers prepared from a dianhydride of an aromatic tetracarboxylic such as 3,3', 4,4'-benzophenonetetracarboxylic acid, an aromatic diamine, and a propargyl ester of an amino-substituted aromatic acid such as aminobenzoic acid. The structure of the polyimide oligomers is shown in FIG. 3.

Abstract: The products of the invention are vinyl end-capped oligomers which have the structure as shown in FIG. 3. The products are prepared from either of two (2) precursors. The first precursor is a compound which has the structure as shown in FIG. 2. The second precursor is a complex amine salt which has the structure shown in FIG. 5.

Abstract: The products of the invention are acetylene end-capped polyimide oligomers prepared from a dianhydride of an aromatic tetracarboxylic acid such as 3,3',4,4' benzophenonetetracarboxylic acid, an aromatic triamine, and an acetylene-substituted aromatic monoamine. The structure of the polyimide oligomers is shown in FIG. 3.

Abstract: The products of the invention are end-capped polyimide oligomers prepared from a dianhydride of an aromatic tetracarboxylic acid such as 3,3'4,4'-benzophenonetetracarboxylic acid, an aromatic triamine, and a 1-(aminoaryl)-3-hydroxy-3-methyl-1-butyne. The structure of the polyimide oligomers is shown in FIG. 3.

Abstract: Acetylene end-capped polyimide oligomers are prepared by a process including the following sequential steps:1. Preparing an alkanol or ether solution containing substantially 1 molar equivalent of a dialkyl ester of an aromatic tetracarboxylic acid,2. Adding substantially 0.5 to 0.8 molar equivalent of an aromatic diamine to the solution of (1) to form a reaction product between the diacid and the diamine,3. Adding an aminoarylacetylene to the solution of (2) in a quantity sufficient to provide amine groups equivalent to the free carboxylic acid groups present in the product of (2).4. Heating the solution of (3) to vaporize the solvent therefrom, and5. Heating the product of (4) to convert the carboxylic acid groups, the ester groups, and the amino groups thereof to imide groups.The temperature in steps (2) and (3) is maintained below about 50.degree. C. The temperature in steps (4) and (5) is maintained below about 210.degree. C.

Abstract: The products of the invention are acetylene end-capped polyimide oligomers prepared from a dianhydride of an aromatic tetracarboxylic such as 3, 3', 4, 4'-benzophenonetetracarboxylic acid, an aromatic triamine, and a propargyl ester of an amino-substituted aromatic acid such as aminobenzoic acid. The structure of the polyimide oligomers is shown in FIG. 3.

Abstract: The present invention relates to polycondensates of the formula 10, their use for absorbing metal ions of the transition elements of the periodic system and their use for the preparation of polymers containing metals of formula 11 which have e.g. improved resistance to heat and to chemicals compared to the corresponding polycondensates of formula 10.

Abstract: An electrical insulating resin composition comprising a resin obtained by reacting (a) one or more tri- or higher polyhydric alcohols and/or tri- or higher polybasic acids, (b) one or more dihydric alcohols, (c) one or more dibasic acids, (d) one or more monobasic acids containing one or more aromatic rings in the molecule, and/or (e) one or more monohydric alcohols containing one or more aromatic rings in the molecule, and if desired (f) one or more compounds containing or being able to form one or more 5-membered imide rings, can give high solids varnishes without lowering the molecular weight of the resin produced. Said varnishes can give coating films excellent in heat resistance, flexibility and mechanical strengths.