Abstract: A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Abstract: A process for making polyetherimides involving reacting an aromatic bis(ether anhydride) with an organic diamine in the presence of a solvent so as to form a polyamide acid. The polyamide acid is thereafter polymerized in a solid state at a temperature below the glass transition temperature of the final polyetherimide.

Abstract: Aromatic or aliphatic dianhydrides and/or acid anhydrides are reacted with certain aromatic diamines alone or in combination with other diamines to produce polyimides, polyamide acids, poly(amide-imides), poly(amide-amide acids), poly(esterimides) or poly(esteramide acids). These polymers are thermoplastic in nature and have improved processing characteristics and thermal stability. The polymers may be prepared by either melt or solution polymerization techniques.

Abstract: The present invention provides a process for the production of random copolymers containing repeating polyimide units and repeating polyetherimide units. The process is a reverse addition process and utilizes at least two dianhydrides of varying reactivity.

Abstract: High molecular weight siloxane polyamic acids and polyimides are prepared by the reaction of dianhydrides with diamines in a polar aprotic solvent, all of the reagents and solvent being highly purified and substantially anhydrous. The polyamic acids may be coated on substrates and baked to form polyimide dielectric layers. When so used, they are free from certain disadvantages of lower molecular weight polymers, especially undercutting and scum formation during photolithography and etching procedures.

Abstract: A process for preparing polyamides which comprises polycondensing dicarboxylic acids having the following general formula and diamines by using carbodiimides as the condensing agent. ##STR1## wherein X is a group having a valence of (m+2), and C.sub.6-20 carbocyclic group, C.sub.3-20 heterocyclic group, C.sub.2-20 alkyl group, or C.sub.2-20 alkenyl group, the group having at least one carbon-carbon double bond in the position of conjugating to carboxylic acid radical or the group having an .alpha.,.beta.-unsaturated ketone structure;Y is --OR or --NRR' wherein R and R' each independently is C.sub.5-20 carbocyclic group, C.sub.1-20 heterocyclic group, C.sub.1-20 alkyl group or substituted group thereof having at least one substituent selected from the group consisting of --OW (wherein W is C.sub.1-12 alkyl group), C.sub.2-12 saturated acyl group, C.sub.2-12 saturated acyloxy group, C.sub.2-12 saturated acylamino group, C.sub.2-12 dialkylamino group, --SW (wherein W is the same as defined above), C.sub.

Abstract: Polypyromellitimide filaments having high strength and high modulus are obtained by dry-spinning a solution of polyamide-acid of polypyromellitic dianhydride, 3,4'-oxydianiline and paraphenylenediamine, substituted derivatives thereof or 4,4'-diaminobiphenyl or 4,4'-diaminobenzanilide, then converting the polyamide-acid to the polyimide and drawing.

Abstract: Homopolyimides and copolyimides of aromatic tetracarboxylic acids and aromatic diamines which are substituted in the two ortho-positions relative to at least one N atom by alkyl, alkoxy, alkoxyalkyl, cycloalkyl or aralkyl, are soluble in organic solvents and have increased glass transition temperatures and hence very good heat stabilities. Such polyimides, which contain radicals of a benzophenonetetracarboxylic acid, are radiation-sensitive and autophotocrosslinkable. The polyimides are suitable for the production of films, protective coatings and photographic relief images.

Abstract: A copolymer formed from an isoimide oligomer and another compound, such as an aryl sulfone, each of which has reactive functional terminal groups, such as ethylenic or acetylenic groups. The isoimide oligomer is soluble in the other compound, unreactive with the compound below a certain temperature and forms a liquid blend therewith. Upon heating the liquid blend above that certain temperature, the terminal groups on the isoimide oligomer and the other compound react with each other to form a copolymer. The liquid blends may be used to form encapsulants, coatings, films, and resin matrices for composites to provide resins with excellent high temperature properties.

Abstract: Novel fluoro-containing polyetherimides are prepared from bis ether dianhydrides, fluoro-containing dianhydrides, and organic diamines. The compolymers exhibit both increased Tg and increased solubility in halogenated solvents which enhances their value in a wide variety of uses including films, molding compounds, and coatings.

Abstract: A process for the manufacture of polyamides, polyamide-imides and polyimides which process comprises preparing a salt of an aliphatic or aromatic diamine or a mixture of these and di, tri or tetracarboxylic acid or mixture of these or their corresponding anhydride by reacting both feedstocks at a temperature of about 300.degree. to 500.degree. F. in a solvent medium provided the water content of the resulting solution is below 25% water by weight the resulting salt solution is subjected to a pressure of about 1500-3000 psig and is then passed through a preheat zone where the temperature is increased to about 625.degree. F., the total residence time is kept at about 25 to about 50 seconds. The reactants are flashed through a control valve or nozzle to give an aerosol mist at a pressure of about 0-400 psig, the polymerization is further carried out in a flash reactor with a high heat flux and with wall temperatures of about 600.degree. F. to about 1000.degree. F. and melt temperatures of about 500.degree. F.

Abstract: Methods of making water soluble polyimide resin compositions. A carboxy terminated bisimide is prepared by reacting a suitable aromatic dianhydride with a suitable oxoimine. The bisimide is then mixed with a sufficient quantity of a water soluble solvent to dissolve the bisimide. Water is added to make a solution of the desired viscosity. An aromatic diamine is added to this water solution. To the mixture is added a suitable quantity of a tertiary amine to stabilize the resin. The solution is coated onto a surface and dried to produce a smooth, flexible coating. The coating can then be heated to an appropriate temperature to produce a fully polymerized coating which is thermally stable and resistant to oils and solvents.

Abstract: A process for incorporating continuous graphite fiber reinforcement impregnated with polyamide-imide polymer onto injection molded polyamide-imide parts. These impregnated parts are useful as automotive parts such as push rods or rocker arms, and for aircraft parts such as fittings and secondary structural parts.

Abstract: Di-substituted maleic anhydride compounds are disclosed of the structural formula ##STR1## wherein R and R.sup.1 are selected from the group consisting of aliphatic and phenyl moieties, and R.sup.2 is a divalent aromatic moiety. Polyamide-imide polymers, polyimide polymers and vinyl copolymers derived therefrom are also disclosed.

Abstract: A polyamic acid copolymer forming a polyimide comprising, in mole percent, from greater than 5 percent to about 45 percent pyromellitic dianhydride, from about 5 percent to about 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline. Polyimides formed by curing the copolymer are also disclosed as is a process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry using the copolymer.

Abstract: A soluble polyimide derived from dehydration of a polyamic acid which is the liquid phase condensation reaction product of a solution in aprotic solvent of approximately equimolar amounts of aromatic dianhydride and aromatic diamine. At least 50 mole % of the dianhydride must have ring linkages which prevent conjugation between the rings and at least 20 mole % of the diamine must contain electron withdrawing groups.

Abstract: There is provided a siloxane-imide copolymer composition having at least one polymeric block with a low glass transition temperature and at least one polymeric block with a high glass transition temperature.

Abstract: An aromatic polyimide composition usable for producing shaped articles, for example, films, or as varnish, lacquer, or bonding agent, comprises a high molecular weight aromatic polyimide resin which is a polycondensation-imidization product of an aromatic tetracarboxylic acid component comprising 50 molar % or more of 3,4,3',4'-biphenyltetracarboxylic acid, anhydride, salt, or ester with an aromatic diamine component including 50 molar % or more of 4,4'-diaminodiphenylether, and which is dissolved in a mixed solvent consisting essentially of 10% by weight or more of a first solvent component selected from naphthol and resorcin and the balance of a second solvent component selected from phenol and cresols.

Abstract: An organic solvent-soluble photosensitive polyimide resin having excellent heat resistance and electrical and mechanical properties, comprising a copolycondensation product of a biphenyltetracarboxylic acid component with an aromatic diamine component consisting of 40 to 90 molar % of a diamine compound of the formula (I) and 10 to 60 molar % of a diaminodiphenylether compound of the formula (II), ##STR1## wherein X=--CO--O-- or --CH.sub.2 --O--, R.sub.1 and R.sub.2 =an organic residue having an ethylenically unsaturated radical, and R.sub.3 =H or --NHCOR.sub.2.

Abstract: A process for the synthesis of the photosensitive polyamic acid derivatives which are polyimide precursors, comprising the sequential steps:(1) Partially derivatizing an aromatic dianhydride with a reactive monomer containing a photosensitive moiety;(2) Condensation polymerizing the partially derivatized aromatic dianhydride with aromatic diamine to form polyamic acid;(3) Isoimidization of the polyamic acid;(4) Condensation of the polyisoimide to polyamic acid derivative by reaction with additional reactive monomer; and(5) Separation of the polyamic acid derivative.

Abstract: Aromatic polyimides with various functional end-groups such as --CH.dbd.CH.sub.2, --C.tbd.CH, --CN and --CHO are chain-extended (molecular weight increased) by reacting the functional groups with aromatic bis-dipoles. A representative bis-dipole is 1,4-benzene-dinitrile oxide. These polyimides can be shaped and formed prior to chain extending.The aromatic polyimides appropriate for chain-extending are formed by the reaction of aromatic dianhydrides, aromatic amines and monoamines which contain the functional groups.

Abstract: Cyclic dianhydrides and polyimides are prepared from maleic anhydride compounds and diolefins. The diolefins are alpha- , omega-linear diolefins of up to 100 carbon atoms or cyclic diolefins of up to 40 carbon atoms. The polyimides and copolyimides prepared from these cyclic dianhydrides are useful in films, fibers and coatings.

Abstract: Novel compositions comprising a high concentration of one or more extended chain homopolymer, copolymer, or block polymer and certain polyphosphoric acids are prepared. Such compositions are optically anisotropic (liquid crystalline), capable of exhibiting excellent cohesive strength, and are especially suited to the production of high molecular weight ordered polymer fibers by dry-jet wet spinning. These liquid crystalline compositions are capable of being drawn through long air gap distances and spun at exceptionally high spin draw ratios. Fibers, films and other articles formed from these liquid crystalline compositions exhibit exceptionally high physical and heat resistant properties.

Abstract: Disclosed is a polyimide film consisting essentially of 2,2'-dichloro-4,4'-biphenylene pyromellitimide units. This film has high tensile characteristics and excellent heat resistance.

Abstract: A one-step solution technique for preparing an aromatic polyimide acid which comprises reacting an aromatic dianhydride with an aromatic diamine in the presence of propylene glycol methyl ether.

Abstract: A process for producing a polyimide precursor having excellent adhesion property and improved moisture resistance by polymerization of an organic tetracarboxylic acid component and a diamine is disclosed. A portion of the organic tetracarboxylic acid is reacted with an aminosilane compound in which H in an amino group is substituted with a monovalent organic group containing a hydrophobic aromatic ring, to produce a silane-modified polycarboxylic acid component and the resulting silane-modified polycarboxylic acid component is polymerized with a diamine together with the residual organic tetracarboxylic acid component.

Abstract: Processes for forming a class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction are provided. These oligomers are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deleterious gases. The process for forming these oligomers includes the formation of a polyamic acid and dehydration thereof under specified conditions to effect cyclization of the polyamic acid to form the isoimide-containing oligomer, without the formation of undesired side-reaction products.

Abstract: A class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction are provided. These oligomers are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deleterious gases. The oligomers of the present invention may be formed by reacting an aromatic dianhydride with an aromatic diamine, followed by reaction with a monoanhydride. The resulting product is dehydrated to form the isoimide-containing oligomer.

Abstract: Novel carbinol-containing polyimides capable of self-crosslinking at low temperatures are prepared by reacting a molar excess of selected 3,3',4,4'-benzhydrol tetracarboxylic acid compounds (the tetraacid, diester-diacid, or (dianhydride) with polyfunctional polyamines (e.g. 4,4'-methylenedianiline, 1,6-hexanediamine, etc.) in an inert organic solvent at about 100.degree.-150.degree. C. The molar ratio of tetracarboxylic acid compound to diamine must be between 2:1 and 9:8. The polyimides may be crosslinked at less than 200.degree. C. via a reaction between the carbinol group(s) and the end group(s) of the polyimide.

Abstract: A class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction are provided. These oligomers are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deleterious gases. The oligomers of the present invention may be formed by reacting an aromatic dianhydride with an aromatic diamine, followed by reaction with a functional mono-amine. The resulting product is then dehydrated to form the isoimide-containing oligomer.

Abstract: Polyamideimides are prepared by first reacting a diamine, preferably an aromatic diamine, with a carboxy anhydride such as trimellitic anhydride and a dianhydride such as bisphenol A dianhydride; and then reacting mixtures of the resulting prepolymers and dicarboxylic acid, or functional derivatives thereof, with a diisocyanate or diamine, preferably an aromatic diisocyanate.

Abstract: An aromatic polyimide film having excellent mechanical, thermal and electrical properties, is continuously produced by the steps of:preparing a dope solution having a rotation viscosity of 500-10.sup.5 poises at 100.degree. C. by uniformly dissolving aromatic polyimide in a solvent consisting of at least one phenol compound; extruding the dope solution through a T-die at 50.degree. C. or more, but at least 30.degree. C. below the boiling point of the solvent, under conditions which cause the apparent viscosity and shear stress of the dope solution to be 500-5.times.10.sup.4 poises and 10.sup.4 -10.sup.6 dyne.multidot.cm.sup.-2, respectively, to form a filmy stream of the dope solution; placing the filmy stream of the dope solution on a surface of a supporting means while heating the surface at a temperature of 50.degree. C.

Abstract: Cationic heat-hardenable binders comprising polymers containing amine groups and a crosslinking component which is film-forming with the amine group containing polymer through transesterification at elevated temperatures are described. The binders which are water-dilutable upon protonization of the amine groups comprise(a) 60 to 95% by weight of a polymer having a hydroxyl value of from 40 to 450 mg KOH/g and an amine value of from 20 to 150 mg KOH/g, water-soluble or water-dilutable upon protonation of the basic groups, and(b) 5 to 40% by weight of a cross-linking component of the general formula ##STR1## n having a value of from 1 through 5, R.sub.1 being the moiety of a monoalcohol having from 1 to 8 C-atoms or of a polyol or of a polyamine or of a polyepoxy compound or of a polyisocyanate remaining after reaction with one or more carboxylic acid groups, andR.sub.2 being a straight chain or branched alkyl radical with from 1 to 8 C-atoms.

Abstract: A polyamide acid composition for preparing a polyimide which can extend the pot life of the composition comprising a solution of a polyamide acid in an organic solvent, the polyamide acid being a precursor of the polyimide, a dehydrating agent, a catalyst and a pot life extending agent which can lower a rate of conversion of the polyamide acid to the polyimide, and the process for preparing the polyimide from said polyamide acid composition. According to the present invention the pot life can be extremely extended to give the composition an enough flowability for a long time without reducing the excellent properties such as a heat resistance and an electric insulation of the obtained polyimide.

Abstract: Polyamide acid obtained by reacting 2,3,5-tricarboxycyclopentane-acetic acid and a diamine in a solvent has a high stability in the form of a solution, has a high workability and is excellent in storage stability. Polyimide obtained by heating said polyamide acid is excellent in heat resistance, mechanical properties, electrical properties and chemical resistance.

Abstract: Novel copolymers and molding compositions are prepared from acyl halide derivatives of dicarboxylic acids, acyl halide derivatives of tricarboxylic aromatic anhydrides and aromatic diamines and about 1 to about 10 percent by weight of phthalic anhydride moieties. Also, glass filled copolymers are prepared. The copolymers are useful as engineering plastics.

Abstract: In a process for producing an aromatic polyamide-imide by polycondensation of an aromatic tricarboxylic acid and/or aromatic tricarboxylic anhydride and an aromatic diamine with heating in the presence of a dehydration catalyst, the improvement which comprises using a solvent containing sulfolane as a reaction medium.

Abstract: Injection moldable homopolymers, copolymers, and terpolymers are prepared from fully or partially acylated aromatic diamines, aliphatic diamines or a mixture of these and aromatic tricarboxylic anhydride compounds or mixtures of tricarboxylic anhydrides and dicarboxylic acids. These polymers are improved by the addition of calcium moieties such as oxide, calcium acetate and calcium hydroxide. These polymers are useful for the preparation of injection molded articles.

Abstract: Polyetherimides are formed by the blending of a first melt of organic dianhydride and a second melt of organic diamine and the resulting blend is polymerized in a continuous, steady state manner, employing an extruder reactor as the reaction chamber. The extruder reactor is provided with means for heating, evacuation of water of reaction, and transfer sections in order to achieve the steady state necessary for continuous production of a substantially uniform polyimide.

Abstract: Polyetherimides are formed by the dry blending of organodianhydride, organic diamine, and chain stopper and the polymerization of the dry-blended mixture in a continuous, steady state reaction, employing an extruder reactor as the reaction chamber. The extruder reactor is provided with means for heating and cooling, evacuation of water of reaction, and material conveyance means in order to achieve a steady state necessary for continuous production of a uniform polymeric product.

Abstract: A copolyamide acid comprising repeating units represented by the general formulas: ##STR1## in which the repeating unit (A) and the repeating unit (B) are present in a molar ratio from 20:80 to 80:20, and which has a logarithmic viscosity number (.eta..sub.inh) of 0.5 dl/g--10 dl/g measured in N,N-dimethylformamide at a concentration of 0.5 g/dl and at a temperature of 30.degree. C. and a copolyimide comprising repeating units represented by the general formulas: ##STR2## in which the repeating unit (C) and the repeating unit (D) are present in a molar ratio from 20:80 to 80:20 and which has a logarithmic viscosity number (.eta..sub.inh) of o.5 dl/g--10 dl/g measured in 97% concentrated sulfuric acid at a concentration of 0.5 g/dl and at a temperature of 30.degree. C.

Abstract: A class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction. The oligomers of the present invention are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deletrious gases.

Abstract: Novel glass and graphite filled copolyimides and polyimides useful as engineering plastics are prepared. Also fibers and oriented fibers from the copolyimides and polyimides derived from tetramethylcyclobutane 1,2,3,4-tetracarboxylic dianhydride and diamines are disclosed.

Abstract: A process for extrusion molding a polyamidoimide resin comprising: feeding a polyamidoimide molding material in a granular solid or powder form into an extruder; then simultaneously compressing and melting the polyamidoimide molding material under a pressure of about 300 kg/cm.sup.2 or more by heating it to a temperature between the melting point and the decomposition temperature of the polyamidoimide resin; and next introducing the molten polyamidoimide molding material into a die such that the molten material is shaped to a desired form, solidified in the die, and is extruded from the die in a solidified form.

Abstract: Novel polyetherimides containing sulfone units such as those derived from bis(3,4-dicarboxyphenyl) sulfone dianhydride, as well as units derived from an ether anhydride such as 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, may be prepared by the reaction of a mixture of said dianhydrides with diamines such as m-phenylene diamine. The polyetherimides have high thermal stability and solvent resistance.

Abstract: Polyetherimides are formed by the dry blending of organodianhydride, organic diamine, and chain stopper and the polymerization of the dry-blended mixture in a continuous, steady state reaction, employing an extruder reactor as the reaction chamber. The extruder reactor is provided with means for heating and cooling, evacuation of water of reaction, and material conveyance means in order to achieve a steady state necessary for continuous production of a uniform polymeric product.

Abstract: Novel polyimides and polyimides-amides, and molding compositions are prepared from novel dianhydrides such as tricyclo[6.4.0.0.sup.2,7 ] dodecane-3,6-diphenyl-1,8,4,5-tetracarboxylic acid dianhydride and tricyclo [6.4.0.0.sup.2,7 ] dodecane-1,8,4,5-tetracarboxylic acid dianhydride, dicarboxylic acids and diamines. The novel polyimides and polyimides-amides are useful as engineering plastics.

Abstract: A polyimide powder particularly suitable for the production of moldings by high pressure sintering is prepared by mixing a solution of an aromatic polyimido-acid, obtained by a conventional process and having an intrinsic viscosity of 1.5 to 2.5 dl/g, in an aprotic dipolar organic solvent, with a water-entraining agent, heating the mixture to the boiling point of the entraining agent, azeotropically distilling off the water formed, filtering off the polyimide powder which precipitates, washing it if appropriate, and drying it.

Abstract: This invention relates to copolyimides-polyamides prepared from mixtures of tetramethylcyclobutane-1,2,3,4-tetracarboxylic dianhydride (TMCDA), aromatic or aliphatic dianhydrides, and dicarboxylic acids or their esters or acid chlorides. These dianhydride-dicarboxylic acid mixtures are then reacted with aliphatic or aromatic diamines. These novel copolyimides-polyamides are useful in the preparation of molded articles, fibers, films, laminates and coatings.

Abstract: Novel polyimide-amide polymers and copolymers and molding compositions are prepared from tetramethylcyclobutane-1,2,3,4-tetracarboxylic dianhydride, dicarboxylic acids and mixtures of diamines. Also glass and graphite filled polymers are prepared. The polyimide-polyamide polymers and copolymers are useful as engineering plastics.