Two Or More Polycarboxylic Acids Or Derivatives Or Mixtures Thereof Patents (Class 528/189)
-
Patent number: 10854525Abstract: A method for densifying thermoplastics, particularly polyimides, for use in conjunction with electronic circuits while producing improved physical properties and a high degree of crystallinity, involves variable frequency microwave (VFM) processing at temperatures typically 100° C. below the glass transition temperature or lower, for times of about 50 to 100 minutes. It is particularly applicable to polymers based on BPDA-PPD, but may also be generally applied to other intentionally designed polyimide structures with the same features. The invention enables the creation of layered structures involving integrated circuits with small feature sizes and overcoatings of polymers with high Tg and other desirable properties.Type: GrantFiled: January 14, 2019Date of Patent: December 1, 2020Assignee: APPLIED MATERIALS, INC.Inventor: Robert L. Hubbard
-
Publication number: 20140135447Abstract: Reactive extrusion can be used in a continuous, solvent-less preparation of imide oligomers involving two competing reactions among three ingredients, the first reaction between a dianhydride and a diamine and the second reaction between an endcap and the diamine. The imide oligomer can form a composite via conventional production methods or via formation of a film from imide oligomer re-melted in an extruder before being impregnated into tape or fabric.Type: ApplicationFiled: July 3, 2012Publication date: May 15, 2014Applicant: POLYONE CORPORATIONInventors: Joseph C. Golba, Thomas W. Hughes, Roger W. Avakian
-
Patent number: 7989578Abstract: The present invention relates to a negative photosensitive polyimide polymer having a repeating unit of formula (1) as a polymerized unit: wherein G, Q and P* are as defined in the specification. The polyimide polymer of the present invention is developable in an aqueous alkaline solution, and has the properties associated with an insulating layer and photoresist.Type: GrantFiled: October 30, 2007Date of Patent: August 2, 2011Assignee: Eternal Chemical Co., Ltd.Inventor: Chung-Jen Wu
-
Publication number: 20100305295Abstract: Disclosed is a process for producing a polyamic acid solution by reacting a diamine component consisting essentially of 20 mol % to 80 mol % of p-phenylenediamine and 80 mol % to 20 mol % of diaminodiphenyl ether with a tetracarboxylic acid component consisting essentially of 10 mol % to 60 mol % of 2,3,3?,4?-biphenyltetracarboxylic dianhydride and 90 mol % to 40 mol % of 3,3?,4,4?-biphenyltetracarboxylic dianhydride in a solvent, comprising: a first step in which a diamine component is reacted with a molar excess of a tetracarboxylic acid component in a solvent containing more than ? mole of water per mole of the tetracarboxylic acid component, whereby preparing a polyamic acid solution; and a second step in which a diamine component, or a diamine component and a tetracarboxylic acid component are added to the polyamic acid solution obtained in the first step so that the molar amount of the diamine component is substantially equal to the molar amount of the tetracarboxylic acid component, and then the diaminType: ApplicationFiled: December 1, 2008Publication date: December 2, 2010Applicant: UBE INDUSTRIES, LTD.Inventors: Takeshige Nakayama, Seiichirou Takabayashi, Tooru Murakami
-
Patent number: 7794706Abstract: The present invention provides wound dressings, optionally surgically implantable, containing biodegradable, polymers and hydrogels having allogenic or autologous precursor cells, such as stem cells and progenitor cells dispersed within. Alternatively, the wound dressings can have conditioned medium obtained from the precursor cells dispersed within. The wound dressings promote tissue restoration processes at a site of application or implantation. Additional bioactive agents can also be dispersed within the polymer/hydrogel matrix, which can be formulated to biodegrade at a controlled rate by adjusting the composition. Methods are also provided for using such biodegradable wound dressings as a delivery device or carrier for the precursor cells, conditioned medium and bioactive agents, or as coatings on implantable medical devices, to promote tissue restoration at a lesion site.Type: GrantFiled: April 26, 2007Date of Patent: September 14, 2010Assignee: Medivas, LLCInventors: Kenneth W. Carpenter, William G. Turnell, Kristin M. DeFife, Kathryn A. Grako, Ramaz Katsarava
-
Patent number: 7408018Abstract: The invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers are based on ?-amino acids and possess physical, chemical and biodegradation properties that render them suitable for use in the human body. The polymers are useful as carriers of drugs or other bioactive substances. The polymers can also be linked, intermixed, or a combination thereof, to one or more drugs. Additionally, the polymers can be used to coat stents, for example, to suppress restenosis. Furthermore, the biodegradation of the copolyester amides and copolyester urethanes allows for the delivery of essential ?-amino acids to sites in the body, for example, to facilitate wound repair of injured tissues.Type: GrantFiled: October 5, 2006Date of Patent: August 5, 2008Assignee: Cornell Research Foundation, Inc.Inventors: Chih-Chang Chu, Ramaz Katsarava
-
Patent number: 7304122Abstract: The present invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers that are based on ?-amino acids and possess suitable physical, chemical and biodegradation properties. The polymers are useful as carriers of drugs or other bioactive substances. The polymers can be linked, intermixed, or a combination thereof, to one or more drugs.Type: GrantFiled: August 30, 2001Date of Patent: December 4, 2007Assignee: Cornell Research Foundation, Inc.Inventors: Chih-Chang Chu, Ramaz Katsarava
-
Patent number: 6984711Abstract: A method of production of a cyclic polysulfide having the formula (I): wherein x is an integer of 2 to 6, n is an integer of 1 to 15, and R indicates a substituted or unsubstituted C2 to C18 alkylene group or a substituted or unsubstituted C2 to C18 alkylene group including an oxyalkylene group comprising: reacting a dihalogen compound of the formula X—R—X wherein, X independently indicates a halogen atom, and R indicates a substituted or unsubstituted C2 to C18 alkylene group or a substituted or unsubstituted C2 to C18 alkylene group including an oxyalkylene group and an alkali metal polysulfide of the formula M2Sx wherein, M is an alkali metal and x is an integer of 2 to 6, by a two-phase system in an incompatible mixed solvent of a hydrophilic and lypophilic solvent.Type: GrantFiled: November 27, 2001Date of Patent: January 10, 2006Assignee: The Yokohama Rubber Co., Ltd.Inventors: Choi Wonmun, Kazunori Ishikawa
-
Patent number: 6864348Abstract: Polyetherpolyamide elastomer showing a low water absorption, a high stress relaxation, and a high elastic recovery percentage of elongation is obtainable by polymerizing an aminocarboxylic acid compound and/or a lactam compound, a triblock polyetherdiamine compound having the following formula, and a dicarboxylic acid compound: [x is a value of 1 to 20, y is a value of 4 to 50, z is a value of 1 to 20].Type: GrantFiled: November 27, 2002Date of Patent: March 8, 2005Assignee: UBE Industries, Ltd.Inventors: Hiroshi Okushita, Tadao Muramatsu, Teruaki Fujii
-
Patent number: 6828408Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.Type: GrantFiled: September 5, 2002Date of Patent: December 7, 2004Assignee: Sumitomo Chemical Company, LimitedInventors: Satoshi Okamoto, Manabu Hirakawa
-
Patent number: 6762277Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation. The method for manufacturing N-carboxyamino acid anhydride comprising reacting &agr;-amino acid with di-tert-butyltricarbonate. The method for manufacturing polyamino acid comprising decarboxylating the N-carboxyamino acid anhydride obtained by reacting &agr;-amino acid with di-tert-butyltricarbonate.Type: GrantFiled: April 26, 2002Date of Patent: July 13, 2004Assignee: JSR CorporationInventors: Hiroto Kudoh, Takeshi Endoh
-
Patent number: 6649730Abstract: The object of the present invention is to provide an aromatic polyester amide which has improved mechanical strength and high elastic modulus after being molded into a thin wall article as well as exhibits excellent heat stability and moldability. The present invention provides an aromatic polyester amide comprising the following repeating units (a)-(d): [wherein n in (c) represents 0 or 1] wherein (a) is from 2 to 20 mole %, (b) is from 30 to 65 mole %, (c) is from 15 to 35 mole % and (d) is from 15 to 30 mole % provided that the sum of (a) to (d) is 100 mole %.Type: GrantFiled: September 23, 2002Date of Patent: November 18, 2003Assignee: Sumitomo Chemical Company, LimitedInventors: Satoshi Okamoto, Tomohiro Sato, Manabu Hirakawa
-
Patent number: 6610815Abstract: Disclosed is a polyamide ester which comprises a plurality of specific amide ester recurring units including, in a specific ratio, recurring units containing a tetravalent benzene group and recurring units containing a tetravalent diphenyl ether group, and which is adapted to be converted to a polyimide in a coating form by heat-curing, wherein the polyimide coating exhibits a residual stress of 33 MPa or less as measured with respect to a 10 &mgr;m-thick polyimide coating formed on a silicon substrate. Also disclosed is a polyamide ester composition comprising a plurality of different polyamide esters, wherein the plurality of different polyamide esters collectively contain, in a specific ratio, the recurring units containing a tetravalent benzene group and the recurring units containing a tetravalent diphenyl ether group.Type: GrantFiled: June 21, 2001Date of Patent: August 26, 2003Assignee: Asahi Kasei Kabushiki KaishaInventors: Keiko Hata, Yoko Tanizaki, Yoshio Matsuoka
-
Patent number: 6586561Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.Type: GrantFiled: February 18, 2000Date of Patent: July 1, 2003Assignee: Case Western Reserve UniversityInventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
-
Patent number: 6586555Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.Type: GrantFiled: September 12, 2001Date of Patent: July 1, 2003Assignee: Japan Science and Technology CorporationInventors: Kazuaki Ishihara, Hisashi Yamamoto
-
Patent number: 6503538Abstract: The present invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers that are based on &agr;-amino acids and possess suitable physical, chemical and biodegradation properties. The polymers are useful as carriers of drugs or other bioactive substances.Type: GrantFiled: August 30, 2000Date of Patent: January 7, 2003Assignee: Cornell Research Foundation, Inc.Inventors: Chih-Chang Chu, Ramaz Katsarava
-
Patent number: 6498226Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.Type: GrantFiled: May 3, 2001Date of Patent: December 24, 2002Assignee: Industrial Technology Research InstituteInventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
-
Publication number: 20020188095Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation.Type: ApplicationFiled: April 26, 2002Publication date: December 12, 2002Applicant: JSR CORPORATIONInventors: Hiroto Kudoh, Takeshi Endoh
-
Publication number: 20020037992Abstract: Bush 1 comprises back metal layer 2 made from a steel plate and porous sintered metal layer 4 made from copper, provided on the surface of back metal layer 2 through copper plating layer 3 and impregnated and coated with sliding material 5 within and on the surface of porous sintered metal layer 4, where sliding material 5 comprises PTFE as the main component (not less than 50 vol. % of the entire material), 3-40 vol. % of Bi particles and/or Bi alloy particles, 1-40 vol. % of injection moldable fluororesin such as PFA, etc., 0.1-20 vol. % of hard particles such a W, Al2O3, etc., and 0.1-20 vol. % of a solid lubricant such as graphite, etc. The sliding material based on PTFE as the main component is free from lead and can further improve the wear resistance, while maintaining good sliding characteristics.Type: ApplicationFiled: July 27, 2001Publication date: March 28, 2002Applicant: DAIDO METAL COMPANYInventors: Takahiro Niwa, Hideki Iwata, Nobutaka Hiramatsu, Takayuki Shibayama
-
Patent number: 6291122Abstract: A branched polyester resin of the Formula wherein n and m represent randomly repeating segments, and the number of n and m segments in the polymer backbone are each of from about 10 to about 10,000; X is an alkylene group, an olefinic group, or an arylene; Y is an organic dioxy group or radical of I, II, or mixtures thereof; Z is an organic trioxy radical of III, IV, or mixtures thereof; and wherein R and R1 is a hydrogen atom or an alkyl group; G is an alkylene or arylene group, and a is 0 or 1.Type: GrantFiled: September 14, 2000Date of Patent: September 18, 2001Assignee: Xerox CorporationInventors: Guerino G. Sacripante, Alan E. J. Toth, Marko D. Saban
-
Patent number: 6180747Abstract: A branched polyester resin of the Formula wherein n and m represent randomly repeating segments, and the number of n and m segments in the polymer backbone are each of from about 10 to about 10,000; X is an alkylene group, an olefinic group, or an arylene; Y is an organic dioxy group or radical of I, II, or mixtures thereof; Z is an organic trioxy radical of III, IV, or mixtures thereof; and wherein R and R1 is a hydrogen atom or an alkyl group; G is an alkylene or arylene group, and a is 0 or 1.Type: GrantFiled: February 28, 2000Date of Patent: January 30, 2001Assignee: Xerox CorporationInventors: Guerino G. Sacripante, Alan E. J. Toth, Marko D. Saban
-
Patent number: 6132884Abstract: Process for producing highly stretchable, amorphous anisotropic melt-forming polymers having recurring units derived from p-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, at least one aromatic diacid and an aromatic diol and/or hydroxyamine component, at least a portion of which is 4,4'-biphenol, which comprises incorporating into such polymers recurring units derived from resorcinol and at least one additional monomer that provides the resulting polymer with selected meta linkages, wherein each of said recurring units is present in the polymer in specified amounts.Type: GrantFiled: January 14, 2000Date of Patent: October 17, 2000Assignee: Ticona LLCInventors: H. Clay Linstid, III, Dominick L. Cangiano, Ronald N. DeMartino, James E. Kuder, Vincent J. Provino
-
Patent number: 6063465Abstract: A polyester container made from a polymer having ethylene glycol moieties, isosorbide moieties and terepthaloyl moieties, and the method of making the container is described. The polyester container is suitable for holding liquids and solids, and may be hot-filled or cold-filled. In particular, wide-mouth jars and narrow-necked bottles may be formed. The polyester has an inherent viscosity of at least 0.35 dL/g when measured as a 1% (weight/volume) solution of the polyester in o-chlorophenol at a temperature of 25.degree. C.Type: GrantFiled: April 23, 1998Date of Patent: May 16, 2000Assignee: HNA Holdings, Inc.Inventors: Larry F. Charbonneau, Robert E. Johnson
-
Patent number: 5948881Abstract: Curative compositions of amine terminated polyamide resins blended with a deaminated bis-(p-aminocyclohexyl)methane composition (DeAms) are useful for curing adhesive epoxy resin compositions. The polyamides comprise combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines which are piperazine or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. DeAms is blended at 2 to 40 wt % based on polyamide. Adhesive compositions comprising these curatives are also disclosed.Type: GrantFiled: December 4, 1997Date of Patent: September 7, 1999Assignee: Air Products and Chemicals, Inc.Inventors: Dilipkumar Nandlal Shah, William Edward Starner
-
Patent number: 5783655Abstract: A process for the preparation of aromatic polyamide pulp having both excellent physical properties and a high degree of polymerization by continuous polymerization and orientation by using of mixed solutions. The solutions are prepared by reacting diamine with aromatic diacid dichloride in an amide and/or urea-based polymerization solvent containing inorganic salts, or a mixture of inorganic salts and a Lewis acid compound. The process can be practiced by polymerization-orientation apparatus located on the continuous transferable polymerization-orientation means comprised of a belt and one or more stirring bars.Type: GrantFiled: June 5, 1995Date of Patent: July 21, 1998Assignee: Kolon Industries, Inc.Inventors: Du Hyun Kim, Seock Chul Ryu, Won Jun Choe, Young Hwan Park, Chang Seop Ji
-
Patent number: 5780556Abstract: The present invention provides an amino curable polyester oligomer composition having low viscosity and a narrow molecular weight distribution comprising one or a mixture of oligomers (a) and (b): ##STR1## wherein R is the residue of at least one aliphatic, cycloaliphatic or mixed aliphatic/aromatic polycarboxylic-acid having from 2 to about 20 carbon atoms, R.sub.1 is the residue of at least one aliphatic, cycloaliphatic or mixed aliphatic/cycloaliphatic polyol having from 2 to about 20 carbon atoms, A is a radical of the formula: ##STR2## B is a radical of the formula: ##STR3## wherein R.sub.4 is H, OH, halogen or an organic radical containing 1 to 4 carbon atoms, R.sub.5 is a direct bond or an organic radical containing 1 to 20 carbon atoms and R.sub.6 is an organic radical containing 2 to 20 carbon atoms, n is a number averaging from greater than 0 up to less than 2 and p is a number averaging from about 0.Type: GrantFiled: June 7, 1995Date of Patent: July 14, 1998Assignee: Exxon Chemical Patents IncInventors: Albert Ilya Yezrielev, Konstantinos R. Rigopoulos, Vijay Swarup
-
Patent number: 5714572Abstract: The present invention provides a polyimide resin composition comprising:(a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.Type: GrantFiled: October 23, 1996Date of Patent: February 3, 1998Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Hideto Kato
-
Patent number: 5569738Abstract: This invention relates to melt processable copolymer of etherimideimide/etherimide herein-after identified as PEII/PEI copolymer of following structural formula(I). ##STR1## wherein, R and R' are independently selected from the groups of ##STR2## Ar and Ar' are independently selected from the groups of ##STR3## (wherein, R1 is H or C1-C6 alkyl group,R2 is II or C1-C4 alkyl group, andR3 is --O--, --CO--, --SO--, --SO2--.); andn and m are independently an integer between 5 and 500.Type: GrantFiled: March 14, 1995Date of Patent: October 29, 1996Assignees: Korea Research Institute of Chemical Technology, Cheil Industries, Inc.Inventors: Kil Y. Choi, Jong C. Won, Young T. Hong, Sang S. Woo, Youn S. Don
-
Patent number: 5494964Abstract: Polyester resins suitable as binders for electrophotographic toners and for acceptor layers for the thermal diffusion printing process based on hydroxyl-containing prepolymers of olefinically unsaturated monomers obtained by(1) polymerization of a mixture of(a) from 60 to 90% by weight of styrene or of a styrene derivative,(b) from 0 to 40% by weight of one or more C.sub.1 -C.sub.Type: GrantFiled: September 30, 1994Date of Patent: February 27, 1996Assignee: BASF AktiengesellschaftInventors: Georg Meichsner, Thomas Wuensch, Rainer Dyllick-Brenzinger
-
Patent number: 5405695Abstract: Disclosed herein are poly(phenylene sulfide) fibers having a tensile strength of at least 3.5 g/d, a knot tenacity of at least 2 g/d, a loop tenacity of at least 3.5 g/d, the number of abrasion cycles until breaking in a flexing abrasion test of at least 3,000 times, and the number of repeated flexings until breaking in a flexural fatigue test of at least 150 times. A process for the production of poly(phenylene sulfide) fibers, which comprises melt-spinning a poly(phenylene sulfide), stretching the resultant unstretched filaments at a draw ratio of 2:1 to 7:1 within a temperature range of 80.degree.-260.degree. C., and heat-treating the stretched filaments for 0.1-30 seconds under conditions of a take-up ratio of 0.8:1 to 1.35:1 in a dry heat atmosphere exceeding 285.degree. C., but not exceeding 385.degree. C. is also disclosed.Type: GrantFiled: October 20, 1992Date of Patent: April 11, 1995Assignee: Kureha Kagaku Kogyo K.K.Inventors: Masamichi Akatsu, Eisho Nakano, Hiroyuki Endo, Keiji Sonoda
-
Patent number: 5380590Abstract: A water-dispersible aromatic polyester comprising a dicarboxylic acid component and a glycol component, wherein (A) at least 95 mol% of the dicarboxylic acid component is composed of an aromatic dicarboxylic acid component containing 30 to 99.5 mol% of a 2,6-naphthalenedicarboxylic acid component and at least 0.005 mol% to less than 5 mol% of an aromatic dicarboxylic acid component having a sulfonic acid salt group, and (B) at least 95 mol% of the glycol component is composed of an ethylene glycol component and a component from a propylene oxide adduce of bisphenol A, the molar ratio of the ethylene glycol component:the component of a propylene oxide adduct of bisphenol A being 40-99:60-1; and a fast-adhesion polyester film comprising a polyester film and a coating which contains the above water-dispersible aromatic polyester and is formed on at least one surface of the polyester film.Type: GrantFiled: March 4, 1994Date of Patent: January 10, 1995Assignee: Teijin LimitedInventors: Tomoki Nakamura, Tetsuo Ichihashi, Masayuki Fukuda
-
Patent number: 5304626Abstract: A chemical resistant copolymer useful in electronic applications, said copolymer is a polyimide containing a 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moiety, at least one other dianhydride moiety, and at least one diamine.Type: GrantFiled: September 13, 1991Date of Patent: April 19, 1994Assignee: Amoco CorporationInventors: Marvin J. Burgess, Douglas E. Fjare, Herbert J. Neuhaus
-
Patent number: 5290909Abstract: A polyimide composition for use in making polyimide/copper foil laminate that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an adhesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced.Type: GrantFiled: May 28, 1993Date of Patent: March 1, 1994Assignee: Industrial Technology Research InstituteInventors: Han L. Chen, Syh-Ming Ho, Tsung H. Wang, Jing-Pin Pan
-
Patent number: 5250652Abstract: The invention is concerned with novel water-dispersible copolymers which contain at least one UVA light-absorbing monomer, one UVB light-absorbing monomer, one hydrophilic monomer, and optionally one hydrophobic monomer component. The UVA light-absorbing monomer absorbs at .lambda.max ultraviolet light in the 320-400 nm range. The UVB light-absorbing monomer absorbs at max ultraviolet light in the 290-320 nm range. Because of the R.sub.3 group used in the invention, the copolymers of the invention permit higher loading of UV monomers than previously obtainable.Type: GrantFiled: July 30, 1992Date of Patent: October 5, 1993Assignee: Lever Brothers Company, Division of Conopco, Inc.Inventors: Matthew E. Langer, Ferial Khorshahi
-
Patent number: 5248760Abstract: The invention comprises curing polyamic acid solutions into polyimide solutions by adding a hydrophilic reagent to a polyamic acid solution. The hydrophilic reagent is selected to have little or no reactivity with amines or carboxylic acids, and is of the type that will react with water to form by-products that shift the equilibrium between polyamic acid as a reactant and polyimide and water as products toward the production of polyimide.Type: GrantFiled: January 25, 1991Date of Patent: September 28, 1993Assignees: UNC at Charlotte, MCNCInventors: Thomas D. DuBois, Farid M. Tranjan, Stephen M. Bobbio
-
Patent number: 5239049Abstract: Poly(dianhydride) compounds having formulae (I) and (II): ##STR1## where m is 0 to 50. ##STR2## wherein n is 0 to 20 and X is bond junction, oxygen atom, sulfur atom, SO.sub.2, C(CF.sub.3), CO, C(CH.sub.3).sub.2, CF.sub.2 --O--CF.sub.2, CH.sub.2, and CHOH.Type: GrantFiled: November 23, 1992Date of Patent: August 24, 1993Assignee: Olin CorporationInventors: Bruce A. Marien, Keith O. Wilbourn
-
Patent number: 5233018Abstract: A perfluorinated polyimide comprising a repeating unit represented by general formula (1): ##STR1## and a perfluorinated poly(amic acid) comprising a repeating unit represented by general formula (6): ##STR2## wherein R.sub.1 is a tetravalent organic group; and R.sub.2 is a divalent organic group, provided that chemical bonds between carbon atoms and monovalent elements contained in R.sub.1 and R.sub.2 are exclusively carbon-to-fluorine bonds; methods for preparing them; and optical material including the perfluorinated polyimide. 1,4-Bis(3,4-dicarboxytrifluorophenoxy)tetrafluorobenzene dianhydride, 1,4-difluoropyromellitic anhydride, 1,4-bis(3,4-dicarboxytrifluorophenoxy)tetrafluorobenzene, 1,4-difluoropyromellitic acid, and 1,4-bis(3,4-dicyanotrifluorophenoxy)tetrafluorobenzene as well as methods preparing them. The perfluorinated polyimide has a thermal stability and has a low optical loss in an optical communication wavelength region (0.8 to 1.7 .mu.m).Type: GrantFiled: September 26, 1991Date of Patent: August 3, 1993Assignee: Nippon Telegraph and Telephone CorporationInventors: Shinji Ando, Toru Matsuura, Shigekuni Sasaki, Fumio Yamamoto
-
Patent number: 5218076Abstract: The invention is a process for making novel branched polybenzazole polymers and the polymers formed thereby. Novel compounds are also disclosed that are useful as branching agents in making the branched polybenzazole polymers. The branched polymers synthesized by the process can be formed into strong, light articles such as fibers and films.Type: GrantFiled: March 11, 1992Date of Patent: June 8, 1993Assignee: The Dow Chemical CompanyInventors: Norman L. Madison, William J. Harris
-
Patent number: 5212277Abstract: The present invention relates to new polyetherimideimides having imideimide group with the following structural formula(I) and inherent viscosity of 0.27.about.0.71 dl/g, which can be made by effecting reaction between an aromatic bis(ether anhydride) and an organic diamine or an aromatic bis(nitro imideimide) and a metal salt of diol.Type: GrantFiled: January 10, 1991Date of Patent: May 18, 1993Assignees: Korea Research Institute of Chemical Technology, Cheil Industries, Inc.Inventors: Kwang-Sup Lee, Kil-Yeong Choi, Jong C. Won, Byoung K. Park, In-Tae Lee
-
Patent number: 5112942Abstract: Copolyimides and their precursors are disclosed comprising units represented by the formula ##STR1## where R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are hydrogen or C.sub.1 to C.sub.6 linear or branched alkyl, with the proviso that R.sub.1, R.sub.2, R.sub.3 and R.sub.4 cannot simultaneously be hydrogen and where Z is a chemical bond, ##STR2## Ar is the tetravalent residue of a tetracarboxylic acid or acid dianhydride or di- or tetraester thereof, where x and y are integers from about 100 to about 1,000, and the ratio of x to y is from about 1:99 to about 49:51, and z is 0-5.These copolymers have improved resistance to stress cracking. They may also be used in applications such as coatings, or adhesives.Type: GrantFiled: September 26, 1990Date of Patent: May 12, 1992Assignee: Ethyl CorporationInventor: Wesley C. Blocker
-
Patent number: 5109107Abstract: The present invention provides for a novel heat stable class of polyamide-imide polymers having excellent flow properties and hydrolytic stability which are prepared by forming the polycondensation product of one or more aromatic or aliphatic diamines, one or more additional comonomers selected from the group consisting of a tetrafunctional aromatic dianhydride, an aromatic or aliphatic dicarboxylic acid (or acid derivative thereof) and mixtures thereof, and a comonomer comprising a tri- or hexafluoro-substituted tricarboxylic acid anhydride (or acid derivative thereof) having the structure: ##STR1## wherein Z is CF.sub.3 or a phenyl radical.Type: GrantFiled: December 21, 1990Date of Patent: April 28, 1992Assignee: Hoecht Celanese Corp.Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
-
Patent number: 5096998Abstract: A reactive oligoimide, which may serve as an adhesive for bonding at least one layer or film to another layer, preferably a flexible metallic layer to a flexible layer of a polyimide, in order to form a flexible multilayer metal-clad laminate.Type: GrantFiled: October 31, 1990Date of Patent: March 17, 1992Assignee: E. I. Du Pont de Nemours and CompanyInventor: Philip Manos
-
Patent number: 5077382Abstract: A co-polyimide based upon a mixture of 4,4'-oxydiphthalic dianhydride (ODPA) and 3,4,3',4'-biphenyltetracarboxylic dianhydride (BPDA) as the dianhydride component and either 4,4'-oxydianiline (ODA) or paraphenylene diamine as the amine component is disclosed. The molar ratio between the ODPA and BPDA ranges from 3:1 to 1:3. The co-polyimide may either be formed as a random copolymer, or as a block copolymer where the blocks are based upon blocks of polymer containing ODPA and blocks of polymer containing BPDA provided that the molar ratios of ODPA and BPDA are in the ratio of 3:1 to 1:3.Type: GrantFiled: October 26, 1989Date of Patent: December 31, 1991Assignee: Occidental Chemical CorporationInventors: Timothy A. Meterko, Rudolph F. Mundhenke, Willis T. Schwartz
-
Patent number: 5068307Abstract: A polyamideimide having an inherent viscosity of above 0.48 which comprises a unit of the following formula (II) ##STR1## and a unit of the following formula (IV) ##STR2## as main units forming the molecular chains of the polyamideimide, and an intimate mixture of the polyamideimide and a plasticising material for the polyamideimide.Type: GrantFiled: November 8, 1989Date of Patent: November 26, 1991Assignee: Teijin LimitedInventors: Shigeyoshi Hara, Hiroo Inata, Shunichi Matsumura
-
Patent number: 5032667Abstract: Described herein are amide and/or imide containing polymers based on novel monomers that contain isoalkylidene bridges. These polymers have excellent toughness combined with high temperature stability, low water absorption, and good melt-fabricability.Type: GrantFiled: December 20, 1989Date of Patent: July 16, 1991Assignee: Amoco CorporationInventors: James E. Harris, Abe Berger, Vilas M. Chopdekar, Markus Matzner, James Spanswick
-
Patent number: 4994544Abstract: A process for the production of polyimide fibers and polyimide fibers obtained by the process. The process includes thermal or chemical imidation of a polyamic acid which has been obtained by reacting a specific diamine and a particular tetracarboxylic dianhydride in the presence of a dicarboxylic anhydride represented by the following formula: ##STR1## wherein Z represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups and non-fused polycyclic aromatic groups with aromatic rings bonded together directly or via a crosslinking member.Type: GrantFiled: November 6, 1989Date of Patent: February 19, 1991Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Taizo Nagahiro, Masahiro Ohta, Shuichi Morikawa, Nubohito Koga, Shoji Tamai
-
Patent number: 4987197Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.Type: GrantFiled: April 24, 1989Date of Patent: January 22, 1991Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
-
Patent number: 4977235Abstract: Novel polyarylate polymers comprise alternating moieties derived from an aromatic dicarboxylic acid halide, with moieties derived from a hydroxyaryl-substituted 1,6-diaza [4.4] spirodilactam compound and, optionally, with moieties derived from a di(hydroxyphenyl) compound. The polyarylate polymers are thermoplastic polymers characterized by relatively high glass transition temperatures.Type: GrantFiled: December 21, 1989Date of Patent: December 11, 1990Assignee: Shell Oil CompanyInventor: Pen-Chung Wang
-
Patent number: 4963647Abstract: The present invention provides novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines and one or more trifunctional acid anhydride monomers, wherein at least one of said diamine monomers is a 12F-Diamine or 12F-Oxydiamine containing at least two CF.sub.3 ##STR1## R groups linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degredation.Type: GrantFiled: February 27, 1989Date of Patent: October 16, 1990Assignee: Hoechst Celanese Corp.Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr., Jeffrey S. Devolve
-
Patent number: 4959447Abstract: A copoly(imidine-imide) consisting of a copolymer of polyimidines and polyimides having, in the basic chain structure of the polymer, imidine structures represented by formula (I) and the imide structures represented by formula (II): ##STR1##Type: GrantFiled: September 2, 1988Date of Patent: September 25, 1990Assignee: Nippon Steel CorporationInventors: Mitsuru Arai, Patrick E. Cassidy, James M. Farley